EN IEC 62769-5:2023

SLOVENSKI STANDARD
01-november-2023
Integracija procesne naprave (FDI®) - 5. del: Informacijski model FDI (IEC 62769-
5:2023)
Field Device Integration (FDI®) - Part 5: FDI Information Model (IEC 62769-5:2023)
Feldgeräteintegration (FDI®) - Teil 5: FDI-Informationsmodell (IEC 62769-5:2023)
Intégration des appareils de terrain (FDI®) - Partie 5: Modèle d'Information FDI (IEC
62769-5:2023)
Ta slovenski standard je istoveten z: EN IEC 62769-5:2023
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62769-5

NORME EUROPÉENNE
EUROPÄISCHE NORM May 2023
ICS 25.040.40; 35.100.05 Supersedes EN IEC 62769-5:2021
English Version
Field Device Integration (FDI®) - Part 5: FDI Information Model
(IEC 62769-5:2023)
Intégration des appareils de terrain (FDI®) - Partie 5: Feldgeräteintegration (FDI®) - Teil 5: FDI-
Modèle d'Information FDI Informationsmodell
(IEC 62769-5:2023) (IEC 62769-5:2023)
This European Standard was approved by CENELEC on 2023-05-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62769-5:2023 E

European foreword
The text of document 65E/858/CDV, future edition 3 of IEC 62769-5, prepared by SC 65E "Devices
and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement, control and
automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-02-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-05-10
document have to be withdrawn
This document supersedes EN IEC 62769-5:2021 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62769-5:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61987 (series) NOTE Approved as EN IEC 61987 (series)
IEC/TR 62541-1 NOTE Approved as CLC IEC/TR 62541-1
IEC 62541-7 NOTE Approved as EN IEC 62541-7
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61784-1-3 2023 Industrial networks - Profiles - Part 1-3: EN IEC 61784-1-3 2023
Fieldbus profiles - Communication Profile
Family 3
IEC 61804-3 - Devices and integration in enterprise systems - EN IEC 61804-3 -
Function blocks (FB) for process control and
electronic device description language (EDDL)
- Part 3: EDDL syntax and semantics
IEC 61804-4 - Devices and integration in enterprise systems - EN IEC 61804-4 -
Function blocks (FB) for process control and
electronic device description language (EDDL)
- Part 4: EDD interpretation
IEC 62541-3 - OPC Unified Architecture - Part 3: Address EN IEC 62541-3 -
Space Model
IEC 62541-4 - OPC Unified Architecture - Part 4: Services EN IEC 62541-4 -
IEC 62541-5 - OPC Unified Architecture - Part 5: Information EN IEC 62541-5 -
Model
IEC 62541-6 - OPC Unified Architecture - Part 6: Mappings EN IEC 62541-6 -
IEC 62541-8 - OPC Unified Architecture - Part 8: Data Access EN IEC 62541-8 -
IEC 62541-100 - OPC Unified Architecture - Part 100: Device EN 62541-100 -
Interface
IEC 62769-1 - Field Device Integration (FDI®) - Part 1: EN IEC 62769-1 -
Overview
IEC 62769-2 - Field Device Integration (FDI®) - Part 2: Client EN IEC 62769-2 -
IEC 62769-3 - Field Device Integration (FDI®) - Part 3: Server EN IEC 62769-3 -
IEC 62769-4 - Field Device Integration (FDI®) - Part 4: FDI EN IEC 62769-4 -
Packages
IEC 62769-6 - Field Device Integration (FDI®) - Part 6: FDI EN IEC 62769-6 -
Technology Mappings
IEC 62769-7 - Field Device Integration (FDI®) - Part 7: EN IEC 62769-7 -
Communication Devices
Publication Year Title EN/HD Year
IEC 62769-1xx series Field device integration (FDI®) - Part 1xx-y: - -
Profiles
OPC 10000-19 - OPC Unified Architecture - Part 19: Dictionary - -
Reference
IEC 62769-5 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI®) –
Part 5: FDI Information Model
Intégration des appareils de terrain (FDI®) –
Partie 5: Modèle d'Information FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6474-4
– 2 – IEC 62769-5:2023 © IEC 2023
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 10
3 Terms, definitions, abbreviated terms, acronyms and conventions . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms and acronyms . 11
3.3 Conventions . 11
3.3.1 Capitalization . 11
3.3.2 Conventions for graphical notation . 11
4 Overview of OPC Unified Architecture . 13
4.1 General . 13
4.2 Overview of OPC UA Devices . 14
5 Concepts . 16
5.1 General . 16
5.2 Device topology . 16
5.3 Online/offline . 17
5.4 Catalogue (Type Definitions) . 18
5.5 Communication . 18
5.6 Semantic Information . 18
6 AddressSpace organization . 20 ®
7 Device Model for FDI . 21
7.1 General . 21
7.2 Online/offline . 21
7.3 Device health . 22
7.3.1 DeviceHealth Mapping . 22
7.3.2 DeviceHealth Diagnostics . 23
7.4 User interface elements . 24
7.4.1 General . 24
7.4.2 UI Description Type . 24
7.4.3 UI Plug-in Type . 25
7.5 Type-specific support information . 26
7.6 Actions . 27
7.6.1 Overview . 27
7.6.2 Action Type . 27
7.6.3 ActionService Type . 28
7.6.4 ActionService Object . 28
7.6.5 InvokeAction Method . 29
7.6.6 RespondAction Method . 30
7.6.7 AbortAction Method . 31
7.6.8 Interactive Transfer to device . 32
8 Network and connectivity . 32
9 Utility functions . 32
9.1 Overview. 32
9.2 Locking . 32
9.3 EditContext . 33
9.3.1 Overview . 33

IEC 62769-5:2023 © IEC 2023 – 3 –
9.3.2 EditContext Type . 33
9.3.3 EditContext Object . 33
9.3.4 GetEditContext Method . 34
9.3.5 RegisterNodes Method . 35
9.3.6 Apply Method . 36
9.3.7 Reset Method . 37
9.3.8 Discard Method . 38
9.4 DirectDeviceAccess . 39
9.4.1 General . 39
9.4.2 DirectDeviceAccess Type . 39
9.4.3 DirectDeviceAccess Object . 40
9.4.4 InitDirectAccess Method . 41
9.4.5 EndDirectAccess Method . 41
9.4.6 Transfer Method . 42
10 Parameter Types . 43
10.1 General . 43
10.2 ScalingFactor Property . 44
10.3 Min_Max_Values Property . 44 ®
11 FDI StatusCodes . 45
11.1 General . 45
11.2 Structure of the StatusCode . 45 ®
11.3 FDI specific operation level result codes . 46
12 Specialized topology elements. 49
13 Auditing . 50
13.1 General . 50 ®
13.2 FDI Client-provided context information . 50
13.3 LogAuditTrailMessage Method . 50 ®
14 FDI Server Version . 51
® ®
15 Mapping FDI Package information to the FDI Information Model . 51
15.1 General . 51
15.2 Localization . 52
15.2.1 Localized text . 52
15.2.2 Engineering units . 52
15.3 Device . 52
15.3.1 General . 52
15.3.2 Mapping to Attributes to a specific DeviceType Node . 52
15.3.3 Mapping to Properties . 52
15.3.4 Mapping to ParameterSet . 53
15.3.5 Mapping to Functional Groups . 53
15.3.6 Mapping to DeviceTypeImage . 53
15.3.7 Mapping to Documentation . 53
15.3.8 Mapping to ProtocolSupport . 53
15.3.9 Mapping to ImageSet . 54
15.3.10 Mapping to ActionSet . 54
15.3.11 Mapping to MethodSet . 54
15.4 Modular Device . 54
15.5 Block . 54
15.5.1 General . 54

– 4 – IEC 62769-5:2023 © IEC 2023
15.5.2 Mapping to Attributes . 54
15.5.3 Mapping to ParameterSet . 55
15.5.4 Mapping to Functional Groups . 55
15.5.5 Mapping to ActionSet . 55
15.5.6 Mapping to MethodSet . 55
15.5.7 Instantiation rules . 55
15.6 Parameter . 55
15.6.1 General . 55
15.6.2 Private Parameters . 60
15.6.3 MIN_Value and MAX_Value . 60
15.6.4 Engineering units . 60
15.6.5 Enumerated Parameters . 60
15.6.6 Bit-enumerated Parameters . 60
15.6.7 Representation of records . 61
15.6.8 Representation of arrays, and lists of Parameters with simple data types . 62
15.6.9 Representation of values arrays, and lists of RECORD Parameters . 62
15.6.10 Representation of COLLECTION and REFERENCE ARRAY . 63
15.6.11 SCALING_FACTOR . 63
15.6.12 EDDL CLASS Attributes on Parameters . 63
15.7 Functional Groups. 65
15.8 AXIS elements in UIDs . 65
15.9 Actions . 65
15.10 UIPs . 66
15.11 Protocols, Networks and Connection Points . 66
15.12 Semantic Identifies . 66
15.13 DictionaryIds Property . 67
15.14 MultiStateDictionaryEntryDiscreteType . 67
15.15 GetNodeIdsByDictionaryEntryId . 68
16 Profiles . 69
Annex A (normative) Namespace and Mappings . 70
Bibliography . 71
®
Figure 1 – FDI architecture diagram . 10
Figure 2 – OPC UA graphical notation for NodeClasses . 12
Figure 3 – OPC UA graphical notation for References . 12
Figure 4 – OPC UA graphical notation example . 13
Figure 5 – Optimized Type Reference . 13
Figure 6 – OPC UA Devices example: Functional Groups . 15
Figure 7 – OPC UA Devices example: Configurable components . 15
Figure 8 – Example of an automation system . 16
Figure 9 – Example of a Device topology . 17
Figure 10 – Example Device Types representing a catalogue . 18
Figure 11 – Example of concrete DictionaryEntryType and Object . 19
Figure 12 – Example of DictionaryEntries . 20
Figure 13 – Online component for access to device data . 21
Figure 14 – Hierarchy of user interface Types . 24

IEC 62769-5:2023 © IEC 2023 – 5 –
Figure 15 – Integration of Actions within a TopologyElement . 27
Figure 16 – Action Service . 29
Figure 17 – EditContext type and instance . 34
Figure 18 – DirectDeviceAccessType . 39
Figure 19 – DirectDeviceAccess instance . 40
Figure 20 – OPC UA VariableTypes including OPC UA DataAccess . 44
Figure 21 – Example: Complex variable representing a RECORD . 61
Figure 22 – Complex variable representing a VALUE_ARRAY of RECORDs . 62 ®
Figure 23 – Example of EDDL CLASS Attributes in the FDI OPC UA Information
Model . 64

Table 1 – DeviceHealth Mapping . 22
Table 2 – DeviceType definition (excerpt applicable for Subclause 7.3.1) . 22
Table 3 – DeviceType definition with DeviceHealth and DeviceHealthDiagnostics . 23
Table 4 – UIDescriptionType Definition . 24
Table 5 – UIPlugInType Definition . 25
Table 6 – ActionType Definition . 28
Table 7 – ActionServiceType Definition . 28
Table 8 – InvokeAction Method Arguments . 30
Table 9 – InvokeAction Method AddressSpace Definition . 30
Table 10 – RespondAction Method Arguments . 31
Table 11 – RespondAction Method AddressSpace Definition . 31
Table 12 – AbortAction Method Arguments . 31
Table 13 – AbortAction Method AddressSpace Definition . 32
Table 14 – EditContextType Definition . 33
Table 15 – GetEditContext Method Arguments . 34
Table 16 – GetEditContext Method AddressSpace Definition . 35
Table 17 – RegisterNodes Method Arguments . 35
Table 18 – RegisterNodes Method AddressSpace Definition . 35
Table 19 – RegistrationParameters DataType Structure . 36
Table 20 – RegisterNodesResult DataType Structure . 36
Table 21 – Apply Method Arguments . 37
Table 22 – Apply Method AddressSpace Definition . 37
Table 23 – ApplyResult DataType Structure . 37
Table 24 – Reset Method Arguments . 38
Table 25 – Reset Method AddressSpace Definition . 38
Table 26 – Discard Method Arguments . 38
Table 27 – Discard Method AddressSpace Definition . 38
Table 28 – DirectDeviceAccessType Definition . 40
Table 29 – DirectDeviceAccess Instance Definition . 41
Table 30 – InitDirectAccess Method Arguments . 41
Table 31 – InitDirectAccess Method AddressSpace Definition . 41
Table 32 – EndDirectAccess Method Arguments . 42

– 6 – IEC 62769-5:2023 © IEC 2023
Table 33 – EndDirectAccess Method AddressSpace Definition. 42
Table 34 – Transfer Method Arguments . 42
Table 35 – Transfer Method AddressSpace Definition . 43
Table 36 – ScalingFactor Property Definition . 44
Table 37 – Min_Max_Values Property Definition . 45
Table 38 – Variant_Range DataType Structure . 45
Table 39 – Variant_Range Definition . 45
Table 40 – StatusCode Bit Assignments . 46
Table 41 – DataValue InfoBits. 46
Table 42 – Good operation level result codes . 47
Table 43 – Uncertain operation level result codes . 48
Table 44 – Bad operation level result codes . 48
Table 45 – LogAuditTrailMessage Method Arguments . 51
Table 46 – LogAuditTrailMessage Method AddressSpace Definition . 51
Table 47 – FDIServerVersion Property Definition . 51
Table 48 – DeviceType Property Mapping . 53
Table 49 – Setting OPC UA Variable Attributes from EDDL variable attributes . 56
Table 50 – Correspondence between EDDL and OPC UA standard data types . 57
Table 51 – Definition of EddlDictionaryType . 63
Table 52 – Definition of EddlDictionary Object . 63
Table 53 – Definition of Parameter Class Attributes . 64
Table 54 – DictionaryIds Definition. 67
Table 55 – MultiStateDictionaryEntryDiscreteType definition . 67
Table 56 – GetNodeIdsByDictionaryEntryId Method arguments . 68
Table 57 – GetNodeIdsByDictionaryEntryId Method result codes . 68
Table 58 – GetNodeIdsByDictionaryEntryId . 68 ®
Table 59 – FDI Server Facet Definition . 69 ®
Table 60 – FDI Client Facet Definition . 69

IEC 62769-5:2023 © IEC 2023 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 5: FDI Information Model
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62769-5 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2021. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added INTERACTIVE_TRANSFER_TO_DEVICE ACTION.

– 8 – IEC 62769-5:2023 © IEC 2023
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/858/CDV 65E/915/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62769 series, published under the general title Field device ®
integration (FDI ), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

IEC 62769-5:2023 © IEC 2023 – 9 – ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 5: FDI Information Model
1 Scope
®1
This part of IEC 62769 defines the FDI Information Model. One of the main tasks of the
Information Model is to reflect the topology of the automation system. Therefore, it represents
the devices of the automation system as well as the connecting communication networks
including their properties, relationships, and the operations that can be performed on them. The ®
types in the AddressSpace of the FDI Server constitute some kind of catalogue, which is built ®
from FDI Packages. ®
The fundamental types for the FDI Information Model are well defined in OPC UA for Devices ®
(IEC 62541-100). The FDI Information Model specifies extensions for a few special cases and
otherwise explains how these types are used and how the contents are built from elements of
DevicePackages. ®
The overall FDI architecture is illustrated in Figure 1. The architectural components that are
within the scope of this document have been highlighted in this illustration.
___________
1 ®
FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given
for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark
holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires
permission of the trade name holder.

– 10 – IEC 62769-5:2023 © IEC 2023
®
Figure 1 – FDI architecture diagram
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61784-1-3:2023, Industrial networks – Profiles – Part 1-3: Fieldbus profiles –
Communication Profile Family 3
IEC 61804-3, Devices and integration in enterprise systems − Function blocks (FB) for process
control and electronic device description language (EDDL) − Part 3: EDDL syntax and
semantics
IEC 61804-4, Devices and integration in enterprise systems − Function blocks (FB) for process
control and electronic device description language (EDDL) − Part 4: EDD interpretation
IEC 62541-3, OPC Unified Architecture – Part 3: Address Space Model
IEC 62541-4, OPC Unified Architecture – Part 4: Services
IEC 62541-5, OPC Unified Architecture – Part 5: Information Model
IEC 62541-6, OPC Unified Architecture – Part 6: Mappings

IEC 62769-5:2023 © IEC 2023 – 11 –
IEC 62541-8, OPC Unified Architecture – Part 8: Data Access
IEC 62541-100, OPC Unified Architecture – Part 100: Device Interface ®
IEC 62769-1, Field Device Integration (FDI ) – Part 1: Overview ®
IEC 62769-2, Field Device Integration (FDI ) – Part 2: Client ®
IEC 62769-3, Field Device Integration (FDI ) – Part 3: Server
® ®
) – Part 4: FDI Packages
IEC 62769-4, Field Device Integration (FDI
® ®
IEC 62769-6, Field Device Integration (FDI ) – Part 6: FDI Technology Mappings ®
IEC 62769-7, Field Device Integration (FDI ) – Part 7: Communication Devices ®
IEC 62769-1xx (all parts), Field Device Integration (FDI ) – Part 1xx-y: Profiles
OPC 10000-19, OPC Unified Architecture – Part 19: Dictionary Reference
3 Terms, definitions, abbreviated terms, acronyms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62769-1 and
IEC 62769-3 apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.2 Abbreviated terms and acronyms
For the purposes of this document, the abbreviated terms and acronyms given in IEC 62769-1
and the following apply.
HMI Human Machine Interface
SCADA Supervisory Control and Data Acquisition
TCP Transmission Control Protocol
3.3 Conventions
3.3.1 Capitalization ®
Capitalization of the first letter of words is used in the IEC 62769 series to emphasize an FDI
defined term.
3.3.2 Conventions for graphical notation
OPC UA defines a graphical notation for an OPC UA AddressSpace. It defines graphical
symbols for all NodeClasses and how different types of References between Nodes can be
visualized. Figure 2 shows the symbols for the NodeClasses used in this document.
NodeClasses representing types always have a shadow.

– 12 – IEC 62769-5:2023 © IEC 2023

Figure 2 – OPC UA graphical notation for NodeClasses
Figure 3 shows the symbols for the ReferenceTypes used in this document. The Reference
symbol is normally pointing from the source Node to the target Node. The only exception is the
HasSubType Reference. The most important References such as HasComponent, HasProperty,
HasTypeDefinition and HasSubType have special symbols avoiding the name of the Reference.
For other ReferenceTypes or derived ReferenceTypes, the name of the ReferenceType is used
together with the symbol.
Figure 3 – OPC UA graphical notation for References
Figure 4 shows a typical example for the use of the graphical notation. Object_A and Object_B
are instances of the ObjectType_Y indicated by the HasTypeDefinition References. The
ObjectType_Y is derived from ObjectType_X indicated by the HasSubType Reference. The
Object_A has the components Variable_1, Variabl
...