EN 62215-3:2013

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Integrirana vezja - Merjenje odpornosti proti impulzom - 3. del: Metoda z vnašanjem prehodnih nesinhronih motenj (IEC 62215-3:2013)/Circuits intégrés - Mesure de l'immunité aux impulsions - Partie 3: Méthode d'injection de transitoires non synchronesIntegrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method31.200Integrirana vezja, mikroelektronikaIntegrated circuits. MicroelectronicsICS:Ta slovenski standard je istoveten z:EN 62215-3:2013SIST EN 62215-3:2014en01-maj-2014SIST EN 62215-3:2014SLOVENSKI
STANDARD
EUROPEAN STANDARD EN 62215-3 NORME EUROPÉENNE
EUROPÄISCHE NORM October 2013
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2013 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62215-3:2013 E
ICS 31.200
English version
Integrated circuits -
Measurement of impulse immunity -
Part 3: Non-synchronous transient injection method (IEC 62215-3:2013)
Circuits intégrés -
Mesure de l'immunité aux impulsions -
Partie 3: Méthode d'injection de transitoires non synchrones (CEI 62215-3:2013)
Integrierte Schaltungen -
Messung der Störfestigkeit
gegen Impulse -
Teil 3: Asynchrones Transienteneinspeisungs-Verfahren (IEC 62215-3:2013)
This European Standard was approved by CENELEC on 2013-08-21. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
Foreword The text of document 47A/881/CDV, future edition 1 of IEC 62215-3, prepared by SC 47A “Integrated circuits” of IEC/TC 47 “Semiconductor devices” was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62215-3:2013.
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-05-21 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-08-21
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 62215-3:2013 was approved by CENELEC as a European Standard without any modification. SIST EN 62215-3:2014

- 3 - EN 62215-3:2013
Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary (IEV) - -
IEC 61000-4-4 2012 Electromagnetic compatibility (EMC) -
Part 4-4: Testing and measurement techniques - Electrical fast transient/burst immunity test EN 61000-4-4 2012
IEC 61000-4-5 + corr. October
2005 2009 Electromagnetic compatibility (EMC) -
Part 4-5: Testing and measurement techniques - Surge immunity test EN 61000-4-5 2006
IEC 62132-4 2006 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 4: Direct RF power injection method EN 62132-4 2006
ISO 7637-2 2011 Road vehicles - Electrical disturbances from conduction and coupling -
Part 2: Electrical transient conduction along supply lines only - -
IEC 62215-3 Edition 1.0 2013-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Integrated circuits – Measurement of impulse immunity –
Part 3: Non-synchronous transient injection method
Circuits intégrés – Mesure de l'immunité aux impulsions –
Partie 3: Méthode d'injection de transitoires non synchrones
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE V ICS 31.200 PRICE CODE CODE PRIX ISBN 978-2-8322-0994-3
– 2 – 62215-3 © IEC:2013 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 General . 8 5 Coupling networks . 9 5.1 General on coupling networks . 9 5.2 Supply injection network . 9 5.2.1 Direct injection . 9 5.2.2 Capacitive coupling . 10 5.3 Input injection . 10 5.4 Output injection . 11 5.5 Simultaneous multiple pin injection . 12 6 IC configuration and evaluation . 12 6.1 IC configuration and operating modes . 12 6.2 IC monitoring . 13 6.3 IC performance classes . 13 7 Test conditions . 14 7.1 General . 14 7.2 Ambient electromagnetic environment . 14 7.3 Ambient temperature . 14 7.4 IC supply voltage . 14 8 Test equipment . 14 8.1 General requirements for test equipment . 14 8.2 Cables . 14 8.3 Shielding . 14 8.4 Transient generator . 14 8.5 Power supply . 14 8.6 Monitoring and stimulation equipment . 14 8.7 Control unit . 15 9 Test set up . 15 9.1 General . 15 9.2 EMC test board . 15 10 Test procedure . 17 10.1 Test plan . 17 10.2 Test preparation . 17 10.3 Characterization of coupled impulses . 17 10.4 Impulse immunity measurement . 17 10.5 Interpretation and comparison of results . 18 10.6 Transient immunity acceptance level . 18 11 Test report . 18 Annex A (informative)
Test board recommendations . 19 Annex B (informative)
Selection hints for coupling and decoupling network values . 24 Annex C (informative)
Industrial and consumer applications . 26 Annex D (informative)
Vehicle applications . 29 SIST EN 62215-3:2014

62215-3 © IEC:2013 – 3 –
Figure 1 – Typical pin injection test implementation . 9 Figure 2 – Supply pin direct injection test implementation . 10 Figure 3 – Supply pin capacitive injection test implementation . 10 Figure 4 – Input pin injection test implementation . 11 Figure 5 – Output pin injection test implementation . 12 Figure 6 – Multiple pin injection test implementation . 12 Figure 7 – Test set-up diagram . 15 Figure 8 – Example of the routing from
the injection port to a pin of the DUT . 16 Figure A.1 – Typical EMC test board topology. 22 Figure A.2 – Example of implementation
of multiple injection structures . 23
Table A.1 – Position of vias over the board . 19 Table C.1 – Definition of pin types . 26 Table C.2 – Test circuit values . 27 Table C.3 – Example of IC impulse test level (IEC 61000-4-4) . 28 Table D.1 – IC pin type definition . 29 Table D.2 – Transient test level 12 V (ISO 7637-2) . 30 Table D.3 – Transient test level 24 V (ISO 7637-2) . 31 Table D.4 – Example of transient test specification . 32
– 4 – 62215-3 © IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
INTEGRATED CIRCUITS –
MEASUREMENT OF IMPULSE IMMUNITY –
Part 3: Non-synchronous transient injection method
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international conse
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