IEC 62047-13:2012

IEC 62047-13 ®
Edition 1.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 13: Bend - and shear - type test methods of measuring adhesive strength
for MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la
résistance d'adhérence pour les structures MEMS

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IEC 62047-13 ®
Edition 1.0 2012-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –

Part 13: Bend - and shear - type test methods of measuring adhesive strength

for MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 13: Méthodes d'essais de types courbure et cisaillement de mesure de la

résistance d'adhérence pour les structures MEMS

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.080.99 ISBN 978-2-88912-937-9

– 2 – 62047-13  IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Data analysis . 7
5 Test equipment . 8
5.1 General . 8
5.2 Actuator . 8
5.3 Force measurement sensor . 8
5.4 Alignment system . 8
5.5 Recorder . 8
6 Test pieces . 9
6.1 Design of test pieces . 9
6.2 Preparation of test pieces . 9
7 Test conditions . 9
7.1 Method for gripping . 9
7.2 Speed of testing . 9
7.3 Alignment of test piece . 9
7.4 Test environment. 10
8 Test report. 10
Annex A (informative) Technical background . 11
Bibliography . 14

Figure 1 – Columnar test pieces . 6
Figure 2 – Adhesive strength test method . 7
Figure 3 – Alignment between columnar test piece and loading tool . 10
Figure A.1 – Example of the RRT results (see [1]) . 11
Figure A.2 – Effects of aspect ratio of columnar test piece on the stress condition in
bend type test (see [2]) . 12
Figure A.3 – Effects of knife edge angle of loading tool and aspect ratio of columnar
test piece on the stress condition in bend test . 13

62047-13  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-13 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/109/FDIS 47F/119/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62047-13  IEC:2012
A list of all parts of IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62047-13  IEC:2012 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 13: Bend - and shear - type test methods
of measuring adhesive strength for MEMS structures

1 Scope
This part of IEC 62047 specifies the adhesive testing method between micro-sized elements
and a substrate using the columnar shape of the specimens. This international standard can
be applied to adhesive strength measurement of microstructures, prepared on a substrate,
with width and thickness of 1 µm to 1 mm, respectively.
Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a
substrate, which are fabricated by deposition, plating, and/or coating with photolithography.
MEMS devices include a large number of interfaces between dissimilar materials, at which
delamination occasionally occurs during fabrication or in operation. Combination of the
materials at the junction determines the adhesive strength; moreover, defects and residual
stress in the vicinity of the interface, which are changing by processing condition, strongly
affect the adhesive strength. This standard specifies the adhesive testing method for micro-
sized-elements in order to optimally select materials and processing conditions for MEMS
devices.
This standard does not particularly restrict test piece material, test piece size and
performance of the measuring device, since the materials and size of MEMS device
components range widely and testing machine for micro-sized materials has not been
generalized.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
adhesive bend strength
nominal strength at failure on adhesive joint area by bending mode
3.2
adhesive shear strength
nominal strength at failure on adhesive joint area by shear mode

– 6 – 62047-13  IEC:2012
1 1
SS
DD
ll
cc
TT
IEC  192/12
Key
Configurations or specimen Dimensions of specimen
1 Top view D diameter of columnar test piece
2 Side view l length of columnar test piece
c
3 Column type test piece l /D aspect ratio of columnar test piece
c
4 Substrate thickness of substrate
Τ
S spacing between columnar test pieces
Figure 1 – Columnar test pieces
4 Test method
4.1 General
This standard specifies the adhesive testing methods between a columnar test piece (see
Figure 1) and substrate. Displacement or force is applied to a columnar test piece at a
constant speed and the force at delamination is measured to analyze the adhesive strength
between the columnar test piece and substrate. A knife edge shape with tapered tip is utilized
as the loading tool to apply the force to a columnar test piece. The angle of the knife edge is
changed by loading types of measuring adhesive strength as follows.
In case of measuring adhesive bend strength by applying bending force at the end of a
columnar test piece (bend type test), the knife edge of loading tool is used by slanting its apex
in the upper direction against the test piece as shown in Figure 2 a). In such a case, it is
easier to align the loading tool and a test piece since point load is applied at the end of the
columnar test piece. Attention should be drawn to the fact that the bend type test is not pure
bending, which includes compression component to the columnar root. The compression
component increases by increasing the contact angle of the knife edge. In order to minimize
the effect of compression component, the contact angle of the knife edge (θ ) should be
b
within a range of from 10° to 20°.

62047-13  IEC:2012 – 7 –
In case of measuring adhesive shear strength by applying shear force on the lateral face of a
columnar test piece (shear type test), line load is applied to the test piece using a loading tool
which is parallel to the lateral face of the cylinder as shown in Figure 2 b). In such a case, the
test apparatus should have a precise alignment system, which can align the knife edge
parallel to the lateral face of the cylinder. Or alternatively, the knife edge of loading tool is
used by slanting its apex in lower direction against the test piece as shown in Figure 2 b) to
minimize the effects of bend stress (see Clause A.2).The angle error (θ ) should be within a
s
range of from 0° to 15°. It should be noted that the test results from the bend type test are
affected by the aspect ratio (l /D), when the aspect ratio is less than 1,2. See Clause A.2. In
c
addition, the columnar test piece with the aspect ratio of less than 0,5 should not be applied in
the bend type test; because the effects of the aspect ratio on the shear and the compression
stress on the adhesive joint area significantly increase when the aspect ratio decreases. See
Clause A.2 and Clause A.3.
F
F
F
F
l
l
tt
3 ll
3 33
tt
R
Rc
c
θ
θ
bb
θ R
θ Rc
s c
s
1 2
l
p
l
p
l
p
l
p
IEC  193/12 IEC  194/12
Figure 2a – Bend type test                             Figure 2b – Shear type test
NOTE This figure illustrates two types of the test method for measuring adhesive strength between a columnar
test piece and substrate.
Key
Configurations or specimen Supply and dimensions of specimen
1 Columnar test piece F loading force supplied by a kind of actuator
l
2 Substrate distance between the loading position and substrate
p
3 Knife edge of loading tool l distance between the tip of the loading tool and
t
substrate
angle between the lateral face of a columnar test piece
θ
b
and contact face of knife edge for bend type test
θ angle between the lateral face of a columnar test piece
s
and contact face of knife edge for shear type test
Figure 2 – Adhesive strength test method
4.2 Data analysis
In adhesive strength test by bend loading, adhesive bend strength is calculated by the
following Equation (1).
32F l
M 32F l
max p
a max c
σ = = = (1)
a
3 3
Z pD pD
where
– 8 – 62047-13  IEC:2012
σ is the adhesive bend strength;
a
Z is the section modulus of a columnar test piece;
M is the bend moment at delamination;
a
F is the maximum load at delamination;
max
is the loading point from the root of a columnar test piece.
l
p
In adhesive strength test by shear loading, adhesive shear strength is calculated by the
following Equation (2).
F 4F
max max
τ = = (2)
a
A pD
where
τ is the adhesive bend strength;
a
A is the adhesive joint area between a columnar test piece and substrate;
F is the maximum load at delamination.
max
In the bend type test, it is required to be attentive to the possibility of exfoliation due to shear
/D) of the columnar test piece is less than 1,2. See 4.1 and Clause
force if the aspect ratio (l
c
A.2.
5 Test equipment
5.1 General
The test equipment shall be capable of applying microscopic displacement or micro-level
force to the test piece. The test equipment consists of an actuator for applying displacement,
a sensor for force measurement, a controller applying displacement or force at a constant
speed, an alignment system between the test piece and the loading tool, and a recorder for
detecting the load at delamination.
5.2 Actuator
Displacement or force should be linearly applied along the loading axis of the test piece at a
constant speed. Thus, the actuator shall be capable of linearly applying displacement or force
at a constant speed.
5.3 Force measurement sensor
Load cell with enough resolution, which guarantees 5 % accuracy of the measured adhesive
strength shall be used for the force measurement. The force sensor shall be set to measure
the force to the loading direction. The knife edge of the loading tool shall be located within the
effective measuring area of the force sensor. See Figure 3.
5.4 Alignment system
The alignment system shall be capable of aligning the test piece and loading tool in the
proper position to apply displacement or force in the correct direction (see 7.3).
5.5 Recorder
The test equipment shall include a recorder for detecting the force at delamination.

62047-13  IEC:2012 – 9 –
6 Test pieces
6.1 Design of test pieces
The test piece should satisfy the following two items:
a) It is recommended that the dimensions of a test piece, such as the columnar diameter and
length,, are in the same order as the size of parts of a device to be evaluated;
b) Every gap between the test pieces (S) should provide more than twice compared with both
the diameter of columnar test piece (D) and the length of test piece (l ) to prevent each
c
piece from having an influence on the test of adjacent test piece (see Figure 1). In
addition, the gap (S) should be sufficiently larger than the width of the knife edge tip of the
) to avoid loading two columnar test pieces at the same time. See Figures 1
loading tool (l
k
and 3.
6.2 Preparation of test pieces
A number of columnar test pieces with the same manufacturing process and conditions are
obtained, since a plurality of columnar test pieces are prepared on the same substrate.
The test pieces should satisfy the following two items:
a) Test pieces should be prepared on a substrate through an almost identical manufacturing
process and under the same manufacturing conditions as those applied when fabricating
the thin film of the device to be evaluated;
b) More than ten columnar test pieces should be prepared on the same substrate at the
same time. Then, adhesive testing should be performed using more than ten columnar
test pieces under the same testing conditions (see Clause A.1).
7 Test conditions
7.1 Method for gripping
Substrate of test pieces shall be fixed according to the following two items:
a) Substrate of test pieces shall be fixed at test device ensuring not to move during adhesive
strength test. Clauses A.2 and A.3 of IEC 62047-2:2006 shall apply;
b) Substrate of test pieces shall be fixed such as the loading direction of the test device is
parallel with the substrate surface. See 7.3.
7.2 Speed of testing
Displacement speed or loading speed should be constant. As the speed of testing will depend
upon the testing environment, the type of testing machine employed and the stiffness of the
test piece, the speed shall be the one which is more suitable for the particular combination of
environment, material, test piece, and testing machine. Generally, the speed of testing should
be chosen properly depending on the application of the materials.
7.3 Alignment of test piece
The alignment of the test piece shall satisfy the following item:
a) The surface of the test piece substrate shall be parallel to the axis of loading direction
within 3° accuracy. See Figure 3 a) ;
In addition, the alignment of loading equipment and substrate should satisfy the following
three items:
b) Contact surface of the loading knife edge shall be normal to the plane including loading
axis and normal of a test piece substrate. See Figure 3 b);

– 10 – 62047-13  IEC:2012
c) In the case of the bend type test, the distance between the loading tool and the substrate,
l should be larger than 10 % of the columnar length (l ) to avoid contact between each
t c
other. See Figure 2 a);
d) In the case of the shear type test, the tip of loading tool should be kept at a distance (l )
t
from the substrate to avoid contact between each other. l should be within a range of
t
10 % of the columnar diameter (D), provided that D is 10 µm and larger. l should be
t
within 1 µm, provided that D is less than10 µm. See Figure 2 b).
l
lk
k
A
A
2 1
A’
A’
IEC  195/12
IEC  196/12
Figure 3a – Side view of columnar test
Figure 3b – Cross-section of A-A’
piece and loading tool
Key
Configurations or specimen Direction or plane for alignment
1 Columnar test piece 5 Loading axis (loading direction)
2 Test piece substrate 6 Surface of test piece substrate
3 Loading tool 7 Contact surface of the loading knife edge
4 Load cell 8 Plane including loading axis and normal of a
test piece substrate
l width of the knife edge tip
k
Figure 3 – Alignment between columnar test piece and loading tool
7.4 Test environment
As the environment greatly affects the adhesive properties of micro-materials, the test
temperature and humidity should be controlled within ± 1 °C and ± 5 %, respectively.
8 Test report
Test reports shall include at least the following:
a) reference to this standard, i.e. IEC 62047-13;
b) materials of the columnar test piece and substrate;
c) dimensions of the columnar test piece and substrate as well as spacing between adjacent
columnar test piece;
d) preparation method of test piece and the details;
e) test conditions such as test device and test loading condition;
f) test environment such as temperature and humidity;
g) measurement results and calculated adhesive strength.

62047-13  IEC:2012 – 11 –
Annex A
(informative)
Technical background
A.1 Outline of round-robin tests performed in Germany and Japan
Validities of adhesive strength test methods between a micro-sized columnar test piece and a
substrate described in Clause 4, as well as the testing method presented in this standard are
verified as results of round-robin tests (RRT) described as follows.
Round-robin tests (RRT) were performed from 2008 to 2009 in Germany and Japan. The RRT
were carried out with the participation of several universities in Germany and Japan.
The materials used in the RRT were epoxy type photoresist, SU-8 and silicon wafer. Several
different dimensions of SU-8 columnar test pieces were prepared for the RRT. A number of
the micro-sized columnar test pieces with each dimension were fabricated on each wafer
under the same manufacturing condition. The RRT were carried out using each particular
material testing machine for micro-sized materials in each institute, which can apply precise
displacement and/or force with constant rate. Adhesive tests were carried out under
displacement control mode and both force and displacement were measured during the tests.
The adhesive strengths were compared within each of the different-sized columnar test pieces.
On the basis of finding from the RRT, this standard was developed.
Figure A.1 shows an example of the testing results obtained from the RRT in each institute.
Specimen A Specimen B
diameter of 125 µm diameter of 125 µm
aspect ratio of 0,8 aspect ratio of 1,2
θ
b
Univ. 1: 45°
Univ. 2: 45°
Univ. 3: 10°
Univ. 1 Univ. 2 Univ. 3 Univ. 1 Univ. 2 Univ. 3
IEC  197/12
NOTE 1 This graph shows one of the RRT results, which is obtained from bend type tests using two different-
sized SU-8 columns on Si substrate. 10 to 20 test pieces of each different-sized column were tested in each
institute, because adhesive strength data tend to be scattered.
NOTE 2 In columnar test pieces with an aspect ratio of 1,2 (specimen B), the maximum tensile stress at
delamination (the adhesive bend strength) is about the same in each laboratory.
NOTE 3 In columnar test pieces with an aspect ratio of 0,8 (specimen A), the adhesive bend strength is about the
same as that in specimen B, when the knife edge angle of the loading tool (θ ) is 10°. On the other hand, the
b
adhesive bend strength is larger than that in specimen B, when θ is 45°.
b
Figure A.1 – Example of the RRT results (see [1] )
___________
Figures in square brackets refer to the bibliography.
Maximum tensile stress at delamination/MPa

– 12 – 62047-13  IEC:2012
A.2 Effects of the aspect ratio of columnar test piece on the adhesive bend
strength in bend type test
This standard utilizes columnar shape as the adhesive test piece for evaluation of adhesive
strength between micro-sized components and a substrate in MEMS. A reason to adopt the
shape is that point loading at the end of the column is possible in the adhesive tests under
bend loading condition. Therefore, proper loading can be applied to the end of the columnar
specimen under the point loading mode without the strict adjustment for alignment.
However, consideration shall be given to the effects of the aspect ratio of the columnar
specimens on adhesive strength obtained from the adhesive testing under the bend loading
condition. Figure A.2 shows that the proportion of the shear stress to the maximum tensile
stress increases when decreasing the aspect ratio.
In case of a columnar test piece with an aspect ratio of less than 0,5, there is high possibility
that the delamination occurs by the shear stress because the proportion of the shear stress
becomes larger, as shown in Figure A.2. Hence, the columnar test piece with the aspect ratio
shall adopt shear loading type.
In the case of a columnar test with an aspect ratio of 0,5 to 1,2, the effective stress for
delamination is transferred from the shear stress to the maximum tensile stress when
increasing the aspect ratio as shown in Figure A.2. That is to say, it is not clear which causes
the delamination: the shear stress, the maximum tensile stress or mixture of them. Therefore,
it is recommended that the bend type test does not applied to the columnar test piece within
the aspect ratio of 0,5 to1,2.
0,5
0,5
0,4
0,4
0,3
0,3
0,2
0,2
0,1
0,1
0 0,5 1,0 1,5 2,0 2,5 3,0
0 0,5 1 1,5 2 2,5 3
Aspect ratio (columnar length/diameter)
Aspect ratio (columnar length / diameter)

IEC  198/12
Figure A.2 – Effects of aspect ratio of columnar test piece on the stress condition
in bend type test (see [2])
A.3 Effects of knife edge angle of loading tool on the adhesive bend strength
in bend type test
In the case of the bend type test, the proportion of compression stress at the adhesive joint
area to maximum tensile stress at the columnar root increases when increasing the knife edge
angle of loading tool (θ ). The effects cannot be neglected at the larger angle of θ as shown
b b
in Figure A.3. Hence, θ should be within the range of 10° to 20°in the bend type test.
b
Shear stress/maximum tensile stress
Shear stress / Max. tensile stress

62047-13  IEC:2012 – 13 –
30°45°
0,5
0,5
20°
0,4
0,4
0,3
0,3
10°
0,2
0,2
00,,11
45°
30°
20°
0 10°
0 0,5 1,0 1,5 2,0
0 0,5 1 1,5 2
Aspect ration (columnar length/diameter)
Aspect ratio (Columnar length / diameter )

IEC  199/12
NOTE Each line in this graph shows the calculated result using each different knife edge angle of loading tool to
the lateral face of columnar test piece.
Figure A.3 – Effects of knife edge angle of loading tool and aspect ratio
of columnar test piece on the stress condition in bend test

Compression stress/maximum tensile stress
Compression stress / Max. tensile stress

– 14 – 62047-13  IEC:2012
Bibliography
[1] Toshikazu Tasaki, Tso-Fu Mark Chang, Chiemi Ishiyama, Masato Sone, Study on
delamination mechanism of SU-8 micropillars on a Si-substrate under bend loading by
Weibull analysis Microelectronic Engineering 88 (2011) 2132–2134
[2] Chiemi Ishiyama, Akinobu Shibata, Masato Sone, and Yakichi Higo Effects of Aspect
Ratio of Photoresist Patterns on Adhesive Strength between Microsized SU-8 Columns
and Silicon Substrate under Bend Loading Condition Japanese Journal of Applied
Physics 49 (2010) 06GN14
___________
– 16 – 62047-13  CEI:2012
SOMMAIRE
AVANT-PROPOS . 17
1 Domaine d’application . 19
2 Références normatives . 19
3 Termes et définitions . 19
4 Méthode d’essai . 20
4.1 Généralités. 20
4.2 Analyse des données . 22
5 Equipement d’essai . 22
5.1 Généralités. 22
5.2 Actionneur . 22
5.3 Capteur de mesure de la force . 22
5.4 Système d'alignement . 23
5.5 Appareil enregistreur . 23
6 Eprouvettes d’essai . 23
6.1 Conception des éprouvettes d’essai . 23
6.2 Préparation des éprouvettes d'essai . 23
7 Conditions d'essais . 23
7.1 Méthode de préhension . 23
7.2 Vitesse d’essai . 24
7.3 Alignement de l’éprouvette d’essai . 24
7.4 Environnement d’essai . 25
8 Rapport d’essai . 25
Annexe A (informative) Contexte technique . 26
Bibliographie . 30

Figure 1 – Éprouvettes d'essai en colonnes . 20
Figure 2 – Méthode de l'essai de la résistance d'adhérence . 21
Figure 3 – Alignement d'une éprouvette d'essai en colonnes et d'un outil de charge . 24
Figure A.1 – Exemple de résultats des RRT (voir Bibliographie [1]) . 27
Figure A.2 – Effet du rapport de forme de l'éprouvette d'essai en colonnes sur la
contrainte de traction dans des conditions d'effort de courbure (see Bibliography [2]) . 28
Figure A.3 – Effets de l'angle de la lame de couteau de l’outil de charge et du rapport
de forme de l'éprouvette d’essai en colonnes sur la condition de contrainte en essai de
type courbure. 29

62047-13  CEI:2012 – 17 –
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
DISPOSITIFS MICROÉLECTROMÉCANIQUES –

Partie 13: Méthodes d'essais de types courbure et cisaillement
de mesure de la résistance d'adhérence pour les structures MEMS

AVANT-PROPOS
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La Norme internationale CEI 62047-13 a été établie par le sous-comité 47F: Systèmes
microélectromécaniques, du comité d'études 47 de la CEI: Dispositifs à semiconducteurs.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
47F/109/FDIS 47F/119/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.

– 18 – 62047-13  CEI:2012
Cette publication a été rédigée selon les Directives ISO/CEI, Partie 2.
Une liste de toutes les parties de la série CEI 62047, publiées sous le titre général Dispositifs
à semiconducteurs – Dispositifs microélectromécaniques, peut être consultée sur le site web
de la CEI.
Le comité a décidé que le contenu de cette publication ne sera pas modifié avant la date de
stabilité indiquée sur le site web de la CEI sous "http://webstore.iec.ch" dans les données
relatives à la publication recherchée. A cette date, la publication sera
• reconduite,
• supprimée,
• remplacée par une édition révisée, ou
• amendée.
62047-13  CEI:2012 – 19 –
DISPOSITIFS À SEMICONDUCTEURS –
DISPOSITIFS MICROÉLECTROMÉCANIQUES –

Partie 13: Méthodes d'essais de types courbure et cisaillement
de mesure de la résistance d'adhérence pour les structures MEMS

1 Domaine d’application
La présente partie de la CEI 62047 spécifie la méthode d'essai d'adhérence entre des
éléments microminiaturisés et un substrat au moyen d'éprouvettes de forme en colonnes. La
présente norme internationale peut être appliquée à la mes
...