EN 61190-1-3:2002

SLOVENSKI SIST EN 61190-1-3:2003

STANDARD
april 2003
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
ICS 25.160.50; 31.190 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61190-1-3
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2002
ICS 31.190
English version
Attachment materials for electronic assembly
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2002)
Matériaux de fixation pour Verbindungsmaterialien für
les assemblages électroniques Baugruppen der Elektronik
Partie 1-3: Exigences relatives aux Teil 1-3: Anforderungen an
alliages à braser de catégorie Eletroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel für das
fluxées et non-fluxées pour les Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2002)
(CEI 61190-1-3:2002)
This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2002 E
Foreword
The text of document 91/279/FDIS, future edition 1 of IEC 61190-1-3, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 61190-1-3 on 2002-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annexes designated "normative" are part of the body of the standard.
Annexes designated "informative" are given for information only.
In this standard, annexes B and ZA are normative and annex A is informative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2002 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 61190-1-3:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60194 1999 Printed board design, manufacture and--
assembly - Terms and definitions
1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections
in electronics assembly
1) 2)
IEC 61190-1-2 - Part 1-2: Requirements for solder EN 61190-1-2 2002
pastes for high-quality interconnections
in electronics assembly
1) 2)
ISO 9002 - Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
ISO 9453 1990 Soft solder alloys - Chemical EN 29453 1993
compositions and forms
1) 2)
ISO 9454-1 - Soft soldering fluxes - Classification EN 29454-1 1993
and requirements
Part 1: Classification, labelling
and packaging
1) 2)
ISO 9454-2 - Part 2: Performance requirements EN ISO 9454-2 2000

1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE IEC
61190-1-3
INTERNATIONAL
Première édition
STANDARD
First edition
2002-03
Matériaux de fixation pour
les assemblages électroniques –
Partie 1-3:
Exigences relatives aux alliages à braser
de catégorie électronique et brasures solides
fluxées et non fluxées pour les applications
de brasage électronique
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders for
electronic soldering applications
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
V
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

61190-1-3 © IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.9
2 Normative references.9
3 Classification .11
3.1 Alloy composition.11
3.2 Solder form .11
3.3 Flux type .11
3.4 Flux percentage and metal content .13
3.5 Other characteristics.15
4 Terms and definitions .15
5 Requirements .19
5.1 Materials .19
5.2 Alloys .19
5.3 Solder forms.21
5.4 Flux type and form.25
5.5 Flux residue dryness.25
5.6 Spitting.25
5.7 Solder-pool.25
5.8 Labelling for product identification.27
5.9 Workmanship .27
6 Quality assurance provisions.27
6.1 Responsibility for inspection and compliance.27
6.2 Classification of inspections.29
6.3 Material inspection.39
6.4 Qualification inspection.39
6.5 Quality conformance.41
6.6 Preparation of solder alloy for test.41
7 Preparation for delivery.41
7.1 Preservation, packing, and packaging .41
Annex A (informative).43
A.1 Intended use.43
A.2 Acquisition requirements.45
A.3 Standard solder product packages .47
A.4 Protocol for establishing short names for IEC 61190-1-3 alloys.47
A.5 Standard description of solid solder products .49
Annex B (normative) Solder alloys.51
Bibliography .65

61190-1-3 © IEC:2002 – 5 –
Figure 1 – Report form for solder alloy tests .31
Figure 2 – Report form for solder powder tests .33
Figure 3 – Report form for non-fluxed solder tests .35
Figure 4 – Report form for fluxed wire/ribbon solder tests .37
Table 1 – Solder materials.11
Table 2 – Flux types and designating symbols .13
Table 3 – Flux percentage.15
Table 4 – Standard solder powders .23
Table 5 – Solder inspections .39
Table B.1 – Composition and temperature characteristics of lead-free solder alloys .51
Table B.2 – Composition and temperature characteristics of common tin-lead alloys.53
Table B.3 – Composition and temperature characteristics for speciality
(non-tin/lead) alloys.57
Table B.4 – Cross-reference from solidus and liquidus temperatures
to alloy names by temperature.59
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations
to IEC 61190-1-3 alloy names .63

61190-1-3 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/279/FDIS 91/289/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A is for information only.
Annex B forms an integral part of this standard.
The committee has decided that the contents of this publication will remain unchanged until 2007.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61190-1-3 © IEC:2002 – 9 –
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
1 Scope
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder
paste, for electronic soldering applications as well as for special electronic grade solders. For
the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2,
respectively. This standard is a quality control document and is not intended to relate directly to
the material performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Some examples of
special solders are anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy
solder powders, etc.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194:1999, Printed board design, manufacture and assembly – Terms and definitions
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
1)
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assembly – Part 1-2: Requirements for
1)
solder pastes for high-quality interconnections in electronics assembly
ISO 9002, Quality Systems – Model for Quality Assurance in Production, Installation and
Servicing
ISO 9453:1990, Soft solder alloys – Chemical compositions and forms
ISO-9454-1, Soft soldering fluxes – Classification and requirements – Part 1: Classification,
labelling and packaging
ISO-9454-2, Soft soldering fluxes – Classification and requirements – Part 2: Performance
requirements
___________
1)
To be published.
61190-1-3 © IEC:2002 – 11 –
3 Classification
Soldering materials covered by this standard shall be classified by alloy composition, solder
form, flux type, flux percentage, and by other characteristics peculiar to the solder material
form.
3.1 Alloy composition
The solder alloys covered by this standard are the alloys listed in annex B, table B.1, and
include pure tin and pure indium. Each alloy is identified by an alloy name, which is composed
of a series of alphanumeric characters that identify the component elements in the alloy by
chemical symbol and nominal percentage by mass, and ending with an arbitrarily assigned
alloy variation letter (A, B, C, D, E). Alloys are also identified by an alloy short name, which is a
five-character alphanumeric designation composed of the chemical symbol for the key element
in the alloy (see A.4), the nominal percentage of that element in the alloy, and the arbitrarily
assigned alloy variation letter. Annex B, table B.1, identifies alloy composition, the alloy short
name, and alloy temperature characteristics. Annex B, table B.2, cross-references solidus and
liquidus temperatures to alloy names. Annex B, table B.3, cross-references alloy short names
to alloy names. Annex B, table B.4, cross-references ISO alloy numbers and designations from
ISO 9453 to alloy names.
3.2 Solder form
The forms of solder materials covered by this set of standards are listed with their single-letter
designating symbols in table 1.
Table 1 – Solder materials
Identifying symbol Solder form
F Flux (only)
P Paste (cream)
BBar
D Powder
R Ribbon
WWire
S Special
3.3 Flux type
The flux types used in/on solders covered by this set of standards are listed in table 2. The
requirements for fluxes are covered by IEC 61190-1-1.

61190-1-3 © IEC:2002 – 13 –
Table 2 – Flux types and designating symbols
Flux materials Flux activity levels
c d
IEC flux designator ISO flux designator
a b
of composition (weight % halide)
Low (<0,01) L0 ROL0 1.1.1
Low (<0,15) L1 ROL1 1.1.2.W, 1.1.2.X
Rosin Moderate (0) M0 ROM0 1.1.3.W
(RO) Moderate (0,5-2,0) M1 ROM1 1.1.2.Y, 1.1.2.Z
High (0) H0 ROH0 1.1.3.X
High (>2,0) H1 ROH1 1.1.2.Z
Low (<0,01) L0 REL0 1.2.1
Low (<0,15) L1 REL1 1.2.2.W, 1.2.2.X
Resin Moderate (0) M0 REM0 1.2.3.W
(RE) Moderate (0,5-2,0) M1 REM1 1.2.2.Y, 1.2.2.Z
High (0) H0 REH0 1.2.3.X
High (>2,0) H1 REH1 1.2.2.Z
Low (0) L0 ORL0 2.1., 2.2.3.E
Low (<0,5) L1 ORL1 –
Organic Moderate (0) M0 ORM0 –
(OR) Moderate (0,5-2,0) M1 ORM1 2.1.2, 2.2.2
High (0) H0 ORH0 2.2.3.0
High (>2,0) H1 ORH1 2.2.2
Low (0) L0 INL0 Not applicable
Low (<0,5) L1 INL1 (Inorganic ISO flux
is different)
Inorganic Moderate (0) M0 INM0
(IN) Moderate (0,5-2,0) M1 INM1
High (0) H0 INH0
High (>2,0) H1 INH1
a
Fluxes are available in S (solid), P (paste/cream) or L (liquid) forms.
b
The 0 and 1 indicate absence and presence of halides, respectively. See 4.2.3 of IEC 61190-1-1 for an
explanation of L, M and H nomenclature.
c
See 7.2 and 7.3 of IEC 61190-1-1 for comparisons of RO, RE, OR and IN composition classes and L, M and H
activity levels with the traditional classes such as R, RMA, RA, water soluble and low solids “no-clean”.
d
ISO designations are similar to IEC designators with minor differences in characteristics.
3.4 Flux percentage and metal content
The nominal percentage of flux, by mass, in solid-form solder products is identified as the flux
percentage. The flux percentage in/on solid solders is identified by a single alphanumeric
character in accordance with table 3. Metal content refers to the percentage of metal in solder
paste (see IEC 61190-1-2).
61190-1-3 © IEC:2002 – 15 –
Table 3 – Flux percentage
Designation Nominal Allowable
symbol percentage percentage range
0 None
1 0,5 0,2 - 0,8
2 1,0 0,7 - 1,3
3 1,5 1,2 - 1,8
4 2,0 1,7 - 2,3
5 2,5 2,2 - 2,8
6 3,0 2,7 - 3,3
7 3,5 3,2 - 3,8
8 4,0 3,7 - 4,3
9 4,5 4,2 - 4,8
A 5,0 4,7 - 5,3
B 5,5 5,2 - 5,8
C 6,0 5,7 - 6,3
D 6,5 6,2 - 6,8
3.5 Other characteristics
Standard bar solders are further classified by unit mass. Wire solders are further classified by
wire size (outside diameter) and unit mass. Ribbon solders are further classified by thickness,
width and unit mass. Powder solders are further classified by powder particle size distribution
and unit mass.
4 Terms and definitions
1)
For the purpose of this part of IEC 61190, the terms and definitions given in English only in
IEC 60194 and the following apply.
4.1
acceptance tests
tests deemed necessary to determine the acceptability of a product and as agreed to by both
purchaser and vendor
[IEC 60194]
4.2
alloy
substance having metallic properties and being composed of two or more chemical elements of
which at least one is an elemental metal
4.3
basis metal
metal upon which coatings are deposited, (also referred to as base metal)
[IEC 60194, modified]
4.4
corrosion (chemical/electrolytic)
attack of chemicals, flux, and flux residues on base metals
___________
1)
Certain definitions of IEC 60194 have been translated into French.

61190-1-3 © IEC:2002 – 17 –
4.5
density (phototool)
logarithm of the value of opacity, usually expressed in grams per cubic centimeter
[IEC 60194, modified]
4.6
dewetting
condition that results when molten solder coats a surface and then recedes to leave irregularly
shaped mounds of solder that are separated by areas that are covered with a thin film of solder
and with the basis metal not exposed
4.7
eutectic (n.)
alloy having the composition indicated by the eutectic point on an equilibrium diagram or an
alloy structure of intermixed solid constituents formed by a eutectic reaction
[IEC 60194]
4.8
eutectic (v.)
isothermal reversible reaction in which, on cooling, a liquid solution is converted into two or
more intimately mixed solids, with the number of solids formed being the same as the number
of components in the system
[IEC 60194]
4.9
flux
chemically and physically active compound that, when heated, promotes the wetting of a base
metal surface by molten solder by removing minor surface oxidation and other surface films
and by protecting the surfaces from reoxidation during a soldering operation
[IEC 60194 modified]
4.10
flux characterization
series of tests that determines the basic corrosive and conductive properties of fluxes and flux
residues
[IEC 60194]
4.11
flux residue
flux-related contaminant that is present on or near the surface of a solder connection
[IEC 60194]
4.12
liquidus
temperature at which a solder alloy changes from a paste form to a liquid form
4.13
non-wetting (solder)
partial adherence of molten solder to a surface that it has contacted and of which the basis
metal remains exposed
[IEC 60194]
4.14
solder
metal alloy with a melting temperature that is below 485 °C
NOTE Metal alloy with a melting temperature less than 450 °C is classified as "soft solder".
[IEC 60194, modified]
61190-1-3 © IEC:2002 – 19 –
4.15
solderability
ability of the surface of a metal to be wetted by molten solder
[IEC 60194]
4.16
solidus
temperature at which a solder alloy changes from a solid to a paste form
4.17
wetting, solder
formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a basis
metal
[IEC 60194, modified]
5 Requirements
5.1 Materials
Materials shall be used which permit the solder product to conform to the specified
requirements. The use of recovered or recycled materials is encouraged. Recovered or
recycled materials must conform to or exceed comparable standards for virgin raw materials.
5.2 Alloys
The solder alloy shall be as specified (see annex B). For purposes of this standard, electronic
grade solder alloys are all of the alloys listed in annex B, table B.1, including pure tin (Sn99)
and pure indium (In99). The elements listed in annex B, table B.1, for an alloy are considered
to be the component elements of that alloy. Only the component elements of an alloy are
desirable and all other elements are impurities for that alloy. To the maximum extent feasible
and unless otherwise specified, solder alloy metal, including solder powder, shall be a homo-
genous mixture of the component elements of the alloy, so that each particle of the metal is the
same alloy. Unless otherwise specified, the percentage by mass of impurity elements in alloys
which are identified with an A, B, C, or E suffix shall not exceed the following values and the
values listed in 5.2.1, 5.2.2, 5.2.3, and 5.2.5 respectively, and the percentage by mass of
impurity elements in alloys which are identified with a D suffix shall conform to the
requirements in 5.2.4.
Ag: 0,05 Au: 0,05 Cu: 0,08 Ni: 0,01 Sn: 0,25
Al: 0,001 Bi: 0,10 Fe: 0,02 Pb: 0,20 Zn: 0,001
As: 0,03 Cd: 0,002 In: 0,10
The percentage of each element in an alloy shall be determined by any standard analytical
procedure. Wet chemistry shall be used as the referee procedure.
5.2.1 Variation A alloys
In alloys which are identified with an A suffix, the percentage by mass of antimony (Sb) as an
impurity element shall not exceed 0,50.
5.2.2 Variation B alloys
In alloys which are identified with a B suffix, the percentage by mass of antimony as an impurity
element shall not exceed 0,20.

61190-1-3 © IEC:2002 – 21 –
5.2.3 Variation C alloys
In alloys which are identified with a C suffix, the percentage by mass of antimony as an
impurity element shall not exceed 0,05.
5.2.4 Variation D alloys
Alloys identified with a D suffix are ultra-pure alloys that are intended for use in barrier-free die
attachment applications. In alloys identified with a D suffix, the combined total percentage
by mass of all impurity elements shall not exceed 0,05 and the combined total percentage by
mass of each of the following sets of impurity elements shall not exceed 0,0005:
Set 1: Be, Hg, Mg, and Zn.  Set 2: As, Bi, P, and Sb.
5.2.5 Variation E alloys
In the alloy identified with an E suffix, the percentage of lead (Pb) shall not exceed 0,10 and
the percentage of antimony (Sb) shall not exceed 0,20.
5.3 Solder forms
This standard covers solders in the form of bars, wires, ribbons, and powders, and special
solders. Normally bar solders and solder powder are not fluxed, and wire, ribbon, and special
solders may be non-fluxed, flux-cored, flux-coated, or both flux-cored and flux-coated. Users
should determine from prospective sources the standard solder form characteristics that are
available and should specify standard characteristics to the maximum extent feasible.
5.3.1 Bar solder
The nominal cross-section area, the nominal length, and the nominal mass shall be as specified
(see A.2 item c). Unless otherwise specified (see A.2 item d), the actual cross-section area
shall not vary from the nominal value by more than 50 %, the actual length shall not vary from
the nominal value by more than 20 %, and the actual mass shall not vary from the nominal
value by more than 10 %. Bars with special end configurations, such as hooks or eyes, are
classified as special solders.
5.3.2 Wire solder
The wire size, flux type, and flux percentage shall be as specified (see A.2 item e). Unless
otherwise specified (see A.2 item f), wire solders shall have a circular cross-section, the wire
size shall indicate the nominal outside diameter of the wire, and the actual outside diameter
shall not vary from the nominal diameter by more than ±5 % or ±0,05 mm, whichever is greater.
5.3.3 Ribbon solder
The ribbon thickness and width, flux type, and flux percentage shall be as specified (see A.2
item g). Unless otherwise specified (see A.2 item h), ribbon solders shall have a rectangular
cross-section, and the actual thickness and width shall not vary from their nominal values by
more than ±5 % or ±0,05 mm, whichever is greater.

61190-1-3 © IEC:2002 – 23 –
5.3.4 Solder powder
The powder size and shape shall be as specified (see A.2 item i and A.2 item j). The charac-
teristics of six standard solder powders, sizes 1 through 6, are listed in table 4. When shape is
not specified, solder powder shall be spherical. Solder powder shall be smooth and bright and
free of adhering small particles and oxides to the maximum extent possible.
NOTE Solder powders made with high-lead alloys are not bright by nature, but they should not appear unusually
dark. Solder powders which contain more than one solder alloy (multiple-alloy powders) are classified as special
solders.
Table 4 – Standard solder powders
Percentages of powder by weight
Powder size
Less than 1 % At least 80 % At least 90 % Less than 10 %
None larger
symbol
than larger than between between smaller than
µm µm µm µm µm
1 160 150 150 - 75 20
2 80 75 75 - 45 20
3 50 45 45 - 25 20
4 40 38 38 - 20 20
5 28 25 25 - 15 15
6 18 15 15 - 5 5
5.3.4.1 Powder size
Maximum particle size shall be determined in accordance with IEC 61189-6, test method 6X04.
Powder particle size distribution shall be determined in accordance with IEC 61189-6, test
methods 6X01, 6X02 or 6X03
5.3.4.2 Powder shape
Solder powder shape shall be determined by visual observation using a binocular microscope
with sufficient magnification, by the light beam scatter method, or by a suitable microscopic
imaging analysis method. Solder powders visually determined to have at least 90 % of the
particles with a length to width ratio of 1,2 or less shall be classified as spherical powders.
Solder powders having a light beam scatter deviation result or an image analysis result that is
equivalent to the above visual results shall be classified as spherical powders. All other
powders shall be classified as non-spherical.
5.3.5 Special solder
All pertinent characteristics and tolerances for special form solders shall be specified (see A.2
item k). Special solders include all solders which do not fully conform to another solder
classification identified herein or in IEC 61190-1-2. Special solders include, but are not
necessarily limited to, anodes, bars with hook or eye ends, chips, ingots, multiple-alloy
powders, pellets, preforms, rings, sleeves, etc.

61190-1-3 © IEC:2002 – 25 –
5.4 Flux type and form
The flux type and form shall be as specified (see A.2 item l). Fluxes used in the manufacture of
solder products shall conform to the requirements of IEC 61190-1-1. Fluxes shall have been
fully tested and characterized in accordance with IEC 61190-1-1, and shall not have been
altered since being tested except for the addition of inert plasticizers.
5.4.1 Flux percentage
The percentage by mass of flux in/on solders shall be as specified (see A.2 item m). For fluxed
solders other than solder paste, the flux percentage is identified in accordance with table 3.
The flux percentage of flux-coated and/or flux-cored solder shall be determined in accordance
with IEC 61189-6, test method 6C09.
5.4.2 Solder cores
Unless otherwise specified (see A.2 item n), the core(s) of flux-cored solders may be of any
construction, provided they are continuous, uniform in cross-section, and symmetrically
disposed in the solder. When appropriate, the core(s) in the solder should be sealed at both
ends by a suitable means to prevent flux from leaking out.
5.4.3 Solder coatings
Unless otherwise specified (see A.2 item o), the coatings on flux-coated solders shall be dry
and tack-free such that individual pieces do not stick together when the temperature and
humidity are maintained at, or below, 25 °C and 60 % RH.
5.5 Flux residue dryness
When specified (see A.2 item p), the dryness characteristics of the reflowed residue of fluxed
solders shall be determined in accordance with IEC 61189-5, test method 5X12. When a fluxed
solder is tested in accordance with test method 5X12, the flux residue of no-clean solders and,
when specified, other flux type solders, shall be free of tackiness (not tacky).
5.6 Spitting
When specified (see A.2 item q), the spitting characteristics of flux-cored wire and ribbon
solders shall be determined in accordance with IEC 61189-5, test method 5X13.
5.7 Solder-pool
When specified (see A.2 item r), the solder-pool characteristics of fluxed solder shall be
determined in accordance with IEC 61189-5, test method 5X14. When fluxed solder is tested in
accordance with test method 5X14, the flux shall promote the spreading of molten solder over
the coupon to form integrally thereon a coat of solder which shall feather out to a thin edge.
There shall be no evidence of dewetting or non-wetting. There shall be no evidence of
spattering, as indicated by the presence of flux and/or flux residue particles outside the main
pool of residue. Irregularly shaped solder pools do not necessarily indicate dewetting or non-
wetting.
61190-1-3 © IEC:2002 – 27 –
5.8 Labelling for product identification
Unless otherwise specified (see A.2 item s), solder bars shall be marked with the alloy name or
alloy short name and the manufacturer's name or commonly accepted symbol. Unless
otherwise specified, spools, packages, and containers of wire, ribbon, and powder solders, and
written documentation accompanying bar and special solders shall be marked with the
following information:
a) the manufacturer's name and address;
b) the number and revision designation of this standard;
c) the solder product description, and the manufacturer's designation of the solder product;
d) the net mass of the solder (and nominal unit mass of bar solder);
e) the batch number(s);
f) the date(s) of manufacture;
g) expected useful life of solder product, if applicable;
h) all applicable health and safety markings;
i) any other information which may be pertinent to the particular solder form;
j) any other markings or labelling specified in the contract or purchase order.
5.9 Workmanship
Solder products shall be made uniform in quality and free from defects which limit service life
or affect the serviceability or appearance.
6 Quality assurance provisions
6.1 Responsibility for inspection and compliance
The user shall specify the qualification and quality conformance inspections (see A.2 item t).
The solder product manufacturer is responsible for the performance of qualification and quality
conformance inspections. The manufacturer may use his own or any other facility for the
performance of these inspections, unless the facility is disapproved by the user.
It is the responsibility of the manufacturer to ascertain that all solder products or supplies
delivered to the user or submitted for user acceptance conform to the requirements of the
contract or purchase order and clause 5, herein. The absence of any inspection requirements
shall not relieve the vendor of this responsibility.
6.1.1 Responsibility for compliance
Materials covered by this specification shall meet all the requirements of clause 5. The inspec-
tion(s) excluding the performance inspections defined in this specification shall become a part
of the contractor's overall inspection system or quality programme. The vendor has the
responsibility of ensuring that all products or supplies submitted to the user for acceptance
comply with all requirements of the purchase order contract.

61190-1-3 © IEC:2002 – 29 –
6.1.1.1 Quality assurance programme
When required by the user, a quality assurance programme for material furnished under this
specification shall be established and maintained in accordance with ISO 9002, or as otherwise
agreed on between user and manufacturer, and shall be monitored by the qualifying activity.
6.1.2 Test equipment and inspection facilities
Test/measuring equipment and inspection facilities, of sufficient accuracy, quality, and quantity
to permit performance of the required inspection(s), shall be established and maintained or
designated by the supplier. Establishment and maintenance of a calibration system to control
the accuracy of the measuring and test equipment shall be in accordance with the general
requirements of IEC 61189-5 and IEC 61189-6 as appropriate.
6.1.3 Inspection conditions
Unless otherwise specified herein, all inspections shall be performed in accordance with the
test conditions specified in clause 5.
6.2 Classification of inspections
The inspections specified herein are classified as follows:
1) material inspection (6.3);
2) qualification inspection (6.4);
3) quality conformance (6.5).
6.2.1 Inspection report form
Figures 1 through 4 are suitable, and recommended, for recording the results of alloy and of
solid form solder inspections. Where applicable, definitive results should be entered on the
report forms. Where definitive results are not required or appropriate, successful completion of
inspections should be indicated by check marks on the report forms.

61190-1-3 © IEC:2002 – 31 –
Test report on solder alloy
(for suffix A, B, C, and E alloys)
(Enter appropriate information in top portion and requirements columns of report and complete
report by entering the test results or checkmarks in the appropriate spaces).
Alloy designation: _______________________________________________________________
Manufacturer's identification: ______________________________________________________
Manufacturer's batch number: _____________________________________________________
Date of manufacture: ____________________________________________________________
a
Date inspection completed: __________________ Overall results : ___Pass ___Fail
Testing methods used: ___________________________________________________________
_____________________________________________________________
Inspection performed by: __________________ Witnessed by: __________________________
Required percentages
Percentage Tested by
b
Elements Pass/Fail
As an alloy As an impurity
in sample and date
element element
Ag 0,05 max.
Al 0,005 max.
As 0,03 max.
Au 0,05 max.
Bi 0,10 max.
Cd 0,002 max.
Cu 0,08 max.
Fe 0,02 max.
In 0,10 max.
Ni 0,01 max.
c
Pb ___ 0,20 max.
___ 0,10 max.
d
Sb ___ 0,50 max.
___ 0,20 max.
___ 0,05 max.
Sn 0,25 max.
Zn 0,003 max.
a
Overall Results: Check "Pass" if the test results for all elements conform to the requirements, otherwise check "Fail".
b
Pass/Fail: Enter "P" for an element if test results conform to the actual requirement, otherwise, enter "F."
c
When lead (Pb) is an impurity in the alloy being tested, check the appropriate Pb percentage requirement in the
third column.
d
When antimony (Sb) is an impurity in the alloy being tested, check the appropriate Sb percentage requirement
in the third column.
Comments: ____________________________________________________________________
_____________________________________________________________________________
_____________________________________________________________________________
_____________________________________________________________________________
IEC  711/02
Figure 1 – Report form for solder alloy tests

61190-1-3 © IEC:2002 – 33 –
Test report on solder powder
(Enter appropriate information in top portion and requirements columns of report and complete
report by entering the test results or checkmarks in the appropriate spaces).
Alloy designation: _________________________ Powder size number ____________________
Manufacturer's identification: ______________________________________________________
Manufacturer's batch number: _____________________________________________________
Date of manufacture: ____________________________________________________________
a
Date inspection completed: __________________ Overall results : ___Pass ___Fail
Testing methods used: ___________________________________________________________
_____________________________________________________________
Inspection performed by: __________________ Witnessed by: __________________________
Test results Tested by
b
Inspections Requirements Pass/Fail
obtained and date
Material
Visual
Alloy
Max. powder size:
None larger than ___ µm
Powder size:
<1 % larger than ___ µm
≥80 % between ___ − ___ µm
≥90 % between ___ − ___ µm
<10 % smaller than ___ µm
Powder shape
a
Overall Results: Check "Pass" if the test results for all elements conform to the requirements, otherwise check "Fail".
b
Pass/Fail: Enter "P" for an element if test results conform to the actual requirement, otherwise, enter "F".
Comments: ____________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
IEC  712/02
Figure 2 – Report form for solder powder tests

61190-1-3 © IEC:2002 – 35 –
Test report on non-fluxed solder
(Enter appropriate information in top portion and requirements columns of report and complete
report by entering the test results or checkmarks in the appropriate spaces).
Solder designation: ______________________________________________________________
Inspection purpose:___________________________ QPL I.D. number: ____________________
____ Qualification ____________________________ Manufactur
...