IEC 60115-8:2009
(Main)Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. The major technical changes with regard to the first edition are the following:
- introduction of a product classification based on application requirements;
- extension of the list of styles and dimensions;
- use of an extended scope of stability class definitions;
- extension of the lists of preferred values of ratings;
- inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- inclusion of a new set of severities for a shear test;
- inclusion of definitions for a test board;
- replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- inclusion of requirements applicable to 0 ohm resistors (jumpers).
Résistances fixes utilisés dans les équipements électroniques - Partie 8: Spécification intermédiaire - Résistances fixes pour montage en surface
La CEI 60115-8:2009 s'applique aux résistances fixes pour montage en surface utilisées dans les équipements électroniques. Ces résistances sont généralement décrites selon des types (différentes formes géométriques) et des modèles (différentes dimensions). Elles comportent des extrémités métallisées et sont conçues principalement pour être montées directement sur un circuit imprimé. Les principales modifications techniques par rapport à la première édition sont les suivantes:
- introduction d'une classification de produit basée sur les exigences de l'application;
- extension de la liste des modèles et des dimensions;
- utilisation d'un domaine d'application étendu avec des définitions de classe de stabilité;
- extension des listes de valeurs préférentielles des caractéristiques nominales;
- inclusion de conditions d'essai et d'exigences pour le brasage sans plomb, pour les surcharges périodiques, pour la résistance aux décharges électrostatiques (DES);
- inclusion d'une nouvelle série de sévérités pour un essai de cisaillement;
- inclusion de définitions d'une carte d'essai;
- remplacement du niveau d'assurance de la qualité E et des autres possibles par l'unique niveau d'assurance de la qualité EZ qui est conforme aux exigences de l'approche "zéro défaut";
- inclusion d'un essai d'endurance étendu, d'un essai d'inflammabilité, d'un essai d'échauffement, d'essais de vibrations, d'un essai étendu de variation rapide de température et d'un essai de surcharge sous forme d'une simple impulsion de tension élevée;
- inclusion d'exigences applicable aux résistances de valeurs 0 ohm (cavaliers).
General Information
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Standards Content (Sample)
IEC 60115-8 ®
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification – Fixed surface mount resistors
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IEC 60115-8 ®
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification – Fixed surface mount resistors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.040.10 ISBN 978-2-88910-060-6
– 2 – 60115-8 © IEC:2009(E)
CONTENTS
FOREWORD.4
1 General .6
1.1 Scope.6
1.2 Object .6
1.3 Normative references .6
1.4 Information to be specified in a detail specification.7
1.4.1 Outline drawing .7
1.4.2 Style and dimensions .7
1.4.3 Climatic category.7
1.4.4 Limits of resistance change after testing.7
1.4.5 Resistance range.7
1.4.6 Tolerances on nominal resistance.7
1.4.7 Temperature coefficient of resistance .7
1.4.8 Rated dissipation.7
1.4.9 Limiting element voltage.8
1.4.10 Insulation voltage .8
1.4.11 Insulation resistance.8
1.4.12 Marking .8
1.4.13 Ordering information.8
1.4.14 Mounting .8
1.5 Product classification .8
2 Preferred characteristics, ratings and test severities.9
2.1 Preferred characteristics .9
2.1.1 Style and dimensions .9
2.1.2 Preferred climatic categories .11
2.1.3 Variation of resistance with temperature .11
2.1.4 Limits for change in resistance .12
2.2 Preferred values of ratings .13
2.2.1 Resistance .13
2.2.2 Tolerances on resistance.13
2.2.3 Rated dissipation P .13
2.2.4 Limiting element voltage U .14
max
2.2.5 Insulation resistance.14
2.2.6 Insulation voltage .14
2.3 Preferred test severities .14
2.3.1 Short time overload .14
2.3.2 Solderability .15
2.3.3 Resistance to soldering heat .15
2.3.4 Shear (adhesion) test .16
2.3.5 Periodic pulse overload test.17
2.3.6 Resistance to electrostatic discharge (ESD) .17
2.3.7 Component solvent resistance.18
2.3.8 Solvent resistance of marking.18
2.4 Preparation of specimen.18
2.4.1 Drying .18
2.4.2 Mounting of components.18
3 Quality assessment procedures.21
60115-8 © IEC:2009(E) – 3 –
3.1 General .21
3.2 Definitions .21
3.2.1 Primary stage of manufacture.21
3.2.2 Structurally similar components .21
3.2.3 Assessment level EZ .21
3.3 Formation of inspection lots.21
3.4 Qualification approval.22
3.4.1 Qualification approval on the basis of the fixed sample size
procedure .22
3.4.2 Qualification approval on the basis of lot-by-lot and periodic testing .23
3.5 Quality conformance inspection.23
3.6 Technology approval procedures.23
3.7 Delayed delivery.23
Annex A (normative) 0 Ω resistors (Jumper) .36
A.1 Information to be specified in a detail specification .36
A.2 Preferred characteristics.36
A.3 Preferred ratings .36
A.4 Preferred severities .36
A.5 Test schedule for qualification approval.37
A.6 Test schedule for quality conformance inspection.37
Annex B (informative) Letter symbols and abbreviations .38
B.1 Letter symbols.38
B.2 Abbreviations .39
Bibliography.40
Figure 1 – Shape and dimensions of rectangular (RR) resistors.10
Figure 2 – Shape and dimensions of cylindrical (RC) resistors .10
Figure 3 – Derating curve .14
Figure 4 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4
point) connections .19
Figure 5 – Attachment of the sense line for Kelvin (4 point) connections for specimen
with nominal resistance lower than 100 mΩ .19
Figure 6 – Basic layout for mechanical, environmental and electrical tests.20
Table 1a – Preferred styles for rectangular (RR) resistors.9
Table 1b – Preferred styles for cylindrical (RC) resistors.10
Table 2 – Permitted change of resistance .11
Table 3a – Limits for change of resistance .12
Table 3b – Limits for change of resistance .13
Table 4 – Shear test force.17
Table 5 – Soldering pad dimensions .20
Table 6 – Test schedule for qualification approval.24
Table 7a – Test schedule for quality conformance inspection: Lot-by-lot tests.30
Table 7b – Test schedule for quality conformance inspection: Periodic tests.32
– 4 – 60115-8 © IEC:2009(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –
Part 8: Sectional specification –
Fixed surface mount resistors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60115-8 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This second edition cancels and replaces the first edition, published in 1989, and its
Amendment 1 (2000). This second edition constitutes a technical revision and includes test
conditions and requirements for lead-free soldering and assessment procedures meeting the
requirements of a “zero defect” approach.
The major technical changes with regard to the first edition are the following:
– introduction of a product classification based on application requirements;
– extension of the list of styles and dimensions;
– use of an extended scope of stability class definitions;
– extension of the lists of preferred values of ratings
– inclusion of test conditions and requirements for lead-free soldering, for periodic overload
and for resistance to electrostatic discharge (ESD);
60115-8 © IEC:2009(E) – 5 –
– inclusion of a new set of severities for a shear test;
– inclusion of definitions for a test board;
– replacement of assessment level E and possible others by the sole assessment level EZ,
meeting the requirements of a “zero defect” approach;
– inclusion of an extended endurance test, a flammability test, a temperature rise test,
vibration tests, an extended rapid change of temperature test, and a single pulse high-
voltage overload test;
– inclusion of requirements applicable to 0 Ω resistors (jumpers).
The text of this standard is based on the following documents:
FDIS Report on voting
40/1933/FDIS 40/1970/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts of the IEC 60115 series, under the general title Fixed resistors for use in
electronic equipment, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
– 6 – 60115-8 © IEC:2009(E)
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –
Part 8: Sectional specification –
Fixed surface mount resistors
1 General
1.1 Scope
This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic
equipment.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions). They have metallized terminations and are primarily intended to
be mounted directly on to a circuit board.
1.2 Object
The object of this standard is to prescribe preferred ratings and characteristics and to select
from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring
methods and to give general performance requirements for this type of resistor.
Test severities and requirements prescribed in detail specifications referring to this sectional
specification shall be of equal or higher performance level, because lower performance levels
are not permitted.
1.3 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60062:2004, Marking codes for resistors and capacitors
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1(1992)
IEC 60068-2-58:2004, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60115-1:2008, Fixed resistors for use in electronic equipment – Part 1: Generic
specification
IEC 61193-2:2007, Quality assessment systems – Part 2: Selection and use of sampling plans
for inspection of electronic components and packages
IEC 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61760-1:2006, Surface mounting technology – Part 1: Standard method for the
specification of surface mounting components (SMDs)
60115-8 © IEC:2009(E) – 7 –
1.4 Information to be specified in a detail specification
Detail specifications shall be derived from the relevant blank detail specification.
Detail specifications shall not specify requirements inferior to those of the generic
specification, sectional specification or blank detail specification. When severer requirements
are included, they shall be listed in a subclause of the detail specification and indicated in the
test schedules, for example by a note.
The following information shall be given in each detail specification and the values quoted
shall preferably be selected from those given in the appropriate clause of this sectional
specification.
1.4.1 Outline drawing
There shall be an illustration of the resistor as an aid to easy recognition and for comparison
of the resistor with others.
1.4.2 Style and dimensions
See 2.1.1.
Dimensions and their associated tolerances, which affect interchangeability and mounting,
shall be given in the detail specification.
1.4.3 Climatic category
See 2.1.2.
1.4.4 Limits of resistance change after testing
See 2.1.4.
1.4.5 Resistance range
See 2.2.1.
NOTE When products approved according to the detail specification have different ranges, the following
statement should be added: “The range of values available in each style, together with the associated tolerance
and temperature coefficient, is given in the register of approvals, available for example on the website
www.iecq.org”.
1.4.6 Tolerances on nominal resistance
See 2.2.2.
1.4.7 Temperature coefficient of resistance
See 2.1.3.
1.4.8 Rated dissipation
See 2.2.3.
The mounting conditions are as described in 2.4.2.
The detail specification shall state the maximum dissipation at temperatures other than 70 °C,
for example the derating, either in a diagram or in the form of a statement. All break points
shall be verified by test.
– 8 – 60115-8 © IEC:2009(E)
1.4.9 Limiting element voltage
See 2.2.4.
1.4.10 Insulation voltage
This information is required only for insulated resistors.
See 2.2.6 and the definition in IEC 60115-1, 2.2.10
For small size resistors where the dimensions of the test jig given in IEC 60115-1, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.11 Insulation resistance
This information is required only for insulated resistors.
See 2.2.5.
For small size resistors where the dimensions of the test jig given in IEC 60115-1, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.12 Marking
Surface mount resistors are generally not marked on the body. However, if some marking is
applied to the body, the resistor shall be marked with the resistance according to IEC 60062,
Clause 3 and as many of the remaining items listed in IEC 60115-1, 2.4. All the required
information shall be marked on the packaging.
1.4.13 Ordering information
The detail specification shall specify that the following information is required when ordering
resistors:
The number of the detail specification and style reference.
Resistance, tolerance on resistance and temperature coefficient of resistance according to
IEC 60062.
1.4.14 Mounting
The detail specification shall give guidance on methods of mounting for normal use,
preferably based on the specification of assembly process conditions of IEC 61760-1,
Clause 5. Mounting for test and measurement purposes (when required) shall be in
accordance with 2.4.2 of this specification and IEC 60115-1, 4.31.
The detail specification may include additional information (which is not normally required to
be verified by the inspection procedure), such as circuit diagrams, curves, drawings and notes
needed for the clarification of the detail specification.
1.5 Product classification
The introduction of a product classification permits the user to select performance
requirements according to the conditions of the intended end-use application.
Two general end product levels have been established to reflect characteristic differences in
functional, performance and reliability requirements and to permit the use of suitable
inspection and test schedules. It should be recognized that there may be overlaps of
applications between the levels.
Level G – General electronic equipment, typically operated under benign or moderate
environmental conditions, where the major requirement is function. Examples for level G
include consumer products and telecommunication user terminals.
60115-8 IEC:2009 – 9 –
Level P – High-performance electronic equipment, where one or more of the following criteria
applies:
– uninterrupted performance is desired or mandatory;
– operation in harsh environmental conditions;
– extended lifetime.
Examples for level P include professional equipment, telecommunication transmission
systems, industrial control and measurement systems and most automotive applications
operated outside the passenger compartment.
Level P is the suitable basis for detail specifications aiming for the approval of components
with established reliability.
Each level shall be used in individual detail specifications.
2 Preferred characteristics, ratings and test severities
2.1 Preferred characteristics
The values given in detail specifications shall preferably be selected from the following.
2.1.1 Style and dimensions
The preferred styles and dimensions are given in Table 1a and Table 1b.
Table 1a – Preferred styles for rectangular (RR) resistors
Style Dimensions
Length L Width W Height T
a
Metric Imperial
mm mm mm
RR0603M RR0201
0,6 ± 0,03 0,3 ± 0,03 0,23 ± 0,03
RR1005M RR0402
1,0 ± 0,05 0,5 ± 0,05 0,35 ± 0,05
RR1608M RR0603 1,6 ± 0,1 0,8 ± 0,1 0,45 ± 0,1
+0,15
RR2012M RR0805
2,0 ± 0,1 1,25 ± 0,15
0,5
−0,10
RR3216M RR1206
3,2 ± 0,2 1,6 ± 0,15 0,55 ± 0,1
RR3225M RR1210 3,2 ± 0,2 2,5 ± 0,2 0,55 ± 0,1
RR3245M RR1218 3,2 ± 0,2 4,6 ± 0,2 0,55 ± 0,1
RR4532M RR1812
4,6 ± 0,2 3,2 ± 0,2 0,55 ± 0,1
RR5025M RR2010
5,0 ± 0,2 2,5 ± 0,2 0,55 ± 0,2
RR6332M RR2512 6,3 ± 0,2 3,2 ± 0,2 0,55 ± 0,2
NOTE Figure 1 shows the shape and dimensions of rectangular resistors.
a
Historical style codes, for information only.
– 10 – 60115-8 © IEC:2009(E)
W
T
L
IEC 2353/08
Figure 1 – Shape and dimensions of rectangular (RR) resistors
Table 1b – Preferred styles for cylindrical (RC) resistors
Style Dimensions
Metric Length L Diameter D
mm mm
RC1610M +0,10 +0,15
1,6 1,0
−0,05 −0,05
+ 0,2
RC2012M 2,0 ± 0,1
1,25
−0,1
0 0
RC2211M
2,2 1,1
−0,3 −0,10
a
RC3514M
3,5 ± 0,2 1,4 ± 0,2
b
RC5922M
5,9 ± 0,2 2,2 ± 0,2
NOTE Figure 2 shows the shape and dimensions of cylindrical resistors.
a 0 + 0,1
Comparable to historical style: RC3715M (L = 3,7 mm; D = 1,5 mm).
− 0,4 −0,3
b 0 + 0,2
Comparable to historical style: RC6123M (L = 6,1 mm; D = 2,3 mm).
− 0,9 − 0,4
L
D
IEC 2354/08
Figure 2 – Shape and dimensions of cylindrical (RC) resistors
When the component style is other than described above, for example for surface mount
wirewound resistors, the detail specification shall state such dimensional information as will
adequately describe the resistor.
60115-8 © IEC:2009(E) – 11 –
2.1.2 Preferred climatic categories
The surface mount resistors covered by this specification are classified into climatic
categories according to the general rules given in IEC 60068-1 its Amendment 1, Annex A.
The lower and upper category temperature and the duration of the damp heat, steady state
test shall be chosen from the following:
Lower category temperature (LCT) –55 °C; –40 °C; –25 °C and –10 °C.
Upper category temperature (UCT) +85 °C; +100 °C; +125 °C; +155 °C;
+175 °C and +200 °C.
Duration of damp heat, steady state test: 10, 21 and 56 days.
The severities for the cold and dry heat tests are the lower and upper category temperatures
respectively.
NOTE The climatic performance of assembled resistors is greatly influenced by the circuit board, the assembly
method and a final coating.
2.1.3 Variation of resistance with temperature
The preferred limits of change in resistance for the variation of resistance with temperature
test are given in Table 2.
Table 2 – Permitted change of resistance
Limit of resistance change
%
Tempe-
b
rature
Lower category temperature / Reference Reference temperature / Upper category temperature
coefficient
temperature
°C
°C
±1 000 W ±7,50 ±6,00 ±4,50 ±3,00 ±6,50 ±10,5 ±13,5 ±15,5 ±18,0
±500 V ±3,75 ±3,00 ±2,25 ±1,50 ±3,25 ±5,25 ±6,75 ±7,75 ±9,00
±250 U ±1,88 ±1,50 ±1,13 ±0,75 ±1,63 ±2,63 ±3,38 ±3,88 ±4,50
±100 S ±0,75 ±0,60 ±0,45 ±0,30 ±0,65 ±1,05 ±1,35 ±1,55 ±1,80
±50 R ±0,375 ±0,300 ±0,225 ±0,150 ±0,325 ±0,525 ±0,675 ±0,775 ±0,900
±25 Q ±0,188 ±0,150 ±0,113 ±0,075 ±0,163 ±0,263 ±0,338 ±0,388 ±0,450
±15 P ±0,113 ±0,090 ±0,068 ±0,045 ±0,098 ±0,158 ±0,203 ±0,233 ±0,270
±10 N ±0,075 ±0,060 ±0,045 ±0,030 ±0,065 ±0,105 ±0,135 ±0,155 ±0,180
±5 M ±0,038 ±0,030 ±0,023 ±0,015 ±0,033 ±0,053 ±0,068 ±0,078 ±0,090
±2 L ±0,015 ±0,012 ±0,009 ±0,006 ±0,013 ±0,021 ±0,027 ±0,031 ±0,036
±1 K ±0,008 ±0,006 ±0,005 ±0,003 ±0,007 ±0,011 ±0,014 ±0,016 ±0,018
a
–6
Abbreviation: e.g. ±50 = 0 ± 50 × 10 /K.
b
If additional temperature coefficients are required, these shall be specified in the detail specification.
c
Code letters according to IEC 60062, 5.5.
–6 a b
10 /K
c
Code
-55 / +20
-40 / +20
-25 / +20
-10 / +20
+20 / +85
+20 / +125
+20 / +155
+20 / +175
+20 / +200
– 12 – 60115-8 © IEC:2009(E)
Each line in the table gives the preferred temperature coefficient and limits of change in
resistance for the measurement of the variation of resistance with temperature (see
IEC 60115-1, 4.8) on the basis of category temperature ranges of 2.1.2 of this specification.
2.1.4 Limits for change in resistance
Tables 3a and 3b list preferred limits for resistance change for all tests listed in the heading.
To classify the performance of resistors, they will be assigned to stability classes as listed in
Table 3a and Table 3b below.
Table 3a – Limits for change of resistance
Long term tests Short term tests
a a a
Stability IEC 60115-1 , IEC 60115-1 , IEC 60115-1 ,
class
4.23 Climatic 4.25.1 Endurance at 70 °C, 4.13 Short term
code
b
sequence overload
4.24 Damp heat, 4.18 Resistance to
steady state soldering heat
4.25.3 Endurance at 4.19 Rapid change of
upper category temperature,
temperature 5 cycles
c
4.21 Shock
d
d
4.22 Vibration
1 000 h Extended, 8 000 h
4.33 Substrate
bending test
±(5 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(10 % R + 0,1 Ω) ±(1 % R + 0,05 Ω)
2 ±(2 % R + 0,1 Ω) ±(2 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(0,5 % R + 0,05 Ω)
1 ±(1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(2 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω)
0,5 ± (0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(0,1 % R + 0,01 Ω)
0,25 ±(0,25 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(0,05 % R + 0,01 Ω)
0,1
±(0,1 % R + 0,02 Ω) ±(0,1 % R + 0,02 Ω) ±(0,25 % R + 0,02 Ω) ±(0,05 % R + 0,01 Ω)
0,05
±(0,05 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,1 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω)
0,025
±(0,025 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,01 % R + 0,01 Ω)
a
IEC 60115-1.
b
Test is mandatory only for resistors categorized as level G.
c
Test is only applicable to other styles than RR or RC.
d
Test is mandatory only for resistors categorized as level P.
60115-8 © IEC:2009(E) – 13 –
Table 3b – Limits for change of resistance
a a a a
Stability IEC 60115-1 , IEC 60115-1 , IEC 60115-1 , IEC 60115-1 ,
class
4.19 Rapid change 4.27 Single pulse 4.38 Electrostatic 4.39 Periodic
code
b
of temperature, high-voltage discharge electric overload
c c c
≥ 100 cycles overload test
± (1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(1% R + 0,05 Ω) ±(2 % R + 0,05 Ω)
± (0,5 % R + 0,05 Ω)
0,5
0,25
±(0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω)
0,1
±(0,25 % R + 0,05 Ω)
0,05
0,025
a
IEC 60115-1.
b
Human body model (HBM) according to IEC 61340-3-1, using 3 positive and 3 negative discharges for
resistors categorized as level P, or 1 positive and 1 negative discharge for resistors categorized as level G.
c
Test is mandatory only for resistors categorized as level P.
2.2 Preferred values of ratings
2.2.1 Resistance
See IEC 60115-1, 2.3.2.
2.2.2 Tolerances on resistance
The preferred tolerances on resistance are:
±10 %; ±5 %; ±2 %; ±1 %; ±0,5 %; ±0,25 %; ±0,1 %; ±0,05 %; ±0,02 %; ±0,01 %;
0/-30 %; 0/-20 % and 0/-10 %.
NOTE Asymmetric tolerances (e.g. 0/-20 %) are intended to be used for laser trimmable resistors.
2.2.3 Rated dissipation P
The preferred values of rated dissipation P for mounted resistors at 70 °C ambient
temperature are:
0,016 W; 0,032 W; 0,05 W; 0,063 W; 0,1 W; 0,125 W; 0,25 W; 0,33 W; 0,4 W; 0,5 W; 0,75 W;
1 W; 2 W and 3 W.
The detail specification shall specify the conditions under which the rated dissipation applies.
– 14 – 60115-8 © IEC:2009(E)
Figure 3 shows an example of a derating curve that may be used to provide derating
information.
Area of recommended
operation
70 °C
Upper category
Lower category
temperature
temperature
IEC 2355/08
Figure 3 – Derating curve
All break points on the curve shall be verified by test.
2.2.4 Limiting element voltage U
max
The preferred values of limiting element voltage U d.c. or a.c. (r.m.s.) are:
max
12,5 V; 15 V; 25 V; 50 V; 75 V; 100 V; 150 V; 200 V; 300 V and 500 V.
2.2.5 Insulation resistance
For insulated resistors, the insulation resistance R shall be not less than 1 GΩ after dry
ins
heat tests and not less than 100 MΩ after climatic tests.
2.2.6 Insulation voltage
For insulated resistors, the preferred values of insulation voltage U d.c. or a.c. (peak) are:
ins
75 V; 100 V; 200 V; 300 V and 500 V.
2.3 Preferred test severities
2.3.1 Short time overload
See IEC 60115-1, 4.13, with the following details:
Applied voltage: The detail specification shall state the applied voltage. Preferred
values are
U = 2,5 ⋅U (1)
r
or
U = 2 ⋅U (2)
max
whichever is the less severe,
where
U is the rated voltage
r
U is the limiting element voltage.
max
Duration: The detail specification shall state the load duration.
Preferred values are 0,5 s; 1 s; 2 s; 5 s and 10 s.
Percentage of the rated
dissipation
60115-8 © IEC:2009(E) – 15 –
This time shall be fixed in such a way, that the maximum element
temperature is at least 30 K above the upper category temperature.
Mounting: See 2.4.2. The distance between individual surface mount resistors
shall not be less than the largest surface mount resistor dimension.
The test board shall be mounted horizontally and shall be in free air at
an ambient temperature between 15 °C and 35 °C.
2.3.2 Solderability
See IEC 60115-1, 4.17, with the following details:
The solderability test shall be preceded by accelerated ageing. Unless otherwise specified in
the relevant detail specification, Ageing 3a as prescribed in IEC 60068-2-20, 4.1.1 (i.e. 4 h at
155 °C dry heat) shall be used. After the accelerated ageing, the specimen shall be subjected
to standard atmospheric conditions for testing for not less than 2 h and not more than 24 h.
The solderable termination surface of the resistors shall be compatible with both, traditional
SnPb solder and lead-free solder, unless otherwise explicitly stated in the relevant detail
specification. Therefore solderability testing is required for both soldering processes.
Solderability with traditional SnPb solder shall be tested according to IEC 60068-2-58, 8.2.1,
solder bath method with the following severity
Solder alloy: Sn60Pb40 or Sn63Pb37
Bath temperature: (235 ± 5) °C
Immersion time: (2 ± 0,2) s
Lead-free solder alloys are grouped in IEC 60068-2-58, Clause 4 according to their typical
process temperature. The most popular solder alloys SnAg, SnAgCu and SnAgBi are
contained in group 3, medium-high temperature. Solderability with lead-free solder shall be
tested according to IEC 60068-2-58, 8.1.1, solder bath method with the following
representative severity for group 3:
Solder alloy: Sn96, 5Ag3, 0Cu0,5
Bath temperature: (245 ± 5) °C
Immersion time: (3 ± 0,3) s
2.3.3 Resistance to soldering heat
See IEC 60115-1, 4.18, with the following details:
Resistors shall be capable to withstand the full variety of soldering processes described in
IEC 61760-1, unless explicitly stated otherwise in the relevant detail specification:
• SnPb vapour phase reflow soldering;
• Lead-free vapour phase reflow soldering;
• SnPb infrared or forced gas convection reflow soldering;
• Lead-free infrared or forced gas convection reflow soldering;
• SnPb double wave soldering;
– 16 – 60115-8 © IEC:2009(E)
• Lead-free double wave soldering.
Resistance to soldering heat for the combination of all soldering methods shall be tested with
the worst case condition from IEC 60068-2-58, 8.2.1 and IEC 60068-2-58, 8.1.1:
Test method: Solder bath method
Solder alloy: any alloy SnPb or SnCu or SnAgCu or SnAg
Bath temperature: (260 ± 5) °C
Immersion time: (10 ± 1) s
Test cycles: 1
For resistors, where the relevant detail specification explicitly excludes wave soldering,
resistance to soldering heat may be tested with the worst case reflow condition from
IEC 60068-2-58, 8.2.4 and IEC 61760-1, Clause 6.
Test method: Vapour phase soldering
Vapour temperature: (230 ± 5) °C
Immersion time: (40 ± 1) s
Test cycles: 3, the recovery period between two successive cycles shall be at least
the time it takes until the specimen drops below 50 °C.
For resistors, where the relevant detail specification explicitly excludes wave soldering and
vapour phase reflow soldering, resistance to soldering heat may be tested with the worst case
non-vapour phase reflow condition from IEC 60068-2-58, 8.2.4 and IEC 60068-2-58, 8.1.2.2.
Test method: Infrared and forced gas convection soldering
Preheating: 150 °C to 180 °C
for (120 ± 5) s
Peak temperature: (255 ± 5) °C
Dwell time: (40 ± 1) s above 245 °C
(60 to 90) s above 220 °C
Test cycles: 3, the recovery period between two successive cycles shall be at least
the time it takes until the specimen drops below 50 °C.
2.3.4 Shear (adhesion) test
See IEC 60115-1, 4.32.2 b), with the following details:
Unless otherwise specified in the relevant detail specification, a force as given in Table 4
shall be applied to the surface mount resistor body.
60115-8 © IEC:2009(E) – 17 –
Table 4 – Shear test force
Style
a
Force
N
Rectangular Cylindrical
RR0603M — 2
RR1005M — 3
RR1608M RC1610M 5
RC2012M
RR2012M 9
RC2211M
RR3216M
RC3514M 25
RR3225M
RR3245M
RR4532M
— 45
RR5025M
RR6332M
— RC5922M 90
NOTE The specified forces exceed the result of an acceleration of
981 m/s (100 g), for example a shock or a bump, based on the
typical mass of resistors of the respective style.
a
A relative tolerance of 0/+10 % applies to the prescribed shear
test forces.
2.3.5 Periodic pulse overload test
See IEC 60115-1, 4.39, with the following details:
Pulse voltage: The preferred pulse voltage is
U = 15 ⋅P ⋅R (3)
70 n
but no more than
U = 2 ⋅U (4)
max
where
P is the rated dissipation
R is the resistance
n
U is the limiting element voltage.
max
Pulse duration: 1 000 cycles, 0,1 s on / 2,5 s off.
Mounting: See 2.4.2. The distance between individual surface mount resistors
shall not be less than the largest surface mount resistor dimension.
The test board shall be mounted horizontally and shall be in free air at
an ambient temperature between 15 °C and 35 °C
2.3.6 Resistance to electrostatic discharge (ESD)
IEC 60115-1, 4.38 with the following details:
Discharge count: Three discharges of positive and three discharges of negative polarity
shall be applied. Change of polarity may be performed by swapping the
terminations of the resistor.
Applied voltage: Preferred values are 300 V; 500 V; 800 V; 1 000 V; 1 500 V; 2 000 V;
3 000 V and 4 000 V
Classification into HBM ESD sensitivity classes shall not be applied.
– 18 – 60115-8 IEC:2009
2.3.7 Component solvent resistance
See IEC 60115-1, 4.29, with the following detail:
Solvent temperature: (23 ± 5) °C (preferred value), or ( ) °C.
−5
2.3.8 Solvent resistance of marking
See IEC 60115-1, 4.30, with the following detail:
Solvent temperature: (23 ± 5) °C (preferred value), or ( 50 ) °C.
−5
2.4 Preparation of specimen
2.4.1 Drying
Procedure I of IEC 60115-1, 4.3 shall be used.
2.4.2 Mounting of components
Surface mount resistors shall be mounted on a test board with a basic layout as shown in
Figure 4 or Figure 6.
The test boards shall be an epoxide woven glass type with a thickness of (1,6 ± 0,1) mm, with
conductors made of copper with a nominal thickness of 35 µm. For styles RR1005M and
smaller, alternative substrate thickness (0,8 ± 0,1) mm is permissible. If necessary, the detail
specification may provide a different material specification and basic layout, including layout
dimensions.
No metal area is permitted on the bottom side and on any inner layer under the defined area,
except a single straight 0,3 mm conductor for every Kelvin connection.
60115-8 © IEC:2009(E) – 19 –
M
n 3 1
G
Y
Defined area
X P C K
IEC 2356/08
Key
solderable area
non solderable area, conductor covered with solder resist
NOTE 1 For dimensions refer to Table 5.
NOTE 2 For specimen with a nominal resistance value lower than 100 mΩ, the sense line should be attached to
the solderable area as shown in Figure 5.
Figure 4 – Basic layout for mechanical, environmental and electrical tests,
Kelvin (4 point) connections
IEC 2357/08
Key
solderable area
non solderable area, conductor covered with solder resist
Figure 5 – Attachment of the sense line for Kelvin (4 point) connections
for specimen with nominal resistance lower than 100 mΩ
> 25 mm > 25 mm
– 20 – 60115-8 © IEC:2009(E)
Table 5 – Soldering pad dimensions
X Y G C K P
Style M
mm mm mm mm mm mm
RR0603M under preparation
RR1005M 0,7 0,6 0,5 0,3 0,15 5,0
RR1608M 1,0 1,1 0,6 0,5 0,2 5,0
RR2012M, RC2211M 1,5 1,3 0,6 2,0 0,2 5,0
RR3216M, RC3514M 2,0 1,6 1,5 2,0 0,2 5,0
RR3225M 2,9 1,6 1,5 2,0 0,2 10,0 M = P
RR3245M 5,0 1,6 1,5 5,0 0,2 10,0
RR4532M 3,6 1,8 2,3 5,0 0,2 10,0
RR5025M, RC5922M 2,9 1,8
...
IEC 60115-8 ®
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification – Fixed surface mount resistors
Résistances fixes utilisées dans les équipements électroniques –
Partie 8: Spécification intermédiaire – Résistances fixes pour montage en
surface
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IEC 60115-8 ®
Edition 2.0 2009-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –
Part 8: Sectional specification – Fixed surface mount resistors
Résistances fixes utilisées dans les équipements électroniques –
Partie 8: Spécification intermédiaire – Résistances fixes pour montage en
surface
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.040.10 ISBN 978-2-83220-594-5
– 2 – 60115-8 IEC:2009
CONTENTS
FOREWORD . 4
1 General . 6
1.1 Scope . 6
1.2 Object . 6
1.3 Normative references . 6
1.4 Information to be specified in a detail specification . 7
1.4.1 Outline drawing . 7
1.4.2 Style and dimensions . 7
1.4.3 Climatic category . 7
1.4.4 Limits of resistance change after testing . 7
1.4.5 Resistance range. 7
1.4.6 Tolerances on nominal resistance. 7
1.4.7 Temperature coefficient of resistance . 7
1.4.8 Rated dissipation . 7
1.4.9 Limiting element voltage . 8
1.4.10 Insulation voltage . 8
1.4.11 Insulation resistance . 8
1.4.12 Marking . 8
1.4.13 Ordering information . 8
1.4.14 Mounting . 8
1.5 Product classification . 8
2 Preferred characteristics, ratings and test severities . 9
2.1 Preferred characteristics . 9
2.1.1 Style and dimensions . 9
2.1.2 Preferred climatic categories . 11
2.1.3 Variation of resistance with temperature . 11
2.1.4 Limits for change in resistance . 12
2.2 Preferred values of ratings . 13
2.2.1 Resistance . 13
2.2.2 Tolerances on resistance . 13
2.2.3 Rated dissipation P . 13
2.2.4 Limiting element voltage U . 14
max
2.2.5 Insulation resistance . 14
2.2.6 Insulation voltage . 14
2.3 Preferred test severities . 14
2.3.1 Short time overload . 14
2.3.2 Solderability . 15
2.3.3 Resistance to soldering heat . 15
2.3.4 Shear (adhesion) test . 16
2.3.5 Periodic pulse overload test . 17
2.3.6 Resistance to electrostatic discharge (ESD) . 17
2.3.7 Component solvent resistance . 18
2.3.8 Solvent resistance of marking . 18
2.4 Preparation of specimen . 18
2.4.1 Drying . 18
2.4.2 Mounting of components . 18
3 Quality assessment procedures . 21
60115-8 IEC:2009 – 3 –
3.1 General . 21
3.2 Definitions . 21
3.2.1 Primary stage of manufacture . 21
3.2.2 Structurally similar components . 21
3.2.3 Assessment level EZ . 21
3.3 Formation of inspection lots . 21
3.4 Qualification approval . 22
3.4.1 Qualification approval on the basis of the fixed sample size
procedure . 22
3.4.2 Qualification approval on the basis of lot-by-lot and periodic testing . 23
3.5 Quality conformance inspection . 23
3.6 Technology approval procedures . 23
3.7 Delayed delivery . 23
Annex A (normative) 0 Ω resistors (Jumper) . 36
A.1 Information to be specified in a detail specification . 36
A.2 Preferred characteristics. 36
A.3 Preferred ratings . 36
A.4 Preferred severities . 36
A.5 Test schedule for qualification approval . 37
A.6 Test schedule for quality conformance inspection . 37
Annex B (informative) Letter symbols and abbreviations . 38
B.1 Letter symbols . 38
B.2 Abbreviations . 39
Bibliography . 40
Figure 1 – Shape and dimensions of rectangular (RR) resistors . 10
Figure 2 – Shape and dimensions of cylindrical (RC) resistors . 10
Figure 3 – Derating curve . 14
Figure 4 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4
point) connections . 19
Figure 5 – Attachment of the sense line for Kelvin (4 point) connections for specimen
with nominal resistance lower than 100 mΩ . 19
Figure 6 – Basic layout for mechanical, environmental and electrical tests . 20
Table 1a – Preferred styles for rectangular (RR) resistors . 9
Table 1b – Preferred styles for cylindrical (RC) resistors . 10
Table 2 – Permitted change of resistance . 11
Table 3a – Limits for change of resistance . 12
Table 3b – Limits for change of resistance . 13
Table 4 – Shear test force . 17
Table 5 – Soldering pad dimensions . 20
Table 6 – Test schedule for qualification approval. 24
Table 7a – Test schedule for quality conformance inspection: Lot-by-lot tests . 30
Table 7b – Test schedule for quality conformance inspection: Periodic tests . 32
– 4 – 60115-8 IEC:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –
Part 8: Sectional specification –
Fixed surface mount resistors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60115-8 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This second edition cancels and replaces the first edition, published in 1989, and its
Amendment 1 (2000). This second edition constitutes a technical revision and includes test
conditions and requirements for lead-free soldering and assessment procedures meeting the
requirements of a “zero defect” approach.
The major technical changes with regard to the first edition are the following:
– introduction of a product classification based on application requirements;
– extension of the list of styles and dimensions;
– use of an extended scope of stability class definitions;
– extension of the lists of preferred values of ratings
– inclusion of test conditions and requirements for lead-free soldering, for periodic overload
and for resistance to electrostatic discharge (ESD);
60115-8 IEC:2009 – 5 –
– inclusion of a new set of severities for a shear test;
– inclusion of definitions for a test board;
– replacement of assessment level E and possible others by the sole assessment level EZ,
meeting the requirements of a “zero defect” approach;
– inclusion of an extended endurance test, a flammability test, a temperature rise test,
vibration tests, an extended rapid change of temperature test, and a single pulse high-
voltage overload test;
– inclusion of requirements applicable to 0 Ω resistors (jumpers).
This bilingual version (2013-01) corresponds to the monolingual English version, published in
2009-01.
The text of this standard is based on the following documents:
FDIS Report on voting
40/1933/FDIS 40/1970/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts of the IEC 60115 series, under the general title Fixed resistors for use in
electronic equipment, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – 60115-8 IEC:2009
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –
Part 8: Sectional specification –
Fixed surface mount resistors
1 General
1.1 Scope
This part of IEC 60115 is applicable to fixed surface mount resistors for use in electronic
equipment.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions). They have metallized terminations and are primarily intended to
be mounted directly on to a circuit board.
1.2 Object
The object of this standard is to prescribe preferred ratings and characteristics and to select
from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring
methods and to give general performance requirements for this type of resistor.
Test severities and requirements prescribed in detail specifications referring to this sectional
specification shall be of equal or higher performance level, because lower performance levels
are not permitted.
1.3 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60062:2004, Marking codes for resistors and capacitors
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1(1992)
IEC 60068-2-58:2004, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60115-1:2008, Fixed resistors for use in electronic equipment – Part 1: Generic
specification
IEC 61193-2:2007, Quality assessment systems – Part 2: Selection and use of sampling plans
for inspection of electronic components and packages
IEC 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61760-1:2006, Surface mounting technology – Part 1: Standard method for the
specification of surface mounting components (SMDs)
60115-8 IEC:2009 – 7 –
1.4 Information to be specified in a detail specification
Detail specifications shall be derived from the relevant blank detail specification.
Detail specifications shall not specify requirements inferior to those of the generic
specification, sectional specification or blank detail specification. When severer requirements
are included, they shall be listed in a subclause of the detail specification and indicated in the
test schedules, for example by a note.
The following information shall be given in each detail specification and the values quoted
shall preferably be selected from those given in the appropriate clause of this sectional
specification.
1.4.1 Outline drawing
There shall be an illustration of the resistor as an aid to easy recognition and for comparison
of the resistor with others.
1.4.2 Style and dimensions
See 2.1.1.
Dimensions and their associated tolerances, which affect interchangeability and mounting,
shall be given in the detail specification.
1.4.3 Climatic category
See 2.1.2.
1.4.4 Limits of resistance change after testing
See 2.1.4.
1.4.5 Resistance range
See 2.2.1.
NOTE When products approved according to the detail specification have different ranges, the following
statement should be added: “The range of values available in each style, together with the associated tolerance
and temperature coefficient, is given in the register of approvals, available for example on the website
www.iecq.org”.
1.4.6 Tolerances on nominal resistance
See 2.2.2.
1.4.7 Temperature coefficient of resistance
See 2.1.3.
1.4.8 Rated dissipation
See 2.2.3.
The mounting conditions are as described in 2.4.2.
The detail specification shall state the maximum dissipation at temperatures other than 70 °C,
for example the derating, either in a diagram or in the form of a statement. All break points
shall be verified by test.
– 8 – 60115-8 IEC:2009
1.4.9 Limiting element voltage
See 2.2.4.
1.4.10 Insulation voltage
This information is required only for insulated resistors.
See 2.2.6 and the definition in IEC 60115-1, 2.2.10
For small size resistors where the dimensions of the test jig given in IEC 60115-1, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.11 Insulation resistance
This information is required only for insulated resistors.
See 2.2.5.
For small size resistors where the dimensions of the test jig given in IEC 60115-1, 4.6 are not
adequate, they shall be specified in the detail specification.
1.4.12 Marking
Surface mount resistors are generally not marked on the body. However, if some marking is
applied to the body, the resistor shall be marked with the resistance according to IEC 60062,
Clause 3 and as many of the remaining items listed in IEC 60115-1, 2.4. All the required
information shall be marked on the packaging.
1.4.13 Ordering information
The detail specification shall specify that the following information is required when ordering
resistors:
The number of the detail specification and style reference.
Resistance, tolerance on resistance and temperature coefficient of resistance according to
IEC 60062.
1.4.14 Mounting
The detail specification shall give guidance on methods of mounting for normal use,
preferably based on the specification of assembly process conditions of IEC 61760-1,
Clause 5. Mounting for test and measurement purposes (when required) shall be in
accordance with 2.4.2 of this specification and IEC 60115-1, 4.31.
The detail specification may include additional information (which is not normally required to
be verified by the inspection procedure), such as circuit diagrams, curves, drawings and notes
needed for the clarification of the detail specification.
1.5 Product classification
The introduction of a product classification permits the user to select performance
requirements according to the conditions of the intended end-use application.
Two general end product levels have been established to reflect characteristic differences in
functional, performance and reliability requirements and to permit the use of suitable
inspection and test schedules. It should be recognized that there may be overlaps of
applications between the levels.
Level G – General electronic equipment, typically operated under benign or moderate
environmental conditions, where the major requirement is function. Examples for level G
include consumer products and telecommunication user terminals.
60115-8 IEC:2009 – 9 –
Level P – High-performance electronic equipment, where one or more of the following criteria
applies:
– uninterrupted performance is desired or mandatory;
– operation in harsh environmental conditions;
– extended lifetime.
Examples for level P include professional equipment, telecommunication transmission
systems, industrial control and measurement systems and most automotive applications
operated outside the passenger compartment.
Level P is the suitable basis for detail specifications aiming for the approval of components
with established reliability.
Each level shall be used in individual detail specifications.
2 Preferred characteristics, ratings and test severities
2.1 Preferred characteristics
The values given in detail specifications shall preferably be selected from the following.
2.1.1 Style and dimensions
The preferred styles and dimensions are given in Table 1a and Table 1b.
Table 1a – Preferred styles for rectangular (RR) resistors
Style Dimensions
a Length L Width W Height T
Metric Imperial
mm mm mm
RR0603M RR0201
0,6 ± 0,03 0,3 ± 0,03 0,23 ± 0,03
RR1005M RR0402
1,0 ± 0,05 0,5 ± 0,05 0,35 ± 0,05
RR1608M RR0603
1,6 ± 0,1 0,8 ± 0,1 0,45 ± 0,1
+0,15
RR2012M RR0805 2,0 ± 0,1 1,25 ± 0,15
0,5
−0,10
RR3216M RR1206
3,2 ± 0,2 1,6 ± 0,15 0,55 ± 0,1
RR3225M RR1210
3,2 ± 0,2 2,5 ± 0,2 0,55 ± 0,1
RR3245M RR1218 3,2 ± 0,2 4,6 ± 0,2 0,55 ± 0,1
RR4532M RR1812
4,6 ± 0,2 3,2 ± 0,2 0,55 ± 0,1
RR5025M RR2010
5,0 ± 0,2 2,5 ± 0,2 0,55 ± 0,2
RR6332M RR2512 6,3 ± 0,2 3,2 ± 0,2 0,55 ± 0,2
NOTE Figure 1 shows the shape and dimensions of rectangular resistors.
a
Historical style codes, for information only.
– 10 – 60115-8 IEC:2009
W
T
L
IEC 2353/08
Figure 1 – Shape and dimensions of rectangular (RR) resistors
Table 1b – Preferred styles for cylindrical (RC) resistors
Style Dimensions
Metric Length L Diameter D
mm mm
+0,10 +0,15
RC1610M
1,6 1,0
−0,05 −0,05
+0,2
RC2012M 2,0 ± 0,1
1,25
−0,1
0 0
RC2211M
2,2 1,1
−0,3 −0,10
a
RC3514M
3,5 ± 0,2 1,4 ± 0,2
b
RC5922M 5,9 ± 0,2 2,2 ± 0,2
NOTE Figure 2 shows the shape and dimensions of cylindrical resistors.
a 0 + 0,1
Comparable to historical style: RC3715M (L = 3,7 mm; D = 1,5 mm).
− 0,4 −0,3
b 0 + 0,2
Comparable to historical style: RC6123M (L = 6,1 mm; D = 2,3 mm).
− 0,9 − 0,4
L
D
IEC 2354/08
Figure 2 – Shape and dimensions of cylindrical (RC) resistors
When the component style is other than described above, for example for surface mount
wirewound resistors, the detail specification shall state such dimensional information as will
adequately describe the resistor.
60115-8 IEC:2009 – 11 –
2.1.2 Preferred climatic categories
The surface mount resistors covered by this specification are classified into climatic
categories according to the general rules given in IEC 60068-1 its Amendment 1, Annex A.
The lower and upper category temperature and the duration of the damp heat, steady state
test shall be chosen from the following:
Lower category temperature (LCT) –55 °C; –40 °C; –25 °C and –10 °C.
Upper category temperature (UCT) +85 °C; +100 °C; +125 °C; +155 °C;
+175 °C and +200 °C.
Duration of damp heat, steady state test: 10, 21 and 56 days.
The severities for the cold and dry heat tests are the lower and upper category temperatures
respectively.
NOTE The climatic performance of assembled resistors is greatly influenced by the circuit board, the assembly
method and a final coating.
2.1.3 Variation of resistance with temperature
The preferred limits of change in resistance for the variation of resistance with temperature
test are given in Table 2.
Table 2 – Permitted change of resistance
Limit of resistance change
%
Tempe-
b
rature
Lower category temperature / Reference Reference temperature / Upper category temperature
coefficient
temperature °C
°C
±1 000 W ±7,50 ±6,00 ±4,50 ±3,00 ±6,50 ±10,5 ±13,5 ±15,5 ±18,0
±500 V ±3,75 ±3,00 ±2,25 ±1,50 ±3,25 ±5,25 ±6,75 ±7,75 ±9,00
±250 U ±1,88 ±1,50 ±1,13 ±0,75 ±1,63 ±2,63 ±3,38 ±3,88 ±4,50
S
±100 ±0,75 ±0,60 ±0,45 ±0,30 ±0,65 ±1,05 ±1,35 ±1,55 ±1,80
±50 R ±0,375 ±0,300 ±0,225 ±0,150 ±0,325 ±0,525 ±0,675 ±0,775 ±0,900
±25 Q ±0,188 ±0,150 ±0,113 ±0,075 ±0,163 ±0,263 ±0,338 ±0,388 ±0,450
P
±15 ±0,113 ±0,090 ±0,068 ±0,045 ±0,098 ±0,158 ±0,203 ±0,233 ±0,270
±10 N ±0,075 ±0,060 ±0,045 ±0,030 ±0,065 ±0,105 ±0,135 ±0,155 ±0,180
±5 M ±0,038 ±0,030 ±0,023 ±0,015 ±0,033 ±0,053 ±0,068 ±0,078 ±0,090
L
±2 ±0,015 ±0,012 ±0,009 ±0,006 ±0,013 ±0,021 ±0,027 ±0,031 ±0,036
±1 K ±0,008 ±0,006 ±0,005 ±0,003 ±0,007 ±0,011 ±0,014 ±0,016 ±0,018
a
–6
Abbreviation: e.g. ±50 = 0 ± 50 × 10 /K.
b
If additional temperature coefficients are required, these shall be specified in the detail specification.
c
Code letters according to IEC 60062, 5.5.
–6 a b
10 /K
c
Code
-55 / +20
-40 / +20
-25 / +20
-10 / +20
+20 / +85
+20 / +125
+20 / +155
+20 / +175
+20 / +200
– 12 – 60115-8 IEC:2009
Each line in the table gives the preferred temperature coefficient and limits of change in
resistance for the measurement of the variation of resistance with temperature (see
IEC 60115-1, 4.8) on the basis of category temperature ranges of 2.1.2 of this specification.
2.1.4 Limits for change in resistance
Tables 3a and 3b list preferred limits for resistance change for all tests listed in the heading.
To classify the performance of resistors, they will be assigned to stability classes as listed in
Table 3a and Table 3b below.
Table 3a – Limits for change of resistance
Long term tests Short term tests
a a a
Stability IEC 60115-1 , IEC 60115-1 , IEC 60115-1 ,
class
4.23 Climatic 4.25.1 Endurance at 70 °C, 4.13 Short term
code
b
sequence overload
4.24 Damp heat, 4.18 Resistance to
steady state soldering heat
4.25.3 Endurance at 4.19 Rapid change of
upper category temperature,
temperature 5 cycles
c
4.21 Shock
d
d
4.22 Vibration
1 000 h Extended, 8 000 h
4.33 Substrate
bending test
±(5 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(10 % R + 0,1 Ω) ±(1 % R + 0,05 Ω)
±(2 % R + 0,1 Ω) ±(2 % R + 0,1 Ω) ±(5 % R + 0,1 Ω) ±(0,5 % R + 0,05 Ω)
1 ±(1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(2 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω)
0,5
± (0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(0,1 % R + 0,01 Ω)
0,25
±(0,25 % R + 0,05 Ω) ±(0,25 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(0,05 % R + 0,01 Ω)
0,1
±(0,1 % R + 0,02 Ω) ±(0,1 % R + 0,02 Ω) ±(0,25 % R + 0,02 Ω) ±(0,05 % R + 0,01 Ω)
0,05 ±(0,05 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,1 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω)
0,025
±(0,025 % R + 0,01 Ω) ±(0,025 % R + 0,01 Ω) ±(0,05 % R + 0,01 Ω) ±(0,01 % R + 0,01 Ω)
a
IEC 60115-1.
b
Test is mandatory only for resistors categorized as level G.
c
Test is only applicable to other styles than RR or RC.
d
Test is mandatory only for resistors categorized as level P.
60115-8 IEC:2009 – 13 –
Table 3b – Limits for change of resistance
a a a a
Stability IEC 60115-1 , IEC 60115-1 , IEC 60115-1 , IEC 60115-1 ,
class
4.19 Rapid change 4.27 Single pulse 4.38 Electrostatic 4.39 Periodic
code
b
of temperature, high-voltage discharge electric overload
c c
c
overload test
≥ 100 cycles
± (1 % R + 0,05 Ω) ±(1 % R + 0,05 Ω) ±(1% R + 0,05 Ω) ±(2 % R + 0,05 Ω)
± (0,5 % R + 0,05 Ω)
0,5
0,25
±(0,5 % R + 0,05 Ω) ±(0,5 % R + 0,05 Ω) ±(1 % R + 0,05 Ω)
0,1
±(0,25 % R + 0,05 Ω)
0,05
0,025
a
IEC 60115-1.
b
Human body model (HBM) according to IEC 61340-3-1, using 3 positive and 3 negative discharges for
resistors categorized as level P, or 1 positive and 1 negative discharge for resistors categorized as level G.
c
Test is mandatory only for resistors categorized as level P.
2.2 Preferred values of ratings
2.2.1 Resistance
See IEC 60115-1, 2.3.2.
2.2.2 Tolerances on resistance
The preferred tolerances on resistance are:
±10 %; ±5 %; ±2 %; ±1 %; ±0,5 %; ±0,25 %; ±0,1 %; ±0,05 %; ±0,02 %; ±0,01 %;
0/-30 %; 0/-20 % and 0/-10 %.
NOTE Asymmetric tolerances (e.g. 0/-20 %) are intended to be used for laser trimmable resistors.
2.2.3 Rated dissipation P
The preferred values of rated dissipation P for mounted resistors at 70 °C ambient
temperature are:
0,016 W; 0,032 W; 0,05 W; 0,063 W; 0,1 W; 0,125 W; 0,25 W; 0,33 W; 0,4 W; 0,5 W; 0,75 W;
1 W; 2 W and 3 W.
The detail specification shall specify the conditions under which the rated dissipation applies.
– 14 – 60115-8 IEC:2009
Figure 3 shows an example of a derating curve that may be used to provide derating
information.
Area of recommended
operation
70 °C
Upper category
Lower category
temperature
temperature
IEC 2355/08
Figure 3 – Derating curve
All break points on the curve shall be verified by test.
2.2.4 Limiting element voltage U
max
The preferred values of limiting element voltage U d.c. or a.c. (r.m.s.) are:
max
12,5 V; 15 V; 25 V; 50 V; 75 V; 100 V; 150 V; 200 V; 300 V and 500 V.
2.2.5 Insulation resistance
For insulated resistors, the insulation resistance R shall be not less than 1 GΩ after dry
ins
heat tests and not less than 100 MΩ after climatic tests.
2.2.6 Insulation voltage
For insulated resistors, the preferred values of insulation voltage U d.c. or a.c. (peak) are:
ins
75 V; 100 V; 200 V; 300 V and 500 V.
2.3 Preferred test severities
2.3.1 Short time overload
See IEC 60115-1, 4.13, with the following details:
Applied voltage: The detail specification shall state the applied voltage. Preferred
values are
U = 2,5 ⋅U (1)
r
or
(2)
U = 2 ⋅U
max
whichever is the less severe,
where
U is the rated voltage
r
U is the limiting element voltage.
max
Duration: The detail specification shall state the load duration.
Preferred values are 0,5 s; 1 s; 2 s; 5 s and 10 s.
Percentage of the rated
dissipation
60115-8 IEC:2009 – 15 –
This time shall be fixed in such a way, that the maximum element
temperature is at least 30 K above the upper category temperature.
Mounting: See 2.4.2. The distance between individual surface mount resistors
shall not be less than the largest surface mount resistor dimension.
The test board shall be mounted horizontally and shall be in free air at
an ambient temperature between 15 °C and 35 °C.
2.3.2 Solderability
See IEC 60115-1, 4.17, with the following details:
The solderability test shall be preceded by accelerated ageing. Unless otherwise specified in
the relevant detail specification, Ageing 3a as prescribed in IEC 60068-2-20, 4.1.1 (i.e. 4 h at
155 °C dry heat) shall be used. After the accelerated ageing, the specimen shall be subjected
to standard atmospheric conditions for testing for not less than 2 h and not more than 24 h.
The solderable termination surface of the resistors shall be compatible with both, traditional
SnPb solder and lead-free solder, unless otherwise explicitly stated in the relevant detail
specification. Therefore solderability testing is required for both soldering processes.
Solderability with traditional SnPb solder shall be tested according to IEC 60068-2-58, 8.2.1,
solder bath method with the following severity
Solder alloy: Sn60Pb40 or Sn63Pb37
Bath temperature: (235 ± 5) °C
Immersion time: (2 ± 0,2) s
Lead-free solder alloys are grouped in IEC 60068-2-58, Clause 4 according to their typical
process temperature. The most popular solder alloys SnAg, SnAgCu and SnAgBi are
contained in group 3, medium-high temperature. Solderability with lead-free solder shall be
tested according to IEC 60068-2-58, 8.1.1, solder bath method with the following
representative severity for group 3:
Solder alloy: Sn96, 5Ag3, 0Cu0,5
Bath temperature: (245 ± 5) °C
Immersion time: (3 ± 0,3) s
2.3.3 Resistance to soldering heat
See IEC 60115-1, 4.18, with the following details:
Resistors shall be capable to withstand the full variety of soldering processes described in
IEC 61760-1, unless explicitly stated otherwise in the relevant detail specification:
• SnPb vapour phase reflow soldering;
• Lead-free vapour phase reflow soldering;
• SnPb infrared or forced gas convection reflow soldering;
• Lead-free infrared or forced gas convection reflow soldering;
• SnPb double wave soldering;
– 16 – 60115-8 IEC:2009
• Lead-free double wave soldering.
Resistance to soldering heat for the combination of all soldering methods shall be tested with
the worst case condition from IEC 60068-2-58, 8.2.1 and IEC 60068-2-58, 8.1.1:
Test method: Solder bath method
Solder alloy: any alloy SnPb or SnCu or SnAgCu or SnAg
Bath temperature: (260 ± 5) °C
Immersion time: (10 ± 1) s
Test cycles: 1
For resistors, where the relevant detail specification explicitly excludes wave soldering,
resistance to soldering heat may be tested with the worst case reflow condition from
IEC 60068-2-58, 8.2.4 and IEC 61760-1, Clause 6.
Test method: Vapour phase soldering
Vapour temperature: (230 ± 5) °C
Immersion time: (40 ± 1) s
Test cycles: 3, the recovery period between two successive cycles shall be at least
the time it takes until the specimen drops below 50 °C.
For resistors, where the relevant detail specification explicitly excludes wave soldering and
vapour phase reflow soldering, resistance to soldering heat may be tested with the worst case
non-vapour phase reflow condition from IEC 60068-2-58, 8.2.4 and IEC 60068-2-58, 8.1.2.2.
Test method: Infrared and forced gas convection soldering
Preheating: 150 °C to 180 °C
for (120 ± 5) s
Peak temperature: (255 ± 5) °C
Dwell time: (40 ± 1) s above 245 °C
(60 to 90) s above 220 °C
Test cycles: 3, the recovery period between two successive cycles shall be at least
the time it takes until the specimen drops below 50 °C.
2.3.4 Shear (adhesion) test
See IEC 60115-1, 4.32.2 b), with the following details:
Unless otherwise specified in the relevant detail specification, a force as given in Table 4
shall be applied to the surface mount resistor body.
60115-8 IEC:2009 – 17 –
Table 4 – Shear test force
Style
a
Force
N
Rectangular Cylindrical
RR0603M — 2
RR1005M — 3
RR1608M RC1610M 5
RC2012M
RR2012M 9
RC2211M
RR3216M
RC3514M 25
RR3225M
RR3245M
RR4532M
— 45
RR5025M
RR6332M
— RC5922M 90
NOTE The specified forces exceed the result of an acceleration of
981 m/s (100 g), for example a shock or a bump, based on the
typical mass of resistors of the respective style.
a
A relative tolerance of 0/+10 % applies to the prescribed shear
test forces.
2.3.5 Periodic pulse overload test
See IEC 60115-1, 4.39, with the following details:
Pulse voltage: The preferred pulse voltage is
U = 15 ⋅P ⋅R (3)
70 n
but no more than
(4)
U = 2 ⋅U
max
where
P is the rated dissipation
R is the resistance
n
U is the limiting element voltage.
max
Pulse duration: 1 000 cycles, 0,1 s on / 2,5 s off.
Mounting: See 2.4.2. The distance between individual surface mount resistors
shall not be less than the largest surface mount resistor dimension.
The test board shall be mounted horizontally and shall be in free air at
an ambient temperature between 15 °C and 35 °C
2.3.6 Resistance to electrostatic discharge (ESD)
IEC 60115-1, 4.38 with the following details:
Discharge count: Three discharges of positive and three discharges of negative polarity
shall be appli
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