IEC TS 62861:2017

IEC TS 62861 ®
Edition 1.0 2017-03
TECHNICAL
SPECIFICATION
Guidelines for principal component reliability testing for LED light sources and
LED luminaires
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IEC TS 62861 ®
Edition 1.0 2017-03
TECHNICAL
SPECIFICATION
Guidelines for principal component reliability testing for LED light sources and

LED luminaires
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.140.99 ISBN 978-2-8322-4017-5

– 2 – IEC TS 62861:2017 © IEC 2017
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
4 Component test conditions . 13
5 LED package and interconnects . 14
5.1 General . 14
5.2 Sampling requirements . 14
5.3 Production requirements . 14
5.4 Assembly of LED packages on test boards. 15
5.5 Moisture preconditioning . 15
5.6 Thermal characteristics . 15
5.7 Pre- and post-stress electrical and photometric requirements . 15
5.8 Pre- and post-stress visual inspection . 15
5.9 Solderability and resistance to soldering heat . 15
5.9.1 Solderability. 15
5.9.2 Resistance to soldering heat (RSH-reflow) test . 15
5.10 Failure criteria . 16
5.11 Initial qualification tests for LED packages . 16
5.11.1 General . 16
5.11.2 Temperature and operation stress . 17
5.11.3 Thermo-mechanical stress . 18
5.11.4 Temperature and humidity stress . 18
5.11.5 Electrical stress – ESD-HBM . 19
5.11.6 Environmental stress . 19
5.12 Initial qualification test for LED package interconnects – VVF . 20
5.13 Accelerated stress tests for LED package interconnects . 20
5.13.1 General . 20
5.13.2 Interconnect temperature cycling (TMCL) . 21
6 Optical materials. 21
6.1 General . 21
6.2 Optical material test samples . 22
6.3 Moisture preconditioning . 22
6.4 Pre- and post-stress photometric measurements . 22
6.5 Adhesion test . 23
6.6 Pre- and post-stress visual inspection . 23
6.7 Failure criteria . 23
6.8 Initial qualification tests . 23
6.8.1 Relative humidity (RH) . 23
6.8.2 Boiling water (BW) . 24
6.8.3 Oven water (OW) . 24
6.8.4 High temperature exposure (HTE) . 24
6.9 Accelerated stress tests . 24
6.9.1 Prediction models . 24
6.9.2 Temperature and humidity (TH) . 25

6.9.3 Temperature and light exposure (TL) . 25
6.10 Light-transmitting materials . 26
6.11 Light-reflecting materials . 26
6.11.1 Dichroic-coated glass and aluminium-coated glass . 26
6.11.2 Aluminium-coated plastic . 26
6.11.3 White plastic/non-coated plastic . 26
6.12 Optical converters . 27
7 Electronic subassemblies . 27
7.1 General . 27
7.2 Sampling requirements . 27
7.3 Production requirements . 27
7.4 Pre- and post-stress electrical requirements . 28
7.5 Pre- and post-stress visual inspection . 28
7.6 Failure criteria . 28
7.7 Initial qualification tests . 28
7.7.1 Temperature and operation stress (PTC) . 28
7.7.2 Humidity and operation stress (HOT) . 29
7.8 Accelerated stress tests . 29
7.8.1 Prediction models . 29
7.8.2 Temperature, humidity and operation stress (sequential ALT) . 29
8 Active and passive cooling systems . 30
8.1 General . 30
8.2 Cooling system test samples . 31
8.3 Moisture preconditioning . 32
8.4 Thermal resistance test . 32
8.5 Performance parameter test . 32
8.6 Pre- and post-stress cooling performance requirements . 32
8.7 Pre- and post-stress visual inspection . 32
8.8 Failure criteria . 32
8.9 Initial qualification tests . 33
8.9.1 General . 33
8.9.2 Dust. 33
8.10 Accelerated stress tests . 34
8.10.1 General . 34
8.10.2 Cyclic temperature test (CT) with humidity and with/without operational
stress . 34
8.10.3 Temperature life test (TLT) passive cooling system . 34
8.10.4 Temperature life test (TLT) active cooling system . 35
9 Construction materials . 35
9.1 General . 35
9.2 Mechanical components and interconnects . 36
9.3 Mechanical interfaces between different components . 36
9.4 Chemical interactions . 37
10 Final product testing . 38
10.1 General . 38
10.2 Principal component reliability in the final product . 38
10.3 Minimum validated AST time . 39
10.4 Final product qualification for reliability . 40
11 Product updates .
...