IEC 62047-13:2012

IEC 62047-13 ®
Edition 1.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 13: Bend - and shear - type test methods of measuring adhesive strength
for MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la
résistance d'adhérence pour les structures MEMS

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IEC 62047-13 ®
Edition 1.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –

Part 13: Bend - and shear - type test methods of measuring adhesive strength

for MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la

résistance d'adhérence pour les structures MEMS

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.080.99 ISBN 978-2-88912-937-9

– 2 – 62047-13  IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Data analysis . 7
5 Test equipment . 8
5.1 General . 8
5.2 Actuator . 8
5.3 Force measurement sensor . 8
5.4 Alignment system . 8
5.5 Recorder . 8
6 Test pieces . 9
6.1 Design of test pieces . 9
6.2 Preparation of test pieces . 9
7 Test conditions . 9
7.1 Method for gripping . 9
7.2 Speed of testing . 9
7.3 Alignment of test piece . 9
7.4 Test environment. 10
8 Test report. 10
Annex A (informative) Technical background . 11
Bibliography . 14

Figure 1 – Columnar test pieces . 6
Figure 2 – Adhesive strength test method . 7
Figure 3 – Alignment between columnar test piece and loading tool . 10
Figure A.1 – Example of the RRT results (see [1]) . 11
Figure A.2 – Effects of aspect ratio of columnar test piece on the stress condition in
bend type test (see [2]) . 12
Figure A.3 – Effects of knife edge angle of loading tool and aspect ratio of columnar
test piece on the stress condition in bend test . 13

62047-13  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures

FOREWORD
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International Standard IEC 62047-13 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/109/FDIS 47F/119/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62047-13  IEC:2012
A list of all parts of IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62047-13  IEC:2012 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures

1 Scope
This part of IEC 62047 specifies the adhesive te
...