IEC 60393-4:2023 is applicable to single-turn rotary power potentiometers wire-wound technology. Enamelled, cemented, moulded, enclosed. This specification is applicable to rotary potentiometers with nominal dissipation in excess of 10 W, the resistive element of which consists of a wire or a wound tape. All the potentiometers specified by this specification are slider-driven without reduction. Their stroke less than 360° is limited by stops. This document specifies preferred ratings and characteristics and selects from IEC 60393-1, appropriate quality assessment procedures, tests and measuring methods. It provides general performance requirements for this type of potentiometer. This document gives the minimum performance requirements and test severities. Annex A lists the letters and symbols used in the clauses of this document. This edition includes the following significant technical changes with respect to the previous edition: a) the document structure has been organized to follow new sectional specification structure decided in TC 40; b) the information on the assessment level EZ and FZ (zero nonconforming) has been revised.

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This part of IEC 60393 applies to rotary precision potentiometers for use in electronic equipment. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60393-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of potentiometer. This standard gives the minimum performance requirements and test severities.

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IEC 60539-1:2022 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This edition includes the following significant technical changes with respect to the previous edition:
Restructured completely to comply to ISO/IEC directives; categorization and reorganization of test methods into these categories;
Annex X added for comparison to the previous edition;
Some wordings, figures and references have been revised.

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This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant technical changes with respect to the previous edition: a) complete revision of structure; b) consolidation of essential parameters and requirements in Clause 4.

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This part of IEC 60738 describes terms and methods of test for positive step-function temperature coefficient thermistors, insulated and non-insulated types typically made from ferro-electric semi-conductor materials. It establishes standard terms, inspection procedures and methods of test for use in detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components.

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Specifies marking codes for resistors and capacitors and indexes for the dielectric material and the electrodes of plastic film and paper capacitors

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IEC 60539-2:2019 is available as IEC 60539-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards. This edition includes the following significant technical changes with respect to the previous edition: a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016; b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1 have been added; c) the dimensions of 0402M in Annex A have been added.

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IEC 60286-3:2019 is available as IEC 60286-3:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.

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This part of IEC 61051 is a sectional specification and is applicable to metal oxide varistors with symmetrical voltage-current characteristics for use in electronic equipment connected to any AC or DC supply system. These varistors are designed to protect electronic and other sensitive equipment from high transient surges. Varistors under the scope of this sectional specification are not intended to give primary protection against lightning surges. These varistors have metallic connections and are intended to be mounted as through hole component or directly on to printed boards. The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 61051-1 the appropriate quality assessment procedures, tests and measuring methods, and to give general performance requirements for this type of varistors. Test severities and requirements prescribed in detail specifications referring to this sectional specification should be of equal or higher performance level, because lower performance levels are not permitted.

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This part of IEC 61051 is a generic specification and is applicable to varistors with symmetrical voltage-current characteristics for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications for quality assessment or any other purpose. NOTE Detail specifications can be specifications within the IEC system, another specification system linked to IEC, or specified by the manufacturer or user. The drafting of a complete detail specification by IEC technical committee 40, if required, follows the rules described in Annex A.

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NEW!IEC 60286-5:2018 is available as IEC 60286-5:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60286-5:2018 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This edition includes the following significant technical changes with respect to the previous edition: - The generic rules for the design of matrix trays are given in this document. Newly developed trays which follow these rules will not be listed individually. Only those trays which conform to the design rules set forth herein are classified as "standard trays" and are thus preferred for use. - An update of the matrix trays, which do not conform to the design rules set forth herein, are considered as "non-standard trays" and are not preferred for use, is listed in Annex A.

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IEC 60286-1:2017(E) applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: a) a complete revision of the structure (detailed in Annex A) and reworked layout.

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Specifies marking codes for resistors and capacitors and indexes for the dielectric material and the electrodes of plastic film and paper capacitors

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IEC 60539-1:2016 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This third edition cancels and replaces the second edition published in 2008. This edition constitutes a technical revision. Tables, figures and references have been revised.

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IEC 60393-6:2015 applies to surface mount preset potentiometers for use in electronic equipment. This part of IEC 60393 prescribes preferred ratings and characteristics and selects from IEC 60393-1, the appropriate quality assessment procedures, tests and measuring methods, and it gives general performance requirements for this type of potentiometers. This standard gives the minimum performance requirements and test severities. This edition includes the following significant technical changes with respect to the previous edition: a) revision of the information on the assessment level EZ (zero nonconforming); b) complete editorial revision.

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IEC 60393-2:2015 applies to lead-screw actuated and rotary preset potentiometers, wirewound and non-wirewound for use in electronic equipment. These potentiometers are primarily intended for use in circuits for trimming purposes which require infrequent adjustments. This part of IEC 60393 prescribes preferred ratings and characteristics and selects from IEC 60393-1 the appropriate quality assessment procedures, tests and measuring methods. It provides general performance requirements for this type of potentiometer. This standard gives the minimum performance requirements and test severities. This edition includes the following significant technical changes with respect to the previous edition: a) revision of the information on the assessment level EZ and FZ (zero nonconforming); b) complete editorial revision.

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IEC 60393-5:2015 applies to single-turn rotary low-power wirewound and non-wirewound potentiometers, with a rated dissipation less than to 10 W. These potentiometers are primarily intended for use in electronic equipment. This part of IEC 60393 prescribes preferred ratings and characteristics and selects from IEC 60393-1, appropriate quality assessment procedures, tests and measuring methods. It provides general performance requirements for this type of potentiometer. This standard gives the minimum performance requirements and test severities. This edition includes the following significant technical changes with respect to the previous edition: a) revision of the information on the assessment level EZ and FZ (zero nonconforming); b) complete editorial revision.

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IEC 60286-2:2015 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: - A complete revision of the structure and reworked layout. - A two page overview containing a clear overview of all symbols and references. - Addition of annexes of known radial tape formats. - Improved figures.

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IEC 60063:2015 provides series of preferred values for the resistance of resistors and for the capacitance of capacitors. The definition of such series with a defined numeric resolution is a basic prerequisite for the marking and coding of capacitors and resistors with their respective capacitance or resistance values as described in IEC 60062. This edition includes the following significant technical changes with respect to the previous edition: - revision of the information on a relationship between an E Series and the tolerance of a resistance or capacitance value of a respective component; - introduction of advice on a possible deduction from the marking of a component to an associated E Series and also to an associated tolerance; - complete editorial revision.

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IEC corrigendum

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IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.

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IEC 60717:2012 applies to capacitors and resistors with unidirectional wire terminations intended for use in electronic equipment. This standard provides a method for determination of the space required by capacitors and resistors with unidirectional wire terminations. NOTE: Instead of measuring the actual space, it may be sufficient to ensure that a component fits into the maximum space for which it is designed. This may be achieved by means of fixed gauges. The main technical changes with respect to the first edition are the following: - employment of the millimetre-based grid, the preferred grid system given in IEC 60097, - employment of SI units only, causing deletion of the imperial dimensions from Table 1, - reduction of the tolerance on the chamfer depth in Figure 1, and - introduction of requirements on information to be given in a relevant specification.

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IEC 60286-3-2:2009(E) is applicable to the tape packing of ultra small surface mount components using plastic blister carrier tape of 4 mm in width which has concave cavities for containing components of 1 mm in pitch of the component compartments (W4P1).

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IEC 60286-3-1:2009(E) is applicable to the taping of surface mount components using carrier tapes which have concave cavities formed by compression of the base material.

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IEC 60393-1:2008(E) is applicable to all types of resistive potentiometers, including lead-screw actuated types, presets, multi-turn units, etc. to be used in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. It has been mainly written, and the test methods described, to conform to the widely used single-turn rotary potentiometer with an operating shaft . This edition contains the following significant technical changes with respect to the previous edition: implementation of Annex H which replaces Section 3 of the previous edition. It also includes minor revisions related to tables, figures and references.

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is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006,1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the revised Generic Specification IEC 60738-1.

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Is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006, 1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the revised Generic Specification IEC 60738-1.

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Is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006,1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the revised Generic Specification IEC 60738-1.

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is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006, 1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the revised generic specification IEC 60738-1.

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IEC 60915:2006 contains preferred dimensions for shaft ends and bushes and for the mounting of single-hole, bush-mounted, shaft-operated variable capacitors, variable resistors and potentiometers. If other dimensions not listed in this standard have to be used, it is recommended to select them also from IEC 60390 and IEC 60620. This second edition cancels and replaces the first edition published in 1987 and constitutes a minor revision, related to tables, figures and references. This bilingual version, published in 2008-07, corresponds to the English version. The contents of the corrigendum of December 2008 have been included in this copy.

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IEC 60738-1:2006 describes terms and methods of test for positive step-function temperature coefficient thermistors, insulated and non-insulated types typically made from ferro-electric semi-conductor materials. It establishes standard terms, inspection procedures and methods of test for use in detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components. This third edition cancels and replaces the second edition published in 1998 and constitutes a minor revision. The changes with respect to the previous edition refer to the tables, figures and references.

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Is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an appropriate feeder to the placement machine. The bulk case is attached to the automatic handling machine by means of a coupling interface

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Prescribes terms and methods of test for polymeric positive temperature coefficient thermistors, insulated and non-insulated types, typically intended for use in current limiting and overcurrent protection applications. It establishes standard terms, inspection procedures and methods of test for use in detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components.

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Is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described.

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IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

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This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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Amandma A1:2010 je dodatek k standardu SIST EN 60539-2:2004
This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

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IEC 60286-2 applies to the tape package of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, preforming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. It cancels and replaces the second edition published in 1997 and its amendment 1 (2002) and constitutes a minor revision related to tables, figures and references.

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It is applicable to varistors with symmetrical voltage current characteristics for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components.

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It is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. It constitutes a minor revision related to tables, figures and references.

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Relates to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. Includes only those dimensions which are essential for the taping of components for the above-mentioned purposes.

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specifies marking codes for resistors and capacitors and indexes for the dielectric material and the electrodes of plastic film and paper capacitors

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describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays.

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is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

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Superseded by EN 60062:2005

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