IEC 62047-17:2015

IEC 62047-17 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 17: Bulge test method for measuring mechanical properties of thin films

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 17: Méthode d'essai de renflement pour la mesure des propriétés
mécaniques des couches minces
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IEC 62047-17 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 17: Bulge test method for measuring mechanical properties of thin films

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 17: Méthode d'essai de renflement pour la mesure des propriétés

mécaniques des couches minces
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-2295-9

– 2 – IEC 62047-17:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and symbols. 6
3.1 Terms and definitions . 6
3.2 Symbols . 7
4 Principle of bulge test . 7
5 Test apparatus and environment . 8
5.1 General . 8
5.2 Apparatus . 9
5.2.1 Pressuring device . 9
5.2.2 Bulge (pressure) chamber. 9
5.2.3 Height measurement units . 9
5.3 Test environment . 10
6 Specimen . 10
6.1 General . 10
6.2 Shape and dimension of specimen . 10
6.3 Measurement of test piece dimension . 10
7 Test procedure and analysis . 11
7.1 Test procedure . 11
7.2 Data analysis . 12
8 Test report . 13
Annex A (informative) Determination of mechanical properties . 14
A.1 General . 14
A.2 Determination of mechanical properties using stress-strain curve . 14
A.3 Determination of mechanical properties using analysis of load-deflection . 16
Annex B (informative) Deformation measurement techniques . 19
B.1 General . 19
B.2 Laser interferometry technique . 19
B.3 Capacitance type measurement . 19
Annex C (informative) Example of test piece fabrication: MEMS process . 25
C.1 Test piece fabrication . 25
C.2 Measurement of shape of specimen . 26
Bibliography . 27

Figure 1 – Typical example of bulge specimen . 7
Figure 2 – Membrane window bulged by pressure . 8
Figure 3 – Typical example of bulge test apparatus . 8
Figure 4 – Bulge membrane window shapes . 10
Figure 5 – Example of typical pressure-height curve obtained from bulge test . 12
Figure A.1 – Determination of biaxial modulus in the stress-strain curve obtained from
bulge test . 18
Figure B.1 – Typical example of laser interferometer configuration . 21

Figure B.2 – Typical fringe patterns obtained from laser Michelson interferometry and
ESPI system . 22
Figure B.3 – Typical example of the measurement system using a photo detector . 23
Figure B.4 – Schematic of capacitance bulge tester . 23
Figure B.5 – Typical example of relationship between bulge height and capacitance
change . 24
Figure C.1 – Example of fabrication procedure for bulge test piece . 25

Table 1 – Symbols and designations of a specimen . 7
Table A.1 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
square films . 17
Table A.2 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
spherical films . 17

– 4 – IEC 62047-17:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 17: Bulge test method for measuring
mechanical properties of thin films

FOREWORD
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