EN 16602-70-12:2016

SLOVENSKI STANDARD
01-december-2016
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Space product assurance - Design rules for printed circuit boards
Raumfahrtproduktsicherung - Designregeln für Leiterplatten
Assurance produit des projets spatiaux - Règles de conception des circuits imprimés
Ta slovenski standard je istoveten z: EN 16602-70-12:2016
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-70-12
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2016
ICS 31.180; 49.140
English version
Space product assurance - Design rules for printed circuit
boards
Assurance produit des projets spatiaux - Règles de Raumfahrtproduktsicherung - Designregeln für
conception des circuits imprimés Leiterplatten
This European Standard was approved by CEN on 22 May 2016.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2016 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-12:2016 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European foreword . 12
Introduction . 13
1 Scope . 14
2 Normative references . 15
3 Terms, definitions and abbreviated terms . 16
3.1 Terms from other standards . 16
3.2 Terms specific to the present standard . 16
3.3 Abbreviated terms. 24
4 Principles . 26
4.1 Qualified PCBs . 26
4.2 Manufacturing tolerances. 26
4.3 Reliability of design . 26
5 Design review and MRR . 28
5.1 Overview . 28
5.2 Documentation . 28
6 General design and production requirements . 30
6.1 Reliability of design . 30
6.2 Choice of materials and build-up . 30
6.2.1 Overview . 30
6.2.2 Material selection . 33
6.3 Selection of the PCB manufacturer . 33
6.4 Traceability and marking . 33
7 Rigid PCBs . 34
7.1 PCB build-up . 34
7.1.1 General . 34
7.1.2 Copper styles . 34
7.1.3 Dielectric thickness . 36
7.2 PCB dimension . 39
7.3 Thickness of PCB . 39
7.3.1 General . 39
7.3.2 Polyimide PCB . 40
7.3.3 Epoxy PCB . 40
7.3.4 Number of copper layers in PCB . 40
7.3.5 Aspect ratio of vias . 40
7.4 Track width and spacing . 41
7.4.1 General . 41
7.4.2 Manufacturing tolerances for width and spacing . 41
7.4.3 External layers . 42
7.4.4 Normal pitch tracks on internal layers. 43
7.4.5 Fine pitch tracks on internal layers . 44
7.4.6 Routing to AAD footprint on internal layers . 45
7.5 Pad design . 46
7.5.1 Non-functional pad removal . 46
7.5.2 Pad dimensions . 46
7.5.3 Non-circular external pads . 48
7.6 Copper planes in rigid PCB . 49
7.7 Design considerations for the prevention of sliver and peelable . 50
7.8 PCB surface finish . 50
7.8.1 Metallization . 50
7.8.2 Solder mask . 51
8 Flex PCBs . 52
8.1 Overview . 52
8.2 Dynamic applications . 52
8.3 PCB build-up . 52
8.3.1 General . 52
8.3.2 Dielectric materials . 52
8.3.3 Copper cladding . 53
8.3.4 Copper planes in flex PCB . 53
8.4 Track design . 54
8.5 Through holes . 55
8.5.1 Annular ring. 55
8.5.2 Vias and pads . 56
8.5.3 Tear drop pad for flex PCB . 56
8.6 Bending radius . 57
8.6.1 Overview . 57
8.6.2 General . 57
8.7 Sculptured flex PCB . 58
8.7.1 Overview . 58
8.7.2 General . 58
8.7.3 Copper foil dimensions for build-up . 58
8.7.4 Connection finger . 59
8.7.5 Through-holes . 60
8.7.6 Bending radius . 61
9 Rigid-flex PCBs . 62
9.1 Overview . 62
9.2 General . 62
9.3 Build-up . 63
9.4 Cover layer . 64
9.5 Interface of rigid part and flexible part . 64
9.6 Pads . 64
10 Thermal rules and heat sinks . 65
10.1 Overview . 65
10.2 General requirements . 65
10.3 Specific requirements for external heat sink. 65
10.3.1 Overview . 65
10.3.2 Construction of the interface between PCB and heat sink . 65
10.3.3 Dimensional requirements . 66
10.4 Specific requirements for internal heat sink . 68
10.4.1 General . 68
10.4.2 Cu thickness and type . 68
10.4.3 CIC and Molybdenum inserts . 69
10.4.4 Dimensional requirements . 69
11 HDI PCBs . 71
11.1 Overview . 71
11.2 Justification . 71
11.3 Microvia technology . 71
11.4 Microvias . 72
11.4.1 Build-up of microvia layers . 72
11.4.2 Design of microvias . 74
11.4.3 Pad design for microvia .
...