SIST EN IEC 60286-3:2019

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2019)Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019)Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)55.060Tulci. VretenaSpools. Bobbins31.020Elektronske komponente na splošnoElectronic components in generalICS:Ta slovenski standard je istoveten z:EN IEC 60286-3:2019SIST EN IEC 60286-3:2019en01-maj-2019SIST EN IEC 60286-3:2019SLOVENSKI
STANDARDSIST EN 60286-3:2013/AC:2014SIST EN 60286-3:20131DGRPHãþD



SIST EN IEC 60286-3:2019



EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN IEC 60286-3
March 2019 ICS 31.020; 31.240
Supersedes
EN 60286-3:2013
English Version
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2019)
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2019) This European Standard was approved by CENELEC on 2019-02-20. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23,
B-1040 Brussels © 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60286-3:2019 E SIST EN IEC 60286-3:2019



EN IEC 60286-3:2019 (E) 2 European foreword The text of document 40/2643/FDIS, future edition 6 of IEC 60286-3, prepared by IEC/TC 40 "Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60286-3:2019. The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2019-11-20 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2022-02-20
This document supersedes EN 60286-3:2013. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 60286-3:2019 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1 IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2 IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3 ISO 11469 NOTE Harmonized as EN ISO 11469
SIST EN IEC 60286-3:2019



EN IEC 60286-3:2019 (E) 3 Annex ZA (normative)
Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1
Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2
Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 60191-2 -
Mechanical standardization of semiconductor devices -- Part 2: Dimensions - -
SIST EN IEC 60286-3:2019



SIST EN IEC 60286-3:2019



IEC 60286-3 Edition 6.0 2019-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes continues
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.020; 31.240
ISBN 978-2-8322-6387-7
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale ®
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé. SIST EN IEC 60286-3:2019 colourinside



– 2 – IEC 60286-3:2019 © IEC 2019 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope . 8 2 Normative references . 8 3 Terms, definitions and symbols. 8 3.1 Terms and definitions . 8 3.2 Symbols . 10 4 Structure of the specification . 11 5 Dimensional requirements for taping . 12 5.1 Component cavity positioning requirements . 12 5.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 . 12 5.1.2 Requirements for types 4 . 12 5.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 12 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 15 5.5 Type2a – Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 17 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) . 20 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm). 21 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 24 6 Polarity and orientation requirements of components in the tape . 26 6.1 Requirements for all tape types . 26 6.2 Specific requirements for type 1a . 27 6.3 Specific requirements for type 4 . 27 7 Carrier tape requirements . 27 7.1 Taping materials . 27 7.2 Minimum bending radius (for all types) . 27 7.3 Camber . 28 8 Cover tape requirements (for types 1a, 1b, 2a, 2b and 3) . 29 9 Component taping and additional tape requirements. 30 9.1 All types . 30 9.2 Specific requirements for type 1b . 31 9.3 Specific tape requirements for type 2b . 31 9.4 Specific requirement for type 4 . 31 9.4.1 General . 31 9.4.2 Coordinate system . 31 9.4.3 Component positioning and lateral displacement . 33 9.5 Specific requirements for tapes containing die products . 33 9.5.1 General . 33 9.5.2 Tape design for tapes containing die products . 33 9.5.3 Cleanliness . 34 9.5.4 Die lateral movement (types 1a, 2a and 2b) . 34 10 Reel requirements . 34 SIST EN IEC 60286-3:2019



IEC 60286-3:2019 © IEC 2019 – 3 –
10.1 Dimensions . 34 10.1.1 General . 34 10.1.2 Reel dimensions . 34 10.1.3 Reel hole dimensions . 36 10.2 Marking . 36 11 Tape reeling requirements . 37 11.1 All types . 37 11.2 Specific requirements for type 1a . 37 11.3 Specific requirements for type 4 . 37 11.4 Leader and trailer tape . 37 11.4.1 General . 37 11.4.2 Leader . 38 11.4.3 Trailer . 38 11.5 Recycling . 38 11.6 Missing components . 38 Annex A (normative)
Recommended measuring methods for type 1b . 39 A.1 Measurement method for carrier tape thickness (T and T3) . 39 A.2 Measurement method for cavity (A0 and B0) . 39 A.3 Measurement method for cavity depth (dimension K0) . 40 Bibliography . 41
Figure 1 – Sectional view of component cavity (type 1b) . 9 Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 13 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 13 Figure 4 – Maximum component tilt, rotation and lateral movement . 13 Figure 5 – Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 mm) . 15 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 16 Figure 7 – Maximum component tilt, rotation and lateral movement . 16 Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 18 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 18 Figure 10 – Maximum component tilt, rotation and lateral movement . 18 Figure 11 – Type 2b carrier tape . 20 Figure 12 – Maximum pocket offset . 20 Figure 13 – Maximum component tilt, rotation and lateral movement . 20 Figure 14 – Blister carrier tape . 22 Figure 15 – Elongated sprocket hole skew . 22 Figure 16 – Maximum component tilt, rotation and lateral movement . 22 Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment pitch) . 24 Figure 18 – Illustration of 2 mm compartment pitch . 24 Figure 19 – Maximum component planar rotation and lateral displacement . 25 Figure 20 – Example of polarity and orientation . 27 Figure 21 – Bending radius . 28 Figure 22 – Measuring method and camber . 29 Figure 23 – Dot seals for thin components (as exceptions) . 30 SIST EN IEC 60286-3:2019



– 4 – IEC 60286-3:2019 © IEC 2019 Figure 24 – Type 4 coordinate system . 32 Figure 25 – Component clearance and positioning method . 33 Figure 26 – Reel . 35 Figure 27 – Reel hole presentation . 36 Figure 28 – Tape reeling and label area on the reel . 37 Figure 29 – Leader and trailer . 38 Figure A.1 – Carrier tape thickness measurement points . 39 Figure A.2 – Cavity cross-section . 40 Figure A.3 – Cavity depth dimension . 40
Table 1 – Component size codes . 9 Table 2 – Classification to symbols concerning tape, reel and common symbols . 10 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 14 Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 14 Table 5 – Component tilt, planar rotation and lateral movement . 15 Table 6 – Constant dimensions of 8 mm pressed carrier tape . 16 Table 7 – Variable dimensions of 8 mm pressed carrier tape . 17 Table 8 – Component tilt, planar rotation and lateral movement . 17 Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 19 Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 19 Table 11 – Component tilt, rotation and lateral movement . 19 Table 12 – Constant dimensions of 4 mm carrier tape . 21 Table 13 – Variable dimensions of 4 mm carrier tape . 21 Table 14 – Component tilt, planar rotation and lateral movements . 21 Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 23 Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 23 Table 17 – Component tilt, planar rotation and lateral movements . 24 Table 18 – Dimensions of adhesive backed punched carrier tape . 25 Table 19 – Variable dimensions of adhesive-backed punched carrier tape . 26 Table 20 – Component planar rotation and lateral displacement . 26 Table 21 – Minimum bending radius . 28 Table 22 – Peel force . 30 Table 23 – Absolute referencing data for component target position . 32 Table 24 – Reel dimensions . 35 Table 25 – Reel hole dimensions . 36
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IEC 60286-3:2019 © IEC 2019 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for electronic equipment. This sixth edition cancels and replaces the fifth edition published in 2013. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition: a) addition of a table of the classification to symbols concerning tape, reel and common symbols; b) additions of a figure of example of polarity and orientation and a figure of example of dot seal; c) revision of requirements for camber; SIST EN IEC 60286-3:2019



– 6 – IEC 60286-3:2019 © IEC 2019 d) addition of a definition of design value with regard to tilt. The text of this International Standard is based on the following documents: FDIS Report on voting 40/2643/FDIS 40/2649/RVD
Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60286 series, published under the general title Packaging of components for automatic handling, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific document. At this date, the document will be • reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer.
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IEC 60286-3:2019 © IEC 2019 – 7 –
INTRODUCTION Tape packaging meets the requirements of automatic component placement machines and also covers the use of tape packaging for components and singulated dies for test purposes and other operations.
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– 8 – IEC 60286-3:2019 © IEC 2019 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
1 Scope This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions 3 Terms, definitions and symbols 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply. Definitions apply to all tape types, unless specifically mentioned. ISO and IEC maintain terminological databases for use in standardization at the following addresses:
• IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 3.1.1
components electronic part of a product that cannot be physically divided into smaller parts without losing its particular function Note 1 to entry: This includes singulated die product. Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise. 3.1.2
component sizes size of component that are identified with their metric size code Note 1 to entry: This size code is followed by a capital M.
Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1. SIST EN IEC 60286-3:2019



IEC 60286-3:2019 © IEC 2019 – 9 –
Table 1 – Component size codes Metric size code Inch size code 0402M 01005 0603M 0201 1005M 0402 1608M 0603 2012M 0805
3.1.3
packaging product made of any material of any nature to be used for the containment, protection, structured alignment for automatic assembly, handling and delivery 3.1.4
pressed carrier tape carrier tape with concave cavities formed by compression of the base material 3.1.5
fluff fibre from the base material attached inside the cavity Note 1 to entry: See Figure 1. 3.1.6
burr surface projection of tape unintentially produced when cavity is formed Note 1 to entry: See Figure 1. 3.1.7
deformation bulge on the inner wall of the cavity Note 1 to entry: See Figure 1. 3.1.8
puff bulge on the reverse side of the cavity Note 1 to entry: See Figure 1.
Figure 1 – Sectional view of component cavity (type 1b) SIST EN IEC 60286-3:2019



– 10 – IEC 60286-3:2019 © IEC 2019 3.1.9
blister carrier tape carrier tape which is identified as tape belonging to types 2a, 2b and 3 Note 1 to entry These types of carriers are also known as "embossed" carrier types. 3.2 Symbols The symbols used in this document are listed in Table 2. Table 2 – Classification to symbols concerning tape, reel and common symbols Symbols Definitions
Figure references A Reel diameter Figure 26 A0 Cavity’s bottom dimension in direction of unreeling Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16 and 20 B Reel hole key’s groove width Figure 27 B0 Cavity’s bottom dimension in direction of tape width Figures 2, 4, 5, 7, 8, 10, 11, 13, 14, 16 and 20 B1 Cavity’s rim in direction of tape width Figures 8, 11 and 14 C Reel hole diameter Figures 26 and 27 CT Distance of puff under cavity in direction of tape width
Figure 5 d Difference of diameter between sprocket hole and round foramen Figure 14 D Reel slot diameter Figure 27 D0 Sprocket hole diameter
...