IEC 60115-1:2020

IEC 60115-1 ®
Edition 5.0 2020-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –
Part 1: Generic specification
Résistances fixes utilisées dans les équipements électroniques –
Partie 1: Spécification générique

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IEC 60115-1 ®
Edition 5.0 2020-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –

Part 1: Generic specification
Résistances fixes utilisées dans les équipements électroniques –

Partie 1: Spécification générique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.10 ISBN 978-2-8322-7904-5

– 2 – IEC 60115-1:2020 © IEC 2020
CONTENTS
FOREWORD . 6
INTRODUCTION . 9
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classifications . 13
3.1 Terms and definitions . 13
3.2 Product technologies . 20
3.3 Resistor encapsulations . 23
3.4 Product classification . 24
4 General requirements . 25
4.1 Units and symbols. 25
4.2 Preferred values . 25
4.3 Coding . 26
4.4 Marking of the resistors. 26
4.5 Marking of the packaging . 26
4.6 Ordering designation . 27
4.7 Permissible substitutions . 27
4.8 Packaging . 28
4.9 Storage . 29
4.10 Transportation . 29
5 General provisions for measurements and test methods . 30
5.1 General . 30
5.2 Standard atmospheric conditions . 30
5.3 Tolerances on test severity parameters . 32
5.4 Drying . 33
5.5 Mounting of specimens . 33
5.6 Measurement of resistance . 35
6 Electrical measurements and tests . 37
6.1 Resistance . 37
6.2 Temperature coefficient of resistance . 39
6.3 Inductance . 42
6.4 Voltage coefficient of resistance . 44
6.5 Non-linearity . 45
6.6 Current noise . 46
6.7 Temperature rise . 47
7 Endurance tests . 48
7.1 Endurance at the rated temperature 70 °C . 48
7.2 Endurance at room temperature . 50
7.3 Endurance at a maximum temperature . 55
8 Electrical overload tests. 59
8.1 Short-term overload . 59
8.2 Single-pulse high-voltage overload test . 61
8.3 Periodic-pulse high-voltage overload test . 66
8.4 Periodic-pulse overload test . 68
8.5 Electrostatic discharge . 70

9 Mechanical measurements and tests . 71
9.1 Visual examination . 71
9.2 Gauging of dimensions . 72
9.3 Detail dimensions . 73
9.4 Robustness of the resistor body . 74
9.5 Robustness of terminations . 75
9.6 Robustness of threaded stud or screw terminations . 78
9.7 Shear test . 79
9.8 Substrate bending test . 81
9.9 Bump . 83
9.10 Shock . 84
9.11 Vibration . 85
10 Environmental and climatic tests . 87
10.1 Rapid change of temperature . 87
10.2 Operation at low temperature . 88
10.3 Climatic sequence. 89
10.4 Damp heat, steady state . 92
10.5 Damp heat, steady state, accelerated . 95
10.6 Corrosion . 97
10.7 Whisker growth test . 99
10.8 Hydrogen sulphide test . 100
11 Tests related to component assembly . 101
11.1 Solderability . 101
11.2 Resistance to soldering heat . 105
11.3 Solvent resistance . 107
12 Tests related to safety . 109
12.1 Insulation resistance . 109
12.2 Voltage proof . 114
12.3 Accidental overload test . 115
12.4 Flammability . 120
13 Quality assessment procedures . 121
Annex A (normative) Symbols and abbreviated terms . 123
A.1 Symbols . 123
A.2 Abbreviated terms . 126
Annex B (normative) Rules for the preparation of detail specifications for resistors
and capacitors for electronic equipment for use within the IECQ system . 129
Annex C (informative) Example of a certified test record . 130
Annex Q (informative) Quality assessment procedures . 132
Q.1 General . 132
Q.2 IECQ Approved Component (IECQ AC) procedures . 136
Q.3 IECQ Qualification Approval (QA) procedures . 137
Q.4 IECQ Approved Component – Capability Certification (IECQ AC-C)
procedures . 138
Q.5 IECQ Approved Component – Technology Certification (IECQ AC-TC)
procedure . 140
Annex R (informative) Failure rate level evaluation, determination and qualification . 143
R.1 General . 143
R.2 Certification and determination of a failure rate level . 144

– 4 – IEC 60115-1:2020 © IEC 2020
R.3 Non-conformances . 146
R.4 Extension of a qualification to a higher failure rate level . 146
R.5 Maintenance of a failure rate level . 146
R.6 Deliveries . 147
R.7 Determination of a component failure rate . 148
Annex X (informative) Cross-references for references to the prior revision of this
document . 151
Bibliography . 155

Figure 1 – Hierarchical system of specifications . 10
Figure 2 – Voltage and dissipation on a resistor below and above its critical resistance . 14
Figure 3 – Standard measurement points on a leaded resistor . 36
Figure 4 – Standard measurement points on an SMD resistor . 36
Figure 5 – Measurement points on an assembled SMD resistor . 37
Figure 6 – Permissible resistance range due to tolerance . 38
Figure 7 – Permissible resistance range due to tolerance and TCR . 39
Figure 8 – Variation of resistance with temperature (example) . 39
Figure 9 – Test circuit for measurement of the inductance . 43
Figure 10 – Exponential voltage rise caused by inductance . 44
Figure 11 – Standard derating curve for the rated dissipation P . 49
Figure 12 – Derating curve with specification of a suitable test dissipation . 53
Figure 13 – Derating curve without specification of a suitable test dissipation . 53
Figure 14 – Derating curve for UCT ≥ MET . 57
Figure 15 – Derating curve for UCT < MET . 57
Figure 16 – Parameters of an open-circuit lightning impulse voltage . 62
Figure 17 – Circuit for generation of 1,2/50 pulses . 63
Figure 18 – Circuit for generation of 10/700 pulses . 64
Figure 19 – Testing of resistor body robustness . 75
Figure 20 – Shear test for SMD resistors . 80
Figure 21 – Substrate bending test for SMD resistors . 82
Figure 22 – V-block fixture . 110
Figure 23 – Foil method applied to a resistor specimen . 111
Figure 24 – Mounting method applied to a resistor specimen . 111
Figure 25 – Parallel clamp fixture for rectangular SMD resistors . 112
Figure 26 – V-clamp test fixture for cylindrical SMD resistors . 113
Figure 27 – Gauze fixture for axial cylindrical specimens . 117
Figure 28 – Gauze fixture dimensions for cylindrical specimens . 118
Figure 29 – Gauze fixture dimensions for non-cylindrical specimens . 119

Table 1 – Reference atmospheric conditions . 30
Table 2 – Referee atmospheric conditions . 31
Table 3 – Standard atmospheric conditions for testing . 31
Table 4 – Controlled atmospheric conditions for recovery . 32
Table 5 – Default tolerances on temperature specifications. 32

Table 6 – Default tolerances on voltage specifications . 32
Table 7 – Default tolerances on duration specifications . 33
Table 8 – Specimen drying procedures . 33
Table 9 – Voltages for resistance measurement . 35
Table 10 – Sequence of temperatures and measurements . 40
Table 11 – Severities for the single-pulse high-voltage overload test . 65
Table 12 – Severities for the periodic-pulse high-voltage overload test . 68
Table 13 – Tensile test force for wire terminations . 76
Table 14 – Test torque for threaded studs, screws and integral mounting devices . 78
Table 15 – Recommended parameters for the substrate bending test . 81
Table 16 – Recommended parameters for the bump test . 84
Table 17 – Recommended parameters for the shock test . 85
Table 18 – Recommended parameters for the vibration test . 86
Table 19 – Recommended parameters for the rapid change of temperature test . 88
Table 20 – Number of additional damp heat cycles . 91
Table 21 – Severity parameters for the damp heat, steady state test . 93
Table 22 – Bias voltage for the damp heat, steady state test . 94
Table 23 – Severity parameters for the accelerated damp heat, steady state test . 96
Table 24 – Grouped DC bias voltages for < 25 % deviation . 97
Table 25 – Recommended parameters for the corrosion test . 98
Table 26 – Test methods and parameters for the whisker growth test . 100
Table 27 – Selection of accelerated ageing methods of IEC 60068-2-20 . 101
Table 28 – Process temperatures for selected solder alloy examples . 102
Table 29 – Solderability test parameters for SMD resistors . 103
Table 30 – Solderability test parameters for resistors with wire or tag terminations . 104
Table 31 – Resistance to soldering heat test parameters for SMD resistors . 106
Table 32 – RSH test parameters for resistors with wire or tag terminations . 106
Table 33 – Recommended parameters for the solvent resistance test . 109
Table 34 – Insulation resistance measuring voltage . 114
Table 35 – Recommended parameters for the accidental overload test . 120
Table R.1 – Requirements for the qualification of a failure rate level . 145
Table R.2 – Requirements for the maintenance of a failure rate level qualification . 147
Table R.3 – Environmental factor π for determination of the component failure rate . 150
E
Table R.4 – Quality factor π for determination of the component failure rate . 150
Q
Table X.1 – Cross-references for references to clauses (1 of 3) . 151
Table X.2 – Cross-references for references to figures . 153
Table X.3 – Cross reference for references to tables . 154

– 6 – IEC 60115-1:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60115-1 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This fifth edition cancels and replaces the fourth edition published in 2008. This edition
constitutes a technical revision.
This edition contains the following significant technical changes with respect to the previous
edition:
th
a) this 5 edition employs a new document structure, where the tests of prior Clause 4 are
given in Clauses 6 to 12 now, with an informative Annex X providing cross-references for
references to the prior revision of this standard;
b) the terms and definitions have been revised and amended, supplemented by a new
section on resistor technologies and a new section on product classification levels;
c) a new Subclause 4.7 on recommendations for permissible substitutions has been added;

d) the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10
have been completely revised;
e) a new Subclause 5.3 on default tolerances for the most common test parameters has been
added;
f) the generic method of measuring resistance, now Sublause 5.6, has been separated from
the test for compliance with a prescribed resistance value in 6.1, as a revision of the prior
4.5;
g) the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the
prior test 4.8, variation of resistance with temperature, where the special concessions for
resistors below 10 Ω have been waived;
h) the test methods for endurance testing of Subclauses 7.1 to 7.3 (prior 4.25.1 to 4.25.3)
have been completely revised;
i) the single-pulse high-voltage overload test of Subclause 8.2 (prior 4.27) has been
completely revised, and now offers adjustable severities for the 1,2/50 and for the 10/700
pulse shape for the benefit of detail specifications with improved significance;
j) the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been
revised and a corrected table of severities provided;
k) the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and
streamlined to only offer the severity historically applied in subordinate specifications;
l) the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the
assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
m) the tests for robustness of terminations (prior 4.16) have been revised and separated into
tests for the robustness of solderable terminations, Subclause 9.5, and tests for the
robustness of threaded stud or screw terminations, Subclause 9.6;
n) the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior
4.21) have been revised to reflect the merged relevant test standard IEC 60068-2-29;
o) the dry heat and cold test of the climatic sequence of Subclause 10.3 (prior 4.23) have
been revised to reflect the changes of the relevant test standards IEC 60068-2-2 and
IEC 60068-2-1;
p) the accelerated damp heat, steady state test of Subclause 10.5 (prior 4.37) has been
amended with an option for a reduced number of bias voltages;
q) the corrosion test of Subclause 10.6 has been completely revised in order to employ the
better suitable test method of IEC 60068-2-52 instead of the prior used IEC 60068-2-11;
r) the whisker growth test of Subclause 10.7 has been revised to reflect the changes of the
new revision of the test methods of IEC 60068-2-82;
s) the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to
soldering heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate
the necessary option for the variety of lead-bearing and lead-free solder alloys and
respective process conditions;
t) the solvent resistance test of Subclause 11.3 combines the prior tests 4.29, component
solvent resistance, and 4.30, solvent resistance of marking, in one test;
u) the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised;
v) the Annex Q on quality assessment procedures has been completely revised;
w) a new Annex R on failure rate evaluation, determination and qualification has been added.
The text of this International Standard is based on the following documents:
FDIS Report on voting
40/2717/FDIS 40/2733/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

– 8 – IEC 60115-1:2020 © IEC 2020
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60115 series, under the general title Fixed resistors for use in
electronic equipment, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
The specification system for fixed resistors for use in electronic equipment is structured in a
hierarchical system as shown in Figure 1, consisting of the following specification types.
Generic specification
The generic specification covers all subjects mainly common to the family of fixed resistors for
use in electronic equipment, such as terminology, methods of measurement and tests. Where
the individual subjects require the prescription conditions or parameters specific to the
particular sub-family or type of fixed resistor, such prescriptions are required to be given by
one of the subordinate specifications.
For the scope of fixed resistors, the numeric reference to the generic specification is
IEC 60115-1.
Sectional specification
Sectional specifications cover all subjects additional to those given in the generic
specification, which are specific to a defined sub-group of fixed resistors. These subjects
normally are preferred values for dimensions and characteristics, additional test methods and
relevant prescriptions for test methods given in the generic specification, prescriptions for
sampling and for the preparation of specimen, recommended test severities and preferred
acceptance criteria. The sectional specification also outlines the structure and scope of the
test schedules which are to be applied in all subordinate detail specifications.
For the scope of fixed resistors, the numeric references to the sectional specifications reach
from IEC 60115-2 for leaded fixed low power film resistors to currently IEC 60115-9 for fixed
surface mount resistor networks with individually measurable resistors. The variety of
sectional specifications may be adapted to the portfolio of different technologies of fixed
resistors.
Detail specification
Detail specifications give directly, or by making reference to other documents, all information
necessary to completely describe a given type and range of fixed resistors, including
prescriptions of all values for dimensions and characteristics. They also give all information
required for the quality assessment of the covered type and range of fixed resistors within a
suitable quality assessment system, including prescriptions for all applied test severities and
acceptance criteria, and the completed test schedules.
Detail specifications can be either specifications within the IEC system, another specification
system linked to IEC, or specified by the manufacturer or user. For the scope of fixed
resistors, the numeric references to detail specifications are e.g. IEC 60115-2-101; if related
to the sectional specification, IEC 60115-2; and if related to the ancillary blank detail
specification, IEC 60115-2-1.
Blank detail specification
The hierarchical system of specifications is supplemented by one or more blank detail
specification to a sectional specification, which are used to ensure a uniform presentation of
detail specifications. The blank detail specifications provide the specification writer with a
template on the layout to be adopted and on the information to be given and with guidance for
the preparation of detail specifications in line with the requirements of the superior generic or
sectional specifications. Blank detail specifications are not considered as relevant
specifications since they do not themselves describe any particular component.

– 10 – IEC 60115-1:2020 © IEC 2020
The presence of an established hierarchical specification system with blank detail
specifications permits the preparation of detail specifications even outside of the relevant IEC
technical committee.
For the scope of fixed resistors, the numeric references to blank detail specifications are e.g.
IEC 60115-2-1: if related to the sectional specification, IEC 60115-2.
Relevant specification
In this system the term "relevant specification" addresses subordinate specifications
containing specific requirements, where applicable.
Any generic or sectional specification may use abstract and universal references to
subordinate specifications of either hierarchical level by use of the expression "relevant
specification".
Key
1 Indicates the range of "Relevant specifications" to the superior generic specification, where applicable.
2 Indicates the range of "Relevant specifications" to the superior sectional specification, where applicable.
Figure 1 – Hierarchical system of specifications

FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
1 Scope
This part of IEC 60115 is a generic specification and is applicable to fixed resistors for use in
electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional
and detail specifications of electronic components for quality assessment or any other
purpose.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050 (all parts), International Electrotechnical Vocabulary (IEV) (available at
www.electropedia.org)
IEC 60062, Marking codes for resistors and capacitors
IEC 60063, Preferred number series for resistors and capacitors
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Tests A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Tests B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21:2006, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27:2008, Environmental testing – Part 2-27: Tests – Test Ea and guidance:
Shock
– 12 – IEC 60115-1:2020 © IEC 2020
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-45:1980, Basic environmental testing procedures - Part 2-45: Tests - Test XA
and guidance: Immersion in cleaning solvents
IEC 60068-2-45:1980/AMD1:1993
IEC 60068-2-47, Environmental testing – Part 2-47: Test – Mounting of specimens for
vibration, impact and similar dynamic tests
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-67, Environmental testing – Part 2-67: Tests – Test Cy: Damp heat, steady state,
accelerated test primarily intended for components
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60068-2-82:2019, Environmental testing – Part 2-82: Tests – Test XW1: Whisker test
methods for components and parts used in electronic assemblies
IEC 60195:2016, Method of measurement of current noise generated in fixed resistors
IEC 60286 (all parts), Packaging of components for automatic handling
IEC 60294, Measurement of the dimensions of a cylindrical component with axial terminations
IEC 60440:2012, Method of measurement of non-linearity in resistors
IEC 60617, Graphical symbols for diagrams (available at http://www.graphical-
symbols.info/equipment)
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 61191 (all parts), Printed board assemblies
IEC 61193-2, Quality assessment systems – Part 2: Selection and use of sampling plans for
inspection of electronic components and packages
IEC 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61760-1, Surface mounting technology – Part 1: Standard method for the specification of
surface mounting components (SMDs)
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions of
surface mounting devices (SMD) – Application guide
IEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologies
IEC 62812:2019, Low resistance measurements – Methods and guidance
IEC 80000 (all parts), Quantities and units
IECQ 03-1:2018, IEC Quality Assessment System for Electronic Components (IECQ System)
– Rules of procedure – Part 1: General Requirements for all IECQ Schemes
ISO 80000 (all parts), Quantities and units
3 Terms, definitions, product technologies and product classifications
NOTE A list of used symbols and abbreviated terms is provided in Annex A.
3.1
...