IEC/SC 65E - IEC_SC_65E

IEC 62382:2024 defines procedures and specifications for loop check, which comprises the activities between the completion of the loop construction (including installation and point-to-point checks) and the beginning of cold commissioning. This document is applicable for the construction of new plants and for expansion or retrofits (i.e. revamping) of electrical and instrument (E&I) installations in existing plants (including PLC, DCS, panel-mounted and field instrumentation). It does not include a detailed checkout of power distribution systems, except as they relate to the loops being checked (i.e. a motor starter or a power supply to a four-wire transmitter). Loop checks can be performed throughout the lifecycle of the plant. This document is also applicable when loop checks are performed after commissioning. This document describes what is intended to be tested but not how the test is performed, due to the wide range of technologies and equipment available. The intent of this document is to provide a means for all parties, including the owner, the installer and the vendor, to clearly establish and agree on the scope of activities and responsibilities involved in performing these tests in order to achieve a timely delivery and acceptance of the automation system. The activities described in this document can be taken as a guideline and adapted to the specific requirements of the process, plant or equipment. This edition includes the following significant technical changes with respect to the previous edition: a) general re-organization of the content of the previous edition, moving informative content to the annexes; b) replacing the forms based on I/O type in IEC 62382:2012, Annex A to Annex E with an example of a generic loop check form; c) providing additional references to other applicable standards.

IEC 63082-2:2024 specifies requirements and recommendations for establishing and maintaining intelligent device management (IDM) as outlined in IEC TR 63082-1 in an enterprise having one or more facilities. The following topics are included in the scope of this document: - optimizing functionality and performance of intelligent devices for their use; - managing information related to IDM; - integrating intelligent devices into industrial automation and control systems (IACS) in facilities; - exchanging information between stakeholders that achieve and sustain IDM; - coordinating multiple asynchronous IDM life cycles. The following topics are outside the scope of this document: - defining and determining the function and performance of intelligent devices; - defining and specifying technologies and tools that provide, preserve and manage information related to IDM such as FDT, FDI, portable on-line and off-line tools, configuration tools, historians, and maintenance planning tools; - defining and specifying technologies and tools that are used to design intelligent devices; - defining and specifying communication network architecture, communication technologies, cybersecurity requirements, and network management requirements.

IEC 62381:2024 defines requirements and checklists for the factory acceptance test (FAT), the factory integration test (FIT), the site acceptance test (SAT), and the site integration test (SIT). These tests are carried out to demonstrate that the automation system meets the requirements of the applicable specification. This document provides a means for all parties, including the owner, the buyer, and the vendor, to clearly establish and agree on the scope of activities and responsibilities involved in performing these tests in order to achieve a timely delivery and acceptance of the automation system. The activities specified in this document can be used to develop test plans adapted to the specific requirements of the process/plant/equipment. The annexes of this document contain checklists which are available for consideration when preparing specific test procedures and documentation for a specific automation system. This edition includes the following significant technical changes with respect to the previous edition: a) General re-organization of the standard; b) Current technology incorporated; c) Optional factory integration test (FIT) added; d) Replaced the forms in the annexes with detailed checklists of activities which can be used to develop project-specific test plans; and e) Provided additional references to other applicable standards.

IEC 61987-32:2024 This part of IEC 61987 provides an operating list of properties (OLOP) for the description of the operating parameters and the collection of requirements for I/O modules and a device list of properties (DLOP) for the description of a range of I/O module types. The structures of the OLOP and the DLOPs correspond to the general structures defined in IEC 61987-11 and agree with the fundamentals for the construction of LOPs defined in IEC 61987-10. Aspects other than the OLOP, needed in different electronic data exchange processes and described in IEC 61987-10 and IEC 61987-11, are published in IEC 61987-92. The locations of the libraries of properties and of blocks used in the LOPs concerned are listed in Annex C and Annex D.

IEC 61406-2:2024 complements IEC 61406-1 by providing additional requirements for those cases where data elements are encoded within the Structured Identification Link string with standardized syntax and semantics. In addition, this document covers cases where the uniqueness relates to product types/models or lots/batches. The default assumption is that the Identification Link identifies unique objects such as unique serialized products, assets, persons or packages, unless otherwise identified.

Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM1), also based on CIPTM, is defined in [15]. This part of IEC 62453 provides information for integrating the CIPTM technology into the FDT interface specification (IEC 62453-2). This part of IEC 62453 specifies communication and other services. This specification neither contains the FDT specification nor modifies it.

IEC 62453-71:2023 specifies an OPC UA Information Model to represent the device information based on FDT-defined device integration.

IEC 62769-6-100:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) using the Runtime .NET. This runtime is specific only to the WORKSTATION platform as defined in IEC 62769‑4. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-102-2:2023 defines the protocol-specific definitions (PSDs) as defined in IEC 62769‑100 (annex on generic protocol extensions) for the Ethernet/IP protocol.

IEC 62769-6-200:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) for the Runtime HTML5. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-109-1:2023 is available as IEC 62769-109-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-109-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 9/1 (HART®)[2] and IEC 61784‑1_CP 9/2 (WirelessHART®)[3]. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] HART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [3] WirelessHART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-151-1:2023 defines the protocol-specific definitions (PSDs) as defined in IEC 62769‑7 for the OPC UA protocol.

IEC 62769-101-2:2023 is available as IEC 62769-101-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1]. [1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-103-4:2023 is available as IEC 62769-103-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-103-1:2023 is available as IEC 62769-103-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-150-1:2023 is available as IEC 62769-150-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-150-1:2023 specifies an FDI profile of IEC 62769 for IEC 62734 (ISA100.11a)[1]. [1] ISA100 WIRELESSTM is a trade name of the non-profit consortium Wireless Compliance Institute. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-101-1:2023 is available as IEC 62769-101-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2]. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI® Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-100:2023 is available as IEC 62769-100:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-100:2023 specifies an FDI®[1] profile of IEC 62769 for Generic Protocols. That means that all interfaces are defined and a host can add support for more protocols without changing its implementation. Nevertheless, there are some protocol specific definitions (PSD) that need to be specified per protocol using this profile. Annex C specifies what PSD need to be defined per protocol so that FDI® Device Packages, FDI® Communication Packages for Gateways and FDI® Communication Servers, FDI® Communication Server, Gateways and Devices supporting such a protocol can work together in a host not aware about this specific protocol.

IEC 62769-4:2023 is available as IEC 62769-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

IEC 62769-5:2023 is available as IEC 62769-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-5:2023 defines the FDI®[1] Information Model. One of the main tasks of the Information Model is to reflect the topology of the automation system. Therefore, it represents the devices of the automation system as well as the connecting communication networks including their properties, relationships, and the operations that can be performed on them. The types in the AddressSpace of the FDI® Server constitute some kind of catalogue, which is built from FDI® Packages. The fundamental types for the FDI® Information Model are well defined in OPC UA for Devices (IEC 62541‑100). The FDI® Information Model specifies extensions for a few special cases and otherwise explains how these types are used and how the contents are built from elements of DevicePackages. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.

IEC 62769-1:2023 is available as IEC 62769-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-3:2023 is available as IEC 62769-3:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-3:2023 specifies the FDI®[1] Server. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. Annex A provides a functional description of the FDI® Server. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 62769-2:2023 is available as IEC 62769-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-2:2023 specifies the FDI®[1] Client. See Annex C for some typical FDI® Client use cases. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

IEC 61987-31:2022 provides  
a characterization for the integration of infrastructure devices in the Common Data Dictionary (CDD);
generic structures in conformance with IEC 61987-10 for Operating Lists of Properties (OLOPs) and Device Lists of Properties (DLOPs) of infrastructure devices.  The generic structures for the OLOP and DLOP contain the most important blocks for infrastructure devices. Blocks pertaining to a specific equipment type will be described in the corresponding part of the IEC 61987 series. Similarly, equipment properties are not part of this part of IEC 61987. For instance, the OLOP and DLOP for I/O-modules are to be found in IEC 61987-32.

IEC 61406-1:2022 specifies minimum requirements for a globally unique identification of physical objects which also constitutes a link to its related digital information. This identification is designated hereinafter as "Identification Link" (IL), with the encoded data designated as IL string. The IL string has the data-format of a link (URL). The IL is machine-readable and is attached to the physical object in a 2D symbol or NFC tag. The requirements in this standard apply to physical objects: - that are provided by the manufacturer as an individual unit, - and that have already been given a unique identity by the manufacturer. This document does not specify any requirements on the content and the layout of nameplates/typeplates (e.g. spatial arrangement, content of the plain texts, approval symbols etc.).

The IEC 62714 series specifies an engineering data exchange format for use in industrial automation systems. This part of IEC 62714 specifies normative as well as informative AML libraries for the modelling of engineering information for the exchange between engineering tools in the plant automation area by means of AML. Moreover, it presents additional user defined libraries as an example. Its provisions apply to the export/import applications of related tools. This part of IEC 62714 specifies AML role class libraries and AML attribute type libraries. Role classes provide semantics to AML objects, attribute types provide semantics to AML attributes. The association of role classes to AML objects or attribute types to AML attributes represent the possibility to add (also external) semantic to it. By associating a role class to an AML object or an attribute type to an AML attribute,it gets a semantic.This part of IEC 62714 does not define details of the data exchange procedure or implementation requirements for the import/export tools.

IEC 63365:2022 applies to products used in the process measurement, control and automation industry. It establishes a concept and requirements for the digital nameplate and provides alternative electronically readable solutions (e.g. 2D codes, RFID or firmware) to current conventional plain text marking on the nameplate or packaging of products. The digital nameplate information is contained in the electronically readable medium affixed to the product, the packaging or accompanying documents. The digital nameplate information is available offline without Internet connection. After electronic reading, all digital nameplate information is displayed in a human readable text format. The digital nameplate also includes the Identification Link String according to IEC 61406-1 which provides additional online information for the product. This document does not specify the contents of the conventional nameplate, which are subject to regional or national regulations and standards.

Communication Profile Family 9 (commonly known as HART®1) defines communication profiles based on IEC 61158-5-20 and IEC 61158-6-20. The basic profile CP 9/1 is defined in IEC 61784-1. This part of IEC 62453 provides information for integrating the HART® technology into the FDT standard (IEC 62453-2). This part of the IEC 62453 specifies communication and other services. This standard neither contains the FDT specification nor modifies it.

IEC 62453-2:2022 is available as IEC 62453-2:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62453-2:2022 explains the common principles of the field device tool concept. These principles can be used in various industrial applications such as engineering systems, configuration programs and monitoring and diagnostic applications. This document specifies the general objects, general object behavior and general object interactions that provide the base of FDT.

Engineering processes of technical systems and their embedded automation systems have to be executed with increasing efficiency and quality. Especially since the project duration tends to increase as the complexity of the engineered system increases. To solve this problem, the engineering process is more often being executed by exploiting software based engineering tools exchanging engineering information and artefacts along the engineering process related tool chain. Communication systems establish an important part of modern technical systems and, especially, of automation systems embedded within them. Following the increasing decentralisation of automation systems and the application of fieldbus and Ethernet technology connecting automation devices and further interacting entities have to fulfil special requirements on communication quality, safety and security. Thus, within the engineering process of modern technical systems, engineering information and artefacts relating to communication systems also have to be exchanged along the engineering process tool chain. In each phase of the engineering process of technical systems, communication system related information can be created which can be consumed in later engineering phases. A typical application case is the creation of configuration information for communication components of automation devices including communication addresses and communication package structuring within controller programming devices during the control programming phase and its use in a device configuration tool. Another typical application case is the transmission of communication device configurations to virtual commissioning tools, to documentation tools, or to diagnosis tools. At present, the consistent and lossless transfer of communication system engineering information along the complete engineering chain of technical systems is unsolved. While user organisations and companies have provided data exchange formats for parts of the relevant information like FDCML, EDDL, and GSD the above named application cases cannot be covered by a data exchange format. Notably the networking related information describing communication relations and their properties and qualities cannot be modelled by a data exchange format.

IEC 61987-92:2018 provides the lists of properties (LOPs) describing aspects of equipment for industrial-process automation that is subject to IEC 61987 standard series. This standard series proposes a method for standardization which will help both suppliers and users of measuring equipment to optimize workflows both within their own companies and in their exchanges with other companies. IEC 61987-92 contains additional aspects that are common to all devices, for example, “Packaging and transportation”, “Calibration and test results” and “Device documents supplied”. The structures of the LOPs correspond to the general structures defined in IEC 61987-11 and agree with the fundamentals for the construction of LOPs defined in IEC 61987-10. Libraries of properties and of blocks used in the aspect LOPs are listed in Annex B and Annex C.

NEW!IEC 62714-1:2018 is available as IEC 62714-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62714-1:2018 is a solution for data exchange focusing on the domain of automation engineering. The data exchange format defined in the IEC 62714 series (Automation Markup Language, AML) is an XML schema based data format and has been developed in order to support the data exchange in a heterogeneous engineering tools landscape. The goal of AML is to interconnect engineering tools in their different disciplines, e.g. mechanical plant engineering, electrical design, process engineering, process control engineering, HMI development, PLC programming, robot programming, etc. This second edition cancels and replaces the first edition published in 2014. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) use of CAEX 3.0 according to IEC 62424:2016 b) improved modelling of references to documents outside of the scope of the present standard, c) modelling of references between CAEX attributes and items in external documents, d) revised role libraries, e) modified Port concept, f) modelling of multilingual expressions, g) modelling of structured attribute lists or array, h) a new AML container format, i) a new standard AML attribute library

This part of IEC 62769 specifies the FDI Server. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. [Figure 1 - FDI architecture diagram]

This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1. [Figure 1 - FDI architecture diagram]

This part of IEC 62769 specifies the FDI Client. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. [Figure 1 - FDI architecture diagram]

This part of IEC 62769 describes the concepts and overview of the Field Device Integration (FDI) specifications. The detailed motivation for the creation of this technology is also described (see 4.1). Reading this document is helpful to understand the other parts of this multi-part standard.

This part of IEC 62769 defines the FDI Information Model. One of the main tasks of the Information Model is to reflect the topology of the automation system. Therefore, it represents the devices of the automation system as well as the connecting communication networks including their properties, relationships, and the operations that can be performed on them. The types in the AddressSpace of the FDI Server constitute a catalogue, which is built from FDI Packages. The fundamental types for the FDI Information Model are well defined in OPC UA for Devices (IEC 62541-100). The FDI Information Model specifies extensions for a few special cases and otherwise explains how these types are used and how the contents are built from elements of DevicePackages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. [Figure 1 - FDI architecture diagram]

This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI) standard. The technology mapping focuses on implementation regarding the components FDI Client and User Interface Plug-in (UIP) that are specific only to the WORKSTATION platform/.NET as defined in IEC 62769-4.

This part of IEC 62769 specifies the elements implementing communication capabilities called Communication Devices (IEC 62769-5). The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device. [Figure 1 - FDI architecture diagram]

This part of IEC 62769 specifies an FDI profile for IEC 62734 (ISA100 WIRELESS).

IEC 61804-2:2018 specifies FB (function blocks) by using the result of a harmonization work as regards several elements. a) The device model which defines the components of an IEC 61804-2 conformant device. b) Conceptual specifications of FBs for measurement, actuation and processing. This includes general rules for the essential features to support control, whilst avoiding details which stop innovation as well as specialization for different industrial sectors. c) The electronic device description (EDD) technology, which enables the integration of real product details using the tools of the engineering life cycle. This third edition cancels and replaces the second edition published in 2006 and integrates parts of IEC 61804-1 which was withdrawn in January 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) added command communication mapping in Clause 8; b) moved and reword compatibility level definition from IEC 62804-1 to new Annex B and terms and definitions; c) added proxy concept in new Annex C.

IEC 62769-101-1:2020 is available as IEC 62769-101-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-1:2020 specifies the IEC 62769 profile for IEC 61784 1_CP 1/1 (FOUNDATION™ Fieldbus H1) .

IEC 62769-101-2:2020 is available as IEC 62769-101-2:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2020 specifies the IEC 62769 profile for IEC 61784 1, CP 1/2 (FOUNDATION™ Fieldbus HSE).

IEC 62453-302:2016 provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision. The main changes are provided in order to provide improved support for Ethernet IP (see Clauses 9, 10, and 12), additional implementation hints (see Annex A) and to support introduction of the technology according to IEC TR 62453-42. This publication is to be read in conjunction with IEC 62453-2:2009.

IEC 62769-100:2020 specifies an FDI profile of IEC 62769 for generic protocols. That means that all interfaces are defined, and a host can add support for more protocols without changing its implementation. Nevertheless, there are some protocol-specific definitions (PSD) that need to be specified per protocol using this profile. Annex C specifies what PSDs need to be defined per protocol so that FDI Device Packages, FDI Communication Packages for Gateways and FDI Communication Servers, FDI Communication Servers, Gateways and Devices supporting such a protocol can work together in a host not aware about this specific protocol.

IEC 62769-115-2:2020 defines the protocol-specific definitions (PSDs) as defined in IEC 62769-7 on generic protocol extensions for the Modbus® -RTU protocol in accordance with CPF 15 in IEC 61784 2.

IEC 62541-4:2020 is available as IEC 62541-4:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62541-4:2020 defines the OPC Unified Architecture (OPC UA) Services. The Services defined are the collection of abstract Remote Procedure Calls (RPC) that are implemented by OPC UA Servers and called by OPC UA Clients. All interactions between OPC UA Clients and Servers occur via these Services. The defined Services are considered abstract because no particular RPC mechanism for implementation is defined in this document. IEC 62541-6 specifies one or more concrete mappings supported for implementation. For example, one mapping in IEC 62541-6 is to XML Web Services. In that case the Services described in this document appear as the Web service methods in the WSDL contract. Not all OPC UA Servers will need to implement all of the defined Services. IEC 62541-7 defines the Profiles that dictate which Services need to be implemented in order to be compliant with a particular Profile This third edition cancels and replaces the second edition published in 2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Added ability to resend all data of monitored items in a Subscription using the ResendData Method. b) Added support for durable Subscriptions (lifetime of hours or days). c) Added Register2 and FindServersOnNetwork Services to support network-wide discovery using capability filters. d) Removed definition of software certificates. Will be defined in a future edition. e) Extended and partially revised the redundancy definition. Added sub-range definitions for ServiceLevel and added more terms for redundancy. f) Added a section on how to use Authorization Services to request user access tokens. g) Added JSON Web Tokens (JWTs) as a new user token. h) Added the concept of session-less service invocation. i) Added a generic structure that allows passing any number of attributes to the AddNodes Service. j) Added requirement to protect against user identity token attacks. k) Added new EncryptedSecret format for user identity tokens.