SIST EN IEC 60749-22-1:2026

SLOVENSKI STANDARD
oSIST prEN IEC 60749-22-1:2025
01-februar-2025
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 22-1.
del: Moč vezi - Preskusne metode za vlečenje žične vezi
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond
strength - Wire bond pull test methods
Ta slovenski standard je istoveten z: prEN IEC 60749-22-1:2024
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
oSIST prEN IEC 60749-22-1:2025 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 60749-22-1:2025

oSIST prEN IEC 60749-22-1:2025
47/2888/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60749-22-1 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-12-13 2025-03-07
SUPERSEDES DOCUMENTS:
47/2883/RR
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):

ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of
which they are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some
Countries” clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is
the final stage for submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength -
wire bond pull test methods
PROPOSED STABILITY DATE: 2031
NOTE FROM TC/SC OFFICERS:
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it,
for any other purpose without permission in writing from IEC.

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 2 – 47/2888/CDV
1 CONTENT
3 FOREWORD . 4
4 1 Scope . 6
5 2 Normative references . 6
6 3 Terms and definitions . 7
7 4 Apparatus and material . 10
8 4.1 Inspection equipment . 10
9 4.2 Workholder . 10
10 4.3 Wire bond pull equipment . 10
11 4.4 Pulling hook . 11
12 4.5 Bond pull clamp . 11
13 5 Procedure . 11
14 5.1 Calibration . 11
15 5.2 Visual examination of bonds to be tested after decapsulation . 11
16 5.2.1 Applicability . 11
17 5.2.2 Bond pad examination and acceptability criteria for both aluminium and
18 copper bond pad metallization . 12
19 5.2.3 Examination and acceptability criteria for Cu and Ag wire and
20 connections (all bonds) . 12
21 5.3 Performing the wire bond pull test . 12
22 5.3.1 Wire bond pull test used . 12
23 5.3.2 Hook pull method . 12
24 5.3.3 Clamp pull method of single bond (cut wire) . 21
25 5.4 Examination of pulled wire bonds . 23
26 5.5 Wire bond pull failure codes . 23
27 5.5.1 Tabulation of codes . 23
28 5.5.2 Defining code 6 vs. 7 for thermosonic stitch bonds . 32
29 5.5.3 Discussion on the significance of failure codes . 32
30 5.6 Wire bond pull data . 33
31 5.6.1 Recording wire bond pull data . 33
32 5.6.2 Determining equivalent wire diameter for ribbon bonds . 34
33 5.6.3 Effective pull force versus the actual force on a bond . 34
34 6 Summary . 34
35 Annex A (informative) Guidance for performing pull testing on stacked bonds (reverse,
36 security and others) . 36
37 A.1 Reverse bonds (a.k.a. “stitch on ball”) . 36
38 A.2 Security bonds . 37
39 A.3 Other stacked bonds . 38
40 Annex B (informative) Guidance for performing decapsulation on devices prior to bond
41 pull testing . 40
42 B.1 Warning regarding ultrasonic cleaning of exposed wire bonds. 40
43 B.2 Concerns with decapsulation processes for devices with copper and silver
44 wire bonds . 40
45 B.3 Concern with undercutting bonds due to the over etching of the silver plating
46 on leadframes . 43
47 B.3.1 Techniques for assessing if excessive etching of ag plating has
48 occurred . 44
49 B.4 Concern with decapsulating packages with stitch bonds on multiple planes . 46

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 3 – 47/2888/CDV
50 B.5 Concern with not removing all encapsulation material around the bonded
51 wire prior to pull testing . 46
52 Annex C (informative) Correlation between pull failure codes in this document versus
53 pull failure codes in Mil-Std 883 method 2011.9 . 48
54 Annex D (Informative) Images to aid in determining appropriate failure code . 50
55 D.1 Fail in deformed portion of wire above thermosonic stitch bond – code 6 . 51
56 D.2 Fail in thermosonic stitch bond – code 7 . 52
57 D.3 Additional guidance for breaks in thermosonic stitch bonds – code 6 vs.
58 code 7 . 53
59 Annex E (informative) Additional guidance regarding minimum pull force specification
60 values and process control requirements . 57
61 Annex F (informative) Factors that can Affect Wire Pull Outcome . 58
62 F.1 How bond angle affects pull force . 58
63 F.2 Pull angle affects pull force and fail mode . 60
64 Annex G (informative) Background and reasons for choice of minimum pull
65 specification values . 62
66 Bibliography . 63
oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 4 – 47/2888/CDV
69 INTERNATIONAL ELECTROTECHNICAL COMMISSION
70 ____________
72 SEMICONDUCTOR DEVICES –
73 MECHANICAL AND CLIMATIC TEST METHODS –
75 Part 22-1: Bond strength - wire bond pull test methods
77 FOREWORD
78 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
79 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
80 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
81 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
82 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
83 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
84 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
85 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
86 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
87 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
88 consensus of opinion on the relevant subjects since each technical committee has representation from all
89 interested IEC National Committees.
90 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
91 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
92 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
93 misinterpretation by any end user.
94 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
95 transparently to the maximum extent possible in their national and regional publications. Any divergence between
96 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
97 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
98 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
99 services carried out by independent certification bodies.
100 6) All users should ensure that they have the latest edition of this publication.
101 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
102 members of its technical committees and IEC National Committees for any personal injury, property damage or
103 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
104 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
105 Publications.
106 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
107 indispensable for the correct application of this publication.
108 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
109 rights. IEC shall not be held responsible for identifying any or all such patent rights.
110 IEC 60749-22-1 has been prepared by IEC technical committee 47: Semiconductor devices. It
111 is an International Standard.
112 This first edition together with the first edition of IEC 60749-22-2, cancels and replaces IEC
113 60749-22 published in 2002 and is based on JEDEC document JESD22-B120. lt is used with
114 permission of the copyright holder, JEDEC Solid State Technology Association.
115 This edition includes the following significant technical changes with respect to the previous
116 edition:
117 Major update, including new techniques and use of new materials (e.g. copper wire) involving
118 a complete rewrite as two separate subparts (this document and IEC 60749-22-2)
119 The text of this International Standard is based on the following documents:
Draft Report on voting
oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 5 – 47/2888/CDV
XX/XX/FDIS XX/XX/RVD
121 Full information on the voting for its approval can be found in the report on voting indicated in
122 the above table.
123 The language used for the development of this International Standard is English
124 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
125 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
126 at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
127 described in greater detail at www.iec.ch/publications.
128 The committee has decided that the contents of this document will remain unchanged until the
129 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
130 specific document. At this date, the document will be
131 • reconfirmed,
132 • withdrawn,
133 • replaced by a revised edition, or
134 • amended.
oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 6 – 47/2888/CDV
137 SEMICONDUCTOR DEVICES –
138 MECHANICAL AND CLIMATIC TEST METHODS –
140 PART 22-1: BOND STRENGTH - WIRE BOND PULL TEST METHODS
144 1 Scope
145 This test method provides a means for determining the strength and failure mode of a wire
146 bonded to, and the corresponding interconnects on, a die or package bonding surface and may
147 be performed on unencapsulated or decapsulated devices. This test method may be performed
148 on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire
149 ranging in diameter from 15 µm to 76 µm (0,000 6” to 0,003”); and on gold alloy, copper alloy,
150 and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to
151 600 µm (0,000 7” to 0,024”)
152 This wire bond pull test method is destructive. It is appropriate for use in process development,
153 process control, and/or quality assurance.
154 This test method allows for two distinct methods of pulling wires:
155 1) One method incorporates the use of a hook that is placed under the wire and is then pulled.
156 2) One method requires that after the wire be cut, a clamp is placed on the wire connected to
157 the bond to be tested, and this clamp is used to pull the wire.
158 This test method defines three pull tests. The Wire Pull Test (WPT) is appropriate for all bonded
159 wires. The Ball Pull Test (BPT) and Stitch Pull Test (SPT) are appropriate for thermosonically
160 bonded wires.
161 This test method can also be used on the following four applications of thermosonic and
162 ultrasonic bonds, though each requires special considerations when performing the test
163 method:
164 a) Pulling aluminium wires and aluminium ribbons that are bonded with multiple ultrasonic
165 bonds. See 5.3.2.2.2 for special considerations. Multiloop wires and ribbons are used in
166 some high-power device packages.
167 b) Pulling wires of reverse bonds which are also known as “stitch on ball”. These types of
168 bonds can include gold stitch on gold ball, copper stitch on copper ball, and copper stitch
169 on gold ball. See Clause A.1 in Annex A for additional information.
170 c) Pulling a thermosonically bonded wire that has a security bond (see 3.9) or security loop
171 (see 3.19) placed on top of the stitch bond (see 3.3) in order to provide additional strength.
172 See Clause A.2 for additional information.
173 d) Pulling thermosonic wire bonds on stacked die when wires and/or bonds are not accessible
174 to allow for proper pull testing. See 5.3.2.2.4 for special considerations
175 This test method does not include bond strength testing using wire bond shear testing. Wire
176 bond shear testing is described in IEC 60749-22-2, Bond strength testing – Wire bond shear
177 test methods.
178 2 Normative references
179 The following documents are referred to in the text in such a way that some or all of their content
180 constitutes requirements of this document. For dated references, only the edition cited applies.

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 7 – 47/2888/CDV
181 IEC 60749-22-2, Semiconductor devices – Mechanical and climatic test methods – Part 22-2:
182 Bond strength testing – Wire bond shear test methods.
183 For undated references, the latest edition of the referenced document (including any
184 amendments) applies.
185 Also see Bibliography (informative) references.
186 3 Terms and definitions
187 For the purposes of this document, the following terms and definitions apply.
188 ISO and IEC maintain terminology databases for use in standardization at the following
189 addresses:
190 • IEC Electropedia: available at https://www.electropedia.org/
191 • ISO Online browsing platform: available at https://www.iso.org/obp
192 3.1
193 bond, wire
194 adhesion or welding of a wire (typically gold, aluminium, copper, or silver) to a bonding surface
195 using a thermosonic or ultrasonic wire bonding process.
196 3.2
197 ball, bond
198 first bond during the thermosonic (ball) bonding process, in which the end of a small diameter
199 wire (typically gold, copper, or silver) is bonded to a die bonding surface (typically an aluminium
200 alloy die pad metallization).
201 Note 1 to entry: The ball bond includes the enlarged spherical or nail-head portion of the wire that is provided by
202 the electronic flame-off, the underlying bonding pad, and the metallurgical weld interface between the ball bond and
203 the bonding pad.
204 3.3
205 stitch bond
206 second bond during the thermosonic (ball) bonding process, in which the wire is typically
207 bonded to the package bonding surface (e.g., leadframe, substrate, post, etc.).
208 Note 1 to entry: A stitch bond may also be referred to as a crescent bond
209 Note 2 to entry: For some unique constructions (e.g., reverse bond), the second bond may be formed on top of a
210 bump. See also “reverse bond” and “bump”).
211 3.4
212 wedge bond
213 attachment of a wire (typically aluminium, copper, or gold) or an aluminium ribbon to a die
214 bonding surface (typically aluminium pad metallization) or the package bonding surface (usually
215 a plated leadframe post or finger) using an ultrasonic bonding process.
216 3.5
217 bonding surface
218 surface to which the wire is bonded, which may be any one of the following: 1) the die pad
219 metallization or die surface metallization (e.g., MOSFET), 2) the package surface metallization
220 (e.g., leadframe, substrate, post), 3) a bump (see also “reverse bond” and “bump”), or 4) a
221 bonded stitch on die pad/flag or package surface metallization (see also “security bond” and
222 “security loop”).
oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 8 – 47/2888/CDV
223 3.6
224 bonding process, thermosonic
225 bonding process in which two members are joined through the combined application of heat,
226 pressure, and an ultrasonic oscillatory lateral motion.
227 3.7
228 bonding process, ultrasonic
229 bonding process in which two members are joined through the combined application of pressure
230 and an ultrasonic oscillatory lateral motion.
231 3.8
232 bonding wire
233 wire that is bonded to a chip bonding surface in order to electrically connect the chip to any
234 other point within the device package.
235 3.9
236 ribbon (wire)
237 flat wire (non-round).
238 Note 1 to entry: Throughout this test method the term “wire” covers both wire and ribbon (wire).
239 3.10
240 aluminium wire
241 aluminium alloy wire in which the aluminium content is typically 98 % or greater.
242 3.11
243 copper wire
244 copper alloy wire in which the copper content is typically 99 %, but also includes copper wire
245 with a very thin coating of palladium or gold and palladium.
246 3.12
247 gold wire
248 gold alloy wire in which the gold content is typically 99 % or greater.
249 3.13
250 silver wire
251 silver alloy wire in which the silver content is typically greater than 85 % for integrated circuits
252 (ICs) and greater than 75 % for light emitting diodes (LEDs).
253 3.14
254 midspan
255 location on the bonded wire that is approximately one half of the horizontal distance between
256 the two bonds. (See Figure 1)

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 9 – 47/2888/CDV
258 Figure 1 – Definition of midspan
259 3.15
260 outlier product
261 product that meets manufacturer specifications and user requirements but exhibits anomalous
262 characteristics with respect to a normal population (an example of which is depicted by the
263 histogram in Figure 2) and may be subject to a higher-than-normal level of failures in the user’s
264 application.
265 Note 1 to entry: For purposes of this document, all Wire Bond Pull Tests have only a minimum pull value
266 requirement and no upper limit, thus the upper specification limit (USL) is not applicable.
267 Note 2 to entry: See also JESD50, “Special Requirements for Maverick Product Elimination and Outlier
268 Management”.
270 Figure 2 – Depiction of eight outliers, seven of which are outlier products
271 3.16
272 reverse bond
273 thermosonic bond for which the ball is placed on the package bonding surface and the stitch is
274 placed on a bump on the die. This is also known as “stitch on ball”.
275 3.17
276 bump
277 thermosonic ball bond from which the wire has been removed. It can be used as the underlying
278 ball bond for reverse bonds on which the stitch (2nd bond) for the reverse bond is placed, or
279 the ball bond placed on a stitch bond to form a security bond.

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 10 – 47/2888/CDV
280 3.18
281 security bond
282 placing of a bump (see also “bump”) on top of a stitch bond to improve the mechanical strength
283 of a stitch bond to withstand the shearing stress between the encapsulation material and the
284 bonding surface.
285 Note 1 to entry: Security bonds are commonly used in surface mount LED (light emitting diode) packages which
286 use non-filled encapsulants for the lens material that have higher coefficients of thermal expansion than silica filled
287 encapsulants, and thus exhort higher shear stresses on the stitch bond.
288 3.19
289 security loop
290 security bond from which the wire has not been removed and the wire for the security loop is
291 attached to the same bonding surface as a stitch bond.
292 3.20
293 wire bond pull, destructive
294 process in which an instrument pulls on a thermosonic or ultrasonic bonded wire until failure.
295 3.21
296 wire bond pull, non-destructive
297 process in which an instrument pulls on a thermosonic or ultrasonic bonded wire with a specified
298 load that is below the minimum destructive pull value, such that no permanent damage or
299 degradation is expected to be imparted on the wire.
300 3.22
301 wire bond pull force (destructive
302 force required to cause any of the following to occur: the bonded wire to break; one of the bonds
303 to separate from a bonding surface; or one of the bonding surfaces to separate from the die,
304 leadframe, or substrate.
305 4 Apparatus and material
306 4.1 Inspection equipment
307 An optical microscope system or scanning electron microscope with a minimum of 70X
308 magnification is required to support the optical assessment of the resulting failure mode, such
309 as whether the wire break was ductile or brittle or if the bond lifted from pad or
310 leadframe/substrate with or without residues on pad or leadframe/substrate).However, a higher
311 magnification may be necessary for verifying Failure Codes 1, 2, 3, 6, 7, 8, and 9 (see 5.5 for
312 a detailed discussion of Failure Codes).
313 4.2 Workholder
314 The fixture used to hold the device, known as the “workholder” shall prevent any movement of
315 the device during wire bond pull testing and shall allow positioning the hook for optimum force
316 application to the wire.
317 4.3 Wire bond pull equipment
318 The apparatus shall consist of suitable equipment for applying a pulling force to the bonding
319 wire as required in accordance with this test method until failure occurs within the wire, wire
320 bond, or wire bonding surface. The equipment shall be capable of applying force at a constant
321 rate. The equipment shall indicate the applied force in SI and/or English units and be calibrated
322 over the full range of the expected values for the specific wire being pulled with an accuracy of
323 ±5 % of the intended breaking load or ± 2.9 mN (± 0,3 gf), whichever is the greater tolerance.
324 The required range of force values will vary by wire material and wire cross -section.

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 11 – 47/2888/CDV
325 The pull tester manufacturer’s recommended pulling tool travel speed for the wire material being
326 tested should be used. To verify that the pull speed for a test was in an acceptable range, the
327 output of the loadcell shall be reviewed to ensure that the strain rate was consistent throughout
328 the test.
329 4.4 Pulling hook
330 The pulling hook should be made of a strong, rigid material that will not deform during pull
331 testing. The diameter of the wire used to make the hook utilized to apply force to the
332 interconnect wire shall be large enough and its final shape shall be such to ensure that the
333 force applied by the hook distributes the pull force through the wire to the bonds and does not
334 cut through the wire. Table 1 provides the minimum diameter for the pulling hook to ensure the
335 above requirement.
336 Table 1 – Guidance for the minimum diameter of the pulling hook
Wire diameter Hook diameter
Minimum of 2,0x wire diameter
≤50 m (0,002”)
˃50 m (0,002”) to ≤125 m (0,005”) Minimum of 1,5x wire diameter
Minimum of 1,0x wire diameter
˃125 m (0,005”)
337 For ribbon wire, use the equivalent round wire diameter which gives the same cross-sectional
338 area as the ribbon wire being tested. The flat portion of the hook (horizontal) should be > 1 ,25x
339 the equivalent diameter of the ribbon wire being tested.
340 The hook shall be smooth (no sharp edges) and free of defects and contamination which could
341 compromise the test results or damage the wire being pulled.
342 4.5 Bond pull clamp
343 For the clamp pull tests, the clamp used shall be able to apply enough force to the wire being
344 pulled to hold it firmly such that it will not slip during the test. The clamp shall be large enough
345 to firmly hold the diameter of the wire or width and thickness of the ribbon to be pulled such
346 that it does not move when being pulled. The external shape and dimensions of the clamp shall
347 be optimized to allow for it to clamp onto the wire to be pulled, but also minimize the chance of
348 it touching and possibly damaging other wires on the device that are intended to be pull tested.
349 5 Procedure
350 5.1 Calibration
351 Before performing the wire bond pull test, it shall be determined that the equipment has been
352 calibrated in accordance with manufacturer's specifications and is presently in calibration.
353 Recalibration is required if the equipment is moved to another location.
354 5.2 Visual examination of bonds to be tested after decapsulation
355 5.2.1 Applicability
356 In addition to being a manufacturing process monitor, this test method can also be used to
357 assess bonds of encapsulated devices after soldering operations or after reliability stress
358 testing. To do this, the encapsulation material needs to be removed in a manner that does not
359 significantly degrade the wire, the bond, the bonding interface, or the bonding surface. Bond
360 pull force values are often lower for bonds that have been decapsulated, and therefore cannot
361 be compared to values for similar, unencapsulated bonds. If the decapsulation process is well
362 controlled and repeatable, which is the case for gold wire, then this test method can be used
363 for lot-to-lot comparison; however, it may be difficult to consistently control the decapsulation
364 process for copper and silver wires to ensure the accuracy of the results. For copper (Cu) and
365 silver (Ag) wires, the effectiveness of etch has been seen to vary due to the encapsulation

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 12 – 47/2888/CDV
366 material and the level of reliability stress testing performed on the samples. See Annex B for
367 additional information regarding the decapsulation process of devices with Cu and Ag wire
368 bonds.
369 Bonds must also be examined to ensure that enough encapsulation material has been removed
370 to allow for suitable placement of the pull hook.
371 5.2.2 Bond pad examination and acceptability criteria for both aluminium and copper
372 bond pad metallization
373 If performing wire bond pull testing on a device which has been opened using wet chemical
374 and/or dry etch techniques, the bond pads shall be examined to initially ensure that there is no
375 absence of metallization on the bonding surface area due to chemical etching, and then ensure
376 that wire bonds are attached to the bonding surface. Bonds on aluminium or copper bond pads
377 with significant chemical attack or absence of metallization shall not be used for wire bond pull
378 testing.
379 It is possible that wire bonds on bonding surfaces without degradation from chemical attack
380 may not be attached to the bonding surface due to other causes (e.g., package stress),
381 however, in these cases wire bonds are considered valid and shall be included in the pull data
382 as a zero (0) pull force value.
383 5.2.3 Examination and acceptability criteria for Cu and Ag wire and connections (all
384 bonds)
385 When performing wire bond pull testing on a device with copper or silver wires, the connection
386 of the bond and wire shall be examined after decapsulation, both before or after the pull test to
387 ensure that there is no significant loss of metal or other damage due to decapsulation process
388 that might affect the results of the pull test. The pull result can be excluded for a copper bond
389 or a copper wire with significant chemical attack or other damage due to the decapsulation
390 process. Annex B provides additional information to assess what level of damage is acceptable.
391 5.3 Performing the wire bond pull test
392 5.3.1 Wire bond pull test used
393 Multiple wire bond pull tests are described in this document:
394 • wire pull (hook used to pull wire so that both bonds are stressed),
395 • ball pull (hook or clamp used to stress mainly the ball bond),
396 • stitch pull (hook or clamp used to stress mainly the stitch bond), and
397 • pull of wedge bonds (clamp or hook used to stress either one or both bonds).
398 Each of the pull tests and their variations are described below.
399 NOTE Not all bond pull tests give repeatable and/or reproducible results, as results may be affected by the geometry
400 of the device and the device decapsulation results (if decapsulation is required). The determination of which wires
401 and bonds are to be pulled within a device and by which pull test is determined by the qualification document that
402 references this test method and should ensure that the pulling of all types of bonds is adequately addressed.
403 5.3.2 Hook pull method
404 5.3.2.1 Hook pull requirements and locations
405 The wire bond pull equipment shall pass all self-diagnostic tests before beginning the test. The
406 wire bond pull equipment and test area shall be free of excessive vibration or movement.
407 Examine the pull hook to ensure that the correct hook is used and to verify it is in good condition

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 13 – 47/2888/CDV
408 and is not bent or damaged (nicks, sharp edges, etc.). Check the pull hook to verify it is in the
409 up position.
410 Adjust the workholder to match the device being tested. Position the device so that the bond
411 to be pulled is located below the pull hook. Lower the pull hook or raise the device depending
412 upon the wire bond pull equipment being used, so the hook is below the wire to be pulled but
413 will not contact the surface of the die or package substrate/leadframe (Figure 3). If there is not
414 enough space under the wire for the hook, a clamp may be used to perform the wire pull test.
415 See 5.3.3 for details.
417 Figure 3 – Place hook under wire
419 Figure 4 – Orientation of hook with respect to the wire (viewed from above)
420 Position the hook with respect to the bonded wire to be tested so that it is perpendicular to the
421 length of the wire when observed from above (see Figure 4), or if constrained by space, as
422 close to perpendicular as possible. Position the pull hook under the wire so the wire is
423 approximately in the middle of the hook; not too close to the end of the hook so that the wire
424 might slip off, or too close to the inside of the hook such that the upper part of the hook does
425 not allow for free movement of the wire. The hook should not contact the wire prior to the start
426 of the test. Once in place, the hook shall be pull upward, perpendicular to the bonding surface
427 whenever possible.
428 If the spacing between wires is less than the length of the hook, such that the hook cannot be
429 inserted next to the wire to be pulled without contacting a wire, then use one of the following
430 approaches to insert the hook may be used:
431 1) The recommended approach is to use a pull tester that has the capability to rotate the hook
432 assembly. This capability rotates the hook to be parallel to the wires, lowers the hook below
433 the wire loop, and then rotates it back such that the hook is orthogonal to the wire. Care
434 must be taken to not contact the wire when it is rotated to the orthogonal position.
435 2) If the pull tester does not have the capability to rotate the hook assembly, the device itself
436 may be rotated until the hook is parallel to the wires, the hook is then lowered below the
437 wires, and then finally the device is rotated back so that the hook is orthogonal to the wire
438 to be pulled without disturbing either adjacent wire.

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 14 – 47/2888/CDV
439 The correct location for placing the hook along the length of the wire as prescribed by the type
440 of pull test to be performed. Below are the three pull tests defined in this test method and their
441 respective hook locations:
442 1) Wire Pull Test (WPT), see 5.3.2.2 - Hook pull near the mid-span of the wire
443 2) Ball Pull Test (BPT), see 5.3.2.3 - Hook pull near the neck of the thermosonic ball bond
444 3) Stitch Pull Test (SPT), see 5.3.2.4 - Hook pull near the thermosonic stitch bond
445 Final hook placement shall be accomplished under observation at 15 x minimum magnification.
446 A microscope with a zoom capability may be used for indexing the hook.
447 If the hook contacts an adjacent wire during set-up or during the pulling operation, that adjacent
448 wire shall not be used for pull testing. If the touched wire was required to have been pulled,
449 then a Failure Code of 0 (See 5.5) should be applied to that wire and another wire be chosen
450 for pull testing.
451 5.3.2.2 Wire Pull Test (WPT) – hook pull near the midspan of the wire
452 5.3.2.2.1 WPT – applicability and method
453 This test may be used on thermosonic bonded gold, copper, and silver wire; on ultrasonic
454 bonded gold, copper, silver, and aluminium wire; and aluminium ultrasonic ribbon. This method
455 is similar to Mil Std 883, Method 2011, Condition D.
456 For this test the hook shall be placed approximately at the midspan of the length of the wire
457 that is not deformed by the formation of the bonds. See Figures 5a through 5f for variations in
458 hook placement for different types of wire bonds. Each of the diagrams in Figure 5 shows a
459 space between two lines for the approximate placement of the hook. This test method cannot
460 provide an exact location for the placement of the hook due to differences in wire length and
461 shape for each bonded wire. Whenever possible, it is recommended that each wire to be pulled
462 be reviewed and a specific location be identified to minimize variability in the results if multiple
463 samples of the same device are to be pull tested.
465 The hook shall be in a fixed position that restricts motion along a straight line between each
466 bond, so that it will not rise to the highest point which could result in a test for only one bond
467 (e.g., as for a ball bond).

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 15 – 47/2888/CDV
469 Figure 5a – Thermosonic (die to substrate)
471 Figure 5b – Thermosonic (reverse)
473 Figure 5c – Thermosonic (Die to Die)
475 Figure 5d – Ultrasonic (die to substrate)

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 16 – 47/2888/CDV
477 Figure 5e – Ultrasonic (die to die)
479 Figure 5f – Ultrasonic multi-loop wire/ribbon
480 NOTE If this method is to be used on wires post encapsulation, the full length of the wire must be free of material.
481 The decision to ensure that all encapsulation material is removed from the bonds will depend on whether there is a
482 concern for failure at either of the bonds.
483 Figure 5 – Hook placement for wire pull test (WPT) for different types of wire bonds
484 5.3.2.2.2 Special considerations for pulling a bonded ribbon or wire with multiple
485 loops
486 When performing (mid-span) wire pull testing on a bonded ribbon or wire with multiple loops
487 see the requirements below for the number of loops to be pulled. If the bonded ribbon or wire
488 has:
489 • 2 loops – Pull only one of the loops (as the middle bond will be weakened by the initial
490 pull which could artificially lower the pull force for the 2nd loop).
491 • 3 or 4 loops – Pull the outer two loops.
492 • 5 or more loops – Pull the outer two loops. Optionally, additional loops may be pulled
493 as long as neither bond for the loop has been previously subjected to pull testing (i.e.,
494 neither loop on each side of the loop to be pulled has been pull tested).

oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 17 – 47/2888/CDV
495 5.3.2.2.3 Special considerations for pulling wires and ribbons with low loop height
496 Wires with low loop height may prevent access of the hook for wire pull testing. Figure 6 shows
497 a module with multiple die and the ultrasonic bonds shown have low bond angles and thus an
498 overall low loop height.
500 Figure 6 – Wires with low bond angles
502 Figure 7 – Device with slots to allow for hook placement
503 A test coupon with either slots (Figure 7) or attached metallized ceramic chips may be used to
504 replicate the wire loop profile and permit access of the hook to the wire to be tested. These
505 wires are to be bonded at the same time the production devices are bonded using the same
506 setup, operator, and schedule. The test coupon wires are to be pull tested in lieu of the
507 inaccessible wires on the production device. Failures on the test coupon shall be considered
508 as failures to production device and appropriate action is to be taken in accordance with the
509 applicable specification.
510 5.3.2.2.4 Special considerations for pulling wires on stacked die
511 Stacking configurations for packages with multiple die can pose challenges in wire pull testing
512 as not all wires or bonds will be exposed to allow for proper pull testing. For some die stacks,
513 not all wires will be accessible by a hook or clamp once fully assembled. For other die stacks,
514 some of the bonds may not be able to freely move during the pull test (e.g., are encapsulated
515 by die adhesive material).
516 To enable wire pull testing for process monitoring, special test vehicles of partially assembled
517 product should be used to allow for the pulling of wires and bonds that are not accessible once
518 all die are bonded. The test vehicle shall be bonded at the same time the production devices
519 are bonded using the same processes, procedures, and controls.
520 When developing the test vehicle build plan, ensure that the wires chosen for pull testing cover
521 the extremes found within the package. For example, pulling wires with the lowest and highest
522 loop profile or pulling the top and bottom wires in a stack to sample the extremes for bonding
523 preheat.
oSIST prEN IEC 60749-22-1:2025
IEC CDV 60749-22-1 © IEC 2024 – 18 – 47/2888/CDV
524 Figure 8 shows a stack of 8 die, with four die stacked like shingles going to the right, and then
525 four die stacked going to the left. The wires shown for the lower four die cannot be pulled by a
526 hook as the upper four die create interference with the pull test. The bond on the fourth die in
527 the stack has the additional issue that it is within the die attach film and thus would not be free
528 to move during wire pulling t
...