IEC 60115-1:2008

IEC 60115-1
Edition 4.0 2008-07
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 1: Generic specification
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IEC 60115-1
Edition 4.0 2008-07
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XC
ICS 31.040.10 ISBN 2-8318-9846-3
– 2 – 60115-1 © IEC:2008(E)
CONTENTS
FOREWORD.7

1 General .9

1.1 Scope.9

1.2 Normative references .9

2 Technical data .11

2.1 Units and symbols .11

2.2 Terms and definitions .11

2.3 Preferred values .15
2.3.1 General .15
2.3.2 Preferred values of nominal resistance.15
2.4 Marking .15
2.5 Coding.16
2.6 Packaging .16
2.7 Storage .16
2.8 Transportation .16
3 Quality assessment procedures .16
4 Test and measurement procedures .17
4.1 General .17
4.2 Standard atmospheric conditions .17
4.2.1 Standard atmospheric conditions for testing .17
4.2.2 Recovery conditions.17
4.2.3 Referee conditions.17
4.2.4 Reference conditions .18
4.3 Drying.18
4.4 Visual examination and checking of dimensions .18
4.4.1 Visual examination.18
4.4.2 Dimensions (gauging) .18
4.4.3 Dimensions (detail) .19
4.5 Resistance .19
4.5.1 Test methods.19
4.5.2 Requirements .20
4.6 Insulation resistance.20
4.6.1 Test methods.20

4.6.2 Measuring conditions .22
4.6.3 Requirements .23
4.7 Voltage proof.23
4.7.1 Test methods.23
4.7.2 Test conditions .23
4.7.3 Requirements .23
4.8 Variation of resistance with temperature .23
4.8.1 Preconditioning.23
4.8.2 Measuring temperatures .23
4.8.3 Measuring procedures .23
4.8.4 Calculation of temperature coefficient of resistance α.24
4.8.5 Requirements .24
4.9 Reactance .25

60115-1 © IEC:2008(E) – 3 –
4.9.1 Test procedures.25

4.9.2 Pulse generator specification .25

4.9.3 Oscilloscope specification .25

4.9.4 Measurements .26

4.9.5 Impedance analyzer.26

4.10 Non-linear properties .26

4.11 Voltage coefficient .26

4.11.1 Preconditioning.26

4.11.2 Measuring methods .26

4.11.3 Calculation of voltage coefficient.27

4.11.4 Requirements .27
4.12 Noise.27
4.13 Short time overload .27
4.13.1 Initial measurements.27
4.13.2 Test procedures.27
4.13.3 Final inspection, measurements and requirements .27
4.14 Temperature rise .27
4.14.1 Object.27
4.14.2 Mounting.27
4.14.3 Test procedures.28
4.14.4 Requirements .28
4.15 Robustness of the resistor body.28
4.15.1 Object.28
4.15.2 Test procedure .28
4.15.3 Requirements .28
4.16 Robustness of terminations.29
4.16.1 Test methods.29
4.16.2 Test Ua Tensile .29
1 –
4.16.3 Test Ub – Bending .30
4.16.4 Test Uc – Torsion .30
4.16.5 Test Ud – Torque.30
4.16.6 Final measurements .30
4.17 Solderability.30
4.17.1 Preconditioning.31
4.17.2 Test procedures.31

4.17.3 Final inspection, measurements and requirements .31
4.18 Resistance to soldering heat.31
4.18.1 Preconditioning.31
4.18.2 Test procedures.32
4.18.3 Recovery .32
4.18.4 Final inspection, measurements and requirements .32
4.19 Rapid change of temperature.32
4.19.1 Initial measurements.32
4.19.2 Test procedures.32
4.19.3 Final inspection, measurements and requirements .32
4.20 Bump .33
4.20.1 Mounting.33
4.20.2 Initial measurements.33
4.20.3 Test procedures.33

– 4 – 60115-1 © IEC:2008(E)
4.20.4 Final inspection, measurements and requirements .33

4.21 Shock.33

4.21.1 Mounting.33

4.21.2 Initial measurements.33

4.21.3 Test procedures.33

4.21.4 Measurements under test.33

4.21.5 Final inspection, measurements and requirements .33

4.22 Vibration.33

4.22.1 Mounting.33

4.22.2 Initial measurements.34

4.22.3 Test procedures.34
4.22.4 Final inspection, measurements and requirements .34
4.23 Climatic sequence .34
4.23.1 Initial measurements.34
4.23.2 Dry heat.34
4.23.3 Damp heat, cyclic, test Db, first cycle .34
4.23.4 Cold.34
4.23.5 Low air pressure .34
4.23.6 Damp heat, cyclic, test Db, remaining cycles .35
4.23.7 DC load .35
4.23.8 Final inspection, measurements and requirements .35
4.24 Damp heat, steady state .35
4.24.1 Initial measurements.35
4.24.2 Test procedures.35
4.24.3 DC load .36
4.24.4 Final inspection, measurements and requirements .36
4.25 Endurance.36
4.25.1 Endurance at 70 °C.36
4.25.2 Endurance at room temperature.38
4.25.3 Endurance at upper category temperature.39
4.26 Accidental overload test.40
4.26.1 Object.40
4.26.2 Gauze cylinder test method.40
4.26.3 Conditions of test.41
4.26.4 Test procedure .42

4.26.5 Requirement .42
4.27 Single-pulse high-voltage overload test .42
4.27.1 Object.42
4.27.2 Terminology.42
4.27.3 Test procedure .42
4.28 Periodic-pulse high-voltage overload test .45
4.28.1 Object.45
4.28.2 Terminology.45
4.28.3 Test procedure .45
4.29 Component solvent resistance .47
4.29.1 Initial measurement .47
4.29.2 Test conditions .47
4.29.3 Requirements .47
4.30 Solvent resistance of marking .48

60115-1 © IEC:2008(E) – 5 –
4.30.1 Test conditions .48

4.30.2 Requirements .48

4.31 Mounting of surface mount resistors .48

4.31.1 Substrate.48

4.31.2 Wave soldering.48

4.31.3 Reflow soldering .49

4.32 Shear test.51

4.32.1 Mounting.51

4.32.2 Severities .51

4.32.3 Requirements .51

4.33 Substrate bending test.51
4.33.1 Preparation.51
4.33.2 Initial measurements.51
4.33.3 Test procedures.51
4.33.4 Final inspection and requirements.51
4.34 Corrosion .52
4.34.1 Test method .52
4.34.2 Requirements .52
4.35 Flammability .52
4.35.1 Test conditions .52
4.35.2 Requirements .52
4.36 Operation at low temperature.52
4.36.1 Initial measurements.52
4.36.2 Test procedures.52
4.36.3 Final inspection, measurements and requirements .52
4.37 Damp heat, steady state, accelerated .52
4.37.1 Initial measurements.52
4.37.2 Test methods.52
4.37.3 Test procedures.53
4.37.4 Final inspection, measurements and requirements .53
4.38 Electrostatic discharge.53
4.38.1 Test methods.53
4.38.2 Initial measurements.53
4.38.3 Test procedures.53
4.38.4 Final inspection, measurements and requirements .53

4.39 Periodic-pulse overload test.53
4.39.1 Preconditioning.53
4.39.2 Mounting.53
4.39.3 Initial measurements.54
4.39.4 Severities .54
4.39.5 Recovery .54
4.39.6 Final inspection, measurements and requirements .54
4.40 Whisker growth test.54
4.40.1 General .54
4.40.2 Preparation of specimen .54
4.40.3 Initial measurement .54
4.40.4 Test procedures.55
4.40.5 Test severities .55
4.40.6 Final inspection, measurements and requirements .55

– 6 – 60115-1 © IEC:2008(E)
4.41 Hydrogen sulphide test .55

Annex A (normative) Interpretation of sampling plans and procedures as described in

IEC 60410 for use within the IECQ system .56

Annex B (normative) Rules for the preparation of detail specifications for resistors and

capacitors for electronic equipment for use within the IECQ system .57

Annex C (informative) Example of test equipment for the periodic-pulse high-voltage
overload test .58

Annex D (normative) Layout of the first page of a PCP/CQC specification.60

Annex E (normative) Requirements for capability approval test report .61

Annex F (informative) Letter symbols and abbreviations .62
Annex G (informative) Index table for test and measurement procedures .64
Annex Q (normative) Quality assessment procedures .66

Figure 1 – Insulation resistance and voltage proof test jig for rectangular surface mount
resistors.21
Figure 2 – Insulation resistance and voltage proof test jig for cylindrical surface mount
resistors.22
Figure 3 – Test circuit .25
Figure 4 – Oscilloscope trace .26
Figure 5 – Testing of resistor body robustness.29
Figure 6 – Gauze cylinder fixture .41
Figure 7 – Pulse generator 1,2/50.43
Figure 8 – Pulse generator 10/700.43
Figure 9 – Suitable substrate for mechanical and electrical tests (may not be suitable for
impedance measurements) .50
Figure 10 – Suitable substrate for electrical tests.50
Figure C.1 – Block diagram of test equipment.58
Figure C.2 – Tolerances on the pulse shape.59
Figure Q.1 – General scheme for capability approval .69

Table 1 – Referee conditions.18
Table 2 – Measuring voltages.19
Table 3 – Calculation of resistance value (R) and change in resistance (ΔR).24

Table 4 – Calculation of temperature differences (ΔT) .24
Table 5 – Tensile force for wire terminations .30
Table 6 – Torque.30
Table 7 – Number of cycles .35
Table 8 – Severities (see Note 2) .44
Table 9 – List of preferred severities .46
Table 10 – Periodic-pulse overload test condition .54

60115-1 © IEC:2008(E) – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60115-1 has been prepared by IEC technical committee 40:

Capacitors and resistors for electronic equipment
This fourth edition cancels and replaces the third edition issued in 1999 and Amendment 1
(2001). It constitutes a technical revision.
This standard cancels and replaces IEC 61045-1 (1991), IEC 61045-2 (1991) and IEC 61045-2-1
(1991).
This edition contains the following significant technical changes with respect to the previous
edition:
a) implementation of Annex Q which replaces Clause 3;
b) addition of new tests procedures in 4.34 through 4.38;
c) removal of the property "temperature characteristics" from 4.8;

– 8 – 60115-1 © IEC:2008(E)
d) introduction of a new system of test severities for the shear test in 4.32;

e) introduction of new bias voltages for the damp heat steady-state test in 4.24;

f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and

constitutes minor revisions related to tables, figures and references.

The text of this standard is based on the following documents:

FDIS Report on voting
40/1907/FDIS 40/1922/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
A list of all parts of the IEC 60115 series, under the general title Fixed resistors for use in
electronic equipment, can be found on the IEC website.
All sectional specifications mentioned above do have one or more blank detail specifications
being a supplementary document, containing requirements for style, layout and minimum
content of detail specifications.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

60115-1 © IEC:2008(E) – 9 –
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 1: Generic specification
1 General
1.1 Scope
This part of IEC 60115 is a generic specification and is applicable to fixed resistors for use in
electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional
and detail specifications of electronic components for quality assessment or any other purpose.
1.2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 60060-1:1989, High-voltage test techniques – Part 1: General definitions and test
requirements
IEC 60062:2004, Marking codes for resistors and capacitors
IEC 60063:1963, Preferred number series for resistors and capacitors
Amendment 1(1967)
Amendment 2(1977)
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1(1992)
IEC 60068-2-1:1990, Environmental testing – Part 2: Tests – Tests A: Cold

Amendment 1(1993)
Amendment 2(1994)
IEC 60068-2-2:1974, Environmental testing – Part 2: Tests – Tests B: Dry heat
Amendment 1(1993)
Amendment 2(1994)
IEC 60068-2-6:2007, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-11:1981, Environmental testing – Part 2: Tests – Test Ka: Salt mist
IEC 60068-2-13:1983, Environmental testing – Part 2: Tests – Test M: Low air pressure
IEC 60068-2-14:1984, Environmental testing – Part 2: Tests – Test N: Change of temperature
Amendment 1(1986)
– 10 – 60115-1 © IEC:2008(E)
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering

Amendment 2(1987)
IEC 60068-2-21:2006, Environmental testing – Part 2: Tests – Test U: Robustness of

terminations and integral mounting devices

IEC 60068-2-27:1987, Environmental testing – Part 2: Tests – Test Ea and guidance: Shock

IEC 60068-2-29:1987, Environmental testing – Part 2: Tests – Test Eb and guidance: Bump

IEC 60068-2-30:2005, Environmental testing – Part 2: Tests – Test Db: Damp heat, cyclic (12

h+ 12 h cycle)
IEC 60068-2-45:1980, Environmental testing – Part 2: Tests – Test XA and guidance:
Immersion in cleaning solvents
Amendment 1(1993)
IE 60068-2-54: 2006, Environmental testing – Part 2.54: Tests – Test Ta: Solderability testing
of electronic components by the wetting balance method
IEC 60068-2-58:2005, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-67:1995, Environmental testing – Part 2-67: Tests – Test Cy: Damp heat, steady
state, accelerated test primarily intended for components
IEC 60068-2-78:2001, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60195:1965, Method of measurement of current noise generated in fixed resistors
IEC 60286, Packaging of components for automatic handling
IEC 60294:1969, Measurement of the dimensions of a cylindrical component having two axial
terminations
IEC 60410:1973, Sampling plans and procedures for inspection by attributes
IEC 60440:1973, Method of measurement of non-linearity in resistorsIEC 60617:2007,

Graphical symbols for diagrams
IEC 60617, Graphical symbols for diagrams
IEC 60695-11-5:2004, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method
– Apparatus, confirmatory test arrangement and guidance
IEC 61193-2:2007,Quality assessment systems – Part 2: Selection and use of sampling plans
for inspection of electronic components and packages
IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures –
Part 2-7: Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet
of defined flammability (vertical burning test), copper-clad

60115-1 © IEC:2008(E) – 11 –
IEC 61249-2-22: 2005, Materials for printed boards and other interconnecting structures – Part

2-22: Reinforced base materials clad and unclad – Modified non-halogenated epoxide woven E-

glass laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-35, Materials for printed boards and other interconnecting structures – Part 2-35:

Reinforced base materials clad and unclad – Modified epoxide woven E-glass laminated sheets

of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61340-3-1:2006, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –

Human body model (HBM) electrostatic discharge test waveforms

ÌEC 61760-1:2006, Surface mounting technology – Part 1: Standard method for the
specification of surface mounting components (SMDs)
IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of procedure – Part 3: Approval procedures
ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain
other units
2 Technical data
2.1 Units and symbols
Units, graphical symbols and letter symbols should, whenever possible, be taken from the
following publications:
– IEC 60027;
– IEC 60050;
– IEC 60617;
– ISO 1000.
When further items are required they shall be derived in accordance with the principles of the
publications listed above.
2.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply, in alphabetical
order:
2.2.1
category dissipation
fraction of the rated dissipation exactly defined in the detail specification, applicable at the
upper category temperature, taking account of the derating curve prescribed in the detail
specification
NOTE 1 For resistors the category dissipation is zero, where the upper category temperature is the maximum
element temperature.
NOTE 2 Related terminology: rated dissipation, upper category temperature, derating curve
2.2.2
category temperature range
range of ambient temperatures for which the resistor has been designed to operate
continuously; this is given by the lower and upper category temperature
___________
To be published.
– 12 – 60115-1 © IEC:2008(E)
NOTE Related terminology: lower category temperature, upper category temperature

2.2.3
critical resistance
resistance value at which the rated voltage is equal to the limiting element voltage (see 2.2.18
and 2.2.11)
NOTE 1 At an ambient temperature of 70 °C, the maximum voltage which may be applied across the terminations

of a resistor is either the calculated rated voltage, if the resistance is less than the critical resistance, or the limiting

element voltage, if the resistance is equal to or greater than the critical resistance. At temperatures other than

70 °C, it is important that account be taken of the derating curve and of the limiting element voltage in the
calculation of any voltage to be applied.

NOTE 2 Related terminology: Rated voltage, limiting element voltage
2.2.4
derating curve
curve which shows the maximum allowable dissipation at ambient temperatures between the
upper and lower category temperature
NOTE 1 In the range between lower category temperature and rated temperature it shows the rated dissipation,
and between rated temperature and maximum element temperature it shows a linear slope down to zero dissipation
at the maximum element temperature. The slope depends on the thermal properties of the resistor, i.e. its capability
to abduct the dissipation to the environment.
NOTE 2 Related terminology: rated dissipation, rated temperature, maximum element temperature
2.2.5
family (of electronic components)
group of components which predominantly displays a particular physical attribute and/or fulfils
a defined function
NOTE Related terminology: subfamily
2.2.6
grade
term indicating additional general characteristics concerning the intended application, for
example, long-life applications
NOTE 1 The term "grade" may be used only in combination with one or more words (for example, long-life grade)
and not with a single letter or number.
NOTE 2 Related terminology: stability class
2.2.7
heat-sink resistor
resistor type designed for mounting on a separate heat-sink

NOTE Related terminology: insulated resistor
2.2.8
insulated resistor
resistor which fulfils the voltage proof and insulation resistance test requirements and the
damp-heat, steady-state test with a polarizing voltage applied when mounted on a metal plate
NOTE Related terminology: heat-sink resistor
2.2.9
insulation resist
...