IEC 61191-6:2010

IEC 61191-6 ®
Edition 1.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed board assemblies –
Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and
measurement method
Ensembles de cartes imprimées –
Partie 6: Critères d’évaluation des vides dans les joints brasés des boîtiers BGA
et LGA et méthode de mesure
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IEC 61191-6 ®
Edition 1.0 2010-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed board assemblies –
Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and
measurement method
Ensembles de cartes imprimées –
Partie 6: Critères d’évaluation des vides dans les joints brasés des boîtiers BGA
et LGA et méthode de mesure
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.180 ISBN 978-2-88910-439-0
– 2 – 61191-6 © IEC:2010
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Terms and definitions .7
4 Voids in solder joints .8
4.1 General .8
4.2 Sources of voids.8
4.3 Impact of voids .9
4.4 Void detection .9
4.5 Void classification .9
5 Measurement .10
5.1 X-ray transmission equipment .10
5.2 Measuring environment .10
5.3 Measurement procedure.10
5.4 Record of the measured value.11
5.5 Considerations on measurement .11
5.5.1 X-ray intensity for void detection.11
5.5.2 Detection of real edge .11
5.5.3 Verification of measurement results.11
6 Void occupancy .11
6.1 Calculation of void occupancy .11
6.2 Void occupancy for multiple voids.14
7 Evaluation .14
7.1 Soldered joints to be evaluated .14
7.2 Evaluation of thermal life cycle decreased due to voids .14
7.3 Evaluation criteria for voids .15
Annex A (informative) Experimental results and simulation of voids and decrease of
life due to thermal stress.16
Annex B (informative) X-ray transmission equipment .20
Annex C (informative) Voids in BGA solder ball .22
Annex D (informative) Measurement using X-ray transmission imaging.34
Bibliography.38

Figure 1 – Void occupancy.13
Figure 2 – Voids in a soldered joint.15
Figure A.1 – BGA soldered joint, Sn-Ag-Cu.17
Figure A.2 – BGA soldered joint, Sn-Zn .17
Figure A.3 – LGA soldered joint .18
Figure B.1 – Construction of the equipment .20
Figure C.1 – Small voids clustered in mass at the ball-to-land interface .26
Figure C.2 – X-ray image of solder balls with voids.27
Figure C.3 – Example of voided area at land and board interface .27
Figure C.4 – Voids in BGAs with crack started at corner lead.31

61191-6 © IEC:2010 – 3 –
Figure D.1 – X-ray transmission imaging.35
Figure D.2 – X-ray transmission imaging of solder joint.36
Figure D.3 – Typical X-ray transmission images of solder joint.36

Table 1 – Void classification .9
Table 2 – Examples of Cross-section of joint and void occupancy.14
Table A.1 – Fatigue life reduced by voids in soldered joint of BGA.17
Table A.2 – Fatigue life reduced by voids in soldered joint of LGA .18
Table A.3 – Voids evaluation criteria for soldered joints of BGA.19
Table A.4 – Voids evaluation criteria for soldered joints of LGA .19
Table C.1 – Void classification .27
Table C.2 – Corrective action indicator for lands used with 1,5 mm, 1,27 mm or
1,0 mm pitch .28
Table C.3 – Corrective action indicator for lands used with 0,8 mm, 0,65 mm or 0,5 mm
pitch .30
Table C.4 – Corrective action indicator for micro-via in-pad lands used with 0,5 mm,
0,4 mm or 0,3 mm pitch .32
Table C.5 – Ball-to-void size image comparison for common ball contact diameters .33
Table C.6 – C = 0 sampling plan (sample size for specific index value).33

– 4 – 61191-6 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 6: Evaluation criteria for voids in soldered joints of BGA
and LGA and measurement method

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61191-6 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/897/FDIS 91/909/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61191 series, under the general title Printed board assemblies,
can be found on the IEC website.

61191-6 © IEC:2010 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – 61191-6 © IEC:2010
INTRODUCTION
The necessity for the evaluation of voids in soldered joints increases in the industry because
the voids may affect the reliability of joints as the devices get smaller. As the number of
interconnections increases the reliability per joint must also increase.
This subject has been discussed in some countries and trade organizations, and specific
proposals have been made for classification or evaluation of voids to develop process
guidelines. The same subject is also studied in academia to find correlation between voids
and reliability of a joint. Appreciable findings are now available from the reliability study
including relation between shapes of voids and degradation of life due to voids in a joint in
thermal cycle stress.
Based on the information available, we developed evaluation criteria of voids in soldered
joints for BGA (Ball Grid Array) and LGA (Land Grid Array) and a measurement method.

61191-6 © IEC:2010 – 7 –
PRINTED BOARD ASSEMBLIES –
Part 6: Evaluation criteria for voids in soldered joints of BGA
and LGA and measurement method

1 Scope
This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal
cycle life, and the measurement method of voids using X-ray observation. This part of
IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered
on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is
assembled on a board.
This standard is applicable also to devices having joints made by melt and re-solidification,
such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard
is not applicable to joints with under-fill between a device and a board, or to solder joints
within a device package.
This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred
micrometres generated in a soldered joint, but is not applicable to smaller voids (typically,
planar microvoids) with a size of smaller than 10 µm in diameter.
This standard is intended for evaluation purposes and is applicable to
− research studies,
− off-line production process control and
− reliability assessment of assembly
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1998, Environmental testing – Part 1: General and guidance
Amendment 1:1992
IEC 60194:2006, Printed board design, manufacture and assembly – Terms and definitions
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 and the
following apply. The terms and definitions for BGA and LGA have been added for the benefit
of the reader, see also IEC 60194.
3.1
ball grid array
BGA
surface mount package wherein the bumps for terminations are formed in a grid on the bottom
of a package
[IEC 60194, definition 34.1096]

– 8 – 61191-6 © IEC:2010
3.2
land grid array
LGA
surface mount package with termination lands located in a grid pattern on the bottom of the
package
[IEC 60194, definition 33.1891, modified]
3.3
void occupancy
ratio of the void cross-section area in a joint to the maximum cross-section area of the joint
NOTE Practical calculation for a void evaluation is specified in 6.1.
3.4
macrovoid
the most widely occurring voids in solder joints; these are caused by volatile compounds that
evolve during the soldering processes, and they are typically larger than 10 μm in diameter
3.5
planar microvoids
series of small voids located at the interface between the PCB (Printed Circuit Board) lands
and the solder; they are caused by the surface condition of the board
4 Voids in solder joints
4.1 General
A change in void size or frequency of voids may be an indication that the manufacturing
parameters need to be adjusted. Two reported causes of voids are trapped flux that has not
had enough time to be released from the solder paste, and contaminants on improperly
cleaned circuit boards. Voids appear as a lighter area inside the X-ray picture of solder joints
and are usually found randomly throughout the package.
4.2 Sources of voids
There can be voids in a BGA solder ball, in the solder joint to LSI (Large-Scale Integration)
package interface, or in the solder joint to PCB interface. Various sources or reasons can be
responsible for these voids. Voids can be carried over from original voids in BGA solder balls,
which could be the result of the ball manufacturing process. Voids can be induced into the
reflowed solder joint by either the voids in the original component solder ball, or during the
reflow attachment process. Voids can also form near the PCB interface during attachment.
These voids are typically formed during the reflow soldering process by flux volatiles trapped
during the solidification of the molten solder. The source of flux volatiles can be either from
applied flux itself (typically rework), or flux which is one of the constituents of the solder paste
used in the reflow assembly process.
In addition to voids formed from via-in-pad construction, some voids are detected in the
middle to top (ball/device interface) of the reflowed solder joint. This is expected because the
trapped air bubble and the vaporized flux, which is applied to the PCB lands, rises during the
reflow profile. This occurs when the applied solder paste and the BGA’s collapsible solder
balls melt together during the reflow profile. If the reflow profile cycle doesn’t allow sufficient
time for either the trapped air or vaporized flux to escape, a void is formed as the molten
solder solidifies in the cool down area of the reflow profile. Therefore, the development of the
reflow profile is extremely important as a contributor to the formation of voids.
Voiding can also be a result of surface contamination at the component land or at the PCB
land, inter-metallics forming between solder ball and land, or un-expelled flux residues from
the assembly process.
61191-6 © IEC:2010 – 9 –
4.3 Impact of voids
How many and what size of voids should be allowable in the product before they impact the
product’s required reliability? Voids may impact reliability by weakening the solder balls and
reducing functionality because the reduced cross-section will have lower heat transfer and
current carrying capabilities. Large voids are more detrimental but small pre-existing voids
can merge during reflow to create larger voids. The elimination of voids, or at least a
substantial reduction, is generally preferred.
4.4 Void detection
X-ray is required for the detection of voids in BGA and LGA solder joints. Higher cost
equipment is based on X-ray tomography or laminography. Both types of these systems
provide valuable techniques for void detection and location.
X-ray systems tend to distort the size of voids depending on measuring conditions and the
capability of the X-ray system used. It is possible to accurately measure the true volume of a
void but the procedure can be involved and requires a known reference for radiometric
calibration of the X-ray film or detector. In most cases the effort is better spent on identifying
and eliminating the cause of the voids.
4.5 Void classification
In order to assess different conditions, voids have been given a specific identifier, based on
location, to establish a method of void identification and the possibility of corrective action for
process improvement. The details are provided in Table 1 which shows the classification
criteria for the location of voids in the BGA solder ball structure.
The following descriptions identify the three different void types.
Type C: Void(s) within the ball after the board level assembly process.
Type D: Void(s) at the ball/package substrate interface after the board level assembly process.
Type E: Void(s) at the ball/board substrate interface after the board level assembly process.
This standard specifies evaluation criteria for voids in soldered joints and the reliability of the
joints of devices assembled on a board. This standard is not applicable to the voids in the
BGA package as received (refer to type A and type B in Table C.1), because any correlation
between voids as received and voids after assembling has not been confirmed yet.
Table 1 – Void classification
Type C Type D Type E
Void within the joint Void at the package Void at the board
interface interface
Package side Package side Package side
Void in BGA
soldered joint
Board side Board side Board side
Package side
Package side Package side
Void in LGA
soldered joint
Board side
Board side
Board side
– 10 – 61191-6 © IEC:2010
5 Measurement
5.1 X-ray transmission equipment
Micro-focus X-ray transmission equipment is such that it can observe a BGA or LGA mounted
on a board from above or below the board. X-ray computer tomography (CT) equipment may
also be used, if necessary.
The test equipment should have the following specification and performance. An example of
the specification of available equipment is described in Annex B.
a) Maximum voltage: not less than 120 kV
b) Feature recognition size of X-ray: typically 2 µm
c) Maximum geometric magnification: more than 100×
Commonly available transmission X-ray systems can vary in the grayscale sensitivity that they
provide in the image which, in turn, can have an effect on the precision of the area calculation.
It should be noted that systems with lower grayscale sensitivity may cause the void(s) to
appear at a reduced size (and hence at a lower value) within the solder joint, as there is
insufficient sensitivity to observe the true edges of the spherical void, and the smallest voids
may not be visible at all. It is suggested that an X-ray system used for this standard has
sufficient capability to be able to see a 20 µm diameter void (for a 6 layer double sided board).
5.2 Measuring environment
Unless otherwise specified, measurements should be made in the standard atmospheric
condition, as specified in IEC 60068-1, after keeping the specimen in the condition for an
appropriate period.
NOTE The standard condition is the following.
Temperature: 15 °C to 35 °C
Relative humidity 25 % to 75 %
Atmospheric pressure 86 kPa to 106 kPa.
5.3 Measurement procedure
The following procedure is recommended for reference measurement of joint size and void
size, using X-ray transmission equipment with area calculation function. Different procedures
may be applied for higher throughput with minimum accuracy required.
a) Detect an image of solder joints and identify the solder joints with voids to be measured.
Multiple joints may be detected in a screen for higher throughput.
b) Determine geometric magnification for measurement. It is recommended that only one
solder joint is detected in a screen for precise measurement. For example, approximately
80x is recommended for the measurement of a joint with diameter of 500 µm. When a
higher resolution of an image digitizing system is available, multiple solder balls may be
detected in a screen. Each ball in the screen is recommended to have more than
400 pixels in diameter.
c) Detect an image of void, with enough X-ray intensity to pass through the joint (for
example, tube voltage is 100 kV), and adjust X-ray intensity and imaging condition.
d) Capture the void image and calculate the cross-section area.
e) Repeat procedure c) and d), when there are multiple voids. Measurement for smaller voids
may be skipped, according to 6.2.
f) Detect an image of joint, with enough X-ray intensity to be identified (for example, tube
voltage is 40 kV), and adjust X-ray intensity and imaging conditions.
g) Capture the solder joint image and calculate the cross-section area.

61191-6 © IEC:2010 – 11 –
h) Calculate the void occupancy for the solder joint.
i) Repeat procedures c), d), e), f), g) and h) when there are multiple solder joints to be
measured.
In procedure f), the same condition as in procedure c) may be applied, if there is no
significant difference between calculated results under those conditions.
Predetermined conditions may be applied repeatedly in the procedures c) and f), if similar
measurements are repeated as the measurement of the different points of the same LSI
package.
5.4 Record of the measured value
Unless otherwise specified, the following measurement results should be recorded for each
solder joints.
a) Void occupancy (O )
v
b) X-ray image
The following supplemental data may be recorded, if necessary.
c) Cross-section area of voids (A , A , A ….A )
v1 v2 v3 vn
d) Maximum cross-section area of soldered joint (A )
smax
5.5 Considerations on measurement
5.5.1 X-ray intensity for void detection
Sufficient intensity of X-ray (for example, tube voltage is 100 kV) to pass through the joint, is
required for detection and measurement of voids in a soldered joint. When the X-ray intensity
is insufficient (for example, tube voltage is 40 kV), X-rays are attenuated almost completely,
whether there is a void or not in the path, and they can’t make any image of the void, but only
the shadow of the joint.
5.5.2 Detection of real edge
The thickness of solder in the path of X-rays changes gradually in the periphery of a void and
joint. An X-ray transmission image of a void and joint is detected with the gradation of black
and white in its periphery. It is very important to detect the outer edge of the gradation and to
measure the maximum size of the outline image to obtain a precise measurement.
5.5.3 Verification of measurement results
The user should have some procedure that provides a reasonable correlation between the
measurement and the actual void size. The verification with a specimen of a known dimension,
or an observation of the cross-section is recommended.
6 Void occupancy
6.1 Calculation of void occupancy
The void occupancy, O , defined in 3.3 is calculated from the maximum cross-section area of
v
the soldered joint, A , and the cross-section area of a void, A . The maximum cross-
smax v
section area of the joint, A , is measured from the projected image of a joint. The cross-
smax
, is also measured from the projected image of a void, regardless
section area of the void, A
v
of its location in the joint.
– 12 – 61191-6 © IEC:2010
A
v
O = (1)
v
A
smax
where
O is the void occupancy,
v
A is the maximum cross-section area of the soldered joint,
smax
A is the cross-section area of the void.
v
For example, if the solder ball size = 300 µm and void size = 50 µm in diameter and the cross-
section of void and joint is approximated by a circle, the void occupancy is calculated as
follows:
π
(50)
A
v 4
void occupancy O = = = 0,028 ≅ 3 % (2)
v
π
A
smax
(300)
The relationship between cross-section image detected by X-ray and void occupancy is shown
in Table 2.
61191-6 © IEC:2010 – 13 –
Package side
A
v
Void
Cross-section
area of the void
A´
A
Soldered joint
A
smax
Maximum cross-section
area of the soldered joint
Board side
Planar void
(not considered here)
Side view Top View on cross-section A-A´

IEC  011/10
Figure 1a – BGA soldered joint

Package side
pack age side
A : Cross- section
v
Void
A
v
A A´ area of the void
Cross-section
area of the void
Soldered joint
soldered
A
Board side
A Maximum csmax ross-
：
smax
Maximum cross-section
area of the soldered joint
Top View on cross-section A-A´
Side view
IEC  012/10
Figure 1b – LGA soldered joint
Figure 1 – Void occupancy
– 14 – 61191-6 © IEC:2010
Table 2 – Examples of Cross-section of joint and void occupancy

Cross-
section of
joint and void
A
Void v
17 % 6 % 3 %
occupancy
A
smax
Ratio of void
D
v
to joint in
41 % 25 % 17 %
maximum
D
s
a
diameter
D is the diameter of void.
v
D is the diameter of solder joint.
s
a
When cross-section of void and joint is approximated by circle.

6.2 Void occupancy for multiple voids
When there are multiple voids, the sum of the cross-section area of all voids is taken as the
cross-section area of the void in the joint.
A + A + A +L+ A
A
v v v v
v 1 2 3 n
O = = (3)
v
A A
smax smax
The void occupancy may be calculated taking only the voids with the cross-section area larger
than 0,25 % of the maximum cross-section area of the solder joint into account, and the
smaller may be omitted from the calculation. When multiple voids overlap, the area of
projected image of the multiple voids may be used to calculate void occupancy, instead of the
sum of the cross–section areas of each void.
7 Evaluation
7.1 Soldered joints to be evaluated
Unless otherwise specified, all soldered joints should be evaluated. However, a void might
only reduce the life time of an assembled BGA in thermal cycling if it is located in one of the
joints with the highest thermo/mechanical stress. Where it is known that specific joints affect
reliability in thermal cycle stress in a package, only these joints may be evaluated and the
other joints may be omitted from evaluation.
7.2 Evaluation of thermal life cycle decreased due to voids
The evaluation criterion, void occupancy, is specified corresponding to the allowable thermal
life cycle. The thermal life cycle is reduced due to voids and is described in the ratio to the life
cycle without a void. The criterion can be applied to any solder ball joint, regardless of life

61191-6 © IEC:2010 – 15 –
length, stress applied, solder material and joint structure, as long as the occurrence of
breaking is not affected.
For comparatively small voids, their effect on the joint reliability depends on the interaction
relation between the positions of the voids and the failure mode (fatigue crack route) in the
solder joints. Only the voids which locate at around the fatigue route in the solder joints,
decrease the joint reliability. Generally, there is only one failure mode in the solder joints, and
it rarely changes, but the positions of the small or middle size voids are uncertain factors. As
a result, it becomes rare that the small voids happen to locate at the fatigue crack route.
However, there exist few possibilities for that case, and it is the worst case for the reliability
issues because the cracks routes are not known in advance, and the location of the voids can
not be detected in vertical direction by the 2-dimensional evaluation, this worst case should
be considered.
Figure 2a shows how a void in Sn-Ag-Cu solder joint affects the joint reliability. Since the void
locates near to the fatigue crack route in the solder joint, it reduces the cross section at the
crack route and decreases the fatigue life of the solder joints. In the Sn-Ag-Cu solder joints,
the fatigue cracks usually propagate through the solder volume, so the voids which locate
near to the crack route have high possibility to interact with the crack and affect the joint
reliability. However, if comparative small voids locate away from the crack route, the joint
reliability will not be affected by them.
On the other hand, in the Sn-Zn alloy solder joints, the fatigue cracks propagate with a route
very close to the interface between the solder area and the Cu electrode, as shown in
Figure 2b, and the macrovoids rarely overlap with this kind of the interface crack route. As a
result, the interaction between the voids and fatigue crack route doesn’t happen even for the
case of considerably big voids. Therefore a different criterion is specified for BGA with Sn-Zn
alloy solder joints.
NOTE Material composition of a lead-free solder alloy is given in IEC 61190-1-3.

IEC  013/10 IEC  014/10
Figure 2a – Void in joint of Sn-Ag-Cu alloy Figure 2b – Void in joint of Sn-Zn alloy
Figure 2 – Voids in a soldered joint
7.3 Evaluation criteria for voids
Typical evaluation criteria of voids in soldered joints of BGA and LGA are shown in Annex A.
The criteria are based on the experimental result and analysis of data described in Annex A.
The evaluation criteria are not specified for those assemblies with different structures and
materials from the ones described in this standard, or for those assemblies having a sufficient
design margin of reliability.
– 16 – 61191-6 © IEC:2010
Annex A
(informative)
Experimental results and simulation of voids
and decrease of life due to thermal stress

There are several scientific articles which conclude that big voids in BGA solder joints
decrease the joint reliability, and very small voids don’t affect the reliability. For the middle
size voids, their effect on the reliability depends on the interaction relation between their
positions in the solder joints and the failure modes of the solder joints. Generally, there is only
one failure mode in the solder joints, and it rarely changes, but the positions of the small or
middle size voids are uncertain factors. As a result, small and middle size voids rarely happen
to locate at the fatigue crack route, and this kind of void doesn’t have a bad influence on the
reliability behaviour. However, there exist few possibilities that the small and middle voids
happen to locate near to the fatigue crack paths in the solder joints, and that they decrease
the joint reliability. It is very difficult to get this kind of result by a few number of test vehicles.
If the reliability issue for a big number of commercial products has to be dealt with, the worst
case should be focused on. Therefore, it is necessary to research the mechanism of the effect
of the voids on the reliability.
An isothermal mechanical fatigue test was used to investigate the effect of the macrovoids on
the thermal fatigue reliability of BGA solder joints. Instead of the thermal mismatch between
both ends (chip side and PCB side) of the joints, a suitable shear deformation was repetitively
applied to BGA solder joints by using a special fatigue testing equipment driving by Piezo-
device actuator, where the deformation can be controlled with very fine resolution. The
position and size of the voids in the solder joints were measured before the tests. During the
testing process, the fatigue cracks in BGA solder joints were checked directly by an optical
microscope. The number of cycles was defined as the fatigue life of the joint, when the fatigue
cracks have expanded to the whole of the projected area in the joint. Therefore, by comparing
the fatigue lives in the solder joint without remarkable voids in relation to that in the joint with
some voids, the effect of the voids on the reliability of BGA joints can be made clear.
Figure A.1 and Figure A.2 show the relationship between relative fatigue lives of solder joints,
which were normalized by the fatigue life of BGA solder joints without any remarkable voids,
and the position and size of the voids. In the Sn-Ag-Cu specimens, the fatigue cracks appear
frequently around the solder area closing to the end of the chip side, so the fatigue lives were
greatly affected by the big voids locating at the same side. Since it is very difficult to control
the location of these kinds of voids in the solder joints, the effect of the voids located in the
same area as the fatigue crack route should be considered as the worst case for the Sn-Ag-
Cu solder joints. In the Sn-Zn alloy solder joints, because the hardness of Sn-Zn is much
higher than that of Sn-Ag-Cu solder, and the micro-structure around the interface between the
solder and the Cu electrode is different from that in the Sn-Ag-Cu solder joints, the fatigue
cracks propagate with a route very close to the interface between the solder area and Cu
electrode. As a result, the macrovoids rarely overlap with this kind of the interface crack route,
and the interaction between the voids and fatigue crack route doesn’t happen even for the
case of the considerable big voids. This is the reason why the effects of voids in Sn-Zn solder
joints isn’t as remarkable as the voids in Sn-Ag-Cu solder joints.
The effect of the macrovoids on the thermal fatigue life of LGA soldered joints was
investigated using a finite element analytical approach, where the fatigue processes from the
initial fatigue crack to the crack growth and complete failure of the joints have been carried
out, and the analytical quality has been confirmed by comparing the agreement of the
experimental results and analytical results of BGA cases. Three different LGA soldered joints
have been studied, and it was shown that the impact of the macrovoids on the reliability of
LGA soldered joints is scarcely affected by the shapes of the soldered joints, and the fatigue
life decreases with almost the same ratio of void area to soldered area. Furthermore, the
basic trend of the relation shown in Figure A.3 does not depend on the solder material.

61191-6 © IEC:2010 – 17 –
1,2
1,0
0,8
No void
no vno voidoid
0,6 Chip side
chip sichip siddee
Substrate side
substrsubstraattee side side
0,4
0,2
0,0
0 5 10 15 20 25
Void size ratio  (%)
IEC  015/10
Figure A.1 – BGA soldered joint, Sn-Ag-Cu

1,2
1,0
0,8
No void
0,6
Chip side
Substrate side
0,4
0,2
0,0
0 5 10 15 20 25 30
Void size ratio  (%)
IEC  016/10
Figure A.2 – BGA soldered joint, Sn-Zn
Table A.1 – Fatigue life reduced by voids in soldered joint of BGA
Equivalent to
Reduced fatigue life to the designed
60 % 80 %
life (no void)
the designed life
Void evaluation Sn-Ag-Cu alloy <20 % <10 % <5 %
criteria
Sn-Zn-(Bi) alloy <30 % <25 % <20 %
(void occupancy)
Normalized fatigue life
Normalized fatigue life
– 18 – 61191-6 © IEC:2010
1,2
SnAgCu
1,0
SnZnBi
Analysis(SnAgCu)
0,8
0,6
0,4
0,2
0,0
0 5 10 15 20 25 30 35
Void size ratio  (%)
IEC  017/10
Figure A.3 – LGA soldered joint
Table A.2 – Fatigue life reduced by voids in soldered joint of LGA
Equivalent to
Reduced fatigue life to the
60 % 80 %
designed life (no void)
the designed life
Void evaluation criteria (for all
lead-free solder)
<35 % <20 % <5 %
(void occupancy)
Table A.1 and Table A.2 show the worst cases of the impact of voids on the reliability. The
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