Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

Standardize the electrical modeling of input signals, output signals, power supply and ground terminals of integrated circuits, in order to provide for analysis of electrical characteristics of equipment

General Information

Status
Published
Publication Date
19-Feb-2007
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
31-Dec-2006
Completion Date
20-Feb-2007
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Technical specification
IEC TS 62404:2007 - Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
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TECHNICAL IEC
SPECIFICATION TS 62404
First edition
2007-02
Logic digital integrated circuits –
Specification for I/O interface model
for integrated circuit (IMIC version 1.3)

Reference number
IEC/TS 62404:2007(E)
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TECHNICAL IEC
SPECIFICATION TS 62404
First edition
2007-02
Logic digital integrated circuits –
Specification for I/O interface model
for integrated circuit (IMIC version 1.3)
© IEC 2007 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB

International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – TS 62404 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 Terms and definitions .7
4 Outline .7
4.1 General .7
4.2 Covered range of model .8
4.3 Language for circuits .8
4.4 Device model .8
4.5 Structure of model.8
4.6 Simulation .8
4.7 Relation to IBIS .8
5 Model structure .9
6 Detailed model description .14
6.1 Description rules .14
6.2 IC model file.16
6.3 Package model file .42
6.4 Module model file .49
7 Levels of models .56

Annex A (informative) Model delivery flow.58
Annex B (informative) Example of model description.59

Figure 1 – Outline of the model.8
Figure 2 – Hierarchy of three models .9
Figure 3 – Data structure of an IMIC model file for IC .11
Figure 4 – Data structure of an IMIC model file for package.12
Figure 5 – Data structure of an IMIC model file for module.13
Figure 6 – Pad assignment .20
Figure 7 – Example of circuit description.24
Figure 8 – Input stimulus .25
Figure 9 – Diode equivalent circuit.29
Figure 10 – Diode characteristics.30
Figure 11 – NMOS transistor equivalent circuit .31
Figure 12 – PMOS transistor equivalent circuit.31
Figure 13 – Gate channel characteristics of MOS transistor .32
Figure 14 – Characteristics of diode in MOS transistor.33
Figure 15 – NPN transistor equivalent circuit .35
Figure 16 – PNP transistor equivalent circuit .35
Figure 17 – Static characteristics of bipolar transistor .35
Figure 18 – NMOS characteristics on regular grid .39

TS 62404 © IEC:2007(E) – 3 –
Figure 19 – MOS transistor model with two-terminal model .39
Figure 20 – Relationship between inner terminals and equivalent circuits of package .46
Figure 21 – Relationship between outer terminals and equivalent circuits of package .47
Figure 22 – Example of module circuit .53
Figure 23 – Example of signal source of module .55
Figure A.1 – Delivery flow of model files .58
Figure B.1 – IC structure.59
Figure B.2 – Equivalent circuit .59

Table 1 – Elements of model structures .10
Table 2 – Levels of models .57
Table 3 – Required elements of model for each level .57

– 4 – TS 62404 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
LOGIC DIGITAL INTEGRATED CIRCUITS –
SPECIFICATION FOR I/O INTERFACE MODEL
FOR INTEGRATED CIRCUIT
(IMIC version 1.3)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
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• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 62404, which is a technical specification, has been prepared by subcommittee 47A:
Integrated circuits, of IEC technical committee 47: Semiconductor devices.

TS 62404 © IEC:2007(E) – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
47A/746/DTS 47A/751/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A bilingual version of this publication may be issued at a later date.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – TS 62404 © IEC:2007(E)
INTRODUCTION
With an increase in speed of electronic systems, it becomes necessary to accurately predict
electrical performance including noise in electronic systems with integrated circuits.
Simulators have been used
...

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