ASTM D5109-99

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An American National Standard
Designation:D5109–99
Standard Test Methods for
Copper-Clad Thermosetting Laminates for Printed Wiring
Boards
This standard is issued under the fixed designation D 5109; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope mittivity (Dielectric Constant) of Solid Electrical Insulat-
ing Materials
1.1 These test methods cover the procedures for testing
D 229 Test Methods for Rigid Sheet and Plate Materials
copper-clad laminates produced from fiber-reinforced, thermo-
Used for Electrical Insulation
setting polymeric materials intended for fabrication of printed
D 257 Test Methods for DC Resistance or Conductance of
wiring boards.
Insulating Materials
1.2 This standard does not purport to address all of the
D 374 Test Methods for Thickness of Solid Electrical Insu-
safety concerns, if any, associated with its use. It is the
lation
responsibility of the user of this standard to establish appro-
D 1531 Test Methods for Relative Permittivity (Dielectric
priate safety and health practices and determine the applica-
Constant) and Dissipation Factor by Fluid Displacement
bility of regulatory limitations prior to use. For specific hazard
Procedures
statements, see 7.2.1, 8.1, and 11.3.1.
D 1711 Terminology Relating to Electrical Insulation
1.3 Metric units are the preferred units for these test
D 1825 Practice for Etching and Cleaning Copper-Clad
methods. Inch-pound units, where shown, are presented for
Electrical Insulating Materials and Thermosetting Lami-
information only.
nates for Electrical Testing
1.4 The procedures appear in the following sections:
D 1867 SpecificationforCopper-CladThermosettingLami-
Procedure Section
nates for Printed Wiring
Referenced Documents 2
Conditioning 4
D 3636 Practice for Sampling and Judging Quality of Solid
Dielectric Breakdown Voltage Parallel to Laminations 13
Electrical Insulating Materials
Dimensional Instability 19
D 6054 Practice for Conditioning Electrical Insulating Ma-
Dissipation Factor 14
Flammability Rating Test 16
terials for Testing
Flexural Strength, Flatwise at Elevated Temperature 15
E 53 Test Methods for Chemical Analysis of Copper
Flexural Strength, Flatwise at Room Temperature 15
2.2 Other Standard:
Oven Blister Test 17
Peel Strength Test at Elevated Temperature 10
NEMA Publication Number LI 1-1975 Test for Hot Peel
Peel Strength Test at Room Temperature 9
Strength of Copper-Clad Industrial Laminates for Printed
Permittivity 14
Pin Holes in Copper Surface 20 Circuits
Purity of Copper 5
Scratches in Copper Surface 21
3. Terminology
Solder Float Test 8
3.1 Definitions: Definitions of terms used in these test
Solvent Resistance 7
Surface Resistivity 11
methods are found in Terminology D 1711.
Volume Resistivity 11
3.2 Definitions of Terms Specific to This Standard:
Terminology 3
3.2.1 blister, copper, n—a gas pocket (a void) located at the
Thickness & Thickness Variation 18
Warp or Twist 6
interface of the dielectric and the copper foil in a copper-clad
Water Absorption 12
laminate.
3.2.2 blister, core, n—a gas pocket (a void) located between
2. Referenced Documents
the laminations in the dielectric core of a copper-clad laminate.
2.1 ASTM Standards:
3.2.3 dimensional instability—a characteristic of a solid
D 150 Test Methods for AC Loss Characteristics and Per-
materialthatisdisplayedbychangesinthedimensionsofatest
1 2
These test methods are under the jurisdiction of ASTM Committee D-9 on Annual Book of ASTM Standards, Vol 10.01.
Electrical and Electronic Insulating Materials and are the direct responsibility of Annual Book of ASTM Standards, Vol 10.02.
Subcommittee D09.07 on Flexible and Rigid Insulating Materials. Annual Book of ASTM Standards, Vol 03.05.
Current edition approved Oct. 10, 1999. Published November 1999. Originally Available from National Electronic Manufacturer’sAssociation (NEMA), 2101
published as D 5109 – 90. Last previous edition D 5109 – 94. L St., NW, Washington, DC 20037.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
D5109
specimen when the specimen is subjected to environments 7.2.2 Using appropriate apparatus to generate and maintain
similar to those that the material may encounter during the the vapor phase, suspend the specimen in solvent vapors for
manufacturing operations or use.
approximately 2 min.
3.2.4 peel strength, n—a force required to separate copper
NOTE 1—An appropriate apparatus consists of a vessel for heating
foil from the surface of a copper-clad laminate using a specific
liquid solvent and a reflux condenser in which the specimen can be placed
test method. It is reported as a force per unit width.
so that it is in contact with the vapor phase of the boiling (condensing)
3.2.5 trace, n—in the printed wiring board industry, an
solvent.
electrically conducting element of a printed circuit board that
7.2.3 At the conclusion of this exposure, examine the
remains on the laminate surface after etching.
surfaces of the specimen for any evidence of blistering or
4. Conditioning
delamination.
4.1 Unless otherwise stated in these test methods, condition
7.3 Report—Report the following information:
test specimens in accordance with the provisions stated in
7.3.1 Any visible evidence of blistering or delamination.
Specification D 1867 for the property of interest. If that
Such behavior may be sufficient cause for judging that the
standard does not specify conditioning requirements, use the
laminate is not resistant to the solvent used.
conditioning requirements of Practice D 6054.
7.3.2 The identification of the laminate tested.
5. Purity of Copper 7.3.3 The identification of the solvent used.
7.4 Precision and Bias:
5.1 Significance and Use—Since the electrical conductance
of copper can be adversely affected by small amounts of
7.4.1 No statement is made about the precision or bias of
impurities, this test provides assurance that the circuits fabri-
this test method for measuring resistance to solvents since the
cated from the laminate will provide sufficient conductance for
resultmerelystateswhetherthereisconformancetothecriteria
signal transmission. The grain structure and the porosity of
for acceptability specified in the procedure.
copper also affect conductance.
5.2 Procedure—Analyze the copper for purity in accor-
8. Solder Float Test
dance with Test Methods E 53.
8.1 Significance and Use—Many printed wiring boards are
5.3 Report the following information:
populatedwithcomponentsfollowedbysolderingeithermanu-
5.3.1 The amount of copper, %, and
ally or with a wave soldering process.Apopular circuit design
5.3.2 The identity of the laminate sampled for testing.
uses a fabrication process known as soldermask over bare
5.4 Precision and Bias:
copper (SMOBC) in which the laminate is submerged in
5.4.1 See Test Methods E 53.
molten solder. In either of these two cases, the laminate is
6. Warp or Twist subjected to exposure to molten solder temperatures for short
periods of time. This test method provides useful information
6.1 Significance and Use—Flat laminate material of large
aboutthesuitabilityofbothcladanduncladlaminatetosurvive
area per sheet is desirable for the most efficient fabrication of
these exposures. (Warning—Molten solder can cause severe
bare circuit boards. Lack of warp or twist is very necessary for
burns. Care should be exercised to prevent injury.)
efficient placement of components on the fabricated but un-
8.2 Unetched Laminate:
populated circuit boards particularly if automatic insertion
machinery is used to install components on the circuit boards.
8.2.1 Prepare test specimens of unetched laminate having
6.2 Procedure—Determine warp or twist on full size lami-
dimensions 25 by 25 6 1 mm by any thickness. For laminate
nate sheets that are in the “as is” condition. Test and report the
clad on both sides, two specimens are required, one for each
results in accordance with Test Methods D 229.
side.Ifspecimensthatsurvivethesolderdipexposurearetobe
used for peel strength tests in accordance with Section 9, at
7. Solvent Resistance
least three specimens are required.
7.1 Significance and Use—Solvents are often used for
8.2.2 Procedure—Float an unfluxed, unetched specimen,
processing or cleaning purposes in the fabrication of printed
copper side down, on clean molten tin/lead 60/40 solder that is
wiring boards. The solvents are used sometimes at elevated
at the temperature specified in Specification D 1867 for the
temperatures. Such exposure should not adversely affect the
thickness of the laminate being tested. At the end of the time
suitability of the dielectric portion of the laminate for its
specified in Specification D 1867, remove the specimen and
intended use.
examine the copper surface for evidence of blisters. For
7.2 Procedure:
laminate clad on two sides, use a fresh specimen for testing
7.2.1 Take a specimen of laminate of 10 to 40–cm area.
each side.
Etch all of the copper from the specimen in accordance with
8.3 Etched Laminate:
Practice D 1825. (Warning—The solvents used in the printed
8.3.1 A specimen is unconditioned laminate of any thick-
wiring board industry may be physiologically hazardous sub-
ness which is 50 by 50 6 5 mm. Etch each specimen in
stances. Such substances are to be used only where adequate
accordance with Practice D 1825 so as to have an etched
ventilation is provided and in such a manner as to avoid
pattern as in Fig. 1.
absorption through the skin. Take precautions to condense any
vapors and return them to the boiling liquid.) 8.3.2 Procedure:
D5109
the peeled copper strip up, providing a 25-mm span. Grip the
end of the peeled strip between two knurled jaws of a clamp.
Attach a flexible chain to a dial-indicating force indicator that
has been adjusted to compensate for the weights of the chain
and the clamp. Adjust the jaws to cover the full width of the
copper strip and clamp them parallel to the line of peel. With
the force indicator in a vertical plane, exert a steady vertical
pull (approximately 50 mm/min) until the needle indicator
shows a constant reading. If the full width of the copper strip
does not peel, discard this specimen and repeat the procedure
on another specimen. Make at least three tests and record the
test result in accordance with Practice D 3636.
9.5 Report—Report the following information:
9.5.1 The identity of the laminate,
9.5.2 The room temperature peel strength test result after
solder float in N/mm of width, and
9.5.3 The total number of strips tested.
FIG. 1 Test Specimen for Peel Strength and Solder Float Tests
9.6 Precision and Bias:
9.6.1 This test has been in use for many years, but no
8.3.2.1 Float the unfluxed specimen with its etched copper
information has been presented to ASTM upon which to base
trace side to be tested down on clean molten 60/40 tin/lead
a statement of precision. No activity has been planned to
solder at the temperatures and for the times shown in Specifi-
develop such information.
cation D 1867.
9.6.2 Thistestmethodhasnobiasbecausethevalueforpeel
8.3.2.2 At the end of the time specified for each grade,
strength is determined solely in terms of this test method itself.
removethespecimen,allowittocooltoroomtemperature,and
thenexamineitforevidenceof:(1)blisteringbetweenlayersof
10. Peel Strength Test at Elevated Temperature
laminate, (2) blistering between copper and substrate, or (3)
10.1 There are two procedures, identified as Procedure A
delamination of the copper foil.
and Procedure B. Only one is required. No preference is given
8.3.2.3 For double-sided clad laminate, use a fresh speci-
here for either procedure. Procedure A uses the narrow
men for examining each side. If no delamination or blistering
(3.2–mm)peelstrengthstripsetchedusingthepatterninFig.1.
is seen, the specimens that were exposed to solder dip may be
Procedure B uses an unconditioned copper-clad laminate for
used for the peel strength tests of Section 9.
preparing specimens on which are etched 25 by 100–mm
8.3.3 Report—Report the following information:
patterns for peel strength test strips. Procedure B is often used
8.3.3.1 Any evidence of blistering between laminate layers,
for quality control purposes.
8.3.3.2 Any evidence of blistering between the copper and
10.2 Significance and Use:
any substrate, and
10.2.1 Either procedure of this test method provides infor-
8.3.3.3 Any delamination of the copper foil from the sub-
mation that deals with the integrity of the adhesive bond
strate.
between the copper foil and the dielectric while the laminate is
9. Peel Strength Test
at an elevated temperature. Such temperatures may be encoun-
tered in fabricating circuit boards or in assembly operations,
9.1 This test is performed at room temperature on speci-
but the forces exerted in this test are not related in any way to
mens of laminate that have previously been subjected to the
the manner in which forces are likely to be encountered by the
solder float test.
laminate in service or during fabrication or assembly.
9.2 Significance and Use—This test method is useful for
10.2.2 Either procedure may show a drastic reduction in the
evaluating laminate for the detrimental effects, if any, due to
peel strength at elevated temperature compared to the peel
soldering or other exposure to elevated temperature, upon the
strengthatroomtemperatureifthetesttemperatureexceedsthe
integrity of the bond interface between the dielectric substrate
glass transition temperature of the polymer resin system used
and the copper foil. There is no significance to this test in
to make the laminate.
relationtotheforcesthatmaybeexerteduponanytraceonany
10.3 Apparatus—The apparatus is described in NEMA
circuit boards in service.
Publication LI 1-1975.
9.3 The specimens that passed the solder float test of 8.3.2
10.4 Specimens:
may be used for the room temperature peel strength tests since
they contain the etched patterns required for peel tests. Other- 10.4.1 The number of specimens will be dictated by the
wise, using the procedures of Practice D 1825, etch patterns as gradeofcopper-cladlaminatebeingtested.Prepareatleasttwo
in Fig. 1 on at least three specimens of copper-clad laminate. specimens for the lengthwise direction and two specimens for
9.4 Procedure—Peel back the copper foil from the 6-mm the crosswise direction. See Test Methods D 229 for explana-
end of the copper strip for approximately 25 mm so that the tions of these terms. Laminate that is clad on
...