EN IEC 62769-4:2021

SLOVENSKI STANDARD
01-julij-2021
Nadomešča:
SIST EN 62769-4:2015
Integracija procesne naprave (FDI) - 4. del: Paketi FDI (IEC 62769-4:2021)
Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021)
Feldgeräteintegration (FDI) - Teil 4: FDI-Packages (IEC 62769-4:2021)
Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI (IEC 62769-4:2021)
Ta slovenski standard je istoveten z: EN IEC 62769-4:2021
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62769-4

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 25.040.40; 35.100.05 Supersedes EN 62769-4:2015 and all of its amendments
and corrigenda (if any)
English Version
Field Device Integration (FDI) - Part 4: FDI Packages
(IEC 62769-4:2021)
Intégration des appareils de terrain (FDI) - Partie 4: Feldgeräteintegration (FDI) - Teil 4: FDI-Packages
Paquetages FDI (IEC 62769-4:2021)
(IEC 62769-4:2021)
This European Standard was approved by CENELEC on 2021-03-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62769-4:2021 E

European foreword
The text of document 65E/761/FDIS, future edition 2 of IEC 62769-4, prepared by SC 65E "Devices
and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement, control and
automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-12
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-12
document have to be withdrawn
This document supersedes EN 62769-4:2015 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62769-4:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61784-1 NOTE Harmonized as EN IEC 61784-1
IEC 61784-2 NOTE Harmonized as EN IEC 61784-2
IEC 62591 NOTE Harmonized as EN 62591
IEC 62769-2 NOTE Harmonized as EN 62769-2
IEC 62769-3 NOTE Harmonized as EN 62769-3
IEC 62769-5 NOTE Harmonized as EN 62769-5
IEC 62769-7 NOTE Harmonized as EN 62769-7
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61804 series Function blocks (FB) for process control and EN IEC 61804 series
electronic device description language (EDDL)
IEC 61804-5 2015 Function blocks (FB) for process control and EN 61804-5 2015
electronic device description language (EDDL)
- Part 5: EDDL Builtin library
IEC 62769-1 - Field Device Integration (FDI) - Part 1: EN 62769-1 -
Overview
IEC 62769-6 - Field Device Integration (FDI) - Part 6: EN 62769-6 -
Technology Mapping
ISO/IEC 29500-2 2016 Information technology - Document - -
description and processing languages - Office
Open XML File Formats - Part 2: Open
Packaging Conventions
ISO 639-1 - Codes for the representation of names of - -
languages - Part 1: Alpha-2 code
ISO 32000-1 - Document management_- Portable document - -
format – Part 1: PDF 1.7
Extensible Markup - W3C Recommendation, available at - -
Language (XML) 1.0
XML Schema - W3C Recommendation, available at - -
Definition Language
(XSD) 1.1
ETSI EN 319 132-1 - Electronic Signatures and Infrastructures - -
(ESI); XAdES digital signatures; Part 1:
Building blocks and XAdES baseline
signatures
ETSI TS 101 733 - Electronic Signatures and Infrastructures - -
(ESI); CMS Advanced Electronic Signatures
(CAdES)
FIPS 140-2 - Security Requirements for Cryptographic - -
Modules
IEC 62769-4 ®
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –

Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –

Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9311-9

– 2 – IEC 62769-4:2021 © IEC 2021
CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms, definitions, abbreviated terms and conventions . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
3.3 Conventions . 12
4 FDI Package Model . 12
4.1 Overview. 12
4.2 FDI Package Elements . 14
4.2.1 Package Catalog . 14
4.2.2 Electronic Device Description . 14
4.2.3 User Interface Plug-in . 14
4.2.4 Attachment . 16
4.3 FDI Package Types . 16
4.3.1 FDI Device Package . 16
4.3.2 FDI Communication Package . 17
4.3.3 FDI UIP Package . 18
4.3.4 FDI Profile Package . 18
5 FDI Package implementation . 20
5.1 Packaging technology . 20
5.2 Use of Open Packaging Conventions . 20
5.2.1 Unknown parts . 20
5.2.2 Invalid parts . 20
5.2.3 Unknown relationships . 20
5.2.4 Interleaving. 20
5.2.5 Core properties . 20
5.2.6 Thumbnails . 20
5.2.7 Digital signatures . 20
5.3 FDI Package Parts . 21
5.3.1 Package Catalog . 21
5.3.2 Electronic Device Description . 22
5.3.3 User Interface Plug-in . 22
5.3.4 Attachments . 25
6 FDI Package Versioning . 27
6.1 Version scheme . 27
6.2 Versioned elements . 28
6.3 Version Hierarchy . 28
6.4 UIP Compatibility . 30
7 Digital Signatures and Registration Certificates . 31
7.1 Signed Elements and Certification documents . 31
7.2 Signing mechanism . 32
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 33

IEC 62769-4:2021 © IEC 2021 – 3 –
Annex A (normative) File name conventions . 34
A.1 Identification . 34
A.2 FDI Package filename convention . 34
Annex B (informative) FDI Package Creation . 35
B.1 General . 35
B.2 Tools and Components . 35
B.3 Development . 35
Annex C (informative) FDI Package deployment . 38
C.1 General . 38
C.2 Scenarios . 38
Annex D (informative) Example . 41
D.1 General . 41
D.2 Open Packaging Conventions . 41
D.3 Creation and Handling of FDI Packages . 44
D.4 FDI Device Package Example . 44
Annex E (normative) Schema . 52
E.1 Target Namespace . 52
E.2 Catalog . 52
E.3 ClassificationIdT . 52
E.4 CommunicationProfileT . 52
E.5 CommunicationRoleT . 52
E.6 CommunicationServerT . 53
E.7 DeviceTypeT . 53
E.8 FdiRegistrationCert . 54
E.9 FdiRegistrationCertT . 54
E.10 InterfaceT . 55
E.11 ListOfCommunicationProfilesT . 56
E.12 ListOfDeviceImagesT . 57
E.13 ListOfDeviceTypesT . 57
E.14 ListOfDocumentsT . 57
E.15 ListOfInterfacesT . 58
E.16 ListOfLocalizedStringsT . 58
E.17 ListOfProtocolSupportFilesT . 58
E.18 ListOfRegDeviceTypesT . 59
E.19 ListOfRegistrationsT . 59
E.20 ListOfSupportedDeviceRevisionsT . 60
E.21 ListOfSupportedUipsT . 60
E.22 ListOfUipVariantsT . 60
E.23 LocalizedStringT . 61
E.24 PackageT . 61
E.25 PackageTypeT . 62
E.26 PlatformT . 63
E.27 RegDeviceTypeT . 63
E.28 RegistrationT . 64
E.29 RelationshipIdT . 64
E.30 String256T . 65
E.31 SupportedUipT . 65
E.32 UipCatalog . 65

– 4 – IEC 62769-4:2021 © IEC 2021
E.33 UipStyleT . 66
E.34 UipT . 66
E.35 UipVariantT . 67
E.36 UuidT . 67
E.37 VersionSupportedT . 68
E.38 VersionT . 68
Annex F (normative) Communication protocol specific profiles . 69
Annex G (informative) FDI Package life cycle use cases . 70
G.1 New Device Type . 70
G.2 Replacement of Device . 70
G.3 Firmware enhancements . 70
G.4 FDI Package life cycle polices . 71
G.5 FDI Package update . 71
G.6 FDI Package upgrade . 71
G.7 FDI Package replacement/exchange . 71
G.8 FDI Package uninstallation . 71
Annex H (normative) Health Status Method . 73
H.1 Background. 73
H.2 Device Health Status model . 73
H.3 Standard EDD Method signature . 73
H.4 Performance considerations . 74
Annex I (normative) Modular devices . 75
I.1 Concept . 75
I.2 EDDL usage profile . 75
I.3 Processing recommendations . 76
Annex J (normative) FDI Communication Packages for FDI Communication Server . 78
J.1 General . 78
J.2 Protocol Support File . 78
J.3 CommunicationProfile definition . 78
J.4 Profile Device . 78
J.5 Protocol version information . 78
J.6 Associating a Package with an FDI Communication Server . 78
J.7 Handling of Catalog elements . 78
J.8 Example. 79
Annex K (normative) FDI Profile for EDDs . 80
K.1 Overview. 80
K.2 Entry Point to Online handling . 80
K.3 Entry Point to Offline handling. 80
K.4 Upload and Download . 80
K.5 Initial Data Set . 80
K.6 Method GetHealthStatus . 80
K.7 Actions . 80
K.8 Shared files . 81
Bibliography . 82

Figure 1 – FDI architecture diagram . 10
Figure 2 – FDI Package Model . 13
Figure 3 – Architectural mapping . 13

IEC 62769-4:2021 © IEC 2021 – 5 –
Figure 4 – User Interface Plug-in Reference Model . 15
Figure 5 – Multiple FDI Packages referencing a common UIP . 16
Figure 6 – FDI Device Package . 17
Figure 7 – FDI Communication Package . 18
Figure 8 – FDI UIP Package . 18
Figure 9 – FDI Profile Package . 19
Figure 10 – Device Function and Parameter sets (type- and profile-specific) . 19
Figure 11 – Catalog Element . 21
Figure 12 – User Interface Plug-in . 23
Figure 13 – UIP Catalog . 24
Figure 14 – FDI Registration Certificate . 27
Figure 15 – Version Hierarchy . 29
Figure 16 – UIP Version Support concept . 31
Figure 17 – FDI Package signing . 32
Figure B.1 – Tools used for FDI Package development . 36
Figure D.1 – Parts and relationships in a package . 41
Figure D.2 – Creating an FDI Package with the content files . 44
Figure D.3 – FDI Device Package Example . 45
Figure D.4 – User Interface Plug-in Example (fancytrend.uip) . 48
Figure I.1 – Modular device's package . 75

Table 1 – UIP Platform . 15
Table 2 – Package Catalog Part . 21
Table 3 – EDD part . 22
Table 4 – User Interface Plug-in part . 23
Table 5 – UIP Catalog Part . 24
Table 6 – UIP Variant Part . 25
Table 7 – Image Part . 25
Table 8 – Documentation Part . 26
Table 9 – Protocol Support File Part . 26
Table 10 – FDI Registration Certificate Part . 26
Table 11 – Versioned Elements . 28
Table 12 – Influence on FDI Package Version . 29
Table A.1 – FDI Package Naming Convention . 34
Table D.1 – Examples of standard MIME media types that can be used in FDI
packages . 43
Table D.2 – Examples of FDI custom MIME media types that can be used in FDI

Packages . 43
Table E.1 – Enumerations of CommunicationRoleT . 53
Table E.2 – Elements of CommunicationServerT . 53
Table E.3 – Elements of DeviceTypeT . 54
Table E.4 – Elements of FdiRegistrationCertT. 55
Table E.5 – Elements of InterfaceT . 56
Table E.6 – Elements of ListOfCommunicationProfilesT . 56

– 6 – IEC 62769-4:2021 © IEC 2021
Table E.7 – Elements of ListOfDeviceImagesT . 57
Table E.8 – Elements of ListOfDeviceTypesT . 57
Table E.9 – Elements of ListOfDocumentsT . 58
Table E.10 – Elements of ListOfInterfacesT . 58
Table E.11 – Elements of ListOfLocalizedStringsT . 58
Table E.12 – Elements of ListOfProtocolSupportFilesT . 59
Table E.13 – Elements of ListOfRegDeviceTypesT . 59
Table E.14 – Elements of ListOfRegistrationsT . 60
Table E.15 – Elements of ListOfSupportedDeviceRevisionsT . 60
Table E.16 – Elements of ListOfSupportedUipsT . 60
Table E.17 – Elements of ListOfUipVariantsT. 61
Table E.18 – Attributes of LocalizedStringT . 61
Table E.19 – Elements of PackageT . 62
Table E.20 – Enumerations of PackageTypeT . 63
Table E.21 – Enumerations of PlatformT . 63
Table E.22 – Elements of RegDeviceTypeT . 64
Table E.23 – Elements of RegistrationT . 64
Table E.24 – Elements of SupportedUipT. 65
Table E.25 – Enumerations of UipStyleT . 66
Table E.26 – Elements of UipT . 67
Table E.27 – Elements of UipVariantT . 67
Table F.1 – Communication protocol interest groups (alphabetical order) . 69
Table G.1– Device Replacement Guidelines . 70
Table G.2 – Firmware enhancement guidelines . 71
Table H.1 – Health Status State . 73
Table J.1 – Catalog Mapping . 78
Table J.2 – Handling of Catalog elements . 78

IEC 62769-4:2021 © IEC 2021 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –

Part 4: FDI Packages
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62769-4 has been prepared by subcommittee 65E: Devices and
integration in enterprise systems, of IEC technical committee 65: Industrial-process
measurement, control and automation.
This second edition cancels and replaces the first edition published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) support for Package Developers to build EDDs targeted for today's EDD bases system
under a single development tool;
b) digital signature now includes trusted timestamping for long-term validation of FDI
Package;
c) time stamp for device package signature.

– 8 – IEC 62769-4:2021 © IEC 2021
The text of this International Standard is based on the following documents:
FDIS Report on voting
65E/761/FDIS 65E/771/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62769 series, published under the general title Field Device
Integration (FDI), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
IEC 62769-4:2021 © IEC 2021 – 9 –
INTRODUCTION
The IEC 62769 series has the general title Field Device Integration (FDI) and the following
parts:
– Part 1: Overview
– Part 2: FDI Client
– Part 3: FDI Server
– Part 4: FDI Packages
– Part 5: FDI Information Model
– Part 6: FDI Technology Mapping
– Part 7: FDI Communication Devices
– Part 100: Profiles – Generic Protocol Extensions
– Part 101-1: Profiles – Foundation Fieldbus H1
– Part 101-2: Profiles – Foundation Fieldbus HSE
– Part 103-1: Profiles – PROFIBUS
– Part 103-4: Profiles – PROFINET
– Part 109-1: Profiles – HART and WirelessHART
– Part 115-2: Profiles – Protocol-specific Definitions for Modbus RTU
– Part 150-1: Profiles – ISA 100.11a

– 10 – IEC 62769-4:2021 © IEC 2021
FIELD DEVICE INTEGRATION (FDI) –

Part 4: FDI Packages
1 Scope
This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated
in Figure 1. The architectural components that are within the scope of this document have
been highlighted in Figure 1.
Figure 1 – FDI architecture diagram
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61804 (all parts), Function blocks (FB) for process control and electronic device
description language (EDDL)
IEC 62769-4:2021 © IEC 2021 – 11 –
IEC 61804-5:2015, Function blocks (FB) for process control and electronic device description
language (EDDL) – Part 5: EDDL Builtin library
IEC 62769-1, Field Device Integration (FDI) – Part 1: Overview
IEC 62769-6, Field Device Integration (FDI) – Part 6: FDI Technology Mapping
ISO/IEC 29500-2:2016, Information technology – Document description and processing
languages – Office Open XML File Formats – Part 2: Open Packaging Conventions
ISO 639-1, Codes for the representation of names of languages – Part 1: Alpha-2 code
ISO 32000-1, Document management – Portable document format – Part 1: PDF 1.7
Extensible Markup Language (XML) 1.0, W3C Recommendation, available at

XML Schema Definition Language (XSD) 1.1, W3C Recommendation, available at

ETSI EN 319 132-1, Electronic Signatures and Infrastructures (ESI); XAdES digital
signatures; Part 1: Building blocks and XAdES baseline signatures
ETSI TS 101 733, Electronic Signatures and Infrastructures (ESI); CMS Advanced Electronic
Signatures (CAdES)
FIPS 140-2, Security Requirements for Cryptographic Modules
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62769-1,
ISO/IEC 29500-2, and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
Attachment
device and protocol-specific support files that are not directly used to integrate the Device into
the system
3.1.2
FDI Communication Package
FDI Package that provides information to integrate an FDI Communication Server to an FDI
Server
3.1.3
FDI Device Package
FDI Package that provides one or more device types to an FDI Server

– 12 – IEC 62769-4:2021 © IEC 2021
3.1.4
FDI Package Model
description of the structure and elements of an FDI Package
3.1.5
FDI Profile Package
FDI Package that provides information for creating a device type node that can be associated
with a class of devices
3.1.6
FDI Registration Authority
entity that has the right and the ability to perform FDI conformance tests on FDI Packages
and to issue registration certificate documents
3.1.7
FDI UIP Package
FDI Package that provides one or more UIPs to an FDI Server
3.1.8
Package Catalog
file that describes the contents of an FDI Package
3.1.9
UIP Catalog
file that describes the properties of a UIP
3.1.10
UIP Variant
platform-specific element of a User Interface Plug-in
Note 1 to entry: A UIP is composed of one or more variants. For example, one variant may be optimized for
portable devices while another variant is optimized for large-screen devices.
3.2 Abbreviated terms
For the purposes of this document, the abbreviated terms given in IEC 62769-1 as well as the
following apply.
CFF Capabilities File for FOUNDATION Fieldbus
ID Identifier
IDE Integrated Development Environment
IM Information Model
PNG Portable network graphics
ZIP Zipper (archive file format)

3.3 Conventions
For the purposes of this document, the conventions given in IEC 62769-1 apply.
4 FDI Package Model
4.1 Overview
The FDI Package Model (see Figure 2) provides all the elements necessary to integrate
devices, network components and FDI Communication Servers into a system.

IEC 62769-4:2021 © IEC 2021 – 13 –

Figure 2 – FDI Package Model
Figure 3 shows the m
...