IEC 60194:1999

INTERNATIONAL IEC
STANDARD
Fourth edition
1999-04
Printed board design, manufacture
and assembly –
Terms and definitions
Conception, fabrication et assemblage
des cartes imprimées –
Termes et définitions
Reference number
Numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series.
Consolidated publications
Consolidated versions of some IEC publications including amendments are

available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the
base publication, the base publication incorporating amendment 1 and the base

publication incorporating amendments 1 and 2.

Validity of this publication
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology.
Information relating to the date of the reconfirmation of the publication is available
in the IEC catalogue.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is to be found at the following IEC sources:
• IEC web site*
•
Catalogue of IEC publications
Published yearly with regular updates
(On-line catalogue)*
• IEC Bulletin
Available both at the IEC web site* and as a printed periodical
Terminology, graphical and letter symbols
For general terminology, readers are referred to IEC 60050: International
Electrotechnical Vocabulary (IEV).
For graphical symbols, and letter symbols and signs approved by the IEC for
general use, readers are referred to publications IEC 60027: Letter symbols to be
used in electrical technology, IEC 60417: Graphical symbols for use on equipment.
Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols
for diagrams.
* See web site address on title page.

INTERNATIONAL IEC
STANDARD
Fourth edition
1999-04
Printed board design, manufacture
and assembly –
Terms and definitions
Conception, fabrication et assemblage
des cartes imprimées –
Termes et définitions
 IEC 1999  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
XE
International Electrotechnical Commission
For price, see current catalogue

– 2 – 60194 © IEC:1999(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –

TERMS AND DEFINITIONS
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60194 has been prepared by IEC technical committee 52: Printed
circuits.
This fourth edition cancels and replaces the third edition published in 1988. This fourth edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
52/801/FDIS 52/806/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
Annexes A, B and C are for information only.
A bilingual version of this standard may be issued at a later date.

60194 © IEC:1999(E) – 3 –
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY –

TERMS AND DEFINITIONS
1 Scope
This International Standard defines the terminology used in the field of printed circuit boards

and printed circuit board assembly products.

2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this International Standard. For dated references, subsequent
amendments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this International Standard are encouraged to investigate the possibility
of applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60050(541), International Electrotechnical Vocabulary (IEV) – Chapter 541: Printed circuits
3 General
The terms have been classified according to the decimal classification code (DCC) and this
DCC number appears to the right of the defined term. The DCC numbering is explained fully
in annex A.
In order to avoid two ID numbers the usual practice of numbering every paragraph (every term
and definition) in front of the paragraph has not been followed in this standard. The official
IEC number is the number which follows the DCC and the period (21.xxxx). Annex B includes
an index of terms listed numerically according to the DCC number. Annex C includes an index
of terms listed alphabetically.
4 Terms and definitions
– 4 – 60194 © IEC:1999(E)
Acid-core solder 46.0008
Abrasive trimming 54.1318
Adjusting the value of a film component by Wire solder with a self-contained acid flux.

notching it with a finely-adjusted stream of an

Acid flux 46.0009
abrasive material against the resistor surface.

An aqueous solution of an acid and an
Absorption coefficients 40.1727

inorganic, organic, or water-soluble flux. (See

The degree to which various materials absorb also "Inorganic flux", "Organic flux", and

heat or radiant energy when compared to each "Water-soluble flux".)
other.
Acid number 54.0010
Accelerated ageing 93.0001
The amount of potassium hydroxide in

The means whereby the deterioration milligrams that is required to neutralize one

encountered in natural ageing is artificially gram of a substance.

reproduced and hastened.
Acid value 54.1217
Accelerator 53.0002
See "Acid number".
See "Catalyst".
Actinic radiation 52.0011
Acceptance quality level (AQL) 90.0003
Light energy that reacts with a photosensitive
The maximum number of defectives likely to material in order to produce an image.
exist within a population (lot) that can be
Activated rosin flux 46.0012
considered to be contractually tolerable;
normally associated with statistically derived A mixture of rosin and small amounts of
sampling plans.
organic-halide or organic-acid activators. (See
also "Synthetic activated flux".)
Acceptance tests 92.0004
Activating 53.0013
Those tests deemed necessary to determine
the acceptability of a product and as agreed to
A treatment that renders non-conductive
by both purchaser and vendor. material receptive to electroless deposition.
Access hole 60.1319
Activating layer 53.0014
A series of holes in successive layers of a A layer of material that renders a non-
multilayer board, each set having their centres
conductive material receptive to electroless
on the same axis. These holes provide access deposition.
to the surface of the land on one of the layers
Activator 46.0015
of the board.
A substance that improves the ability of a flux
to remove surface oxides from the surfaces
being joined.
Active device 30.0016
An electronic component whose basic
character changes while operating on an
applied signal. (This includes diodes,
Figure A-1: Access Hole
transistors, thyristors and integrated circuits
that are used for the rectification, amplification,

Access holes 22.1619
switching, etc. of analog or digital circuits in
A series of holes in successive layers, each set
either monolithic or hybrid form.)
having their centres on the same axis.
Active metal 36.0017
Access protocol 21.0005
A metal that is very high in electromotive force.
A method for establishing how nodes in a
Active trimming 54.1321
network communicate.
Adjusting the value of a film circuit element in
Accordion contact 36.0006
order to obtain a specified functional output
A type of connector contact that consists of a
from the circuit while it is electrically activated.
flat spring formed into a "Z" shape in order to
(See also "Functional trimming".)
permit high deflection without overstress.
Actual size 90.0018
Accuracy 90.0007
The measured size.
The deviation of the measured or observed
value from the accepted reference.

60194 © IEC:1999(E) – 5 –
Additive process 53.1322 Air pollution 14.0027

A process for obtaining conductive patterns by Contamination of the atmosphere with

the selective deposition of conductive material substances that are toxic or otherwise harmful.

on clad or unclad base material. (See also

Algorithm 11.0849
"Semi-additive process" and "Fully-additive

process".) [IEV 541-04-03, modified] A set of procedures for the solution of a problem

in a series of steps.
Add-on component 30.0019
Alignment mark 22.0030
Discrete or integrated packaged or chip
components that are attached to a film circuit in
A stylized pattern that is selectively positioned

order to complete the circuit's function. on a base material to assist in alignment.

Adhesion failure 96.0020
Aliphatic solvents 76.0031
The rupture of an adhesive bond such that the "Straight chain" solvents, derived from

separation appears to be at the adhesive- petroleum, of low solvent power.
adherend interface.
Alkaline cleaner 76.0032
Adhesion layer 74.0021
A material blended from alkali hydroxides and
The metal layer that adheres a barrier metal to alkaline salts.
a metal land on the surface of an integrated
Alpha error 91.0033
circuit.
The size of a Type I error or the probability of
Adhesion promotion 53.0022
rejecting a hypothesis that is true.
The chemical process of preparing a surface to
Alphanumerical 25.1729
enhance its ability to be bonded to another
surface or to accept an over-plate.
Pertaining to data that contain the letters of an
alphabet, the decimal digits, and may contain
Adhesive 46.1728
control characters, special characters and the
A substance such as glue or cement used to space character.
fasten objects together. In surface mounting, an
Alternating current (a.c.) 21.1793
epoxy adhesive is used to adhere SMD's to the
substrate.
A current that varies with time, commonly
applied to a power source that switches polarity
Adhesive-coated catalyzed
many times per second, in the shape of a
laminate 41.1320
sinusoidal, square, or triangular wave.
A base material with a thin polymer coating, that
Alternative hypothesis 93.1324
contains a plating catalyst, that is subsequently
treated in order to obtain a microporous surface.
The supposition that a significant difference
exists between the desired results of two
Adhesive-coated uncatalyzed
comparable populations. (See also "Null
laminate 41.1323
hypothesis" and "Statistical hypothesis".)
A base material with a thin polymer coating, that
Alumina substrate 43.1730
does not contain a plating catalyst, that is
subsequently treated in order to obtain a
Aluminum oxide used as a ceramic substrate
microporous surface.
material.
Adsorbed contaminant 96.0023
Ambient 29.0034
A contaminant attracted to the surface of a
The surrounding environment coming into
material that is held captive in the form of a gas,
contact with the system or component in
vapor or condensate.
question.
Advanced statistical method 91.0024
Amorphous polymer 40.0035
A statistical process analysis and control
A polymer with a random and unstructured
technique that is more sophisticated and less
molecular configuration.
widely applicable than basic statistical methods.
Amplitude, voltage 21.0036
Ageing 90.0025
The magnitude of a voltage as measured with
The change of a property, for example
respect to a reference, such as a ground plane.
solderability, with time. (See also "Accelerated
Analog circuit 21.0037
ageing".)
An electrical circuit that provides a continuous
Air contamination 14.0026
relationship between its input and output.
See "Air pollution".
– 6 – 60194 © IEC:1999(E)
Analysis of variance (ANOVA) 91.0038 Area array tape automated bonding 74.0048

The systematic method of statistically Tape automated Bonding where some carrier

evaluating experimental results in order to tape terminations are made to lands within the

separate the sources of variation. perimeter of the die.

Anchoring spur 22.1325 Array 22.0049

An extension of a land on a flexible printed A group of elements or circuits arranged in

board that extends beneath the cover lay to rows and columns on a base material.
assist in holding the land to the base material.
Artificial intelligence 11.0050

The capacity of a machine to perform functions

that are normally associated with human

intelligence, such as reasoning and learning.

Artwork 22.0051
An accurately-scaled configuration that is used
to produce the "Artwork master" or "Production
master".
Figure A-2: Lands with anchoring spurs
Angled bond 74.0039
The impression of the first and second bonds
that are not in a straight line.
Annotation 22.0040
The process of inserting text, notes, or other
identification on a drawing, map or diagram
constructed on a computer-aided system.
Annular ring 60.0041
That portion of conductive material completely
surrounding a hole.
Anodic cleaning 57.0042
Electrolytic cleaning in which the work is the
anode.
Apparent field-of-view angle 92.0043
The angular subtend of the field-of-view in the
image space of an optical system.
Figure A-3: Simplified flow chart of printed board
Aqueous flux 46.0044 design / fabrication sequence
See "Water-soluble flux".
Artwork master 24.1633
Aramid 44.0045 An accurately scaled configuration used to

produce the original production master; the
See "Para-aramid".
scale is chosen to provide the necessary
accuracy.
Architecture 11.0046
The structure of a computer's functional
Artwork master 24.0052
elements that makes it possess specific
An accurately-scaled, usually 1:1, pattern that
maximum and minimum capabilities.
is used to produce the "Production master".
[IEV 541-04-03, modified]
Arc resistance 92.0047
The resistance of a material to the effects of a
As-fired 45.0054
high voltage, low current arc (under prescribe
Values of thick-film components or the
conditions) passing across the surface of the
smoothness of ceramic base materials after
material. (The resistance is stated as a
they have been processed in a firing furnace
measure of total elapsed time at that voltage
and prior to trimming or polishing.
required to form a conductive path on the
surface material carbonized by the arc.)

60194 © IEC:1999(E) – 7 –
Aspect ratio (Film) 74.0055 Automatic dimensioning 25.1329

The ratio of the length of a film component to A computer-aided drafting function that

its width. automatically generates dimensions, leaders,

arrowheads, etc. that make up a complete set

Aspect ratio (Hole) 53.0056
of documented dimensions.
The ratio of the length or depth of a hole to its
Automatic test equipment 92.0064

preplated diameter.
Equipment that automatically analyzes
Assembled board 80.0057
functional or static parameters in order to
evaluate performance.
See "Assembly".
Assembly 80.1327 Automatic test generation 92.0065

Computer generation of a test program based
A number of parts, subassemblies or

combinations thereof joined together. solely on circuit topology with little or no

NOTE – This term can be used in conjunction manual programming effort.
with other terms listed herein, for example
AWG equivalent 92.0066
"Printed board assembly").
The American Wire Gauge (AWG) round-
Assembly drawing 26.1328
conductor number that is used to designate a
flat conductor with an equal cross-sectional
A document that depicts the physical
relationship of two or more parts, a area.
combination of parts and subordinate
Axial lead 31.0067
assemblies, or a group of assemblies required
to form an assembly of a higher order. Lead wire extending from a component or
module body along its longitudinal axis.
Assembly language 11.0058
Azeotrope 49.0068
A computer language made up of brief
expressions that an assembler program can See "Azeotropic mixture".
translate into a machine language.
Azeotropic mixture (Azeotrope) 49.1330
Assignable cause 91.0059
A liquid mixture of two or more substances that
See "Special cause". behaves like a single substance. The vapour
produced by partial evaporation of the liquid
Asymmetric stripline 21.0060
has the same composition as the liquid.
A stripline signal conductor that is embedded,
Back annotation 21.0072
but not centred, between two ground planes.
The process of extracting appropriate
Attenuation 21.0061
information from a completed printed board
The reduction in the amplitude of a signal due design and inserting it on the boards schematic
diagram.
to losses in the media through which it is
transmitted.
Back-bared land 22.0071
Attributes data 94.0062
A land in flexible printed wiring that has a
Qualitative data that can be counted for portion of the side normally bonded to the base
dielectric material exposed by a clearance
recording and analysis purposes.
hole.
Automated component insertion 72.0063
Back bonding 74.0073
The act or operation of assembling discrete
components to printed boards by means of Attaching a die to a base material with its
circuitry facing away from the base material.
electronically-controlled equipment.
Automatic component placement 22.0029 Backdriving 92.0074
An in-circuit testing technique that drives digital
Software that automatically optimizes the
layout of components on a printed board. circuitry outputs to a given logic level, by
supplying pulses of sufficient electrical current
Automatic conductor routing 22.0124
magnitude in parallel with the outputs, in order
to overdrive the logic state conditions of the
Software that automatically determines the
next digital device inputs.
placement of interconnections on a printed
board.
Backfill 36.0075
Filling a hybrid circuit package with a dry inert
gas prior to hermetic sealing.

– 8 – 60194 © IEC:1999(E)
Background (Artwork) 22.0076 Barrier metal 74.0085

The non-functional area of a phototool. A metal used to seal the semiconductor-die

lands.
Background variable 94.0077
Baseline dimensioning 26.0086
A parameter of no experimental interest that is

not held at a constant value. The maximum variation between two features

that is equal to the sum of the tolerances on
Backlighting 24.0078
the two dimensions from their origin to the
features.
Viewing or photographing by placing an object
between a light source and the eye or

recording medium.
Back mounting 74.0079
See "Back bonding".
Backpanel 85.0080
See "Backplane".
Backplane 85.1331
An interconnection device used to provide
point-to-point electrical interconnections. (It is
usually a printed board that has discrete wiring
terminals on one side and connector
receptacles on the other side.) (See also
Figure B-1: Example of feature location using baseline
dimensions
"Mother board".)
Back taper(s) 51.0081
Base material 40.1334
The constant decrease in diameter along the
length of the body of a drill. The insulating material upon which a
conductive pattern may be formed. (The base
Backward crosstalk 21.1332
material may be rigid or flexible, or both. It may
Noise induced into a quiet line, as seen at the be a dielectric or insulated metal sheet.) [IEV
end of the quiet line that is closest to the signal 541-04-03, modified]
source, because the quiet line has been placed
Base material thickness 33.0087
next to an active line. (See also "Forward
crosstalk".)
The thickness of the base material excluding
metal foil or other material deposited on its
Bake out 56.0082
surfaces.
Subjecting a product to an elevated
Base material thickness 22.1604
temperature in order to remove moisture and
unwanted gasses prior to final sealing.
The thickness of the base material excluding
conductive foil or material deposited on the
Balanced transmission line 21.1333
surfaces.
A transmission line that has distributed
Base metal 45.0088
inductance, capacitance, resistance, and
conductance elements that are equally
See "Basis metal".
distributed between its conductors.
Base solderability 92.0089
Ball bond 74.0083
The ease with which a metal or alloy can be
The thermocompression termination of the
wetted by solder under minimum realistic
ball-shaped end of an interconnecting wire to a
conditions.
land. (See also "Wedge bond".)
Basic dimension 26.1335
Bar code marking 70.1731
A numerical value used to describe the
An identification code consisting of a pattern of
theoretical exact location of a feature or hole.
vertical bars whose width and spacing
(It is the basis from which permissible
identifies the item marked.
variations are established by tolerance on
other dimensions in notes or by feature-control
Bare board 60.0084
symbols.)
An unassembled (unpopulated) printed board.
Basic specification (BS) 26.1778
A document that describes the common
elements for a set, family or group of products,
materials, or services.
60194 © IEC:1999(E) – 9 –
Basic statistical method 91.1336 Benchmark, computer 11.0102

The application of a theory of variation through A standard measure of the performance of

the use of basic problem-solving techniques and computers relative to each other, including set-up

statistical process control. (This includes control time, program generation, and data processing

and capability analysis for both variables and capability.

attributes data.)
Benchmark, testing 92.0103
Basic wettability 70.0090
A standard measure of the performance of
The ease with which a specific metal or alloy can testers relative to each other, including set-up
be wetted by solder. time, test program generation, and fixturing.

Basis material 40.0091 Beta error 91.0104

Material upon which coatings are deposited. The size of a Type II error or the probability of

accepting a hypothesis that is false.

Basis metal 45.0092
Bias (Fabric) 44.0105
A metal upon which coatings are deposited.
Filling yarn that is off-square with the warp ends
Batch oven 56.0093
of a fabric.
A large temperature-controlled oven that is used
Bifurcated contact 36.1810
to heat clean rolls of fabric.
Batch processing 11.0094
Executing a computer-aided program without
human input.
Batch size 17.0095
See "Lot size".
A type of connector contact that usually consists
of a flat spring that has been slotted length-wise
Bathtub curve 93.0096
in order to provide independent contact points
A plot of failures versus time.
with the mating part.
Baume 92.0097
Figure B-2: Bifurcated solder terminal
An arbitrary scale of specific gravities used in the
Bifurcated solder terminal 37.0106
gradation of hydrometers.
A solder terminal with a slot or slit opening
Beaming 44.0099
through which one or more wires are placed prior
The operation in which yarn from several section
to soldering.
beams is combined on the final warp beam.
Binder 47.0107
Beam lead 33.0100
Material added to thick-film compositions and
A component terminal in the form of a long
unfired base materials to give them additional
metallic structural member that is not supported
strength for pre-fire handling. (See also "Glass
along its length.
binder".)
Beam-lead device 33.0098
Binomial distribution 94.0108
An active or passive chip component with beam
A discrete probability distribution that, with certain
leads for interconnecting it to lands on a base
assumptions, describes the way that attributes
material.
(proportions) vary.
Bed-of-nails fixture 92.0101
Biochemical oxygen demand 92.0109
A test fixture consisting of a frame and a holder
A standardized means for estimating the degree
containing a field of spring-loaded pins that make
of contamination of water.
electrical contact with a planar test object.
Biocide 76.0110
Bellows contact 36.1337
A general name for any substance that kills or
A type connector contact that consists of a flat
inhibits the growth of micro-organisms.
spring that has been folded to provide a very
Birdcage 37.1338
uniform spring rate over the full tolerance range
of the mating part.
A defect in stranded wire whereby the strands in
the stripped portion between the covering of an
insulated wire and a soldered connection, or an
end-tinned lead, have separated from the normal
lay of the strands.
– 10 – 60194 © IEC:1999(E)
Bismaleimide 41.0111 Bond 74.0120

A resin that has the generic chemical structure An interconnection that performs a permanent

of an aromatic chemical group that is attached electrical and/or mechanical function.

to two (or "Bis")maleimide groups.

Bondability 74.1342
Bismaleimide triazine 41.0112
Those surface characteristics and conditions of

A resin that contains a mixture of bismaleimide cleanliness of a bonding area that must exist in

and triazine resins. order to provide for the capability to achieve a
successful termination.
Blank 41.1339
Bond deformation 74.0123
An unprocessed or partially processed piece of

base material or metal-clad base material, that The plastic-flow change in the form of a lead

has been cut from a sheet or panel, that has caused by a bonding tool during a termination

the rough dimensions of a printed board. (See process.

also "Panel".)
Bond enhancement treatment 74.0125
Bleeding 52.0113
The improvement of the adhesion of a metal
A condition in which a plated hole discharges foil surface to an adjacent layer of material to
process material or solution from crevices or which it is being attached.
voids or a condition in which a resist migrates
Bond envelope 74.0126
beyond the image area.
The range of termination parameters within
Blends 41.0114
which acceptable bonds may be formed.
Mixtures of resins.
Bonding, die 74.0127
See "Die Bonding".
Bonding area 74.0128
The area defined by the extent of a land or
portion of a terminal to which a lead is to be
bonded.
Picture B-3: Blind and buried vias Bonding island 74.0129
See "Bonding area".
Blind via 22.0115
A via extending only to one surface of a printed
Bonding layer 55.0130
board.
An adhesive layer used in bonding together
other discrete layers of a multilayer printed
Blister 96.1340
board during lamination.
Delamination in the form of a localized swelling
and separation between any of the layers of a
lamination base material, or between base
material and conductive foil or protective
coating.
Blocking variables 94.0116
A relatively homogeneous set of conditions

within which different conditions of primary
variables are compared.
Blow hole 53.0117
A void caused by outgassing.
Board 60.0118
See "Printed board" and "Multilayer printed
board".
Board thickness 22.0119
The overall thickness of the base material and
all conductive materials deposited thereon.
Body land clearance 51.1341
Picture B-4: Drill features
That portion of the land diameter of a drill that
is decreased in order to provide clearance
behind the margin.
60194 © IEC:1999(E) – 11 –
Bonding tool 74.0131 Boss (Connector) 37.0145

The instrument used to position leads or A raised section on a connector that fits into a

discrete wires over a land and to impart specific slot in the positive polarization or keying

sufficient energy to complete the termination. feature of a mating connector.

Bonding wire 74.0132 Bow (Fabric) 44.0146

Fine gold or aluminum wire used for making Filling yarn that lies in an arc across the width of

electrical connections between lands, lead a fabric.
frames, and terminals.
Bow (Sheet, panel, or printed board) 60.1218

Bond interface 74.0133
The deviation from flatness of a board

The common area between a lead and a land to characterized by a roughly cylindrical or

which it has been terminated. spherical curvature such that, if the product is

rectangular, its four corners are in the same

Bond land 74.0134
plane. (See also "Twist".)
See "Bonding area".
Bond lift-off 74.0135
The failure mode whereby a bonded lead
separates from the surface to which it has been
joined.
Bond schedule 74.0136
The values of termination machine parameters.
Figure B-5: Bow
Bond separation 74.0137
The distance between the termination points of
Brainstorming 94.0147
the first bond and the second bond.
The generation of an all-inclusive list of potential
causal factors that are possible contributors to
Bond site 74.0138
process problems.
That portion of the bonding area where the
actual termination takes place.
Breakout 60.0148
See "Hole breakout".
Bond strength 60.0139
The force perpendicular to a board's surface
Bridging, electrical 70.0149
required to separate two adjacent layers of the
The unintentional formation of a conductive path
board, expressed as force per unit area.
between conductors. (See also "Solder
bridging".)
Bond surface 74.0141
See "Bonding area".
Brightness 24.0150
See "Luminance".
Bond-to-bond distance 74.0121
The distance from the bonding site on a die to
Broken pick 35.0151
the corresponding bonding site on a lead frame,
A filling yarn that is missing from a portion of the
interconnecting base material, etc.
width of a fabric.
Bond-to-die distance 74.0122
Brominated epoxy 41.0152
The distance from the heal of a beam lead to
An epoxy resin containing chemically-bound
the die.
bromine.
Border area 22.0142
B-stage 41.1343
The region on a base material that is external to
An intermediate stage in the reaction of a
that of the end-product being fabricated within it.
thermosetting resin in which the material
softens when heated and swells, but does not
Border data 22.0143
entirely fuse or dissolve, when it is in contact
Patterns that appear in the border area, such as
with certain liquids. (See also "C-staged resin".)
tooling features, test patterns, and registration
marks.
B-staged material 41.0069
See "Prepreg".
Boss 22.0144
See "Land".
B-staged resin 41.0070
A thermosetting resin that is in an intermediate
state of cure. (See also "C-staged resin".)

– 12 – 60194 © IEC:1999(E)
Bubble effect 76.0153 Burn-in, dynamic 95.0165

The entrapment of air, solvent or moisture Burn-in at high temperatures that simulates the

bubbles in a protective coating. effects of actual or simulated operating

conditions.
Buffer material 76.0154
Burn-in, static 95.0166
A resilient material that is used to protect a

crack-sensitive component from the stresses Burn-in at high temperatures with unvarying

generated by a conformal coating. voltage, either forward or reverse bias.

Bugging height 74.0155 Burn-off 74.0167

The distance between a land and the lower See "Flame-off".

surface of a beam lead caused by the

Bus 21.0168
deformation of the lead during bonding.

One or more conductors used for transmitting

Bulge 60.0156
data signals or power.
A swelling of a printed board that is usually
Bus bar 37.0169
caused by internal delamination or separation
of fibers.
A conduit, such as a component or conductor
on a printed board, that is used for distributing
Bulk conductance 92.0157
electrical energy. (See also "Plating bar".)
Conductance between two points of a
Butter coat 41.0170
homogeneous material.
An increased amount of resin on the outer
Bulls-eye 20.0158
surface of a base material.
A stylized pattern that is located in the border
Butt lead 36.1732
area in order to aid in alignment.
A surface mounted component lead form in
Bump (Die) 74.0159
which the lead contacts its respective land
A raised metal feature on a die land or tape areas at between 45° and 90° to the plane of
carrier tape that facilitates inner-lead bonding. the substrate.
Bumped die 74.0160 Camber 92.0172
A semiconductor die with raised metal features The planar deflection of a flat cable or flexible
that facilitate inner-lead bonding. laminate from a straight line.
Bumped tape 74.0161 Capability detail specification
(CapDS) 26.1780
Carrier tape with raised metal features that
facilitate inner-lead bonding. A document that establishes the specific
requirements, noted in a detailed specification,
Bumped wafer 74.0162
in order to establish the level of capability that
a manufacturer possesses when he has
A semiconductor wafer with raised metal
feature on its die lands that facilitate inner-lead demonstrated that he has met those
requirements.
bonding.
Buried via 22.0163 Capability index (Cp) 91.0306
See "Capability performance index".
A via that does not extend to the surface of a

printed board.
Capability performance, lower
(Cpkl) 91.1367
A measure of the relationship between the
performance of a process and the lower
specification limit. (See also "Capability
performance, upper".)
Capability performance, upper
Figure B-3: Blind and buried vias
(Cpku) 91.1344
A measure of the relationship between the
Burn-in 95.0164
performance of a process and the upper
The process of electrically stressing a device
specification limit. (See also "Capability
at an elevated temperature, for a sufficient performance, lower".)
amount of time to cause the failure of marginal
Capability performance index 79.1806
devices (infant mortality).
The ratio of the measured performance of a
process compared to specified limits.

60194 © IEC:1999(E) – 13 –
Capability test board (CTB) 94.1784
Castellation 33.0182
A printed board specifically designed to act as A recessed metallized feature on the edge of a

a capability qualifying component (CQC), or to leadless chip carrier that is used to

be used by the manufacturer to evaluate interconnect conducting surface or planes

process variation, process control, or within or on the chip carrier.

continuous improvement procedures.
Catalyst (Resin) 40.0183
Capability test segment (CTS) 94.1785
A chemical that is used to initiate the reaction

or increase the speed of the reaction between
A segment or portion of a capability test board
a resin and a curing agent.
(CTB), containing a set or group of individual

test patterns (ITP), intended to be used to

Catalyzing 53.0184
demonstrate a specific level of printed board

See "Activating".
complexity or manufacturing capability.

Cathodic cleaning 57.0185
Capacitance 21.1794
Electrolytic cleaning in which the work is the
A measure of the ability of two adjacent
cathode.
conductors separated by an insulator to hold a
charge when a voltage is impressed between
Cation exchange 59.0186
them.
See "Ion exchange".
Capacitance density 21.0173
Cationic reagent 59.0187
The amount of capacitance available per unit
Surface-active substances that have the active
area.
constituent in the positive ion.
Capacitive coupling 21.0174
Cause-and-effect diagram 94.0188
The electrical interaction between two A problem solving tool that uses a graphic
conductors that is caused by the capacitance
description of various process elements in
between them. order to analyze potential sources of process
variation.
Capillary 74.0175
Centering force 73.1733
A hollow bonding tool used to guide wire to the
The force required by the pick-up tooling to
bonding site and to be used to apply pressure
center a surface mounting device in its proper
during the bonding cycle. (See also "Wedge
location on a substrate.
tool".)
Center-to-center spacing 22.1346
Cap lamination 55.0176
The nominal distance between the centers of
A process for making multilayer printed boards
adjacent features on any single layer of a
with surface layers of metal-clad laminate
printed board. (See also "Pitch".)
bonded in a single operation. (See also, "Foil
lamination".)
Card 60.0177
See "Printed board".
Card-edge connector 22.0178
See "Edge-board connector".
Card-insertion connector 22.0179
Figure C-1: Center-to-center spacing (pitch)
See "Edge-board connector".
Carrier (Foil) 45.0180
Centerwire break 74.0189
A temporary support medium that facilitates
A failure mode in a wire pull test whereby the
the handling of thin and soft-metal foils.
wire fractures at approximately its midspan.
Carrier tape 36.1345
Central line 91.0190
The carrier for conductors used in tape-
The line on a control chart that depicts the
automated bonding. (See also "Multilayer
average or median value of the items being
carrier tape", "Single-layer carrier tape", "Two-
plotted.
layer carrier tape" and "Three-layer carrier
tape".)
Certification 17.0191
Carry-out 51.0181
The verification that specified training or testing
has been performed and that required
The curved back portion of the flute of a drill.
proficiency or parameter values have been
attained.
– 14 – 60194 © IEC:1999(E)
Chain dimensioning 26.0192 Chemical vapour deposition 45.0202

The maximum variation between two features The deposition of a film onto the surface of a

that is equal to the sum of the tolerances on substrate by the chemical reduction of a

the intermediate distances. vapour on contact with the base material.

Chamfer (Drill) 51.0193 Chemical wire stripping 37.0203

The angle at the end of a drill shank. The process of removing insulation from wire

using chemical compounds.
Characteristic curve 24.1347
Chemisorption 74.1348
A plot of photographic product optical-density

data versus the logarithm of the exposure used The formation of bonds between the surface

to characterize the response of the material to molecules of a metal, or other material of high

exposure and development. surface energy, and another gas or liquid

substance in contact with it.
Chessman 74.0204
A disk, knob or lever used to manually control
the position of a bonding tool with respect to
land.
Chip 35.0205
See "Die".
Chip-and-wire 74.0206
An assembly method that uses discrete wires
to interconnect back-bonding die to lands, lead
Figure C-2: Typical characteristic curve frames, etc.
Chip carrier 33.0208
Characteristic impedance 21.0194
A low-profile, usually square, surface-mount
component semiconductor package whose die
The resistance of a parallel conductor structure
to the flow of alternating current (a.c.), usually cavity or die mounting area is a large fraction
of the package size and whose external
applied to high speed circuits, and normally
consisting of a constant value over a wide connections are usually on all four sides of the
range of frequencies. package. (It may be leaded or leadless.)
Check list 94.1219 Chip-on-board (COB) 86.0207
A printed board assembly technology that uses
A compilation of the specified criteria that may
be evaluated during an audit or inspection. unpackaged semiconductor die.
Check plot 94.0195 Chipped point 51.0209
An interim drawing used for graphical data A condition whereby the amount of chips on
verification. the leading edge of a drill point exceeds an
allowable value.
Check sheet 94.0196
Chisel 74.0210
A form that is used for data collection.

A tool used for wedge and ultrasonic bonding.
Chelate compound 76.0197
Chisel-edge angle 51.0211
A compound in which metal is contained as an
integral part of a ring structure. The angle between the leading cutting edge
and the intersection of the primary and
Chelating agent 76.0198
secondary relief facets of a drill point.
A compound capable of forming a chelate
Chopped bond 74.0212
compound with a metal ion.
A bond with excessive deformation such that
Chemical conversion coating 57.0199
the strength of the bond is greatly reduced.
A protective coating produced by the chemical
Circuit 21.0213
reaction of a metal with a chemical solution.
A number of electrical elements and devices
Chemically-deposited printed circuit50.0201 that have been interconnected to perform a
desired electrical function.
See "Additive process".
Chemically-deposited printed wiring50.0200 Circuit card 60.0214
See "Printed board".
See "Additive process".
60194 © IEC:1999(E) – 15 –
Circuitry layer 22.0215 Closed-entry contact 37.0218

A layer of a printed board containing A type of female connector contact that

conductors, including ground and voltage prevents the entry of an oversized mating part.

planes. (See also "Open-entry contact".)

Circumferential separation 96.1349 Coaxial cable 37.0220

A crack or void in the plating extending around A cable in the form of a central wire

the entire circumference of as plated-through surrounded by a conductor tubing or sheathing
hole, a solder fillet around lead wire or eyelet, that serves as a shield and return.
or the interface between a solder fillet and a

Coefficient of thermal expansion (CTE)
land.
40.0221
Circumferential thermodes 74.1734
The linear dimensional change of a material

A contact tool used for inner-lead and outer- per unit change in temperature. (See also

lead gang bonding. "Thermal expansion mismatch".)
Clad (adj.) 55.1350 Co-firing 56.0219
A condition of the base material to which a The simultaneous processing of thick-film
relatively thin layer or sheet of metal foil has circuit elements during one firing cycle.
been bonded to one or both of its sides, for
Cohesion failure 96.0222
example "a metal-clad base material".
The rupture of an adhesive bond such that the
Clearance hole 22.1811
separation appears to be within the adhesive.
A hole in a conductive pattern that is larger
Coined lead 22.0223
than, and coaxial with a hole in the base
material of a printed board. The end of a round lead that has been formed
to have parallel surfaces that approximate the
shape of a ribbon lead.
Cold hand cleaning 76.0224
Cleaning with a soft brush and rinsing in a
small open tank of chlorinated solvent or
isopropanol.
Cold machine cleaning 76.0225
Cleaning with a chlorinated solvent and an
A
Figure C-3: Clearance Hole
inline brush or wave cleaner.
Clinched lead 72.1351
Cold soldered connection 97.0226
A component lead that is inserted through a
A solder connection that exhibits poor wetting,
hole in a printed board and is then formed in
and that is characterized by a greyisch porous
order to retain the component in place and in
appearance. (This is due to excessive
order to make metal-to-metal contact with a
impurities in the solder, inadequate cleaning
land prior to soldering. (S
...