IEC TS 61967-3:2014

IEC TS 61967-3 ®
Edition 2.0 2014-08
TECHNICAL
SPECIFICATION
SPECIFICATION
TECHNIQUE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 3: Measurement of radiated emissions – Surface scan method

Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 3: Mesure des émissions rayonnées – Méthode de balayage en surface

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IEC TS 61967-3 ®
Edition 2.0 2014-08
TECHNICAL
SPECIFICATION
SPECIFICATION
TECHNIQUE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –

Part 3: Measurement of radiated emissions – Surface scan method

Circuits intégrés – Mesure des émissions électromagnétiques –

Partie 3: Mesure des émissions rayonnées – Méthode de balayage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.200 ISBN 978-2-8322-1809-9

– 2 – IEC TS 61967-3:2014  IEC 2014
CONTENTS
FOREWORD. 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 9
4 General . 9
5 Test conditions . 10
5.1 General . 10
5.2 Supply voltage . 10
5.3 Frequency range . 10
6 Test equipment . 10
6.1 General . 10
6.2 Shielding . 10
6.3 RF measuring instrument . 10
6.4 Preamplifier . 10
6.5 Cables . 11
6.6 Near-field probe . 11
6.6.1 General . 11
6.6.2 Magnetic (H) field probe . 11
6.6.3 Electric (E) field probe. 11
6.6.4 Combined electric and magnetic (E/H) field probe . 11
6.6.5 Probe-positioning and data acquisition system . 11
7 Test setup . 12
7.1 General . 12
7.2 Test configuration . 12
7.3 Test circuit board . 14
7.4 Probe-positioning system software setup . 14
7.5 DUT software . 14
8 Test procedure . 14
8.1 General . 14
8.2 Ambient conditions . 14
8.3 Operational check . 14
8.4 Test technique . 15
9 Test report . 16
9.1 General . 16
9.2 Measurement conditions . 16
9.3 Probe design and calibration . 16
9.4 Measurement data . 16
9.5 Post-processing . 17
9.6 Data exchange . 17
Annex A (normative) Calibration of near-field probes . 18
A.1 General . 18
A.2 Test equipment . 20
A.2.1 General . 20

A.2.2 PCB with microstrip line . 20
A.3 Calibration setup . 21
A.4 Calibration procedure . 22
Annex B (informative)  Discrete electric and magnetic field probes . 25
B.1 General . 25
B.2 Probe electrical description . 25
B.3 Probe physical description . 26
B.3.1 General . 26
B.3.2 Electric field probe . 26
B.3.3 Magnetic field probe . 26
Annex C (informative) Combined electric and magnetic field probe example . 28
C.1 General . 28
C.2 Probe electrical description . 28
C.3 Probe physical description . 29
C.4 Measurement and data acquisition system . 29
Annex D (informative) Coordinate systems . 31
D.1 General . 31
D.2 Cartesian coordinate system . 31
D.3 Cylindrical coordinate system . 32
D.4 Spherical coordinate system . 33
D.5 Coordinate system conversion . 33
Bibliography . 34

Figure 1 – Example of probe-positioning system . 12
Figure 2 – One-input RF measurement setup . 13
Figure 3 – Two-input RF measurement setup with reference probe . 13
Figure 4 – Two-input RF measurement setup with reference signal . 13
Figure 5 – Examples of data overlaid on an image of the DUT (Contour chart) . 16
Figure A.1 – Typical probe factor against frequency . 20
Figure A.2 – Microstrip line for calibration (transverse cross-section) . 21
Figure A.3 – Microstrip line for calibration (longitudinal cross-section) . 21
Figure A.4 – Probe calibration setup. 22
Figure A.5 – Scan direction across Microstrip line . 22
Figure A.6 – Typical plot of measured signal level and simulated field strength (H ) . 24
X
Figure A.7 – Typical plot of measured signal level and simulated field strength (Hz) . 24
Figure B.1 – Electric and magnetic field probe schematics . 25
Figure B.2 – Example of electric field probe construction (E ) . 26
Z
Figure B.3 – Example of magnetic field probe construction (H or H ) . 27
X Y
Figure C 1 – Electromagnetic field probe schematic . 28
Figure C.2 – Electromagnetic field probe construction . 29
Figure C.3 – Measurement and data acquisition system overview . 30
Figure C.4 – Measurement and data acquisition system detail . 30
Figure D.1 – Right-hand Cartesian coordinate system (preferred) . 31
Figure D.2 – Left-hand Cartesian coordinate system . 32
Figure D.3 – Cylindrical coordinate system . 32
Figure D.4 – Spherical coordinate system . 33

– 4 – IEC TS 61967-3:2014  IEC 2014

Table A.1 – Probe factor linear units . 19
Table A.2 – Probe factor logarithmic units . 19
Table A.3 – Dimensions for 50 Ω microstrip . 21
Table D.1 – Coordinate system conversion . 33

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 3: Measurement of radiated emissions –
Surface scan method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 61967-3, which is a technical specification, has been prepared by subcommittee 47A:
Integrated circuits, of IEC technical committee 47: Semiconductor devices.

– 6 – IEC TS 61967-3:2014  IEC 2014
This second edition cancels and replaces the first edition published in 2005. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Removal of:
– 9.4 Data analysis;
– Annex D – Analysing the data from near-field surface scanning.
b) Addition of:
– Introduction
– 9.4 Measurement data
– 9.5 Post-processing
– 9.6 Data exchange
– Annex D – Coordinate systems
c) Expansion of:
– 8.4 Test technique
– Annex A – Calibration of near-field probes
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
47A/925/DTS 47A/937/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61967 series, published under the general title Integrated
circuits – Measurement of electromagnetic emissions, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
Techniques for scanning near-fields radiated by integrated circuits and their surrounding
environment can identify the areas of radiation, which may cause interference to nearby
devices. The ability to associate magnetic or electric field strengths with a particular location
on a device can provide valuable information for improvement of an IC both in terms of
functionality and EMC performance.
Near-field scan techniques have considerably evolved over recent years. The improved
sensitivity, bandwidth and spatial resolution of the probes offer analysis of integrated circuits
operating into the gigahertz range. The ability to measure radiation both in the frequency and
time domain allows not only analysis of fields generated by an IC, but also fields generated by
externally applied disturbances propagating through the device. Post-processing can
considerably enhance the resolution of a near-field scan measurement and the measured data
can be shown in various ways, per user's choice.

– 8 – IEC TS 61967-3:2014  IEC 2014
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 3: Measurement of radiated emissions –
Surface scan method
1 Scope
This part of IEC 61967 provides a test procedure which defines an evaluation method for the
near electric, magnetic or electromagnetic field components at or near the surface of an
integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such
as floor planning and power distribution optimization. This test procedure is applicable to
measurements on an IC mounted on any circuit board that is accessible to the scanning probe.
In some cases it is useful to scan not only the IC but also its environment. For comparison of
surface scan emissions between different ICs, the standardized test board defined in
IEC 61967-1 should be used.
This measurement method provides a mapping of the electric or magnetic near-field
emissions over the IC. The resolution of the measurement is determined by the capability of
the measurement probe and the precision of the probe-positioning system. This method is
intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing
probe technology but is beyond the scope of this specification. Measurements may be carried
out in the frequency domain or in the time domain.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050(all parts), International Electrotechnical Vocabulary (available at
)
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purpose of this document, the terms and definitions given in IEC 61967-1,
IEC 60050-131 and IEC 60050-161, as well as the following apply.
3.1.1
altitude
distance between the tip of the near-field probe and the reference plane of the scan (e.g. the
PCB, the upper surface of the package)
Note 1 to entry: The term “altitude” refers to the vertical direction in a Cartesian coordinate system (Z-axis) in this
document.
3.1.2
probe factor
ratio of electric or magnetic field strength at a specified location in near-field evaluation to the
signal level measured at the output connection or applied to the input connection of a probe
3.1.3
spatial resolution
aptitude of a probe to distinguish measured field between two points
3.2 Abbreviations
DUT: device under test
NFS: near-field scan
PCB: printed circuit board
4 General
The electric and magnetic fields measured by scanning over the surface of the IC yield
information on the relative strength of emission sources within the IC package. It enables the
comparisons between different architectures to facilitate reductions in RF emissions from the
IC. The electric and magnetic field patterns over the surface of the IC are related to the
electromagnetic radiation potential of the IC and its constituting electronic module. However,
this procedure is intended to provide a comparative measure for ICs and not to predict far
field levels for the IC or its circuit board.
Characterizing an IC involves the acquisition of a series of magnitude and/or phase
measurements at specific frequencies or times. Each scan over a die or package collects a
large amount of data depending on the number of locations scanned and the number of
frequencies or times measured at each location. Because of the required precision and the
amount of measured data, this test method uses a computer-controlled probe-positioning and
measurement system to achieve accurate and repeatable probe data. Control software shall
be prepared or adapted to control the optical, precision stepper motors typically used in such
systems. This method also requires an analysis and handling of a large amount of data
typically performed by dedicated software programs. The scanning time depends on the
number of frequencies or times, the number of locations measured, and the capability of the
data collection system.
Due to the wide array of IC processes, packaging technologies, as well as their physical
dimensions, this document does not specify the designs of probe-positioning systems or near-
field probes. The designs of the positioning system and the probes depend on the desired
measurement frequency range, spatial resolution, field type, and the performance of the
available components (such as stepper motors).
The spatial resolution depends on the physical dimensions and construction of the probe. If
the spatial resolution is known, it shall be included in the test report.
The altitude of the probe above the IC surface is not specified. The actual probe height shall
be included in the test report.
The step size of the probe position shall be chosen to fully utilize the spatial resolution while
minimizing the number of measurement points. Step size can be smaller in particular areas of
the die or package for higher resolution. With post-processing the data for higher resolution,
the spatial resolution at the measurement can be reduced, which allows a larger step size.

– 10 – IEC TS 61967-3:2014  IEC 2014
5 Test conditions
5.1 General
Test conditions shall meet the requirements of IEC 61967-1. In addition, the following test
conditions shall apply.
5.2 Supply voltage
A supply voltage should follow the IC manufacturer's specification. If the user uses other
voltage, it shall be documented in the test report.
5.3 Frequency range
An effective frequency range of this radiated emission measurement procedure is 150 kHz to
6 GHz. If a single probe is not able to cover the whole frequency range, the frequency range
may be divided into sub-ranges to allow the use of multiple probes, each of which suits
individual frequency sub-range.
6 Test equipment
6.1 General
The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the
following test equipment requirements shall apply.
6.2 Shielding
Double shielded or semi-rigid coaxial cable is recommended for interconnections between the
probe and the measuring equipment. Depending on the local ambient conditions, it may also
be necessary to carry out the measurements in a shielded room.
6.3 RF measuring instrument
The RF measuring instrument utilized for this test method depends on the type of probe
selected and whether phase or time information is to be acquired. In the case of utilizing a
electric or magnetic field probe and measuring only emission amplitude, a one-input device
such as a spectrum analyser, EMI receiver or oscilloscope shall be used. For time domain
measurements an oscilloscope may be used.
In the case of utilizing an electric or magnetic field probe to measure both emission amplitude
and phase, a two-input device such as a vector signal measuring instrument shall be used.
NOTE To measure phase and amplitude with a vector signal measuring instrument, the reference input (R) and
another input (A or B) are used. The S-parameter ports cannot be generally used for this measurement.
The resolution bandwidth of the spectrum analyser or receiver shall be adjusted to ensure
sufficient noise margin (greater than 6 dB) while allowing adequate sweep time, depending on
the chosen test procedure. The video bandwidth shall not be less than three times the
resolution bandwidth. The resolution bandwidth and video bandwidth shall be described in the
test report.
6.4 Preamplifier
A low noise high gain preamplifier may be used to enhance sensitivity or to meet the ambient
requirements in 8.2. In order to achieve the lowest noise floor for the measurements, the pre-
amplifier shall be connected to the probe with the shortest possible cable. Its characteristics
(e.g. gain, noise figure, etc.) should be included in the test report.

Near-field probes usually present very poor return loss. If the probe does not present a good
impedance match, noise figure and gain of the system will be modified. In order to avoid
unwanted effects such as oscillations or preamplifier damage, specific care is to be taken
during preamplifier selection in regards to its stability in near-field scan setup environment.
6.5 Cables
The scanning motion of the probe requires the use of flexible cables between certain
elements of the setup. Care shall be taken to choose cables that are durable for the scanning
motion of the probe besides maintaining their high frequency performance. The cable losses
as a function of frequency should be included in the test report.
Owing to the repeated movement of the cables, which can accelerate their deterioration,
calibration of the cables shall be carried out regularly. When the test frequency is higher than
1 GHz or phase measurements are to be carried out, the cables shall be calibrated before
each test.
6.6 Near-field probe
6.6.1 General
The near-field probes employed for surface scanning can take various forms depending on
the users' preferences, the type of field to be measured, the capabilities of the measurement
equipment, and the desired spatial resolution of the measurement. Probe calibration is
detailed in Annex A. Some probes receive a field only in a specific direction. In order to
receive fields in several directions, it is necessary to change the probe or rotate it during the
scan process. A brief description of the probe(s) used for the measurement shall be included
in the test report. Various types of near-field probes are discussed below.
NOTE The structures of magnetic and/or electric probes are shown in Annexes B and C. However, the applicable
frequency range depends on the probe structure and calibration method.
6.6.2 Magnetic (H) field probe
For magnetic field measurements, a single turn, miniature magnetic loop probe is often used.
The typical probe is composed of wire, coaxial cable, PCB traces, or any other suitable
material. An example of a magnetic field probe is shown in Annex B and in IEC 61967-6 [1] .
6.6.3 Electric (E) field probe
For electric field measurements, a miniature electric field probe is typically used. The probe
may be constructed of wire, coaxial cable, PCB traces, or any other suitable material. An
example electric field probe is shown in Annex B.
6.6.4 Combined electric and magnetic (E/H) field probe
For combined electric and magnetic field measurements, a single turn, miniature magnetic
loop probe is typically used. The probe may be constructed of wire, coaxial cable, PCB traces,
or any other suitable material. An example electromagnetic field probe is shown in Annex C.
6.6.5 Probe-positioning and data acquisition system
A precise probe-positioning system and data acquisition system are required. The probe-
positioning system shall be able to move the probe in at least two axes (parallel to the DUT
surface) and shall be capable of positioning the probe with a mechanical step at least ten
times less than the minimum required step size. Although this specification describes the use
of Cartesian scanning (X, Y and, optionally, Z-axis), polar and cylindrical scannings are also
_____________
Numbers in square brackets refer to the Bibliography.

– 12 – IEC TS 61967-3:2014  IEC 2014
possible. Annex D defines the three coordinate systems and how the position information can
be converted between them. When using Cartesian coordinates, the right-hand system is
preferred. If the left-hand system is used, it shall be indicated in the test report. In some
cases the probe-positioning system has a mechanical structure to rotate the probe for
adjusting probe orientation. It may be controlled by the data acquisition system.
The x, y and z position of the near-field probe may be out of alignment after the rotation. Care
should be taken to compensate the resulting offset by repositioning the probe.
An example of a probe-positioning system is shown in Figure 1. While not shown in Figure 1,
the DUT is installed on a PCB that is typically mounted on a test fixture to improve stability.
The data acquisition system is typically a computer with software enabling the desired scan
parameters, controlling the measuring instrument and the probe scanning system, and
acquiring the data. The system configurations and the controlling software shall be described
in the test report.
Gantry
z
y
x
Probe
DUT
2 or 3 – axis positioning system
IEC
Figure 1 – Example of probe-positioning system
7 Test setup
7.1 General
Test setup shall meet the requirements as described in IEC 61967-1. In addition, the following
test setup requirements shall apply.
7.2 Test configuration
The general test setups are shown in Figures 2, 3 and 4.

Spectrum analyser,
Preamplifier
EMI receiver or
(optional)
oscilloscope
Probe
Control and
Probe
data acquisition
positioning
system system
DUT
IEC
Figure 2 – One-input RF measurement setup
The setup of Figure 2 allows measurement of only magnitude. The setups of Figures 3 and 4
allow magnitude measurements with phase or time domain measurements.
Vector signal
measuring instrument
or oscilloscope
Probe
Control and
Probe
data acquisition
positioning
system
system
Fixed reference probe
DUT
IEC
Figure 3 – Two-input RF measurement setup with reference probe
For phase or time domain measurements, a reference signal is required. This signal may be
applied externally to a pin of the device, output from the device via a pin or captured with a
stationary auxiliary probe.
Reference signal
Vector signal
from DUT or external
measuring instrument
or oscilloscope
Probe
Control and
Probe
data acquisition
positioning
system
system
DUT
IEC
Figure 4 – Two-input RF measurement setup with reference signal

– 14 – IEC TS 61967-3:2014  IEC 2014
Phase information is needed in order to calculate the current distribution on the DUT (see 9.5).
If only the magnitude of the radiated field is required, phase information is not needed.
7.3 Test circuit board
The test circuit board, on which the DUT is mounted and scanned, may be any board
accessible to the scanning probe. If ICs are to be evaluated for comparison purposes, they
shall be tested on identical PCBs. The PCB may be an application PCB or a standardized test
circuit board designed in accordance with IEC 61967-1.
The test circuit board shall be firmly installed in the probe-positioning system to enhance test
reproducibility. This shall be accomplished by the use of a test fixture having a limited impact
on the radiated field.
7.4 Probe-positioning system software setup
After the DUT and its test PCB are set up, verify that the probe-positioning system software is
configured for the desired scan parameters, in particular those concerning the desired area to
be scanned. Ensure that there are no obstacles that could damage the probe within the
desired scan area. Some scanner software requires reference points to compensate for
alignment errors, origin offsets, etc., as well as to improve the reproducibility of the
measurements. Cameras, lasers and other such artifices may be used to assist the alignment.
Images of the DUT may also be recorded and used as a background for the field
measurements (see 9.4). A brief description of such procedures shall be included in the test
report.
7.5 DUT software
Appropriate software shall be implemented in the DUT during the measurement to meet the
requirements of IEC 61967-1. The description of the software shall be included in the test
report.
8 Test procedure
8.1 General
The test procedure shall be in accordance with IEC 61967-1 except as modified herein. These
default test conditions are intended to assure a consistent test environment. If the users of
this procedure agree to other conditions, they shall be documented in the test report.
8.2 Ambient conditions
The ambient RF noise level shall be measured to establish the noise floor of the test setup.
Only measurement results, at least 6 dB above the noise floor, are considered reliable. The
DUT shall be installed in the test set-up, as used for testing. The DUT shall not be activated
(e.g. power supply voltage disconnected). The test equipment shall be adjusted for an
operational scan. A scan shall be made to measure the ambient noise and the results shall be
described in the test report.
If the ambient RF noise level is excessive, the integrity of the overall measurement system,
especially the interconnecting cables and connectors, shall be checked. If necessary, a
shielded enclosure, a lower noise and/or higher gain preamplifier or a narrower resolution
bandwidth shall be used.
8.3 Operational check
The DUT shall be energized and an operational check shall be performed to ensure proper
operation of the device (i.e. Run IC test code).

8.4 Test technique
With the IC test board energized and the DUT operated in the intended test mode, measure
the signal level at the output terminal of the probe at each desired frequency, location and
field direction.
The procedure used will depend on the configuration of the DUT, the test equipment, the
positioning system and data acquisition system, as well as any user’s preferences. For
example, it is possible to position the probe at a specific location, measure data at a series of
frequencies and then move to the next location. However, it may be preferred to measure
data at a specific frequency over the entire surface before changing the measurement
frequency and rescanning the entire surface.
At a specific location the measurement may be made at a specific frequency (i.e. the
spectrum analyser operating at a single fixed frequency or in "Zero span" mode) or over a
band of frequencies swept by the receiver or spectrum analyser (i.e. Centre frequency/span
mode or start/stop frequency mode). Care shall be taken to choose a swept frequency band,
resolution bandwidth, video bandwidth and sweep time so as to allow for a complete cycle of
IC operation.
When using a spectrum an
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