EN 62433-3:2017

SLOVENSKI STANDARD
01-september-2017
Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 3. del:
Modeli integriranih vezij za simulacijo obnašanja glede na elektromagnetno
odpornost (EMI) - Modeliranje sevanih emisij (ICEM-RE) (IEC 62433-3:2017 )
EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation -
Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017 )
Modèles de circuits intégrés pour la CEM - Partie 3: Modèles de circuits intégrés pour la
simulation du comportement lors de perturbations électromagnétiques - Modélisation des
émissions rayonnées (ICEM-RE) (IEC 62433-3:2017 )
Ta slovenski standard je istoveten z: EN 62433-3:2017
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.10 Emisija Emission
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62433-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2017
ICS 33.100.10; 31.200
English Version
EMC IC modelling - Part 3: Models of Integrated Circuits for EMI
behavioural simulation - Radiated emissions modelling (ICEM-
RE)
(IEC 62433-3:2017)
Modèles de circuits intégrés pour la CEM - Partie 3: EMV-IC-Modellierung - Teil 3: Modelle integrierter
Modèles de circuits intégrés pour la simulation du Schaltungen für die Simulation des Verhaltens bei
comportement lors de perturbations électromagnétiques - elektromagnetischer Beeinflussung - Modellierung von
Modélisation des émissions rayonnées (ICEM-RE) abgestrahlten Aussendungen (ICEM-RE)
(IEC 62433-3:2017) (IEC 62433-3:2017)
This European Standard was approved by CENELEC on 2017-03-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62433-3:2017 E
European foreword
The text of document 47A/1000/FDIS, future edition 1 of IEC 62433-3, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62433-3:2017.

The following dates are fixed:
(dop) 2017-12-03
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-03-03
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62433-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
1)
ISO 8879:1986 NOTE Harmonized as EN 28879:1990

1) Withdrawn publication
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 -  Integrated circuits - Measurement of EN 61967-1 -
electromagnetic emissions, 150 kHz to 1
GHz -- Part 1: General conditions and
definitions
IEC 62433-2 -  EMC IC modelling - Part 2: Models of FprEN 62433-2 -
integrated circuits for EMI behavioural
simulation - Conducted emissions
modelling (ICEM-CE)
IEC/TS 61967-3 -  Integrated circuits - Measurement of - -
electromagnetic emissions - Part 3:
Measurement of radiated emissions -
Surface scan method
IEC/TS 62433- -  EMC IC modelling - Part 1: General - -
1:2011 modelling framework
ANSI INCITS 4 -  Information Systems - Coded Character - -
Sets - 7-Bit American National Standard
Code for Information Interchange (7-Bit
ASCII)
IEC 62433-3 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
EMC IC modelling –
Part 3: Models of integrated circuits for EMI behavioural simulation – Radiated

emissions modelling (ICEM-RE)
Modèles de circuits intégrés pour la CEM –

Partie 3: Modèles de circuits intégrés pour la simulation du comportement lors

de perturbations électromagnétiques – Modélisation des émissions rayonnées

(ICEM-RE)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
31.200; 33.100.10 ISBN 978-2-8322-3878-3

– 2 – IEC 62433-3:2017  IEC 2017
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions, abbreviations and conventions . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 10
3.3 Conventions . 10
4 Philosophy . 10
5 ICEM-RE macro-model description . 11
5.1 General . 11
5.2 PDN description . 12
5.3 IA description . 16
5.4 Electromagnetic field calculation and simulation . 16
6 REML format . 17
6.1 General . 17
6.2 REML structure . 18
6.3 Global keywords . 19
6.4 Header section . 19
6.5 Frequency definitions . 20
6.6 Coordinate system definition . 20
6.7 Reference definition . 21
6.8 Validity section . 21
6.8.1 General . 21
6.8.2 Attribute definitions . 22
6.9 PDN . 24
6.9.1 General . 24
6.9.2 Attribute definitions . 25
6.9.3 PDN of a single-frequency ICEM-RE . 26
6.9.4 PDN for multi-frequency ICEM-RE . 29
6.10 IA . 32
6.10.1 General . 32
6.10.2 Attribute definitions . 33
6.10.3 IA of a single-frequency ICEM-RE . 34
6.10.4 IA for multi-frequency ICEM-RE . 37
7 Extraction . 38
7.1 General . 38
7.2 Environmental extraction constraints . 39
7.3 Obtaining model parameters from near-field data . 39
7.3.1 General . 39
7.3.2 PDN . 40
7.3.3 IA . 42
7.4 Extraction based on ICEM-CE simulation . 45
7.4.1 General . 45
7.4.2 PDN . 45
7.4.3 IA . 46
8 Validation . 46

IEC 62433-3:2017  IEC 2017 – 3 –
Annex A (normative) Preliminary definitions for XML representation . 48
A.1 XML basics . 48
A.1.1 XML declaration . 48
A.1.2 Basic elements . 48
A.1.3 Root element . 48
A.1.4 Comments . 48
A.1.5 Line terminations . 49
A.1.6 Element hierarchy . 49
A.1.7 Element attributes . 49
A.2 Keyword requirements . 49
A.2.1 General . 49
A.2.2 Keyword characters . 49
A.2.3 Keyword syntax . 50
A.2.4 File structure . 50
A.2.5 Values . 52
Annex B (informative) Electromagnetic fields radiated by an elementary electric and
magnetic dipole . 55
B.1 Electric dipole . 55
B.2 Magnetic dipole. 57
Annex C (informative) Example files . 60
C.1 Minimum default ICEM-RE file . 60
C.2 Microcontroller example in REML format . 61
Annex D (normative) REML valid keywords and usage . 63
D.1 Root element keywords . 63
D.2 File header keywords . 64
D.3 Validity section keywords . 65
D.4 Global keywords . 65
D.5 Pdn section keywords . 66
D.6 Ia section keywords . 67
Annex E (informative) ICEM-RE extraction methods . 69
E.1 General . 69
E.2 ICEM-RE Modelling methods . 69
E.2.1 Model . 69
Hman
E.2.2 Model . 69
H
E.2.3 Model . 71
EM_Inv
E.2.4 Model . 72
EM_Iter
E.2.5 Model . 72
EM_TD
E.2.6 Model selection guide . 73
E.3 ICEM-RE modelling environment from near-field data . 73
E.3.1 General . 73
E.3.2 Modelling design-flow . 74
E.3.3 ICEM-RE importation into 3D electromagnetic tools . 75
E.4 ICEM-RE modelling from ICEM-CE . 76
Annex F (informative) ICEM-RE model validation examples . 78
F.1 General . 78
F.2 Validation on a microcontroller . 78
F.2.1 General . 78
F.2.2 Details of the microcontroller . 78

– 4 – IEC 62433-3:2017  IEC 2017
F.2.3 Case 1: Choosing manual model Model . 78
Hman
F.2.4 Case 2: Choosing one of the automatic magnetic field models . 79
F.3 Validation on an oscillator circuit . 81
F.4 Example of validation on passive devices . 84
F.5 Examples of validation on active devices . 85
F.5.1 Extraction from near-field measurements . 85
F.5.2 Extraction from ICEM-CE model . 85
Annex G (informative) ICEM-RE macro-model usage examples . 86
G.1 General . 86
G.2 Methodology for exploiting ICEM-RE macro-model . 86
Bibliography . 88

Figure 1 – General ICEM-RE model structure. 12
Figure 2 – Geometrical representation of the ICEM-RE PDN . 13
Figure 3 – Representation of an elementary dipole in the ICEM-RE PDN . 13
Figure 4 – An elementary current loop of radius “a” in 3D space . 14
Figure 5 – Duality theorem between a current loop and a magnetic dipole . 14
Figure 6 – Example of referential points to describe the geometry . 15
Figure 7 – PDN definition at three different frequencies . 16
Figure 8 – REML inheritance hierarchy . 18
Figure 9 – Format for defining PDN vector data in an external file . 28
Figure 10 – Format for defining IA vector data in an external file . 36
Figure 11 – Electromagnetic field measurement . 39
Figure 12 – B field in nT measured at 3 mm above the microprocessor at 80 MHz. 40
z
Figure 13 – Example of electromagnetic field emitted by an elementary current line . 41
Figure 14 – Manual current mapping . 41
Figure 15 – Model representation with N automatically detected dipoles . 42
Figure 16 – Comparison between the modelled and measured EM fields at 2 mm
above an oscillator . 44
Figure 17 – A simple ICEM-CE PDN representing the package and the internal
network impedance between the power rails . 45
Figure 18 – Reconstructing the geometry of the package model (ICEM-RE PDN) from
IBIS and its link with the electrical model (ICEM-CE PDN) . 46
Figure 19 – Graphical representation of the example validation procedure . 47
Figure A.1 – Multiple XML files . 51
Figure A.2 – XML files with data files (*.dat) . 51
Figure A.3 – XML files with additional files . 52
Figure B.1 – An elementary current line in space . 55
Figure B.2 – Elementary magnetic dipole in space . 57
Figure C.1 – Microcontroller used for illustration . 61
Figure C.2 – Data file representing the PDN information of the microcontroller . 62
Figure C.3 – Data file representing the IA information of the microcontroller . 62
Figure E.1 – Manually defined electric dipole array in Model . 69
Hman
Figure E.2 – Electric and magnetic dipole array in Model . 71
EM_Inv
Figure E.3 – Example of an ICEM-RE modelling environment . 74

IEC 62433-3:2017  IEC 2017 – 5 –
Figure E.4 – ICEM-RE modelling design-flow . 75
Figure E.5 – Example of an imported ICEM-RE PDN and IA in a 3D simulation tool . 76
Figure E.6 – Design-flow to obtain ICEM-RE from ICEM-CE model . 77
Figure F.1 – Microcontroller circuit used for model validation . 78
Figure F.2 – Manual dipoles representing the PDN of the microcontroller . 79
Figure F.3 – Comparison between the modelled and measured fields at 4 mm above
the microcontroller using Model . 79
Hman
Figure F.4 – Validation of Model on the microcontroller . 80
H
Figure F.5 – Detection of dipoles representing the microcontroller using Model . 80
EM_Iter
Figure F.6 – Validation of Model on the microcontroller . 81
EM_Iter
Figure F.7 – Oscillator circuit used for model validation . 81
Figure F.8 – Schematic of the oscillator used for validation . 82
Figure F.9 – Validation of the magnetic field predicted with Model and
EM_Inv
Model on the oscillator at 10 mm height . 83
EM_Iter
Figure F.10 – Validation of the electric field predicted with Model and
EM_Inv
Model on the oscillator at 10 mm height . 83
EM_Iter
Figure F.11 – Modelled maximum total magnetic field as a function of height (z) above
the oscillator compared with measurements . 84
Figure G.1 – Typical EMC issues at equipment and system level covered by ICEM-RE . 87

Table 1 – PDN format . 15
Table 2 – Definition of the Validity section . 22
Table 3 – Definition of the Submodel section of the Pdn element . 25
Table 4 – Definition of the Vector keyword in the Pdn section . 25
Table 5 – Valid fields of the Submodel keyword for single-frequency PDN . 27
Table 6 – Conditions for correct annotation of single-frequency PDN by the REM
parser . 27
Table 7 – Valid fields of the Vector keyword for single-frequency PDN . 27
Table 8 – Valid file extensions in the Pdn section . 29
Table 9 – Conditions for correct annotation of multi-frequency PDN by the REM parser . 30
Table 10 – Definition of the Submodel section of the Ia element . 32
Table 11 – Definition of the Vector keyword in the Ia section . 33
Table 12 – Valid fields of the Submodel keyword for single-frequency IA . 34
Table 13 – Conditions for correct annotation of single-frequency IA by the REM parser . 34
Table 14 – Valid fields of the Vector keyword for single-frequency IA . 35
Table 15 – Accepted file extensions in the Ia section . 37
Table 16 – Conditions for correct annotation of multi-frequency IA by the REM parser . 37
Table A.1 – Valid logarithmic units . 53
Table E.1 – ICEM-RE model selection guide . 73
Table F.1 – ICEM-RE model validation on passive structures. 85

– 6 – IEC 62433-3:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
EMC IC MODELLING –
Part 3: Models of integrated circuits for EMI behavioural simulation –
Radiated emissions modelling (ICEM-RE)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62433-3 has been prepared by subcommittee 47A: Integrated
Circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/1000/FDIS 47A/1008/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

IEC 62433-3:2017  IEC 2017 – 7 –
A list of all parts in the IEC 62433 series, published under the general title EMC IC modelling,
can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 62433-3:2017  IEC 2017
EMC IC MODELLING –
Part 3: Models of integrated circuits for EMI behavioural simulation –
Radiated emissions modelling (ICEM-RE)

1 Scope
This part of IEC 62433 provides a method for deriving a macro-model to allow the simulation
of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called
Integrated Circuit Emission Model – Radiated Emission, ICEM-RE. The model is intended to
be used for modelling a complete IC, with or without its associated package, a functional
block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output
pins, digital core and supply), when measured or simulated data cannot be directly imported
into simulation tools.
The proposed IC macro-model will be inserted in 3D electromagnetic simulation tools so as to:
• predict the near-radiated emissions from the IC
• evaluate the effect of the radiated emissions on neighbouring ICs, cables, transmission
lines, etc.
This part of IEC 62433 has two main parts:
• the first is the electrical description of ICEM-RE macro-model elements,
• the second part proposes a universal data exchange format called REML based on XML.
This format allows encoding the ICEM-RE in a more useable and generic form for
emission simulation.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC TS 62433-1, EMC IC modelling – Part 1: General modelling framework
IEC 62433-2, EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural
simulation – Conducted emissions modelling (ICEM-CE)
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC TS 61967-3, Integrated circuits – Measurement of electromagnetic emissions – Part 3:
Measurement of radiated emissions – Surface scan method
ANSI INCITS 4:1986, Information Systems – Coded Character Sets – 7-Bit American National
Standard Code for Information Interchange (7-Bit ASCII)

IEC 62433-3:2017  IEC 2017 – 9 –
3 Terms, definitions, abbreviations and conventions
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
electric dipole
linear current-carrying element or wire that is always of finite length
3.1.2
current loop
closed current-carrying element or wire that is always of finite radius
3.1.3
magnetic dipole
linear “magnetic current” carrying element or wire that is of finite length
Note 1 to entry: A magnetic dipole is an equivalent magnetic source counterpart of an electric dipole that is used
for mathematical formulations. This quantity is purely mathematical and not physical in nature.
Note 2 to entry: This term is used in an abstract manner to explain the motion of magnetic charges giving rise to
magnetic currents, when compared to their dual quantities of moving electrical charges giving rise to electrical
currents.
3.1.4
PDN
Passive Distribution Network
component of an IC model that represents the geometrical base within which equivalent
radiating sources would be positioned.
3.1.5
IA
Internal Activity
component of an IC model represented by a current or voltage source, which originates in
activity of active devices in an IC or in a portion of the IC
Note 1 to entry: In this part of IEC 62433, a current source is commonly used to excite the elements of the PDN.
[SOURCE: IEC TS 62433-1:2011, 3.3, modified — Note 1 to entry has been added]
3.1.6
model
Hman
radiated magnetic emission model with manual sources
3.1.7
model
H
radiated magnetic emission model with automatic source detection
3.1.8
model
EM_Inv
radiated electric and magnetic emission model based on automatic source detection, using
the matrix inverse method for problem solving
3.1.9
model
EM_Iter
radiated electric and magnetic emission model based on automatic source detection, using an
iterative method for problem solving

– 10 – IEC 62433-3:2017  IEC 2017
3.1.10
model
EMTD
time-harmonic radiated electric and magnetic emission model based on automatic source
detection, using an iterative method for problem solving
3.1.11
section
XML element placed one level below the root element or within another section and that
contains one or more XML elements, but no value
[SOURCE: IEC 62433-4:—, 3.1.1]
3.1.12
parent
keyword which is one level above another keyword
[SOURCE: IEC 62433-4:—, 3.1.2]
3.1.13
child
keyword which is one level below another keyword
[SOURCE: IEC 62433-4:—, 3.1.3]
3.1.14
parser
tool for syntactic analysis of data that is encoded in a specified format
[SOURCE: IEC 62433-4:—, 3.1.6]
3.1.15
Radiated Emissions Markup Language
REML
data exchange format for ICEM-RE macro-model
Note 1 to entry: This note applies to the French language only.
3.2 Abbreviations
REM Radiated Emission Model
XML eXtensible Markup Language
3.3 Conventions
For the sake of clarity, but with some exceptions, the writing conventions of XML language
have been used in text and tables.
The symbol “µ” is used in the text part to define micro = 1e-6. The symbol “u” is used in the
XML parts to define the micro = 1e-6.
4 Philosophy
With every generation, ICs have become more and more complex and diverse with respect to
integration density and functional capabilities in a reduced form-factor. ICs have also become
faster more than ever with lower supply voltages. Modern ICs may contain on-chip radio
frequency modules co-existing with analogue and/or digital logic cores. Printed Circuit Board
(PCB) carrying these ICs has also become denser. The emissions from one IC can couple

IEC 62433-3:2017  IEC 2017 – 11 –
back into neighbouring components (ICs, passive components, traces, etc.) and provoke
undesired system performance or even system failure. Consequently, the emissions from ICs
are becoming more and more critical.
Due to this increased risk of emissions emanating from ICs, it is indispensable to use
simulation tools for evaluating the emission behaviour of every module during the IC design
stages. It is therefore necessary to have accurate radiated electromagnetic emission models
in order to predict the radiated emission behaviour of ICs and their effects on neighbouring
circuits (coupling to PCB tracks, connectors, etc.). Precise evaluation of emission risks at
board level cannot be done otherwise.
IC’s equivalent radiation sources integration in 3D electromagnetic solvers can be achieved
using different input techniques. This part of IEC 62433 identifies and specifies a more
generic, exchangeable and validated macro-model for simulating the radiated emission
behaviour at IC level. For ICs with multiple operating modes, functionalities, programmable
logics and conditions of the IC, its emission profile would be completely different depending
on the operating mode. Consequently, ICEM-RE macro-models are valid only in the conditions
in which they have been established. The models will be used to predict the radiated
electromagnetic emissions at application level.
ICEM-RE macro-model data is arranged in a decipherable nested manner using XML format.
The objective of this exchange format, called Radiated Emission Markup Language (REML), is
to create simple and practical universal access to ICEM-RE macro-model. The preliminary
definitions for XML representation is given in Annex A.
5 ICEM-RE macro-model description
5.1 General
The internal structure of an IC can be broken down into two parts:
• Passive parts, (parasitic resistance (R), inductance (L) and capacitance (C) of tracks,
Electrostatic Discharge (ESD) protection components, pins and bonding) which connects
the external environment to the internal IC blocks.
• Active parts, (Central Processing Unit (CPU) core, clock system, memory, analogue
blocks). It is these active internal blocks that are the emission sources in an IC.
The ICEM-RE macro-model consists of a set of data describing these two parts:
– PDN: the Passive Distribution Network (PDN) represents the geometrical base within
which the equivalent radiating sources would be positioned. It contains the geometrical co-
ordinates of the model.
– IA: the Internal Activity (IA) represents the excitation source of the radiating elements of
the PDN. It contains the amplitude and phase of the electrical current of the model.
Figure 1 presents the general ICEM-RE macro-model structure.

– 12 – IEC 62433-3:2017  IEC 2017
I/O
AGND
VCC1
I/O
AGND
PDN
VCC2
DGND
IA
ICEM-RE
IEC
Figure 1 – General ICEM-RE model structure
There is a direct link between the PDN block and IA block. The PDN represents a set of
equivalent radiation sources such as electric dipoles or electric current loops which serves as
the geometrical base for the IA. The source coordinates are defined with respect to a point in
space which is called the reference point. More details of the reference point can be found in
5.2.
The IA represents the current flowing in each of the equivalent radiating element in the PDN.
The current value is complex in nature, i.e., the currents through the dipole (or loop) are
represented with their magnitude and phase. The phase value is relative to the EM field’s
phase at the reference point. By definition, each element of the PDN has a specific IA, both
the PDN coordinates and IA phase values are referenced to the reference point.
The ICEM-RE macro-model is generally defined in the frequency domain. It does not
inherently have a frequency limit for validity i.e. ICEM-RE structure is valid over any
frequency range. However, depending on the data used for model extraction, the model’s limit
of validity is set by the input data used for extracting the model. Moreover, the model is
defined only in the conditions in which it has been extracted: IC’s operating conditions,
activated functions, external components (decoupling capacitors, external oscillators, etc.)
needed for IC’s basic functioning, etc. Any variation from the specified conditions could
necessitate a modification to the model (re-extract the model). The incorporation of the
variation is not included in the current edition.
5.2 PDN description
The PDN consists of passive elements for the package, bonding and on-chip interconnections.
These elements behave like radiating antennas when high-frequency signals (currents) and
transients’ flow through them. The PDN block of ICEM-RE can be described using a set of
equivalent radiation sources such as electric dipoles or magnetic loops representing the
different package/bonding/interconnection elements as shown in Figure 2.

IEC 62433-3:2017  IEC 2017 – 13 –
y Electric dipole
y
Current loop
x

 x
z
z
IEC
IEC
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