EN 60286-3:2013

SLOVENSKI STANDARD
01-oktober-2013
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih
Packaging of components for automatic handling - Part 3: Packaging of surface mount
components on continuous tapes
Gurtung und Magazinierung von Bauelementen für die automatische Verarbeitung - Teil
3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues
Ta slovenski standard je istoveten z: EN 60286-3:2013
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60286-3
NORME EUROPÉENNE
August 2013
EUROPÄISCHE NORM
ICS 31.020; 31.240 Supersedes EN 60286-3:2007

English version
Packaging of components for automatic handling -
Part 3: Packaging of surface mount components on continuous tapes
(IEC 60286-3:2013)
Emballage de composants pour Gurtung und Magazinierung von
opérations automatisées - Bauelementen für die automatische
Partie 3: Emballage des composants pour Verarbeitung -
montage en surface en bandes continues Teil 3: Gurtung von
(CEI 60286-3:2013) oberflächenmontierbaren Bauelementen
auf Endlosgurten
(IEC 60286-3:2013)
This European Standard was approved by CENELEC on 2013-06-21. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60286-3:2013 E
Foreword
The text of document 40/2200/FDIS, future edition 5 of IEC 60286-3, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN 60286-3:2013.

The following dates are fixed:
(dop) 2014-03-21
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-06-21
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60286-3:2007.

EN 60286-3:2007:
a) integration of EN 60286-3-1:2009 as type 1b (Packaging of surface mount components on
continuous pressed carrier tapes);
b) integration of EN 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister
carrier tapes 4 mm in width).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 60286-3:2013 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60286-3-1:2009 NOTE Harmonised as EN 60286-3-1:2009 (not modified).
IEC 60286-3-2:2009 NOTE Harmonised as EN 60286-3-2:2009 (not modified).
IEC/TR 62258-3 NOTE Harmonised as CLC/TR 62258-3.
ISO 11469 NOTE Harmonised as EN ISO 11469.

- 3 - EN 60286-3:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60191-2 - Mechanical standardization of - -
semiconductor devices -
Part 2: Dimensions
IEC 61340-5-1 - Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements
IEC/TR 61340-5-2 - Electrostatics - CLC/TR 61340-5-2 -
Part 5-2: Protection of electronic devices
from electrostatic phenomena - User guide

IEC 60286-3 ®
Edition 5.0 2013-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –

Part 3: Packaging of surface mount components on continuous tapes

Emballage de composants pour opérations automatisées –

Partie 3: Emballage des composants pour montage en surface en bandes

continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 31.020; 31.240 ISBN 978-2-83220-819-9

– 2 – 60286-3 © IEC:2013
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 General . 8
1.1 Scope . 8
1.2 Normative references . 8
2 Terms and definitions . 8
3 Structure of the specification . 10
4 Dimensional requirements for taping. 10
4.1 Component cavity positioning requirements . 10
4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3. 10
4.1.2 Requirements for types 4 . 10
4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) . 11
4.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths:
8 mm and 12 mm) . 12
4.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) . 14
4.5 Type2a – Blister carrier tape, with single round sprocket holes and tape
pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) . 16
4.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

1mm tape pitch (tape widths: 4 mm) . 18
4.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) . 20
4.8 Type 4 – Adhesive-backed punched plastic carrier tape for singulated bare
die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22
5 Polarity and orientation requirements of components in the tape . 25
5.1 Requirements for all tape types . 25
5.2 Specific requirements for type 1a . 25
5.3 Specific requirements for type 4 . 25
6 Carrier tape requirements . 25
6.1 Taping materials . 25
6.2 Minimum bending radius (for all types) . 26
6.3 Camber . 26
7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27
8 Component taping and additional tape requirements . 28
8.1 All types . 28
8.2 Specific requirements for type 1b . 28
8.3 Specific tape requirements for type 2b. 28
8.4 Specific requirement for type 4 . 28
8.4.1 General . 28
8.4.2 Coordinate system . 29
8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30
8.5 Specific requirements for tapes containing die products . 31
8.5.1 General . 31
8.5.2 Tape design for tapes containing die products . 31
8.5.3 Cleanliness . 31
8.5.4 Die lateral movement (Types 1a, 2a and 2b) . 32
9 Reel requirements . 32
9.1.1 General . 32

60286-3 © IEC:2013 – 3 –
9.1.2 Reel dimensions related to tape (see Figure 24 and Table 23) . 32
9.1.3 Reel hole dimensions (see Figure 25 and Table 24) . 34
9.2 Marking . 34
10 Tape reeling requirements . 35
10.1 All types . 35
10.2 Specific requirements for type 1a . 35
10.3 Specific requirements for type 4 . 35
10.4 Leader and trailer tape (see Figure 27) . 36
10.4.1 Leader . 36
10.4.2 Trailer . 36
10.5 Recycling . 36
10.6 Missing components . 36
Annex A (normative) Recommended measuring methods for type 1b . 37
Bibliography . 39

Figure 1 – Sectional view of component cavity (type 1b) . 9
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) . 12
Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 12
Figure 4 – Maximum component tilt, rotation and lateral movement . 12
Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) . 14
0 1 0 1
Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset . 14
Figure 7 – Maximum component tilt, rotation and lateral m
...