IEC 61190-1-3:2017

IEC 61190-1-3 ®
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solder for electronic soldering applications

Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasure solide fluxée et non-fluxée pour les applications de brasage
électronique
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IEC 61190-1-3 ®
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –

Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-

fluxed solid solder for electronic soldering applications

Matériaux de fixation pour les assemblages électroniques –

Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et

brasure solide fluxée et non-fluxée pour les applications de brasage

électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-5127-0

– 2 – IEC 61190-1-3:2017 © IEC 2017
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Classification . 11
4.1 General . 11
4.2 Alloy composition . 11
4.3 Solder form . 12
4.4 Flux type . 12
4.5 Flux percentage and metal content . 13
4.6 Other characteristics . 14
5 Requirements . 14
5.1 Materials . 14
5.2 Alloys . 14
5.2.1 General . 14
5.2.2 Variation D alloys . 14
5.3 Solder forms . 15
5.3.1 General . 15
5.3.2 Bar solder . 15
5.3.3 Wire solder . 15
5.3.4 Ribbon solder . 15
5.3.5 Solder powder . 15
5.3.6 Special solder . 16
5.4 Flux type and form . 16
5.4.1 General . 16
5.4.2 Flux percentage . 16
5.4.3 Solder cores . 17
5.4.4 Solder coatings . 17
5.5 Flux residue dryness . 17
5.6 Spitting . 17
5.7 Solder pool . 17
5.8 Labelling for product identification. 17
5.9 Workmanship . 18
6 Quality assurance provisions . 18
6.1 Responsibility for inspection and compliance . 18
6.1.1 General . 18
6.1.2 Quality assurance programme . 18
6.1.3 Test equipment and inspection facilities . 18
6.1.4 Inspection conditions . 18
6.2 Classification of inspections . 18
6.3 Inspection of materials . 23
6.4 Qualification inspections . 23
6.4.1 General . 23
6.4.2 Sample size . 23
6.4.3 Inspection routine . 23

6.5 Quality conformance . 24
6.5.1 General . 24
6.5.2 Inspection routine . 24
6.5.3 Sampling plan . 24
6.5.4 Rejected lots . 24
6.6 Preparation of solder alloy for test . 24
6.6.1 General . 24
6.6.2 Wire solder up to approximately 6 mm diameter. 24
6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter . 24
7 Preparation for delivery – Preservation, packing and packaging . 24
Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3 . 25
A.1 Overview. 25
A.2 Intended use . 25
A.2.1 General . 25
A.2.2 Alloys . 25
A.3 Acquisition requirements . 26
A.4 Standard solder product packages . 27
A.4.1 General . 27
A.4.2 Wire and ribbon solders . 27
A.4.3 Bar solders . 27
A.4.4 Solder powder . 27
A.5 Protocol for establishing short names for IEC 61190-1-3 alloys . 28
A.5.1 Lead containing solder alloys and specialty alloy . 28
A.5.2 Lead-free solder alloys . 28
A.6 Standard description of solid solder products . 29
Annex B (normative) Lead-free solder alloys . 30
Annex C (informative) Marking method of solder designation for mounted board, used
in electronic equipment . 41
C.1 General . 41
C.2 Marking . 41
C.2.1 Recommendation for marking . 41
C.2.2 Marking for solder designation . 41
C.2.3 Marking unit and location . 42
Bibliography . 43

Figure 1 – Report form for solder alloy tests . 19
Figure 2 – Report form for solder powder tests . 20
Figure 3 – Report form for non-fluxed solder tests . 21
Figure 4 – Report form for fluxed wire/ribbon solder tests . 22
Figure C.1 – Example of the marking for assembled board . 42

Table 1 – Solder materials . 12
Table 2 – Flux types and designating symbols . 13
Table 3 – Flux percentage . 14
Table 4 – Standard solder powders . 16
Table 5 – Solder inspections . 23

– 4 – IEC 61190-1-3:2017 © IEC 2017
Table B.1 – The composition and temperature characteristics of lead-free solder alloys . 30
Table B.2 – The composition and temperature characteristics of common tin-lead
alloys . 33
Table B.3 – The composition and temperature characteristics for specialty (non-tin/lead)
alloys . 36
Table B.4 – the cross-reference from solidus and liquidus temperatures to alloy names
by temperature . 37
Table B.5 – The cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names . 39

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1–3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic soldering applications

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This third edition cancels and replaces the second edition, published in 2007 and
Amendment 1:2010. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) The maximum impurity level of Pb has been revised and the table of lead free solder
alloys includes some additional lead free solder alloys.

– 6 – IEC 61190-1-3:2017 © IEC 2017
The text of this standard is based on the following documents:
FDIS Report on voting
91/1468/FDIS 91/1488/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
A list of all parts in the IEC 61190 series, under the general title Attachment materials for
electronic assembly, can be found on the IEC website.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights. IEC shall not be held responsible for identifying any or all such patent
rights.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents concerning
particular alloy compositions.
IEC takes no position concerning the evidence, validity and scope of these patent rights.
The holders of these patent rights have assured the IEC that they are willing to negotiate
licences under reasonable and non-discriminatory terms and conditions with applicants
throughout the world. In this respect, the statements of the holders of these patent rights are
registered with IEC. Information may be obtained from:
KR PAT No. 10-0797161
(KR patent application number: KR10-2007-0050905)
KOREA Institute of Industrial technology
89, Yangdaegiro-gil, Ipjang-myeon, Seobuk-gu, Cheonan-si Chungcheongnam-do 331-822 Korea
KR PAT No.10-0445350
Heesung Material LTD.
820-7, Donghang-ri, Yangseong-Myeon,Anseong-Si,Gyeonggi-Do, 456-931, KOREA
JP PAT No.3152945 , and the foreign patents
Nihon Superior
NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063, Japan
JP PAT No.3296289, and the foreign patents
Fuji Electronics
Gate City Ohsaki, East tower 11-2, Osaki 1-Chome, Shinagawa-ku, Tokyo, 141-0032, Japan
JP PAT No. 3736819
Toyota Central R&D Labs., Inc.
41-1, Yokomichi, Nagakute, Aichi 480-1192, Japan
Taiho Kogyo Co., Ltd.
3-65 Midorigaoka Toyota-city, Aichi 471-8502, Japan
JP PAT No. 3622788, and the foreign patents
JP PAT No.3753168, and the foreign patents
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan
NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users
remain responsible for establishing the exact legal position relevant to their own situation.
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

– 8 – IEC 61190-1-3:2017 © IEC 2017
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1–3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic soldering applications

1 Scope
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60194:2015, Printed board design, manufacture and assembly – Terms and definitions
IEC 61189-5-2:2015, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 5-2: General test methods for materials and
assemblies – Soldering flux for printed board assemblies
IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 5-3: General test methods for materials and
assemblies – Soldering paste for printed board assemblies
IEC 61189-5-4:2015, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 5-4: General test methods for materials and
assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61190-1-1:2002, Attachment materials for electronic assembly – Part 1-1: Requirements
for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for
soldering pastes for high-quality interconnects in electronics assembly
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
acceptance tests
tests deemed necessary to determine the acceptability of a product and as agreed to by both
purchaser and vendor
[SOURCE: IEC 60194:2015, 92.0004]
3.2
alloy
substance having metallic properties and being composed of two or more chemical elements
of which at least one is an elemental metal
3.3
base metal
underlying metal surface to be wetted by solder
[SOURCE: IEC 60194:2015, 46.1491
3.4
corrosion
attack of chemicals, flux, and flux residues on base metals
[SOURCE: IEC 60194:2015, 76.0299]
3.5
density
mass of a substance per unit volume
Note 1 to entry: The density is usually expressed in grammes per cubic centimetre.
3.6
dewetting
condition that results when molten solder coats a surface and then recedes to leave
irregularly shaped mounds of solder that are separated by areas that are covered with a thin
film of solder and with the base metal not exposed
[SOURCE: IEC 60194:2015, 97.0370, modified – Reference to Figure 36 has been deleted.]
3.7
eutectic, noun
alloy having the composition indicated by the eutectic point on an equilibrium diagram or an
alloy structure of intermixed solid constituents formed by an eutectic reaction
3.8
eutectic, noun
alloy composition whereby a solder alloy melts/freezes completely without going
through a pasty (partially solid) phase
[SOURCE: IEC 60194:2015, 75.1391, modified – definition of eutectic by using the eutectic
point]
– 10 – IEC 61190-1-3:2017 © IEC 2017
3.9
eutectic, adjective
isothermal reversible reaction in which, on cooling, a liquid solution is converted into two or
more intimately mixed solids, with the number of solids formed being the same as the number
of components in the system
[SOURCE: IEC 60194:2015, 75.1392]
3.10
flux
chemically and physically active compound that, when heated, promotes the wetting of a base
metal surface by molten solder by removing minor surface oxidation and other surface films
and and that protects protecting the surfaces from re-oxidation during a soldering operation
[SOURCE: IEC 60194:2015, 75.0538, modified – The admitted term "soldering flux" has
been deleted.]
3.11
flux characterization
series of tests that determines the basic corrosive and conductive properties of fluxes and flux
residues
[SOURCE: IEC 60194:2015, 76.0542]
3.12
flux residue
flux related contaminant that is present on or near the surface of a solder connection
[SOURCE: IEC 60194:2015, 76.0543]
3.13
liquidus
temperature at which a solder alloy is completely melted
[SOURCE: IEC 01964:2015, 75.1906]
3.14
nonwetting
partial adherence of molten solder to a surface that it has contacted and where basis
metal remains exposed
[SOURCE: IEC 60194:2015, 75.1189, modified – The definition has been changed and the
reference to Figure 63 has been deleted.]
3.15
lead-free solder
solder alloy whose lead content is equal to, or less than 0,10 % by mass
[SOURCE: IEC 60194:2015, 75.1904, modified – The definition has been changed.]
3.16
solder
metal alloy with a melting temperature below 427 °C
[SOURCE: IEC 60194:2015, 46.0956]

3.17
solderability
ability of a metal to be wetted by molten solder
[SOURCE: IEC 60194:2015, 75.0958]
3.18
solidus
temperature at which a solder alloy changes from a solid to a paste form
3.19
wetting
formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a
base metal
[SOURCE: IEC 60194:2015, 75.1161]
4 Classification
4.1 General
Soldering materials covered by this document shall be classified by alloy composition, solder
form, flux type, flux percentage and by other characteristics peculiar to the solder material
form (see Annex A).
4.2 Alloy composition
The solder alloys covered by this document are the alloys listed in Table B.1, Table B.2 and
Table B.3 and include pure tin and pure indium. Each alloy is identified by an alloy name
composed of a series of alphanumeric characters. These characters identify the component
elements in the alloy by a chemical symbol and nominal percentage by mass. They terminate
with an arbitrarily assigned alloy variation letter (D). Alloys are also identified by an alloy short
name. This is an alphanumeric designation composed of the chemical symbol for the key
element in the alloy (see Clause A.5), the nominal percentage of that element in the alloy and
the arbitrarily assigned alloy variation letter.
Table B.1, Table B.2 and Table B.3 identify the alloy composition, short name and
temperature characteristics; Table B.4 cross-references solidus and liquidus temperatures to
alloy names and Table B.5 cross references ISO alloy numbers and designations from
ISO 9435 to allow names.
– 12 – IEC 61190-1-3:2017 © IEC 2017
4.3 Solder form
Table 1 shows the forms of solder materials covered by this document listed with their
single-letter designating symbols.
Table 1 – Solder materials
Identifying symbol Solder form
F Flux (only)
P Paste (cream)
B Bar
D Powder
R Ribbon
W Wire
S Special
4.4 Flux type
The flux types used in/on solders covered by this document are listed in Table 2. The
requirements for fluxes are covered by IEC 61190-1-1.

Table 2 – Flux types and designating symbols
Flux materials Flux activity levels IEC flux ISO flux
a b c d
of composition weight % halide designator designator
Rosin ROL0 1.1.1
Low (<0,01) L0
(RO)
Low (<0,15) L1 ROL1 1.1.2.W, 1.1.2.X

Moderate (<0,01) M0 ROM0 1.1.3.W
Moderate (0,15 to 2,0) M1 ROM1 1.1.2.Y, 1.1.2.Z
High (<0,01) H0 ROH0 1.1.3.X
ROH1 1.1.2.Z
High (>2,0) H1
Resin REL0 1.2.1
Low (<0,01) L0
(RE)
Low (<0,15) L1 REL1 1.2.2.W, 1.2.2.X
REM0 1.2.3.W
Moderate (<0,01) M0
Moderate (0, 15 to 2,0) M1 REM1 1.2.2.Y, 1.2.2.Z
High (<0,01) H0 REH0 1.2.3.X
REH1 1.2.2.Z
High (>2,0) H1
Organic Low (<0,01) L0 ORL0 2.1., 2.2.3.E
(OR)
Low (<0, 15) L1 ORL1 –
Moderate (<0,01) M0 ORM0 –
Moderate (0, 15 – 2,0) M1 ORM1 2.1.2, 2.2.2
ORH0 2.2.3.0
High (<0,01) H0
ORH1 2.2.2
High (>2,0) H1
Inorganic Low (<0,01) L0 INL0 Not applicable
(IN) (Inorganic ISO flux is
Low (<0, 15) L1 INL1
different)
INM0
Moderate (<0,01) M0
Moderate (0, 15 – 2,0) M1 INM1
INH0
High (<0,01) H0
INH1
High (>2,0) H1
a
Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms.
b
See 7.1 and 7.2 of IEC 61190-1-1:2002 for comparisons of RO, RE, OR and IN composition classes and L, M
and H activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids "no-
clean.''
c
The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 of IEC 61190-1-1:2002 for an
explanation of L, M and H nomenclature.
d
ISO designations are similar to IEC designators with minor differences in characteristics.

4.5 Flux percentage and metal content
The nominal percentage of flux, by mass, in solid-form solder products is identified as the flux
percentage. The flux percentage in/on solid solders is identified by a single alphanumeric
character in accordance with Table 3. "Metal content" refers to the percentage of metal in
solder paste (see IEC 61190-1-2).

– 14 – IEC 61190-1-3:2017 © IEC 2017
Table 3 – Flux percentage
Design Nominal Allowable Design Nominal Allowable Design Nominal Allowable
symbol  range symbol  range symbol range
% % % % % %
0 None 5 2,5 2,2 to 2,8 A 5,0 4,7 to 5,3
1 0,5 0,2 to 0,8 6 3,0 2,7 to 3,3 B 5,5 5,2 to 5,8
2 1,0 0,7 to 1,3 7 3,5 3,2 to 3,8 C 6,0 5,7 to 6,3
3 1,5 1,2 to 1,8 8 4,0 3,7 to 4,3 D 6,5 6,2 to 6,8
4 2,0 1,7 to 2,3 9 4,5 4,2 to 4,8

4.6 Other characteristics
Standard bar solders are further classified by unit mass. Wire solders are further classified by
wire size (outside diameter) and unit mass. Ribbon solders are further classified by thickness,
width and unit mass. Powder solders are further classified by powder particle size distribution
and unit mass.
5 Requirements
5.1 Materials
Materials shall be used which permit the solder product to conform to the specified
requirements. The use of recovered or recycled materials is encouraged. Recovered or
recycled materials shall conform to or exceed comparable standards for virgin raw materials.
5.2 Alloys
5.2.1 General
The solder alloy shall be as specified (see Annex B). For the purposes of this document,
electronic grade solder alloys are all those listed in Table B.1 and Table B.2, including pure
tin (Sn99) and pure indium (In99). The elements listed in Table B.1, Table B.2 and Table B.3
for an alloy are considered to be the component elements of that alloy. Only the component
elements of an alloy are desirable and all other elements are impurities for that alloy. To the
maximum extent feasible and, unless otherwise specified, solder alloy metal, including solder
powder, shall be a homogenous mixture of the component elements of the alloy, such that
each particle of the metal is the same alloy. The percentage by mass of impurity elements in
variation D alloys shall conform to the requirements in 5.2.2.
Ag: 0,10 Au: 0,05 Cu: 0,05 Ni: 0,01 Sn: 0,25
Al: 0,001 Bi: 0,10 Fe: 0,02 Pb: 0,07 Zn: 0,001
As: 0,03 Cd: 0,002 In: 0,10 Sb: 0,20
The percentage of each element in an alloy shall be determined by any standard analytical
procedure. Wet chemistry shall be used as the referee procedure.
5.2.2 Variation D alloys
Alloys identified with a "D" suffix are ultra-pure alloys that are intended for use in barrier-free
die attachment applications. In alloys identified with a "D" suffix, the combined total
percentage by mass of all impurity elements shall not exceed 0,05 and the combined total
percentage by mass of each of the following sets of impurity elements shall not exceed
0,000 5:
Set 1: Be, Hg, Mg, and Zn.    Set 2: As, Bi, P, and Sb.

5.3 Solder forms
5.3.1 General
This document covers solders in the form of bars, wires, ribbons, and powders, and special
solders. Normally, bar solders and solder powder are not fluxed, and wire, ribbon, and special
solders may be non-fluxed, flux-cored, flux-coated, or both flux-cored and flux-coated. Users
should determine from prospective sources the standard solder form characteristics that are
available and should specify standard characteristics to the maximum extent feasible.
5.3.2 Bar solder
The nominal cross-sectional area, the nominal length, and the nominal mass shall be as
specified (see Clause A.3 c)). Unless otherwise specified (see Clause A.3 d)), the actual
cross-sectional area shall not vary from the nominal value by more than 50 %, the actual
length shall not vary from the nominal value by more than 20 %, and the actual mass shall not
vary from the nominal value by more than 10 %. Bars with special end configurations, such as
hooks or eyes, are classified as special solders.
5.3.3 Wire solder
The wire size, flux type, and flux percentage shall be as specified (see Clause A.3 e)). Unless
otherwise specified (see Clause A.3 f)), wire solders shall have a circular cross-section, the
wire size shall indicate the nominal outside diameter of the wire and the actual outside
diameter shall not vary from the nominal diameter by more than ± 5 % or ± 0,05 mm,
whichever is greater.
5.3.4 Ribbon solder
The ribbon thickness and width, flux type, and flux percentage shall be as specified (see
Clause A.3 g)). Unless otherwise specified (see Clause A.3 h)), ribbon solders shall have a
rectangular cross-section, and the actual thickness and width shall not vary from their nominal
values by more than ± 5 % or ± 0,05 mm, whichever is greater.
5.3.5 Solder powder
5.3.5.1 General
The powder size and shape shall be as specified (see Clauses A.3 i)) and A.3 j)). The
characteristics of seven standard solder powders, sizes 1 through 7, are listed in Table 4.
When shape is not specified, solder powder shall be spherical. Solder powder shall be smooth
and bright and free of adhering small particles and oxides to the maximum extent possible.
Solder powders made with high-lead alloys are not "bright" by nature, but they should not
appear unusually dark. Solder powders which contain more than one solder alloy
(multiple-alloy powders) are classified as special solders.

– 16 – IEC 61190-1-3:2017 © IEC 2017
Table 4 – Standard solder powders
a
Less than 0,5 % 10 % maximum 80 % minimum 10 % maximum
Type
larger than between between less than
µm µm µm µm
1 160 150 to 160 75 to 150 75
2 80 75 to 80 45 to 75 45
3 60 45 to 60 25 to 45 25
4 50 38 to 50 20 to 38 20
5 40 25 to 40 15 to 25 15
6 25 15 to 25 5 to 15 5
7 15 11 to 15 2 to 11 2
a
Basic powder size symbol for each powder size type.

5.3.5.2 Powder size
Maximum particle size shall be determined in accordance with IEC 61189-5-3:2015, test
method 5-3X15. Powder particle size distribution shall be determined in accordance with
IEC 61189-5-3:2015, test methods 5-3X11, 5-3X12, 5-3X13, 5-3X14 or 5-3X15.
5.3.5.3 Powder shape
Solder powder shape shall be determined by visual observation using a binocular microscope
with sufficient magnification, by the light beam scatter method, or by a suitable microscopic
imaging analysis method. Solder powders visually determined to have at least 90 % of the
particles with a length to width ratio of 1,2 or less shall be classified as spherical powders.
Solder powders having a light beam scatter deviation result or an image analysis result that is
equivalent to the above visual results shall be classified as spherical powders. All other
powders shall be classified as non-spherical.
5.3.6 Special solder
All pertinent characteristics and tolerances for special form solders shall be specified (see
Clause A.3 k)). Special solders include all solders which do not fully conform to another solder
classification identified herein or in IEC 61190-1-2. Special solders include, but are not
necessarily limited to, anodes, bars with hook or eye ends, chips, ingots, multiple-alloy
powders, pellets, preforms, rings, sleeves.
5.4 Flux type and form
5.4.1 General
The flux type and form shall be as specified (see Clause A.3 l)). Fluxes used in the
manufacture of solder products shall conform to the requirements of IEC 61190-1-1. Fluxes
shall have been fully tested and characterized in accordance with IEC 61190-1-1, and shall
have not b
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