Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)

IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.


Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019)

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)

IEC 60286-3:2019 est disponible sous forme de IEC 60286-3:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L'IEC 60286-3:2019 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise en bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l'emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout d'un tableau de classification des symboles concernant les bandes, les bobines et les symboles courants;
- ajout d'une figure représentant un exemple de polarité et d'orientation et d'une figure représentant un exemple de collage ponctuel;
- révision des exigences de cambrage;
- ajout d'une définition de la valeur de conception concernant l'inclinaison.


Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2019)

Ta del standarda IEC 60286 se uporablja za tračno pakiranje elektronskih komponent brez vodov ali ostankov vodov, namenjenih za povezavo z elektronskimi vezji. Vključuje samo dimenzije, bistvene za tračno pakiranje komponent, ki so namenjene za zgoraj navedene namene.
Ta dokument vključuje tudi zahteve glede pakiranja proizvodov s singularnimi polprevodniškimi integriranimi vezji, vključno s tistimi brez ohišja in tistimi z izboklinami (»flip chip«).

General Information

Status
Published
Publication Date
25-Mar-2019
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
18-Mar-2019
Due Date
23-May-2019
Completion Date
26-Mar-2019

Relations

Standard
SIST EN IEC 60286-3:2019 - BARVE
English language
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Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2019)Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019)Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)55.060Tulci. VretenaSpools. Bobbins31.020Elektronske komponente na splošnoElectronic components in generalICS:Ta slovenski standard je istoveten z:EN IEC 60286-3:2019SIST EN IEC 60286-3:2019en01-maj-2019SIST EN IEC 60286-3:2019SLOVENSKI
STANDARDSIST EN 60286-3:2013/AC:2014SIST EN 60286-3:20131DGRPHãþD

EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN IEC 60286-3
March 2019 ICS 31.020; 31.240
Supersedes
EN 60286-3:2013
English Version
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019) This European Standard was approved by CENELEC on 2019-02-20. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23,
B-1040 Brussels © 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60286-3:2019 E SIST EN IEC 60286-3:2019

This document supersedes EN 60286-3:2013. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 60286-3:2019 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1 IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2 IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3 ISO 11469 NOTE Harmonized as EN ISO 11469
Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1
Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2
Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 60191-2 -
Mechanical standardization of semiconductor devices -- Part 2: Dimensions - -
IEC 60286-3 Edition 6.0 2019-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes continues
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.020; 31.240
ISBN 978-2-8322-6387-7
– 2 – IEC 60286-3:2019 © IEC 2019 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope . 8 2 Normative references . 8 3 Terms, definitions and symbols. 8 3.1 Terms and definitions . 8 3.2 Symbols . 10 4 Structure of the specification . 11 5 Dimensional requirements for taping . 12 5.1 Component cavity positioning requirements . 12 5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12 5.1.2 Requirements for types 4 . 12 5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15 5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 17 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) . 20 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24 6 Polarity and orientation requirements of components in the tape . 26 6.1 Requirements for all tape types . 26 6.2 Specific requirements for type 1a . 27 6.3 Specific requirements for type 4 . 27 7 Carrier tape requirements . 27 7.1 Taping materials . 27 7.2 Minimum bending radius (for all types) . 27 7.3 Camber . 28 8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29 9 Component taping and additional tape requirements. 30 9.1 All types . 30 9.2 Specific requirements for type 1b . 31 9.3 Specific tape requirements for type 2b . 31 9.4 Specific requirement for type 4 . 31 9.4.1 General . 31 9.4.2 Coordinate system . 31 9.4.3 Component positioning and lateral displacement . 33 9.5 Specific requirements for tapes containing die products . 33 9.5.1 General . 33 9.5.2 Tape design for tapes containing die products . 33 9.5.3 Cleanliness . 34 9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34 10 Reel requirements . 34 SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 3 –
10.1 Dimensions . 34 10.1.1 General . 34 10.1.2 Reel dimensions . 34 10.1.3 Reel hole dimensions . 36 10.2 Marking . 36 11 Tape reeling requirements . 37 11.1 All types . 37 11.2 Specific requirements for type 1a . 37 11.3 Specific requirements for type 4 . 37 11.4 Leader and trailer tape . 37 11.4.1 General . 37 11.4.2 Leader . 38 11.4.3 Trailer . 38 11.5 Recycling . 38 11.6 Missing components . 38 Annex A (normative)
Recommended measuring methods for type 1b . 39 A.1 Measurement method for carrier tape thickness (T and T3) . 39 A.2 Measurement method for cavity (A0 and B0) . 39 A.3 Measurement method for cavity depth (dimension K0) . 40 Bibliography . 41
Figure 1 – Sectional view of component cavity (type 1b) . 9 Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13 Figure 4 – Maximum component tilt, rotation and lateral movement . 13 Figure 5 – Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 mm) . 15 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16 Figure 7 – Maximum component tilt, rotation and lateral movement . 16 Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18 Figure 10 – Maximum component tilt, rotation and lateral movement . 18 Figure 11 – Type 2b carrier tape . 20 Figure 12 – Maximum pocket offset . 20 Figure 13 – Maximum component tilt, rotation and lateral movement . 20 Figure 14 – Blister carrier tape . 22 Figure 15 – Elongated sprocket hole skew . 22 Figure 16 – Maximum component tilt, rotation and lateral movement . 22 Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) . 24 Figure 18 – Illustration of 2 mm compartment pitch . 24 Figure 19 – Maximum component planar rotation and lateral displacement . 25 Figure 20 – Example of polarity and orientation . 27 Figure 21 – Bending radius . 28 Figure 22 – Measuring method and camber . 29 Figure 23 – Dot seals for thin components (as exceptions) . 30 SIST EN IEC 60286-3:2019

– 4 – IEC 60286-3:2019 © IEC 2019 Figure 24 – Type 4 coordinate system . 32 Figure 25 – Component clearance and positioning method . 33 Figure 26 – Reel . 35 Figure 27 – Reel hole presentation . 36 Figure 28 – Tape reeling and label area on the reel . 37 Figure 29 – Leader and trailer . 38 Figure A.1 – Carrier tape thickness measurement points . 39 Figure A.2 – Cavity cross-section . 40 Figure A.3 – Cavity depth dimension . 40
Table 1 – Component size codes . 9 Table 2 – Classification to symbols concerning tape, reel and common symbols . 10 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 14 Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 14 Table 5 – Component tilt, planar rotation and lateral movement . 15 Table 6 – Constant dimensions of 8 mm pressed carrier tape . 16 Table 7 – Variable dimensions of 8 mm pressed carrier tape . 17 Table 8 – Component tilt, planar rotation and lateral movement . 17 Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 19 Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 19 Table 11 – Component tilt, rotation and lateral movement . 19 Table 12 – Constant dimensions of 4 mm carrier tape . 21 Table 13 – Variable dimensions of 4 mm carrier tape . 21 Table 14 – Component tilt, planar rotation and lateral movements . 21 Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 23 Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 23 Table 17 – Component tilt, planar rotation and lateral movements . 24 Table 18 – Dimensions of adhesive backed punched carrier tape . 25 Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 26 Table 20 – Component planar rotation and lateral displacement . 26 Table 21 – Minimum bending radius . 28 Table 22 – Peel force . 30 Table 23 – Absolute referencing data for component target position . 32 Table 24 – Reel dimensions . 35 Table 25 – Reel hole dimensions . 36
IEC 60286-3:2019 © IEC 2019 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for electronic equipment. This sixth edition cancels and replaces the fifth edition published in 2013. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition: a) addition of a table of the classification to symbols concerning tape, reel and common symbols; b) additions of a figure of example of polarity and orientation and a figure of example of dot seal; c) revision of requirements for camber; SIST EN IEC 60286-3:2019

– 6 – IEC 60286-3:2019 © IEC 2019 d) addition of a definition of design value with regard to tilt. The text of this International Standard is based on the following documents: FDIS Report on voting 40/2643/FDIS 40/2649/RVD
Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60286 series, published under the general title Packaging of components for automatic handling, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific document. At this date, the document will be • reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.
IEC 60286-3:2019 © IEC 2019 – 7 –
INTRODUCTION Tape packaging meets the requirements of automatic component placement machines and also covers the use of tape packaging for components and singulated dies for test purposes and other operations.
– 8 – IEC 60286-3:2019 © IEC 2019 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
1 Scope This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions 3 Terms, definitions and symbols 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply. Definitions apply to all tape types, unless specifically mentioned. ISO and IEC maintain terminological databases for use in standardization at the following addresses:
• IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 3.1.1
components electronic part of a product that cannot be physically divided into smaller parts without losing its particular function Note 1 to entry: This includes singulated die product. Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise. 3.1.2
component sizes size of component that are identified with their metric size code Note 1 to entry: This size code is followed by a capital M.
Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1. SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 9 –
Table 1 – Component size codes Metric size code Inch size code 0402M 01005 0603M 0201 1005M 0402 1608M 0603 2012M 0805
3.1.3
packaging product made of any material of any nature to be used for the containment, protection, structured alignment for automatic assembly, handling and delivery 3.1.4
pressed carrier tape carrier tape with concave cavities formed by compression of the base material 3.1.5
fluff fibre from the base material attached inside the cavity Note 1 to entry: See Figure 1. 3.1.6
burr surface projection of tape unintentially produced when cavity is formed Note 1 to entry: See Figure 1. 3.1.7
deformation bulge on the inner wall of the cavity Note 1 to entry: See Figure 1. 3.1.8
puff bulge on the reverse side of the cavity Note 1 to entry: See Figure 1.
Figure 1 – Sectional view of component cavity (type 1b) SIST EN IEC 60286-3:2019

– 10 – IEC 60286-3:2019 © IEC 2019 3.1.9
blister carrier tape carrier tape which is identified as tape belonging to types 2a, 2b and 3 Note 1 to entry These types of carriers are also known as "embossed" carrier types. 3.2 Symbols The symbols used in this document are listed in Table 2. Table 2 – Classification to symbols concerning tape, reel and common symbols Symbols Definitions
Figure references A Reel diameter Figure 26 A0 Cavity’s bottom dimension in direction of unreeling Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16 and 20 B Reel hole key’s groove width Figure 27 B0 Cavity’s bottom dimension in direction of tape width Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16 and 20 B1 Cavity’s rim in direction of tape width Figures 8, 11 and 14 C Reel hole diameter Figures 26 and 27 CT Distance of puff under cavity in direction of tape width
Figure 5 d Difference of diameter between sprocket hole and round foramen Figure 14 D Reel slot diameter Figure 27 D0 Sprocket hole diameter Figures 2, 5, 8, 11, 14 and 17 D1 Cavity’s bottom hole diameter
Figures 8 and 14 E1 Shorter distance in direction of width between the origin point of round sprocket hole and the edge of a side of tape
Figures 2, 5, 8, 11, 14 and 17 E2 Longer distance in direction of width between the origin point of round sprocket hole and the edge of a side of tape
Figures 2, 5, 8 and 11 F Distance in direction of width between the origin point of round sprocket hole and the centre of cavity Figures 2, 5, 8, 11 and 14 FA Distance in direction of width between the origin point of round sprocket hole and the centre of compartment Figures 17, 19, 24 and 25 G Shorter distance in direction of width between the cavity and the edge of a side of tape Figures 2, 5, 8, 11 and 17 K0 Cavity depth Figures 2, 5, 8 ,11 ,14 and A.3 N Hub diameter Figure 26 P0 Pitch of the sprocket holes Figures 2, 3, 5, 6, 8, 9, 11, 14 and 17 P1 Cavity pitch Figures 2, 3, 5, 6, 8, 9, 11, 14, 17 and 18 P2 Pitch between the centre of a cavity on the same line with the origin point of round sprocket hole and the centre of the next cavity in direction of unreeling Figures 2, 3, 5, 6, 8, 9, 11 and 14 P2A Pitch between the centre line of the origin point of round sprocket hole and the centre line of compartment in direction of unreeling Figures 17, 18, 19, 24 and 25 P3 Pitch between the centre of a cavity on the same line with the origin point of round sprocket hole and the centre of the second next cavity in direction of unreeling Figures 3 and 6 P4 Pitch between the centre of a cavity on the same line with the origin point of round sprocket hole and the centre of the third next cavity in direction of unreeling Figures 3 and 6 SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 11 –
Symbols Definitions
Figure references S Sprocket hole pitch in direction of width Figure 14 R Bending radius of carrier tape Figure 21 r Curvature radius of reel hole key’s groove Figure 27 T Carrier tape thickness without cover tape Figures 2, 5, 8, 11, 14, 17, 25 and A.1 T1 Top cover tape thickness or bottom cover tape thickness Figures 2, 5, 8, 11, 14 and 17 T2 Sum of outer cavity height and top cover tape thickness Figures 8, 11 and 14 T3 Thickenss of pressed carrier tape including bulge Figures 5 and A.1 V1 Compartment dimension in direcion of unreeling Figures 17 and 18 V2 Compartment dimension in direction of width Figures 17 and 18 W Carrier tape width Figures 2, 5, 8, 11, 14 and 17 WP Distance between adhesive tapes Figure 17 W1 Reel inner width(measured at hub) Figure 26 W2 Reel overall width Figure 26 W3 Reel inner width in the rim Figure 26 Z Component thickness Figure 25
4 Structure of the specification
The various types of tapes are as follows. Type 1 – Punched and pressed carrier tape Type 1a: Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm) Type 2 – Blister carrier tape, with single round sprocket holes Type 2a: Blister carrier tape, with single round sprocket holes, with top cover tape and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) Type 2b: Blister carrier tape, with single round sprocket holes, with top cover tape and with 1mm tape pitch (tape widths: 4 mm) Type 3 – Blister carrier tape, with double sprocket holes (tape widths: 32 mm to 200 mm) Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (tape widths: 8 mm, 12 mm, 16 mm, and 24 mm)
– 12 – IEC 60286-3:2019 © IEC 2019 5 Dimensional requirements for taping 5.1 Component cavity positioning requirements 5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 For defined component positioning, the cavity shall be defined to an origin point. The origin is the centre of the round sprocket hole, defined by the crosshair of the dimensions E1 and P0. The centre of the compartment shall be defined by P2 and F, relative to the round sprocket hole (see Figures 2, 5, 8, 11 and 14). When dimension P1 is smaller or equal to 2 mm, the maximum allowed pocket offset, relative to the centre of the round sprocket hole, shall be applied (see Figures 3, 6, 9 and 12). 5.1.2 Requirements for types 4 For defined component positioning, the component placement and location shall be defined to an origin. The origin is the centre of the sprocket hole, defined by the crosshair of the dimensions E1 and P0. The centre of the component location shall be defined by P2A and FA, relative to the sprocket hole (see Figure 17). Type 4 does not have cavities that are used to position components, therefore all position measurements should be made according to the principle defined here and not to the compartments or ‘pockets’, which are virtual boundaries for component protection only. The term ‘pocket offset’ does not apply to type 4. The following applies to tape type 4: a) rotation and lateral movement of the component is defined by the accuracy to which it has been placed in the compartment, with reference to the target; b) the component shall not protrude above the top surface of the carrier tape (see Figure 25, sketch R); c) the components shall not change their orientation within the tape; d) the component shall be able to be removed from the cavity or compartment in a vertical direction, without mechanical restriction. 5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) The size of the component cavity, including applicable tolerances, is governed by the dimensions of the component for which the packaging applies, to ensure that the component is adequately protected and that tilt, rotation and lateral movement of the component complies with the requirements detailed for each type of tape. The following applies to tape types 1a, 1b, 2a, 2b and 3: a) dimensions A0 ≤ B0, unless otherwise specified in the component detail specification; b) maximum and minimum dimensions of the component shall be taken from the component detail specification; c) the component shall not protrude above the top surface of the carrier tape, except for type 1a where the component shall not protrude beyond either surface of the carrier tape; d) the components shall not change their orientation within the tape; e) the component shall be able to be removed from the cavity or compartment in a vertical direction, without mechanical restriction, after the top cover has been removed, where a cover tape is used. 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) For respective dimensional codes, see Figures 2 to 4 and Tables 3 to 5. SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 13 –
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset
Figure 4 – Maximum component tilt, rotation and lateral movement SIST EN IEC 60286-3:2019

– 14 – IEC 60286-3:2019 © IEC 2019 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape Dimensions in millimetres Tape size D0 E1 P0 G min. T max. T1 (each T1) P0 pitch cumulative tolerance 8 and 12 0,101,5+ 1,75 ± 0,1 4,0 ± 0,1 (P1 ≥ 4) 4,0 ± 0,05
(P1 = 2, P1 = 1) 0,75 1,1 papera 1,6 non- paper 0,1 maximum ± 0,2 / 10 pitches For respective dimensional codes, see Figure 2. a The paper is the material of the punched carrier tape.
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape Dimensions in millimetres Tape size E2 min. F P1 P2 P3 P4 W A0, B0, K0 8 6,25 3,5 ± 0,05 1,0 ± 0,05 (P1 = 1) 2,0 ± 0,05 (P1 = 2) 4,0 ± 0,1 (P1 = 4) 1,0 ± 0,05 (P1 = 1) 2,0 ± 0,05 (P1 = 2) 2,0 ± 0,05 (P1 = 4) 2,0 ± 0,05 (P1 = 1) 3,0 ± 0,05 (P1 = 1) 0,83,01,0+− See 5.2 12 10,25 5,5 ± 0,05 2,0 ± 0,05
(P1 = 2) 4,0 ± 0,1 (P1 ≥ 4) 2,0 ± 0,05 – – 0,123,01,0+− Fo± ±espec≥ive ≤imensional co≤es, see Fig×±es 2 ≥o 4.
IEC 60286-3:2019 © IEC 2019 – 15 –
Table 5 – Component tilt, planar rotation and lateral movement Tape size mm Component tilt (design value) a Component planar rotation (design value) a Lateral movement mm 8 and 12 10° maximum 20° maximum 0,3 maximum (P1 = 1, P1 = 2) 0,5 maximum (P1 ≥ 4) For respective dimensional codes, see Figure 4. The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is 10° maximum. For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral movement of 0,2 mm maximum. When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity dimension should be allowed. When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum for either cavity dimension should be allowed. a A design value is a calculated value for design purposes only. For example, component tilt is not intended to be measured, but is intended to be the calculated value for the pocket design of a carrier tape.
5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) For respective dimensional codes, see Figures 5 to 7 and Tables 6 to 8.
Figure 5 – Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 mm) SIST EN IEC 60286-3:2019

– 16 – IEC 60286-3:2019 © IEC 2019
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset
Figure 7 – Maximum component tilt, rotation and lateral movement Table 6 – Constant dimensions of 8 mm pressed carrier tape Dimensions in millimetres Tape size D0 a E1 G min. P0 T max. T1 max. T3-T b max. P0 pitch cumulative tolerance 8 5,11,00+ 1,75 ± 0,1 0,75 4,0 ± 0,1 1,1 0,1 0,1 ± 0,1 / 10 pitches For respective dimensional codes, see Figures 5 and 6. a If positioning precision is required, for example when components ≤ size 1005M are mounted in a narrow space, then the tolerance on D0 should be +0,05 / −0,00 mm. b For components with size designation of 1005M or smaller, the puff (T3 − T) should be limited to 0,05 mm maximum.
IEC 60286-3:2019 © IEC 2019 – 17 –
Table 7 – Variable dimensions of 8 mm pressed carrier tape Dimensions in millimetres Tape size CT max. E2 min. F P1 P2 P3 P4 W A0, B0, K0 8 4,35 6,25 3,5 ± 0,05 1,0 ± 0,05 1,0 ± 0,05 2,0 ± 0,05 3,0 ± 0,05 0,83,01,0+− See 5.2
(P1 = 1) 2,0 ± 0,05 (P1 = 1) 2,0 ± 0,05 (P1 = 1) (P1 = 1)
(P1 = 2) (P1 = 2)
4,0 ± 0,1 2,0 ± 0,05
(P1 = 4) (P1 = 4)
For respective dimensional codes, see Figures 5 to 7.
Table 8 – Component tilt, planar rotation and lateral movement Tape size mm Component tilt (design value) a Component planar rotation (design value) a Lateral movement mm 8 20° maximum 20° maximum 0,12 maximum (Component size ≤ 0603M)
0,20 maximum (Component size 1005M)
0,30 maximum (Component size ≥ 1608M) For respective dimensional codes, see Figure 7. a A design value is a calculated value for design purposes only. For example, component tilt is not intended to be measured, but is intended to be the calculated value for the pocket design of a carrier tape.
5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) For respective dimensional codes, see Figures 8 to 10 and Tables 9 to 11. SIST EN IEC 60286-3:2019

– 18 – IEC 60286-3:2019 © IEC 2019
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm)
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset
Figure 10 – Maximum component tilt, rotation and lateral movement SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 19 –
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape Dimensions in millimetres Tape size D0
E1 G min. P0 T max. T1 max. P0 pitch cumulative tolerance 8 to 24 5,11,00+ 1,75 ± 0,1 0,75 4,0 ± 0,1 (P1 ≥ 4) 4,0 ± 0,05
(P1 = 2) 0,6 0,1 ±0,2 / 10 pitches For respective dimensional codes, see Figures 8 and 9.
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape Dimensions in millimetres Tape size B1 max. D1 a min. E2 min. F P1 P2 T2 max. W A0, B0, K0 8 4,35 0,3 6,25 3,5 ± 0,05 2,0 ± 0,05 4,0 ± 0,1 2,0 ± 0,05 3,5 0,83,01,0+− See 5.2 12 8,2 1,5 10,25 5,5 ± 0,05 2,0 ± 0,05 4,0 ± 0,1 to 12,0 ± 0,1 in 4,0 increments
2,0 ± 0,05 6,5 0,123,01,0+− 16 12,1 1,5 14,25 7,5 ± 0,1 4,0 ± 0,1 to 16,0 ± 0,1 in 4,0 increments 2,0 ± 0,1 9,5 0,163,01,0+− 24 20,1 1,5 22,25 11,5 ± 0,1 4,0 ± 0,1 to 24,0 ± 0,1 in 4,0 increments 2,0 ± 0,1 12,5 0,243,01,0+− Fo± ±espec≥ive ≤imensional co≤es, see Fig×±es 8 ≥o 10. a Op≥ionally, fo± easy an≤ ±eliable ±emoval of ≥he componen≥, o± fo± componen≥ inspec≥ion o± fo± any applicable applica≥ion, ≥he cavi≥y may have a hole in ≥he cen≥±e of ≥he bo≥≥om.
Table 11 – Component tilt, rotation and lateral movement Tape size mm Component tilt (design value) a Component planar rotation (design value) a Lateral movement mm 8, 12 10° maximum 20° maximum 0,5 maximum 16, 24 10° maximum 10° maximum 0,5 maximum For respective dimensional codes, see Figure 10. The trend for allowed component planar rotation of components with either length or width less than 1,2 mm is 10° maximum. For components with either length or width dimensions of less than 1,2 mm, market trends are towards a lateral movement of 0,2 mm maximum. When handling bare die products in tape size 8 mm, the lateral movement of 0,1 mm maximum for either cavity dimension should be allowed. When handling bare die products in tape size 12 mm, the lateral movement of 0,15 mm maximum for either cavity dimension should be allowed. a A design value is a calculated value for design purposes only. For example, component tilt is not intended to be measured, but is intended to be the calculated value for the pocket design of a carrier tape.
– 20 – IEC 60286-3:2019 © IEC 2019 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) For respective dimensional codes, see Figures 11 to 13 and Tables 12 to 14.
Figure 11 – Type 2b carrier tape
Figure 12 – Maximum pocket offset
Figure 13 – Maximum component tilt, rotation and lateral movement SIST EN IEC 60286-3:2019

IEC 60286-3:2019 © IEC 2019 – 21 –
Table 12 – Constant dimensions of 4 mm carrier tape Dimensions in millimetres Tape size D0
E1 G min. P0 T min. T max. T1 max. P0 pitch cumulative tolerance 4 0,80 ± 0,04 0,90 ± 0,05 0,50 2,00 ± 0,04 0,15 0,40 0,08 ±0,1 / 20 pitches For respective dimensional codes, see Figure 11.
Table 13 – Variable dimensions of 4 mm carrier tape Dimensions in millimetres Tape size B1 max. E2 min. F P1 P2 T2 max. W A0, B0, K0 4 1,48 a 3,07 1,8 ± 0,03 1,0 ± 0,03 1,0 ± 0,03 1,1 4,0 ± 0,08 See 5.2 For respective dimensional codes, see Figures 11 and 13. a Reference dimension.
Table 14 – Component tilt, planar rotation and lateral movements Tape size mm Component tilt (design value) a Component planar rotation (design value) a Lateral movement mm 4 20° maximum 20° maximum 0,10 maximum (Component size 0402M)
0,12 m
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