ASTM D5109-99(2004)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
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Designation: D5109 − 99(Reapproved 2004) An American National Standard
Standard Test Methods for
Copper-Clad Thermosetting Laminates for Printed Wiring
Boards
This standard is issued under the fixed designation D5109; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2. Referenced Documents
2.1 ASTM Standards:
1.1 These test methods cover the procedures for testing
D150 Test Methods forAC Loss Characteristics and Permit-
copper-clad laminates produced from fiber-reinforced, thermo-
tivity (Dielectric Constant) of Solid Electrical Insulation
setting polymeric materials intended for fabrication of printed
D229 Test Methods for Rigid Sheet and Plate Materials
wiring boards.
Used for Electrical Insulation
1.2 The procedures appear in the following sections:
D257 Test Methods for DC Resistance or Conductance of
Insulating Materials
Procedure Section
Referenced Documents 2
D374 Test Methods for Thickness of Solid Electrical Insu-
Conditioning 4
lation
Dielectric Breakdown Voltage Parallel to Laminations 13
D1531 Test Methods for Relative Permittivity (Dielectric
Dimensional Instability 19
Dissipation Factor 14
Constant) and Dissipation Factor by Fluid Displacement
Flammability Rating Test 16
Procedures
Flexural Strength, Flatwise at Elevated Temperature 15
D1711 Terminology Relating to Electrical Insulation
Flexural Strength, Flatwise at Room Temperature 15
Oven Blister Test 17
D1825 Practice for Etching and Cleaning Copper-Clad Elec-
Peel Strength Test at Elevated Temperature 10
trical Insulating Materials and Thermosetting Laminates
Peel Strength Test at Room Temperature 9
Permittivity 14 for Electrical Testing (Withdrawn 2012)
Pin Holes in Copper Surface 20
D1867 Specification for Copper-Clad Thermosetting Lami-
Purity of Copper 5
nates for Printed Wiring
Scratches in Copper Surface 21
Solder Float Test 8 D3636 Practice for Sampling and Judging Quality of Solid
Solvent Resistance 7
Electrical Insulating Materials
Surface Resistivity 11
D6054 Practice for Conditioning Electrical Insulating Mate-
Volume Resistivity 11
rials for Testing
Terminology 3
Thickness & Thickness Variation 18
E53 Test Method for Determination of Copper in Unalloyed
Warp or Twist 6
Copper by Gravimetry
Water Absorption 12
2.2 Other Standard:
1.3 Metric units are the preferred units for these test
NEMA Publication Number LI 1-1975 Test for Hot Peel
methods. Inch-pound units, where shown, are presented for
Strength of Copper-Clad Industrial Laminates for Printed
information only. 4
Circuits
1.4 This standard does not purport to address all of the
3. Terminology
safety concerns, if any, associated with its use. It is the
3.1 Definitions: Definitions of terms used in these test
responsibility of the user of this standard to establish appro-
methods are found in Terminology D1711.
priate safety and health practices and determine the applica-
bility of regulatory limitations prior to use. For specific hazard
3.2 Definitions of Terms Specific to This Standard:
statements, see 7.2.1, 8.1, and 11.3.1.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
These test methods are under the jurisdiction of ASTM Committee D09 on Standards volume information, refer to the standard’s Document Summary page on
Electrical and Electronic Insulating Materials and are the direct responsibility of the ASTM website.
Subcommittee D09.07 on Flexible and Rigid Insulating Materials. The last approved version of this historical standard is referenced on
Current edition approved Nov. 1, 2004. Published November 1999. Originally www.astm.org.
approved in 1990. Last previous edition approved in 1994 as D5109 – 94. DOI: Available from National Electronic Manufacturer’sAssociation (NEMA), 2101
10.1520/D5109-99R04. L St., NW, Washington, DC 20037.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
D5109 − 99 (2004)
3.2.1 blister, copper, n—a gas pocket (a void) located at the temperatures. Such exposure should not adversely affect the
interface of the dielectric and the copper foil in a copper-clad suitability of the dielectric portion of the laminate for its
laminate. intended use.
3.2.2 blister, core, n—a gas pocket (a void) located between
7.2 Procedure:
the laminations in the dielectric core of a copper-clad laminate. 7.2.1 Take a specimen of laminate of 10 to 40–cm area.
Etch all of the copper from the specimen in accordance with
3.2.3 dimensional instability—a characteristic of a solid
Practice D1825.(Warning—The solvents used in the printed
materialthatisdisplayedbychangesinthedimensionsofatest
wiring board industry may be physiologically hazardous sub-
specimen when the specimen is subjected to environments
stances. Such substances are to be used only where adequate
similar to those that the material may encounter during the
ventilation is provided and in such a manner as to avoid
manufacturing operations or use.
absorption through the skin. Take precautions to condense any
3.2.4 peel strength, n—a force required to separate copper
vapors and return them to the boiling liquid.)
foil from the surface of a copper-clad laminate using a specific
7.2.2 Using appropriate apparatus to generate and maintain
test method. It is reported as a force per unit width.
the vapor phase, suspend the specimen in solvent vapors for
3.2.5 trace, n—in the printed wiring board industry, an
approximately 2 min.
electrically conducting element of a printed circuit board that
NOTE 1—An appropriate apparatus consists of a vessel for heating
remains on the laminate surface after etching.
liquid solvent and a reflux condenser in which the specimen can be placed
so that it is in contact with the vapor phase of the boiling (condensing)
4. Conditioning solvent.
7.2.3 At the conclusion of this exposure, examine the
4.1 Unless otherwise stated in these test methods, condition
surfaces of the specimen for any evidence of blistering or
test specimens in accordance with the provisions stated in
delamination.
Specification D1867 for the property of interest. If that
standard does not specify conditioning requirements, use the
7.3 Report—Report the following information:
conditioning requirements of Practice D6054.
7.3.1 Any visible evidence of blistering or delamination.
Such behavior may be sufficient cause for judging that the
5. Purity of Copper
laminate is not resistant to the solvent used.
7.3.2 The identification of the laminate tested.
5.1 Significance and Use—Since the electrical conductance
7.3.3 The identification of the solvent used.
of copper can be adversely affected by small amounts of
impurities, this test provides assurance that the circuits fabri-
7.4 Precision and Bias:
cated from the laminate will provide sufficient conductance for
7.4.1 No statement is made about the precision or bias of
signal transmission. The grain structure and the porosity of
this test method for measuring resistance to solvents since the
copper also affect conductance.
resultmerelystateswhetherthereisconformancetothecriteria
for acceptability specified in the procedure.
5.2 Procedure—Analyzethecopperforpurityinaccordance
with Test Methods E53.
8. Solder Float Test
5.3 Report the following information:
8.1 Significance and Use—Many printed wiring boards are
5.3.1 The amount of copper, %, and
populatedwithcomponentsfollowedbysolderingeithermanu-
5.3.2 The identity of the laminate sampled for testing.
ally or with a wave soldering process.Apopular circuit design
5.4 Precision and Bias:
uses a fabrication process known as soldermask over bare
5.4.1 See Test Methods E53. copper (SMOBC) in which the laminate is submerged in
molten solder. In either of these two cases, the laminate is
subjected to exposure to molten solder temperatures for short
6. Warp or Twist
periods of time. This test method provides useful information
6.1 Significance and Use—Flat laminate material of large
aboutthesuitabilityofbothcladanduncladlaminatetosurvive
area per sheet is desirable for the most efficient fabrication of
these exposures. (Warning—Molten solder can cause severe
bare circuit boards. Lack of warp or twist is very necessary for
burns. Care should be exercised to prevent injury.)
efficient placement of components on the fabricated but un-
8.2 Unetched Laminate:
populated circuit boards particularly if automatic insertion
8.2.1 Prepare test specimens of unetched laminate having
machinery is used to install components on the circuit boards.
dimensions 25 by 25 6 1 mm by any thickness. For laminate
6.2 Procedure—Determine warp or twist on full size lami-
clad on both sides, two specimens are required, one for each
nate sheets that are in the “as is” condition. Test and report the
side.Ifspecimensthatsurvivethesolderdipexposurearetobe
results in accordance with Test Methods D229.
used for peel strength tests in accordance with Section 9, at
least three specimens are required.
7. Solvent Resistance
8.2.2 Procedure—Float an unfluxed, unetched specimen,
7.1 Significance and Use—Solvents are often used for copper side down, on clean molten tin/lead 60/40 solder that is
processing or cleaning purposes in the fabrication of printed at the temperature specified in Specification D1867 for the
wiring boards. The solvents are used sometimes at elevated thickness of the laminate being tested. At the end of the time
D5109 − 99 (2004)
specified in Specification D1867, remove the specimen and relationtotheforcesthatmaybeexerteduponanytraceonany
examine the copper surface for evidence of blisters. For circuit boards in service.
laminate clad on two sides, use a fresh specimen for testing
9.3 The specimens that passed the solder float test of 8.3.2
each side.
may be used for the room temperature peel strength tests since
8.3 Etched Laminate: they contain the etched patterns required for peel tests. Other-
8.3.1 A specimen is unconditioned laminate of any thick- wise, using the procedures of Practice D1825, etch patterns as
ness which is 50 by 50 6 5 mm. Etch each specimen in in Fig. 1 on at least three specimens of copper-clad laminate.
accordancewithPracticeD1825soastohaveanetchedpattern
9.4 Procedure—Peel back the copper foil from the 6-mm
as in Fig. 1.
end of the copper strip for approximately 25 mm so that the
8.3.2 Procedure:
line of peel is perpendicular to the surface of the substrate.
8.3.2.1 Float the unfluxed specimen with its etched copper
Clamp each specimen, or hold it on a horizontal surface with
trace side to be tested down on clean molten 60/40 tin/lead
the peeled copper strip up, providing a 25-mm span. Grip the
solder at the temperatures and for the times shown in Specifi-
end of the peeled strip between two knurled jaws of a clamp.
cation D1867.
Attach a flexible chain to a dial-indicating force indicator that
8.3.2.2 At the end of the time specified for each grade,
has been adjusted to compensate for the weights of the chain
removethespecimen,allowittocooltoroomtemperature,and
and the clamp. Adjust the jaws to cover the full width of the
thenexamineitforevidenceof:(1)blisteringbetweenlayersof
copper strip and clamp them parallel to the line of peel. With
laminate, (2) blistering between copper and substrate, or (3)
the force indicator in a vertical plane, exert a steady vertical
delamination of the copper foil.
pull (approximately 50 mm/min) until the needle indicator
8.3.2.3 For double-sided clad laminate, use a fresh speci-
shows a constant reading. If the full width of the copper strip
men for examining each side. If no delamination or blistering
does not peel, discard this specimen and repeat the procedure
is seen, the specimens that were exposed to solder dip may be
on another specimen. Make at least three tests and record the
used for the peel strength tests of Section 9.
test result in accordance with Practice D3636.
8.3.3 Report—Report the following information:
9.5 Report—Report the following information:
8.3.3.1 Any evidence of blistering between laminate layers,
9.5.1 The identity of the laminate,
8.3.3.2 Any evidence of blistering between the copper and
9.5.2 The room temperature peel strength test result after
any substrate, and
solder float in N/mm of width, and
8.3.3.3 Any delamination of the copper foil from the sub-
9.5.3 The total number of strips tested.
strate.
9.6 Precision and Bias:
9. Peel Strength Test
9.6.1 This test has been in use for many years, but no
9.1 This test is performed at room temperature on speci- information has been presented to ASTM upon which to base
a statement of precision. No activity has been planned to
mens of laminate that have previously been subjected to the
develop such information.
solder float test.
9.6.2 Thistestmethodhasnobiasbecausethevalueforpeel
9.2 Significance and Use—This test method is useful for
strength is determined solely in terms of this test method itself.
evaluating laminate for the detrimental effects, if any, due to
soldering or other exposure to elevated temperature, upon the
10. Peel Strength Test at Elevated Temperature
integrity of the bond interface between the dielectric substrate
10.1 There are two procedures, identified as Procedure A
and the copper foil. There is no significance to this test in
and Procedure B. Only one is required. No preference is given
here for either procedure. Procedure A uses the narrow
(3.2–mm)peelstrengthstripsetchedusingthepatterninFig.1.
Procedure B uses an unconditioned copper-clad laminate for
preparing specimens on which are etched 25 by 100–mm
patterns for peel strength test strips. Procedure B is often used
for quality control purposes.
10.2 Significance and Use:
10.2.1 Either procedure of this test method provides infor-
mation that deals with the integrity of the adhesive bond
between the copper foil and the dielectric while the laminate is
at an elevated temperature. Such temperatures may be encoun-
tered in fabricating circuit boards or in assembly operations,
but the forces exerted in this test are not related in any way to
the manner in which forces are likely to be encountered by the
laminate in service or during fabrication or assembly.
10.2.2 Either procedure may show a drastic reduction in the
peel strength at elevated temperature compared to the peel
FIG. 1 Test Specimen for Peel Strength and Solder Float Tests strengthatroomtemperatureifthetesttemperatureexceedsthe
D5109 − 99 (2
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