IEC 62258-6:2006
(Main)Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
General Information
- Status
- Published
- Publication Date
- 27-Aug-2006
- Technical Committee
- TC 47 - Semiconductor devices
- Drafting Committee
- PT 62258 - TC 47/PT 62258
- Current Stage
- PPUB - Publication issued
- Start Date
- 28-Aug-2006
- Completion Date
- 15-Nov-2006
Overview
IEC 62258-6:2006 is an international standard developed by the International Electrotechnical Commission (IEC) focusing on semiconductor die products. Specifically, it outlines the requirements for information concerning thermal simulation. This standard supports stakeholders across the semiconductor supply chain-including manufacturers, designers, and system integrators-in accurately simulating the thermal behavior of electronic systems containing bare or minimally packaged semiconductor die.
The scope of IEC 62258-6 includes wafers, singulated bare die, die with connection structures, and partially encapsulated die. It facilitates compliance with related standards IEC 62258-1 and IEC 62258-2, ensuring a uniform approach to procurement, use, and data exchange formats related to semiconductor dies.
Key Topics
Thermal Simulation Data Requirements
To properly simulate thermal behavior and verify device functionality, this standard specifies the minimum critical information suppliers must provide:
- Operating Temperature Conditions: Specify the device’s operational temperature range.
- Maximum Junction Temperature: Define the maximum allowable junction temperature.
- Extended Junction Temperature Range: Detail additional allowable junction temperatures with reduced lifetimes when applicable.
- Power Dissipation Values: Provide maximum, minimum, and typical power dissipation under specified conditions.
- Heat Source Distribution: Include plots showing the position and area of heat sources on the die surface.
- Heat Source Characteristics: Describe each heat source's type and power; indicate if heat is generated on the die surface or within the bulk substrate.
- Thermal Conductivity: Supply detailed thermal conductivity data of all materials involved.
- Specific Thermal Capacity: Required for transient thermal simulations, specifying the specific heat capacities of materials.
Minimally Packaged Die Thermal Data
In addition to bare die requirements, minimally packaged die must include:
- Package thermal resistance values such as junction-to-ambient or junction-to-reference resistance.
- Test method details for thermal resistance measurements, including ambient conditions, airflow, power applied, and measurement locations.
- Thermal properties of encapsulation materials like adhesives, encapsulant compounds, and dielectric substrates.
Thermal Simulation Model Information
Where simulation models (e.g., finite-element models) are provided, the following metadata should accompany the models:
- Model file name and creation date.
- Comprehensive description outlining the model scope and limitations.
- Source and originator details.
- Supported simulation software names (e.g., ANSYS, FLOTHERM, ICEPAK).
- Compatible software versions and compliance levels.
Applications
IEC 62258-6 is invaluable for:
- Thermal Management Engineering: Enabling precise thermal simulations to predict device behavior under various temperature conditions.
- Reliable Design and Verification: Assisting designers in verifying that semiconductor die operate safely within thermal limits.
- Supply Chain Communication: Standardizing the thermal data format and requirements exchanged between die suppliers, manufacturers, and system integrators.
- Testing and Quality Assurance: Guiding thermal resistance measurement procedures to ensure reliable packaging and assembly processes.
By implementing this standard, companies can reduce thermal reliability issues in semiconductor devices, optimize thermal design, and improve product longevity.
Related Standards
IEC 62258-6 complements the following standards within the semiconductor die product domain:
- IEC 62258-1: Requirements for procurement and use of semiconductor die products.
- IEC 62258-2: Exchange data formats for semiconductor die.
- IEC 62258-5: Requirements for information concerning electrical simulation of die products.
- EIA/JESD51 series: Standards related to thermal measurement methodologies for semiconductor packages, including various test environments and thermal resistance measurement techniques.
Integrating IEC 62258-6 with these standards ensures a comprehensive approach to semiconductor die simulation, data exchange, and operational safety considerations.
By adhering to IEC 62258-6:2006, semiconductor industry stakeholders can ensure consistent, accurate thermal simulation data, contributing to enhanced performance and reliability of semiconductor die integrated into complex electronic systems.
Frequently Asked Questions
IEC 62258-6:2006 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Semiconductor die products - Part 6: Requirements for information concerning thermal simulation". This standard covers: Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
IEC 62258-6:2006 is classified under the following ICS (International Classification for Standards) categories: 31.080.99 - Other semiconductor devices. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 62258-6:2006 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
INTERNATIONAL IEC
STANDARD 62258-6
First edition
2006-08
Semiconductor die products –
Part 6:
Requirements for information
concerning thermal simulation
Reference number
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INTERNATIONAL IEC
STANDARD 62258-6
First edition
2006-08
Semiconductor die products –
Part 6:
Requirements for information
concerning thermal simulation
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 62258-6 IEC:2006(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .6
3 Terms and definitions.6
4 General .6
5 Requirements for information for thermal simulation .7
5.1 Requirements for bare die with or without added connection structures.7
5.2 Requirements for minimally-packaged die .7
5.3 Information on thermal simulation model .8
Bibliography.9
62258-6 IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 6: Requirements for information
concerning thermal simulation
FOREWORD
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International Standard IEC 62258-6 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard should be read in conjunction with IEC 62258-1 and IEC 62258-2.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1870/FDIS 47/1883/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
– 4 – 62258-6 IEC:2006(E)
The structure of IEC 62258, as currently conceived, consists of the following parts under the
general title Semiconductor die products:
Part 1: Requirements for procurement and use
Part 2: Exchange data formats
Part 3: Recommendations fo
...
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