SIST EN 60286-3:2013

SLOVENSKI STANDARD
SIST EN 60286-3:2013
01-oktober-2013
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapes
Gurtung und Magazinierung von Bauelementen für die automatische Verarbeitung - Teil
3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues
Ta slovenski standard je istoveten z: EN 60286-3:2013
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
SIST EN 60286-3:2013 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 60286-3:2013

---------------------- Page: 2 ----------------------

SIST EN 60286-3:2013

EUROPEAN STANDARD
EN 60286-3

NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM

ICS 31.020; 31.240 Supersedes EN 60286-3:2007


English version


Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes
(IEC 60286-3:2013)


Emballage de composants pour Gurtung und Magazinierung von
opérations automatisées - Bauelementen für die automatische
Partie 3: Emballage des composants pour Verarbeitung -
montage en surface en bandes continues Teil 3: Gurtung von
(CEI 60286-3:2013) oberflächenmontierbaren Bauelementen
auf Endlosgurten
(IEC 60286-3:2013)




This European Standard was approved by CENELEC on 2013-06-21. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60286-3:2013 E

---------------------- Page: 3 ----------------------

SIST EN 60286-3:2013
EN 60286-3:2013 - 2 -
Foreword
The text of document 40/2200/FDIS, future edition 5 of IEC 60286-3, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN 60286-3:2013.

The following dates are fixed:
(dop) 2014-03-21
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-06-21
standards conflicting with the
document have to be withdrawn

This document supersedes EN 60286-3:2007.

EN 60286-3:2013 includes the following significant technical changes with respect to
EN 60286-3:2007:
a) integration of EN 60286-3-1:2009 as type 1b (Packaging of surface mount components on
continuous pressed carrier tapes);
b) integration of EN 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister
carrier tapes 4 mm in width).

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 60286-3:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60286-3-1:2009 NOTE Harmonised as EN 60286-3-1:2009 (not modified).
IEC 60286-3-2:2009 NOTE Harmonised as EN 60286-3-2:2009 (not modified).
IEC/TR 62258-3 NOTE Harmonised as CLC/TR 62258-3.
ISO 11469 NOTE Harmonised as EN ISO 11469.

---------------------- Page: 4 ----------------------

SIST EN 60286-3:2013
- 3 - EN 60286-3:2013
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60191-2 - Mechanical standardization of - -
semiconductor devices -
Part 2: Dimensions


IEC 61340-5-1 - Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements


IEC/TR 61340-5-2 - Electrostatics - CLC/TR 61340-5-2 -
Part 5-2: Protection of electronic devices
from electrostatic phenomena - User guide

---------------------- Page: 5 ----------------------

SIST EN 60286-3:2013

---------------------- Page: 6 ----------------------

SIST EN 60286-3:2013



IEC 60286-3

®


Edition 5.0 2013-05




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes




Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX W


ICS 31.020; 31.240 ISBN 978-2-83220-819-9



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 60286-3:2013
– 2 – 60286-3 © IEC:2013
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 General . 8
1.1 Scope . 8
1.2 Normative references . 8
2 Terms and definitions . 8
3 Structure of the specification . 10
4 Dimensional requirements for taping. 10
4.1 Component cavity positioning requirements . 10
4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3. 10
4.1.2 Requirements for types 4 . 10
4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 11
4.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
4.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 14
4.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16
4.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

1mm tape pitch (tape widths: 4 mm) . 18
4.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 20
4.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22
5 Polarity and orientation requirements of components in the tape . 25
5.1 Requirements for all tape types . 25
5.2 Specific requirements for type 1a . 25
5.3 Specific requirements for type 4 . 25
6 Carrier tape requirements . 25
6.1 Taping materials . 25
6.2 Minimum bending radius (for all types) . 26
6.3 Camber . 26
7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27
8 Component taping and additional tape requirements . 28
8.1 All types . 28
8.2 Specific requirements for type 1b . 28
8.3 Specific tape requirements for type 2b. 28
8.4 Specific requirement for type 4 . 28
8.4.1 General . 28
8.4.2 Coordinate system . 29
8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30
8.5 Specific requirements for tapes containing die products . 31
8.5.1 General . 31
8.5.2 Tape design for tapes containing die products . 31
8.5.3 Cleanliness . 31
8.5.4 Die lateral movement (Types 1a, 2a and 2b) . 32
9 Reel requirements . 32
9.1.1 General . 32

---------------------- Page: 8 ----------------------

SIST EN 60286-3:2013
60286-3 © IEC:2013 – 3 –
9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32
9.1.3 Reel hole dimensions (see Figure 25 and Table 24) . 34
9.2 Marking . 34
10 Tape reeling requirements . 35
10.1 All types . 35
10.2 Specific requirements for type 1a . 35
10.3 Specific requirements for type 4 . 35
10.4 Leader and trailer tape (see Figure 27) . 36
10.4.1 Leader . 36
10.4.2 Trailer . 36
10.5 Recycling . 36
10.6 Missing components . 36
Annex A (normative) Recommended measuring methods for type 1b . 37
Bibliography . 39

Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 12
Figure 4 – Maximum component tilt, rotation and lateral movement . 12
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 14
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 14
Figure 7 – Maximum component tilt, rotation and lateral movement . 14
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) . 16
Figure 9 – Illustration of 2 mm cavity pitch and pocket offset . 16
Figure 10 – Maximum component tilt, rotation and lateral movement . 16
Figure 11 – Type 2b carrier tape . 18
Figure 12 – Maximum pocket offset . 18
Figure 13 – Maximum component tilt, rotation and lateral movement . 18
Figure 14 – Blister carrier tape . 20
Figure 15 – Elongated sprocket hole skew . 20
Figure 16 – Maximum component tilt, rotation and lateral movement . 20
Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment
pitch) . 23
Figure 18 – Illustration of 2 mm compartment pitch . 23
Figure 19 – Maximum component planar rotation and lateral displacement . 23
Figure 20 – Bending radius . 26
Figure 21 – Camber (top view) . 27
Figure 22 – Type 4 coordinate system . 30
Figure 23 – Component clearance and positioning method . 31
Figure 24 – Reel . 32
Figure 25 – Reel hole presentation . 34
Figure 26 – Tape reeling and label area on the reel . 35
Figure 27 – Leader and trailer . 36
Figure A.1 – Carrier tape thickness measurement points . 37

---------------------- Page: 9 ----------------------

SIST EN 60286-3:2013
– 4 – 60286-3 © IEC:2013
Figure A.2 – Cavity cross-section . 37
Figure A.3 – Cavity depth dimension . 38

Table 1 – component size codes . 9
Table 2 – Constant dimensions of 8 mm and 12 mm punched carrier tape . 13
Table 3 – Variable dimensions of 8 mm and 12 mm punched carrier tape . 13
Table 4 – Component tilt, planar rotation and lateral movement . 13
Table 5 – Constant dimensions of 8 mm pressed carrier tape . 15
Table 6 – Variable dimensions of 8 mm pressed carrier tape . 15
Table 7 – Component tilt, planar rotation and lateral movement . 15
Table 8 – Constant dimensions of 8 mm to 24 mm blister carrier tape . 17
Table 9 – Variable dimensions of 8 mm to 24 mm blister carrier tape . 17
Table 10 – Component tilt, rotation and lateral movement . 17
Table 11 – Constant dimensions of 4 mm carrier tape . 19
Table 12 – Variable dimensions of 4 mm carrier tape . 19
Table 13 – Component tilt, planar rotation and lateral movements . 19
Table 14 – Constant dimensions of 32 mm to 200 mm blister carrier tape . 21
Table 15 – Variable dimensions of 32 mm to 200 mm blister carrier tape . 21
Table 16 – Component tilt, planar rotation and lateral movements . 21
Table 17 – Dimensions of adhesive backed punched carrier tape . 24
Table 18 – Variable dimensions of adhesive-backed punched carrier tape . 24
Table 19 – Component planar rotation and lateral displacement . 24
Table 20 – Minimum bending radius . 26
Table 21 – Peel force . 27
Table 22 – Absolute referencing data for component target position . 30
Table 23 – Reel dimensions . 33
Table 24 – Reel hole dimensions . 34

---------------------- Page: 10 ----------------------

SIST EN 60286-3:2013
60286-3 © IEC:2013 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60286-3 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This fifth edition cancels and replaces the fourth edition, published in 2007, as well as
IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full
layout revision. In addition, this edition includes the following significant technical changes
with respect to the previous edition:
a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on
continuous pressed carrier tapes);
b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on
blister carrier tapes 4 mm in width).

---------------------- Page: 11 ----------------------

SIST EN 60286-3:2013
– 6 – 60286-3 © IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
40/2200/FDIS 40/2233/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The list of all the parts of the IEC 60286 series, under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

---------------------- Page: 12 ----------------------

SIST EN 60286-3:2013
60286-3 © IEC:2013 – 7 –
INTRODUCTION
Tape packaging meets the requirements of automatic component placement machines and
also covers the use of tape packaging for components and singulated dies for test purposes
and other operations.

---------------------- Page: 13 ----------------------

SIST EN 60286-3:2013
– 8 – 60286-3 © IEC:2013
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 3: Packaging of surface mount components
on continuous tapes



1 General
1.1 Scope
This part of IEC 60286 is applicable to the tape packaging of electronic components without
leads or with lead stumps, intended to be connected to electronic circuits. It includes only
those dimensions that are essential for the taping of components intended for the above-
mentioned purposes.
This standard also includes requirements related to the packaging of singulated die products
including bare die and bumped die (flip chips).
1.2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply. Definitions apply
to all tape types, unless specifically mentioned.
2.1
components
unless specifically mentioned otherwise, for all packaging types for bare die products, the
term components refers to components as well as singulated die products
2.2
component sizes
all component sizes are identified with their metric size code (size code, followed by a
capital M)
Note 1 to entry: To avoid possible confusion with inch-based size codes, an equivalent table is shown in Table 1.

---------------------- Page: 14 ----------------------

SIST EN 60286-3:2013
60286-3 © IEC:2013 – 9 –
Table 1 – component size codes
Metric size code Inch size code
0402M 01005
0603M 0201
1005M 0402
1608M 0603
2012M 0805

2.3
packaging
product made of any material of any nature to be used for the containment, protection,
structured alignment for automatic assembly, handling and delivery
2.4
pressed carrier tape
(type 1b) carrier tape with concave cavities formed by compression of the base material
2.5
fluff
(type 1b) fibre from the base material attached inside the cavity
SEE: Figure 1.
2.6
burr
(type 1b) surface projection of tape unintentially produced when cavity is formed
SEE: Figure 1.
2.7
deformation
(type 1b) bulge on the inner wall of the cavity
SEE: Figure 1.
2.8
puff
(type 1b) bulge on the reverse side of the cavity
SEE: Figure 1.

Burr
Fluff
Deformation
Puff
IEC  1209/13

Figure 1 – Sectional view of component cavity (type 1b)

---------------------- Page: 15 ----------------------

SIST EN 60286-3:2013
– 10 – 60286-3 © IEC:2013

2.9
blister carrier tape
tape types 2a, 2b and 3 are identified as blister carrier tapes
Note 1 to entry: These types of carriers are also known as ‘embossed’ carrier types.
3 Structure of the specification
The various types of tapes are as follows.
NOTE 1 The separation of the prior type 1 into two sub-types 1a and 1b is new in this edition of this standard.
Any reference to type 1 not being specific to type 1a or type 1b is considered as referring to type 1a.
Type 1 – Punched and pressed carrier tape
Type 1a: Punched carrier tape, with top and bottom cover tape (tape
widths: 8 mm and 12 mm)
Type 1b: Pressed carrier tape, with top cover tape (tape width: 8 mm)
NOTE 2 The separ
...