Directly heated negative temperature coefficient thermistors - Part 1: Generic specification

It is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. It constitutes a minor revision related to tables, figures and references.

Direkt geheizte temperaturabhängige Widerstände mit negativem Temperaturkoeffizienten - Teil 1: Fachgrundspezifikation

Thermistors à coefficient de température négatif à chauffage direct - Partie 1: Spécification générique

La CEI 60539-1:2008 s'applique aux thermistances à coefficient de température négatif à chauffage direct, typiquement constitués de matériaux faits d'oxyde de métal de transition dotés de propriétés semi-conductrices. Elle définit les termes normalisés, les procédures d'inspection et les méthodes d'essai utilisés dans les spécifications intermédiaires et particulières des composants électroniques dans le cadre de l'assurance qualité, ainsi qu'à d'autres fins.

Neposredno ogrevani termistorji z negativnim koeficientom - 1. del: Rodovna specifikacija (IEC 60539-1:2008)

General Information

Status
Withdrawn
Publication Date
07-May-2008
Withdrawal Date
28-Feb-2011
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
01-Jun-2019
Completion Date
01-Jun-2019

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SLOVENSKI STANDARD
01-julij-2008
1DGRPHãþD
SIST EN 60539-1:2003
Neposredno ogrevani termistorji z negativnim koeficientom - 1. del: Rodovna
specifikacija (IEC 60539-1:2008)
Directly heated negative temperature coefficient thermistors - Part 1: Generic
specification (IEC 60539-1:2008)
Direkt geheizte temperaturabhängige Widerstände mit negativem
Temperaturkoeffizienten - Teil 1: Fachgrundspezifikation (IEC 60539-1:2008)
Thermistors à coefficient de température négatif à chauffage direct - Partie 1:
Spécification générique (CEI 60539-1:2008)
Ta slovenski standard je istoveten z: EN 60539-1:2008
ICS:
31.040.30 Termistorji Thermistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60539-1
NORME EUROPÉENNE
May 2008
EUROPÄISCHE NORM
ICS 31.040.30 Supersedes EN 60539-1:2002

English version
Directly heated negative temperature coefficient thermistors -
Part 1: Generic specification
(IEC 60539-1:2008)
Thermistors à coefficient de température Direkt geheizte temperaturabhängige
négatif à chauffage direct - Widerstände mit negativem
Partie 1: Spécification générique Temperaturkoeffizienten -
(CEI 60539-1:2008) Teil 1: Fachgrundspezifikation
(IEC 60539-1:2008)
This European Standard was approved by CENELEC on 2008-03-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60539-1:2008 E
Foreword
The text of document 40/1878A/FDIS, future edition 2 of IEC 60539-1, prepared by IEC TC 40,
Capacitors and resistors for electronic equipment, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 60539-1 on 2008-03-01.
This European Standard supersedes EN 60539-1:2002. It constitutes a minor revision related to tables,
figures and references.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2011-03-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60539-1:2008 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60539-1:2008
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 60027-1 - Letter symbols to be used in electrical EN 60027-1 2006
technology -
Part 1: General
IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
1) 2)
IEC 60062 - Marking codes for resistors and capacitors EN 60062 2005
+ corr. January 2007
IEC 60068-1 1988 Environmental testing -
+ A1 1992 Part 1: General and guidance EN 60068-1 1994

IEC 60068-2-1 2007 Environmental testing - EN 60068-2-1 2007
Part 2-1: Tests - Test A: Cold

IEC 60068-2-2 2007 Environmental testing - EN 60068-2-2 2007
Part 2-2: Tests - Test B: Dry heat

3)
IEC 60068-2-6 1995 Environmental testing - EN 60068-2-6 1995
Part 2-6: Tests - Test Fc: Vibration
(sinusoidal)
IEC 60068-2-11 1981 Environmental testing - EN 60068-2-11 1999
Part 2-11: Tests - Test Ka: Salt mist

IEC 60068-2-14 1984 Environmental testing -
+ A1 1986 Part 2-14: Tests - Test N: Change of EN 60068-2-14 1999
temperature
IEC 60068-2-17 1994 Environmental testing - EN 60068-2-17 1994
Part 2-17: Tests - Test Q: Sealing

IEC 60068-2-20 1979 Environmental testing -
+ A2 1987 Part 2-20: Tests - Test T: Soldering HD 323.2.20 S3 1988

IEC 60068-2-21 2006 Environmental testing - EN 60068-2-21 2006
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices

IEC 60068-2-27 1987 Basic environmental testing procedures - EN 60068-2-27 1993
Part 2-27: Tests - Test Ea and guidance:
Shock
IEC 60068-2-29 1987 Environmental testing - EN 60068-2-29 1993
Part 2-29: Tests - Test Eb and guidance:
Bump
IEC 60068-2-32 1975 Environmental testing -
+ A2 1990 Part 2-32: Tests - Test Ed: Free fall EN 60068-2-32 1993

1)
Undated reference.
2)
Valid edition at date of issue.
3)
EN 60068-2-6 is superseded by EN 60068-2-6:2008, which is based on IEC 60068-2-6:2007.

Publication Year Title EN/HD Year
IEC 60068-2-38 1974 Environmental testing - EN 60068-2-38 1999
Part 2-38: Tests - Test Z/AD: Composite
temperature/humidity cyclic test

IEC 60068-2-45 1980 Environmental testing - EN 60068-2-45 1992
A1 1993 Part 2-45: Tests - Test XA and guidance: A1 1993
Immersion in cleaning solvents

IEC 60068-2-52 1996 Environmental testing - EN 60068-2-52 1996
Part 2-52: Tests - Test Kb: Salt mist, cyclic
(sodium chloride solution)
IEC 60068-2-54 2006 Environmental testing - EN 60068-2-54 2006
Part 2-54: Tests - Test Ta: Solderability
testing of electronic components by the
wetting balance method
IEC 60068-2-58 2004 Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-69 2007 Environmental testing - EN 60068-2-69 2007
Part 2-69: Tests - Test Te: Solderability
testing of electronic components for surface
mounting devices (SMD) by the wetting
balance method
IEC 60068-2-78 2001 Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
1)
IEC 60294 - Measurement of the dimensions of a - -
cylindrical component having two axial
terminations
1)
IEC 60410 - Sampling plans and procedures for inspection - -
by attributes
IEC 60617 Data- Graphical symbols for diagrams - -
base
1)
IEC 60717 - Method for the determination of the space - -
required by capacitors and resistors with
unidirectional terminations
1) 2)
IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
1)
IEC QC 001002-3 - IEC Quality Assessment System - -
for Electronic Components (IECQ) - Rules of
Procedure -
Part 3: Approval procedures
1)
ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units

IEC 60539-1
Edition 2.0 2008-02
INTERNATIONAL
STANDARD
QC 430 000
Directly heated negative temperature coefficient thermistors –
Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.040.30 ISBN 2-8318-9584-7

– 2 – 60539-1 © IEC:2008(E)
CONTENTS
FOREWORD.4

1 General .6
1.1 Scope.6
1.2 Normative references .6
2 Technical data.8
2.1 Units, symbols and terminology .8
2.2 Terms and definitions .8
2.3 Preferred values.16
2.4 Marking .16
3 Quality assessment procedures.17
3.1 General .17
3.2 Primary stage of manufacture.17
3.3 Structurally similar components.17
3.4 Qualification approval procedures .18
3.5 Quality conformance inspection.18
3.6 Certified test records of released lots .18
3.7 Delayed delivery.19
3.8 Release for delivery under qualification approval before the completion of
group B tests.19
3.9 Alternative test methods .19
3.10 Unchecked parameters.19
4 Test and measurement procedures.19
4.1 General .19
4.2 Standard atmospheric conditions for testing .19
4.3 Drying and recovery .20
4.4 Mounting (for surface mount thermistors only) .20
4.5 Visual examination and check of dimensions.21
4.6 Zero-power resistance.22
4.7 B-value or resistance ratio.22
4.8 Insulation resistance (for insulated types only) .23
4.9 Voltage proof (for insulated types only) .26
4.10 Resistance/temperature characteristic.26
4.11 Dissipation factor (δ) .26
4.12 Thermal time constant by ambient temperature change (τ ) .28
a
4.13 Thermal time constant by cooling after self-heating (τ ) .28
c
4.14 Robustness of terminations (not applicable to surface mount thermistors) .29
4.15 Resistance to soldering heat .30
4.16 Solderability .31
4.17 Rapid change of temperature .32
4.18 Vibration.32
4.19 Bump .33
4.20 Shock.33
4.21 Free fall (if specified in the detail specification) .33

60539-1 © IEC:2008(E) – 3 –
4.22 Thermal shock (if specified in the detail specification) .34
4.23 Cold (if required by the sectional specification) .34
4.24 Dry heat (if required by the sectional specification) .34
4.25 Damp heat, steady state.35
4.26 Endurance.35
4.27 Shear (adhesion) test .
...

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