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IEC 60115-8:2023

(Main)

Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors

Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors

IEC 60115-8:2023 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. These resistors have metallized terminations and are primarily intended to be mounted directly onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:
a) definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
b) new style of transverse (RT) resistors has been added in 3.1.5 and 4.2.2 to cover resistors with wide terminals, which have become common in market;
c) recommended test boards in 5.2.2 have been revised to fit the demands from the market for higher rated dissipation in resistors;
d) test boards have been revised so that they can be set vertically instead of horizontally during specified tests to optimize the temperature rise stability, area and spacing inside the test chamber;
e) 'Periodic-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been added to the default test method in 5.3.8, however, the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4 is still maintained for historical products;
and more. Please see the foreword for the list of changes.

Résistances fixes utilisées dans les équipements électroniques - Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface

L’IEC 60115-8:2023 s’applique aux résistances fixes pour montage en surface utilisées dans les équipements électroniques.
Ces résistances sont généralement décrites selon des types (différentes formes géométriques), des modèles (différentes dimensions) et des technologies de produits. Ces résistances comportent des sorties métalliques et sont conçues principalement pour être montées directement sur un circuit imprimé.
Le présent document a pour objet de spécifier les caractéristiques assignées et les caractéristiques préférentielles, de choisir dans l’IEC 60115-1 les procédures d’assurance de la qualité et les méthodes d’essai et de mesure appropriées, et de fixer les exigences de performance générales pour ce type de résistance.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) adoption des définitions des technologies de produits et des niveaux de classification des produits de la spécification générique, IEC 60115-1:2020;
b) ajout d’un nouveau modèle de résistances transversales (RT) en 3.1.5 et 4.2.2 afin de couvrir les résistances à larges sorties qui sont devenues courantes sur le marché;
c) révision des cartes d’essai recommandées en 5.2.2 pour répondre aux demandes du marché d’une dissipation assignée supérieure dans les résistances;
d) révision des cartes d’essai pour pouvoir les placer à la verticale et non pas à l’horizontale pendant les essais spécifiés dans le but d’optimiser la stabilité de l’augmentation de température, la surface et l’espacement à l’intérieur de la chambre d’essai;
e) ajout de "l’essai de surcharge haute tension à impulsions périodiques" de l’IEC 60115‑1:2020, 8.3 à la méthode d’essai par défaut en 5.3.8, toutefois l’ancienne méthode d’essai, "essai de surcharge à impulsions périodiques" de l’IEC 60115‑1:2020, 8.4, est maintenue pour les produits historiques;
et plus. Veuillez consulter l'avant-propos pour la liste des modifications.

General Information

Status
Published
Publication Date
24-Aug-2023
ICS
31.040.10 - Fixed resistors
Technical Committee
TC 40 - Capacitors and resistors for electronic equipment
Drafting Committee
MT 60115-8 - TC 40/MT 60115-8
Current Stage
PPUB - Publication issued
Start Date
26-Sep-2023
Completion Date
25-Aug-2023
Ref Project

Relations

Revises
IEC 60115-8:2009 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
Effective Date
05-Sep-2023

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IEC 60115-8:2023 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors Released:8/25/2023IEC 60115-8:2023 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors Released:8/25/2023
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IEC 60115-8:2023 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors Released:8/25/2023
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IEC 60115-8 ®
Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –
Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface
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IEC 60115-8 ®
Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fixed resistors for use in electronic equipment –

Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –

Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.10  ISBN 978-2-8322-7437-8

– 2 – IEC 60115-8:2023 © IEC 2023
CONTENTS
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classification . 12
3.1 Terms and definitions . 12
3.2 Product technologies . 12
3.3 Product classification . 13
4 Preferred characteristics . 13
4.1 General . 13
4.2 Style and dimensions . 13
4.2.1 Preferred styles and outline dimensions for rectangular (RR) resistors . 13
4.2.2 Preferred styles and outline dimensions for transverse (RT) resistors . 14
4.2.3 Preferred styles and outline dimensions for cylindrical (RC) resistors . 15
4.2.4 Preferred styles and outline dimensions for wire-wound (RW) resistors . 16
4.3 Preferred climatic categories . 17
4.4 Resistance . 17
4.5 Tolerances on resistance . 17
4.6 Rated dissipation P . 17
4.7 Limiting element voltage U . 18
max
4.8 Insulation voltage U . 18
ins
4.9 Insulation resistance R . 18
ins
5 Tests and test severities . 18
5.1 General provisions for tests invoked by this document . 18
5.2 Preparation of specimens . 19
5.2.1 Drying . 19
5.2.2 Mounting of components on test boards . 19
5.3 Tests . 25
5.3.1 Resistance . 25
5.3.2 Temperature coefficient of resistance . 25
5.3.3 Temperature rise . 26
5.3.4 Endurance at the rated temperature 70 °C . 26
5.3.5 Endurance at a maximum temperature: UCT . 26
5.3.6 Short-term overload . 27
5.3.7 Single-pulse high-voltage overload test . 27
5.3.8 Periodic-pulse high-voltage overload test . 28
5.3.9 Electrostatic discharge (ESD) test . 29
5.3.10 Visual examination . 29
5.3.11 Gauging of dimensions . 29
5.3.12 Detail dimensions . 30
5.3.13 Shear (adhesion) test . 30
5.3.14 Substrate bending test . 30
5.3.15 Shock . 31
5.3.16 Vibration . 31
5.3.17 Rapid change of temperature . 31
5.3.18 Rapid change of temperature, ≥ 100 cycles . 31
5.3.19 Climatic sequence . 31

5.3.20 Damp heat, steady state . 32
5.3.21 Solderability, with lead-free solder . 33
5.3.22 Solderability, with SnPb solder . 33
5.3.23 Resistance to soldering heat . 34
5.3.24 Solvent resistance . 34
5.3.25 Insulation resistance . 34
5.3.26 Voltage proof . 34
5.3.27 Flammability test . 35
5.4 Optional and/or additional tests . 35
5.4.1 Single-pulse high-voltage overload test . 35
5.4.2 Periodic-pulse overload test . 35
5.4.3 Operation at low temperature. 36
5.4.4 Damp heat, steady state, accelerated . 36
6 Performance requirements. 37
6.1 General . 37
6.2 Limits for change of resistance at tests . 37
6.3 Temperature coefficient of resistance . 40
6.4 Temperature rise . 40
6.5 Visual examination . 41
6.5.1 General visual criteria . 41
6.5.2 Visual criteria after tests . 41
6.5.3 Visual criteria for the packaging . 41
6.6 Solderability . 41
6.7 Insulation resistance . 42
6.8 Flammability . 42
7 Marking, packaging and ordering information . 42
7.1 Marking of the component . 42
7.2 Packaging .
...

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- Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic.
- Adition of a test for the immunity against electrostatic discharge.
- Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests.
- Addition of information relevant for the component user in his assembly process.
- Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

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    89 pages
    English and French language
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IEC
IEC 60115-2:2014(Main)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors

IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition:
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.

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    139 pages
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IEC
IEC 60115-8:2009(Main)
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. The major technical changes with regard to the first edition are the following:
- introduction of a product classification based on application requirements;
- extension of the list of styles and dimensions;
- use of an extended scope of stability class definitions;
- extension of the lists of preferred values of ratings;
- inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- inclusion of a new set of severities for a shear test;
- inclusion of definitions for a test board;
- replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- inclusion of requirements applicable to 0 ohm resistors (jumpers).

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    41 pages
    English language
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  • Standard
    84 pages
    English and French language
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