WG 2 - TC 47/SC 47A/WG 2

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI.
This document provides:
- the description of ICIM-CPI macro-model elements representing electrical, thermal or logical behaviour of the IC.
- a universal data exchange format based on XML.

IEC 62433-1:2019 specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62433 1:2011:
Incorporation of a data exchange format for an integrated circuit’s model representation.
The contents of the corrigendum of July 2020 have been included in this copy.

IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technical changes with respect to the previous edition:
Incorporation of an XML based exchange format for model representation.

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

IEC 62433-4:2016 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model - Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool. This macro-model can be used to model both analogue and digital ICs (input/output, digital core and supply). This macro-model does not take into account the non-linear effects of the IC. The added value of ICIM-CI is that it could also be used for immunity prediction at board and system level through simulations. This part of IEC 62433 has two main parts:
- the electrical description of ICIM-CI macro-model elements;
- a universal data exchange format called CIML based on XML. This format allows ICIM-CI to be encoded in a more useable and generic form for immunity simulation.

IEC/TR 62433-2-1:2010 covers black box modelling which has the potential to make the modelling of conducted emission very simple, very fast, and can provide complete protection of proprietary information of IC vendors. This technical report is intended to provide the theoretical background on black box modelling for IC conducted emission.

IEC 62433-2:2008 specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins:
- conducted emissions through power supply terminals and ground reference structures;
- conducted emissions through input/output (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.

IEC 60748-2-20:2008 aims at giving DC interface specifications for various sets of values, where each comprises the nominal value of power supply voltage, its tolerance, and the worst-case limit values of the input and output voltages for low voltage integrated circuits. This second edition cancels and replaces the first edition published in 2000. This edition constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:
- Expansion of power supply voltages down to nominal 1,0 V
- Addition of Schmitt-trigger input specification.

Standardize the electrical modeling of input signals, output signals, power supply and ground terminals of integrated circuits, in order to provide for analysis of electrical characteristics of equipment

This publication gives standards for the following categories or sub-categories of devices: -Combinatorial and sequential digital circuits; -Integrated circuit memories; -Integrated circuit microprocessors; -Charge-transfer devices. Should be used together with IEC 60747-1 and 60748-1.

Specifies standards on the subcategories of semicustom integrated circuits. Provides basic information on terminology and graphical symbols, essential ratings and characteristics, functional specifications, measuring methods, acceptance and reliability.

Gives requirements for the following categories of interface integrated circuits:line circuits (transmitters and receivers), sense amplifiers, peripheral drivers (including memory drivers) and level shifters, voltage comparators, linear and non-linear analogue-to digital and digital-to-analogue converters, control circuits for switch-mode power supplies, companding PCM coder-decoders (CODEC), digital interface integrated circuits (UBF), integrated service digital network (ISDN).

Applies to film and hybrid film integrated circuits (F and HICs), manufactured as catalogue or as custom-built circuits whose quality is assessed on the basis of the capability approval procedure. Presents preferred values for ratings and characteristics, selects from the generic specification the appropriate tests and measuring methods and gives general performance requirements to be used in detail specifications for film and hybrid film integrated circuits.

Applies to film and hybrid film integrated circuits, manufactured as catalogue or as custom-built products whose quality is assessed on the basis of Qualification Approval. Presents preferred values for rating and characteristics, selects from the generic specification the appropriate tests and measuring methods and gives general performance requirements to be used in detail specifications for film and hybrid film integrated circuits.

IEC/TS 62433-1:2011 provides specifications for model-categories of EMC IC modelling, definitions of terms that are commonly used in IEC 62433 series, modelling approaches that can be used, and requirements for each modelling that is standardized in this series.