IEC 60115-8:2023

IEC 60115-8 ®
Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –
Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC -  IEC Products & Services Portal - products.iec.ch
webstore.iec.ch/advsearchform Découvrez notre puissant moteur de recherche et consultez
La recherche avancée permet de trouver des publications IEC gratuitement tous les aperçus des publications. Avec un
en utilisant différents critères (numéro de référence, texte, abonnement, vous aurez toujours accès à un contenu à jour
comité d’études, …). Elle donne aussi des informations sur les adapté à vos besoins.
projets et les publications remplacées ou retirées.

Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
Le premier dictionnaire d'électrotechnologie en ligne au monde,
Restez informé sur les nouvelles publications IEC. Just
avec plus de 22 300 articles terminologiques en anglais et en
Published détaille les nouvelles publications parues.
français, ainsi que les termes équivalents dans 19 langues
Disponible en ligne et une fois par mois par email.
additionnelles. Egalement appelé Vocabulaire

Electrotechnique International (IEV) en ligne.
Service Clients - webstore.iec.ch/csc

Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
IEC 60115-8 ®
Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fixed resistors for use in electronic equipment –

Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –

Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.10  ISBN 978-2-8322-7437-8

– 2 – IEC 60115-8:2023 © IEC 2023
CONTENTS
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classification . 12
3.1 Terms and definitions . 12
3.2 Product technologies . 12
3.3 Product classification . 13
4 Preferred characteristics . 13
4.1 General . 13
4.2 Style and dimensions . 13
4.2.1 Preferred styles and outline dimensions for rectangular (RR) resistors . 13
4.2.2 Preferred styles and outline dimensions for transverse (RT) resistors . 14
4.2.3 Preferred styles and outline dimensions for cylindrical (RC) resistors . 15
4.2.4 Preferred styles and outline dimensions for wire-wound (RW) resistors . 16
4.3 Preferred climatic categories . 17
4.4 Resistance . 17
4.5 Tolerances on resistance . 17
4.6 Rated dissipation P . 17
4.7 Limiting element voltage U . 18
max
4.8 Insulation voltage U . 18
ins
4.9 Insulation resistance R . 18
ins
5 Tests and test severities . 18
5.1 General provisions for tests invoked by this document . 18
5.2 Preparation of specimens . 19
5.2.1 Drying . 19
5.2.2 Mounting of components on test boards . 19
5.3 Tests . 25
5.3.1 Resistance . 25
5.3.2 Temperature coefficient of resistance . 25
5.3.3 Temperature rise . 26
5.3.4 Endurance at the rated temperature 70 °C . 26
5.3.5 Endurance at a maximum temperature: UCT . 26
5.3.6 Short-term overload . 27
5.3.7 Single-pulse high-voltage overload test . 27
5.3.8 Periodic-pulse high-voltage overload test . 28
5.3.9 Electrostatic discharge (ESD) test . 29
5.3.10 Visual examination . 29
5.3.11 Gauging of dimensions . 29
5.3.12 Detail dimensions . 30
5.3.13 Shear (adhesion) test . 30
5.3.14 Substrate bending test . 30
5.3.15 Shock . 31
5.3.16 Vibration . 31
5.3.17 Rapid change of temperature . 31
5.3.18 Rapid change of temperature, ≥ 100 cycles . 31
5.3.19 Climatic sequence . 31

5.3.20 Damp heat, steady state . 32
5.3.21 Solderability, with lead-free solder . 33
5.3.22 Solderability, with SnPb solder . 33
5.3.23 Resistance to soldering heat . 34
5.3.24 Solvent resistance . 34
5.3.25 Insulation resistance . 34
5.3.26 Voltage proof . 34
5.3.27 Flammability test . 35
5.4 Optional and/or additional tests . 35
5.4.1 Single-pulse high-voltage overload test . 35
5.4.2 Periodic-pulse overload test . 35
5.4.3 Operation at low temperature. 36
5.4.4 Damp heat, steady state, accelerated . 36
6 Performance requirements. 37
6.1 General . 37
6.2 Limits for change of resistance at tests . 37
6.3 Temperature coefficient of resistance . 40
6.4 Temperature rise . 40
6.5 Visual examination . 41
6.5.1 General visual criteria . 41
6.5.2 Visual criteria after tests . 41
6.5.3 Visual criteria for the packaging . 41
6.6 Solderability . 41
6.7 Insulation resistance . 42
6.8 Flammability . 42
7 Marking, packaging and ordering information . 42
7.1 Marking of the component . 42
7.2 Packaging . 42
7.3 Marking of the packaging . 42
7.4 Ordering information . 42
8 Detail specifications . 43
8.1 General . 43
8.2 Information to be specified in a detail specification . 43
8.2.1 Outline drawing or illustration . 43
8.2.2 Style and dimensions . 43
8.2.3 Climatic category . 43
8.2.4 Resistance range . 44
8.2.5 Tolerances on resistance . 44
8.2.6 Rated dissipation P . 44
8.2.7 Limiting element voltage U . 44
max
8.2.8 Insulation voltage U . 44
ins
8.2.9 Insulation resistance R . 44
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 45
8.2.14 Ordering information . 45
8.2.15 Mounting . 45

– 4 – IEC 60115-8:2023 © IEC 2023
8.2.16 Storage. 45
8.2.17 Transportation . 45
8.2.18 Additional information . 45
8.2.19 Quality assessment procedures . 45
8.2.20 0 Ω Resistors . 45
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 46
9.2.1 Primary stage of manufacture . 46
9.2.2 Structurally similar components . 46
9.2.3 Assessment level EZ . 46
9.3 Formation of inspection lots . 46
9.4 Approved component (IECQ AC) procedures . 47
9.5 Qualification approval (QA) procedures . 47
9.5.1 General . 47
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 48
9.6 Capability certification (IECQ AC-C) procedures . 48
9.7 Technology certification (IECQ-AC-TC) procedures . 48
9.8 Periodical evaluation of termination plating . 48
9.9 Delayed delivery . 48
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 60
A.1 Symbols . 60
A.2 Abbreviated terms . 62
Annex B (normative) Visual examination criteria . 63
B.1 General . 63
B.2 Criteria for general visual examination of body of specimens . 63
B.3 Criteria for general visual examination of electrode of specimen . 64
B.4 Criteria for general visual examination of marking of specimen . 64
B.5 Criteria for packaging . 65
Annex C (informative) Workmanship requirements for the assembly of SMD resistors . 66
C.1 General . 66
C.2 Out of alignment from solder pad . 66
C.3 Formation of fillet . 67
C.3.1 Function of the fillet . 67
C.3.2 Rectangular (RR) and transverse (RT) resistors . 67
C.3.3 Cylindrical (RC) resistors . 68
C.4 Thickness of solder paste between the pad and electrode . 69
C.5 Solder ball . 70
Annex D (normative) 0 Ω resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 73
D.6 Detail specification . 73

D.7 Quality assessment procedures . 73
Annex E (informative) Guidance on the application of optional and/or additional tests . 74
E.1 General . 74
E.2 Single-pulse high-voltage overload test . 74
E.3 Periodic-pulse overload test . 75
E.4 Operation at low temperature . 75
E.5 Damp heat, steady state, accelerated . 76
Annex F (informative) Temperature rise of recommended test boards in the endurance
test at the rated temperature 70 °C . 78
F.1 General . 78
F.2 Position of the indicated resistor temperature in the endurance test at the
rated temperature 70 °C. 78
F.2.1 Simulation model . 78
F.2.2 Simulation result . 81
F.2.3 Position suitable for determining the resistor temperature at endurance
at the rated temperature 70 °C . 82
F.3 Applied power of each recommended test board and temperature rise at
endurance test at the rated temperature 70 °C . 82
F.3.1 Precautions . 82
F.3.2 Data of temperature rise for RR resistors (simulation) . 83
F.3.3 Data of temperature rise for RT resistors (simulation) . 87
F.3.4 Data of temperature rise for RC resistors (Simulation) . 90
F.4 Ideal number of specimens to mount on each test board . 91
F.4.1 General . 91
F.4.2 Variation of temperature within the test board . 91
Annex G (informative) Reason for selecting test boards with extremely wide patterns
for high rated dissipation resistors . 94
G.1 General . 94
G.2 Simulation example of recommended test board for RT3263M made to be

equivalent to the usage condition . 94
G.3 Temperature rise when there is no efficient cooling system . 96
G.4 Dimensions of recommended test board when further raise of rated
dissipation is required . 97
Annex X (informative) Cross-references to the prior edition of this document . 100
Bibliography . 103

Figure 1 – Shape and dimension of rectangular (RR) resistors . 13
Figure 2 – Shape and dimension of transverse (RT) resistors . 14
Figure 3 – Shape and dimension of cylindrical (RC) resistors . 15
Figure 4 – Shape and dimension of wire-wound (RW) resistors . 16
Figure 5 – Derating curve based on ambient temperature . 18
Figure 6 – Basic appearance of recommended test board . 20
Figure 7 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4
point) connections. 21
Figure 8 – Attachment of the sense line for Kelvin (4-point) connections for specimens

with nominal resistance lower than 100 mΩ . 21
Figure 9 – Basic layout for mechanical, environmental and electrical tests . 25
Figure F.1 – Simulation model . 80
Figure F.2 – Simulation result . 82

– 6 – IEC 60115-8:2023 © IEC 2023
Figure F.3 – Load reduction curve with terminal part temperature as x-axis . 83
Figure F.4 – RR0402M relationship between power and temperature at 70 °C . 84
Figure F.5 – RR0603M relationship between power and temperature at 70 °C . 84
Figure F.6 – RR1005M relationship between power and temperature at 70 °C . 84
Figure F.7 – RR1608M relationship between power and temperature at 70 °C . 85
Figure F.8 – RR2012M relationship between power and temperature at 70 °C . 85
Figure F.9 – RR3216M relationship between power and temperature at 70 °C . 85
Figure F.10 – RR3225M relationship between power and temperature at 70 °C . 86
Figure F.11 – RR4532M relationship between power and temperature at 70 °C . 86
Figure F.12 – RR5025M relationship between power and temperature at 70 °C . 86
Figure F.13 – RR6332M relationship between power and temperature at 70 °C . 87
Figure F.14 – RT0510M relationship between power and temperature at 70 °C . 87
Figure F.15 – RT0816M relationship between power and temperature at 70 °C . 88
Figure F.16 – RT1220M relationship between power and temperature at 70 °C . 88
Figure F.17 – RT1632M relationship between power and temperature at 70 °C . 88
Figure F.18 – RT3245M relationship between power and temperature at 70 °C . 89
Figure F.19 – RT2550M relationship between power and temperature at 70 °C . 89
Figure F.20 – RT3263M relationship between power and temperature at 70 °C . 89
Figure F.21 – RC1610M relationship between power and temperature at 70 °C . 90
Figure F.22 – RC2012M, RC2211M relationship between power and temperature at
70 °C . 90
Figure F.23 – RC3514M, RC3715M relationship between power and temperature at
70 °C . 91
Figure F.24 – RC5922M, RC6123M relationship between power and temperature at
70 °C . 91
Figure F.25 – Recommended test board for RR3216M mounted with 19 specimens . 92
Figure F.26 – Temperature variation depending on the number of specimens mounted . 92
Figure G.1 – Simulation model of recommended test board . 95
Figure G.2 – Simulation model of circuit board with high heat dissipation capability . 96
Figure G.3 – Simulation model of circuit board with low heat dissipation capability . 97
Figure G.4 – Dimensions of recommended test board in Table G.1 . 98

Table 1 – Preferred styles of rectangular (RR) resistors . 14
Table 2 – Preferred styles of transverse (RT) resistors . 15
Table 3 – Preferred styles of cylindrical (RC) resistors . 16
Table 4 – Preferred styles of wire-wound (RW) resistors . 16
Table 5 – Test board dimensions for RR resistors . 22
Table 6 – Test board dimensions for RT resistors . 23
Table 7 – Test board dimensions for RC resistors . 24
Table 8 – Preferred aggravated overload conditions . 29
Table 9 – Shear test force . 30
Table 10 – Limits for the change of resistance at tests . 39
Table 11 – Permitted change of resistance due to the variation of temperature . 40
Table 12 – Test schedule for the qualification approval . 49

Table 13 – Test schedule for the quality conformance inspections . 55
Table B.1 – Visual examination criteria of body of specimen . 63
Table B.2 – Visual examination criteria of electrode of specimen . 64
Table B.3 – Visual examination criteria of marking of specimen . 65
Table C.1 – Acceptable and non-acceptable mounting alignment . 66
Table C.2 – Fillet of RR and RT resistors . 68
Table C.3 – Fillet of RC resistors . 69
Table C.4 – Thickness of solder paste between the pad and electrode. 70
Table C.5 – Solder ball . 70
Table E.1 – Implementation of the single-pulse high-voltage overload test . 74
Table E.2 – Implementation of the periodic-pulse overload test . 75
Table E.3 – Implementation of the operation at low temperature test . 76
Table E.4 – Implementation of the test damp heat, steady state, accelerated . 77
Table F.1 – Simulation model dimensions . 80
Table F.2 – Physical property values used in simulation . 81
Table G.1 – Dimensions of recommended test boards for raising the rated dissipation . 99
Table X.1 – Cross references to clauses . 100
Table X.2 – Cross references to figures . 102
Table X.3 – Cross references to tables . 102

– 8 – IEC 60115-8:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 8: Sectional specification: Fixed surface mount resistors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 60115-8 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This third edition cancels and replaces the second edition published in 2009. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) definitions of product technologies and product classification levels of the generic
specification, IEC 60115 1:2020, have been adopted;
b) new style of transverse (RT) resistors has been added in 3.1.5 and 4.2.2 to cover resistors
with wide terminals, which have become common in market;
c) recommended test boards in 5.2.2 have been revised to fit the demands from the market for
higher rated dissipation in resistors;

d) test boards have been revised so that they can be set vertically instead of horizontally during
specified tests to optimize the temperature rise stability, area and spacing inside the test
chamber;
e) 'Periodic-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been added to the
default test method in 5.3.8, however, the legacy test 'periodic-pulse overload test' of
IEC 60115-1:2020, 8.4 is still maintained for historical products;
f) revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.21 and 5.3.22;
g) combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.24;
h) 'Single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse
shape 1,2/50 in 5.4.1;
i) climatic tests for 'operation at low temperature' of IEC 60115-1:2020, 10.2, and for 'damp
heat, steady state, accelerated' of IEC 60115-1:2020, 10.5, have been adopted as optional
tests in 5.4.3 and 5.4.4, respectively;
j) new guidance is provided in 6.2 on the presentation of stability requirements with their
permissible absolute and relative deviations;
k) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
l) visual examination for the primary and proximity packaging has been added in 6.5.3 and in
7.2;
m) periodical evaluation of termination plating has been added as a new topic of quality
assessment in 9.8;
n) revised test clause numbering of IEC 60115-1:2020 has been applied;
o) normative Annex A has been moved from Annex B of the old version to stay in line with
other sectional specifications;
p) normative Annex B has been added to show the criteria for general visual examinations;
q) informative Annex C has been added to summarize workmanship requirements for the
assembly;
r) normative Annex D has been moved from Annex A of the old version to stay in line with
other sectional specifications;
s) informative Annex E has been added to show guidance for optional and/or additional tests;
t) informative Annex F has been added to show typical temperature rise of recommended test
boards in the endurance test at the rated temperature 70 °C;
u) informative Annex G has been added to explain why some recommended test boards have
extremely wide copper patterns;
v) informative Annex X has been added to show the cross reference for the prior revision of
this document.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2973/CDV 40/3031/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.

– 10 – IEC 60115-8:2023 © IEC 2023
A list of all parts in the IEC 60115 series, published under the general title Fixed resistors for
use in electronic equipment, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 8: Sectional specification: Fixed surface mount resistors

1 Scope
This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic
equipment.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions) and product technology. These resistors have metallized
terminations and are primarily intended to be mounted directly onto a circuit board.
The object of this document is to specify preferred ratings and characteristics and to select from
IEC 601
...