EN 60286-3:2013/AC:2013
(Corrigendum)Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues
Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih
Ta del standarda IEC 60286 se uporablja za tračno pakiranje elektronskih komponent brez vodov ali ostankov vodov, namenjenih za povezavo z elektronskimi vezji. Vključuje samo dimenzije, bistvene za tračno pakiranje komponent, ki so namenjene za zgoraj navedene namene. Ta standard vključuje tudi zahteve glede pakiranja proizvodov s singularnimi polprevodniškimi integriranimi vezji, vključno s tistimi brez ohišja in tistimi z izboklinami (»flip chip«).
General Information
- Status
- Withdrawn
- Publication Date
- 31-Oct-2013
- Technical Committee
- CLC/SR 40 - Capacitors and resistors for electronic equipment
- Drafting Committee
- IEC/TC 40 - IEC_TC_40
- Current Stage
- 9960 - Withdrawal effective - Withdrawal
- Start Date
- 20-Feb-2022
- Completion Date
- 20-Feb-2022
Relations
- Effective Date
- 23-Jan-2023
- Effective Date
- 28-Jan-2023
Frequently Asked Questions
EN 60286-3:2013/AC:2013 is a corrigendum published by CLC. Its full title is "Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes". This standard covers: This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
EN 60286-3:2013/AC:2013 is classified under the following ICS (International Classification for Standards) categories: 31.020 - Electronic components in general; 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60286-3:2013/AC:2013 has the following relationships with other standards: It is inter standard links to EN IEC 60286-3:2019, EN 60286-3:2013. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60286-3:2013/AC:2013 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Pakiranje komponent za avtomatsko ravnanje - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovihGurtung und Magazinierung von Bauelementen für die automatische Verarbeitung -- Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf EndlosgurtenEmballage de composants pour opérations automatisées -- Partie 3: Emballage des composants pour montage en surface en bandes continuesPackaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes55.060Tulci. VretenaSpools. Bobbins31.020Elektronske komponente na
...




Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.
Loading comments...