EN IEC 63215-2:2023

SLOVENSKI STANDARD
01-februar-2024
Metode za preskušanje vzdržljivosti materialov za bondiranje čipov – 2. del:
Metoda s preskusom temperaturnega cikliranja materialov za bondiranje čipov,
uporabljenih za diskretne močnostne elektronske elemente
Endurance test methods for die attach materials - Part 2: Temperature cycling test
method for die attach materials applied to discrete type power electronic devices
Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum Chip-Bonden - Teil 2:
Verfahren für die Temperaturwechselprüfung von Werkstoffen zum Chip-Bonden von
leistungseektronischen Bauelementen
Méthodes d’essai d’endurance pour les matériaux de fixation de puce - Partie 2:
Méthode d’essai de cycle thermique pour les matériaux de fixation de puce, appliquée
aux dispositifs électroniques de puissance de type discret
Ta slovenski standard je istoveten z: EN IEC 63215-2:2023
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 63215-2

NORME EUROPÉENNE
EUROPÄISCHE NORM December 2023
ICS 31.190
English Version
Endurance test methods for die attach materials - Part 2:
Temperature cycling test method for die attach materials applied
to discrete type power electronic devices
(IEC 63215-2:2023)
Méthodes d'essai d'endurance pour les matériaux de Verfahren für die Haltbarkeitsprüfung von Werkstoffen zum
fixation de puce - Partie 2: Méthode d'essai de cycle Chip-Bonden - Teil 2: Verfahren für die
thermique pour les matériaux de fixation de puce, appliquée Temperaturwechselprüfung von Werkstoffen zum Chip-
aux dispositifs électroniques de puissance de type discret Bonden von leistungseektronischen Bauelementen
(IEC 63215-2:2023) (IEC 63215-2:2023)
This European Standard was approved by CENELEC on 2023-11-28. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63215-2:2023 E

European foreword
The text of document 91/1895/FDIS, future edition 1 of IEC 63215-2, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63215-2:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-08-28
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-11-28
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63215-2:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61190-1-3 NOTE Approved as EN IEC 61190-1-3
IEC 61760-1:2020 NOTE Approved as EN IEC 61760-1:2020 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN IEC 60068-2-14 -
Test N: Change of temperature
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 60747-15 - Semiconductor devices - Discrete devices - EN 60747-15 -
Part 15: Isolated power semiconductor
devices
IEC 63215-2 ®
Edition 1.0 2023-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Endurance test methods for die attach materials –

Part 2: Temperature cycling test method for die attach materials applied to

discrete type power electronic devices

Méthodes d’essai d’endurance pour les matériaux de fixation de puce –

Partie 2: Méthode d’essai de cycle thermique pour les matériaux de fixation de

puce, appliquée aux dispositifs électroniques de puissance de type discret

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190  ISBN 978-2-8322-7677-8

– 2 – IEC 63215-2:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 General . 7
5 Test apparatus . 8
5.1 Die bonding equipment . 8
5.2 Temperature cycling chamber . 8
5.3 Thermal resistance measuring equipment . 8
5.4 Ultrasonic flaw inspection equipment . 8
6 Specimen . 8
6.1 General . 8
6.2 Preparation of specimen . 9
7 Evaluation test . 9
7.1 Test method . 9
7.1.1 General . 9
7.1.2 Temperature cycling test . 9
7.1.3 Test conditions . 10
7.1.4 End of test criteria . 10
7.2 Inspection and measurement . 10
7.2.1 Visual inspection . 10
7.2.2 Thermal resistance measurement . 10
7.2.3 Ultrasonic flaw inspection . 11
7.3 Test procedure . 11
7.3.1 Test preparation . 11
7.3.2 Preconditioning . 11
7.3.3 Initial measurement . 11
7.3.4 Test . 11
7.3.5 Intermediate measurement . 11
7.3.6 Post-test treatment . 11
7.3.7 Final judgment . 11
8 Failure cycle . 12
9 Items to be specified in the product specification . 12
Annex A (normative) Thermal resistance measuring method at die attach region . 13
A.1 Thermal resistance measuring method . 13
A.1.1 General . 13
A.1.2 Temperature characteristics measurement for TEG chip . 13
A.1.3 Thermal resistance measurement method for TEG chip . 14
A.2 Correction of thermal resistance criteria . 15
Annex B (informative) Discrete type specimen preparation using a heating resistor
TEG chip . 18
B.1 Power electronic device specimen . 18
B.1.1 General . 18
B.1.2 Power electronic device chip . 18

IEC 63215-2:2023 © IEC 2023 – 3 –
B.1.3 Base substrate . 18
B.1.4 Package mould . 19
B.1.5 Surface treatment . 19
B.2 Die attach materials . 19
B.3 Specimen preparation . 19
Annex C (informative) Reliability performance index for die attach joint – Discrete type
power electronic device . 22
Bibliography . 23

Figure 1 – Regions for evaluation for discrete type power electronic device . 8
Figure 2 – Temperature cycling test . 9
Figure A.1 – Example of the structure of the specimen using a TEG chip . 13
Figure A.2 – Example of temperature characteristics – TEG chip . 14
Figure A.3 – Example of structure for thermal resistance measurement for a power
electronic device . 15
Figure A.4 – Example of relationship between thermal resistance and die attach
damage . 16
Figure A.5 – Example of ultrasonic flaw inspection result . 17
Figure B.1 – Example of TEG chip . 18
Figure B.2 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 20
Figure B.3 – Example of specimen – TEG chip . 21

Table 1 – Temperature cycling test conditions . 10
Table A.1 – Example of thermal resistance value (R ) result . 16
th
Table C.1 – Reliability performance index for die attach joint – Discrete type power
electronic device . 22

– 4 – IEC 63215-2:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENDURANCE TEST METHODS FOR DIE ATTACH MATERIALS –

Part 2: Temperature cycling test method for die attach materials applied
to discrete type power electronic devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
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members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 63215-2 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1895/FDIS 91/1912/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

IEC 63215-2:2023 © IEC 2023 – 5 –
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 63215 series, published under the general title Endurance test
methods for die attach materials, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

– 6 – IEC 63215-2:2023 © IEC 2023
ENDURANCE TEST METHODS FOR DIE ATTACH MATERIALS –

Part 2: Temperature cycling test method for die attach materials applied
to discrete type power electronic devices

1 Scope
This part of IEC 63215 applies to the die attach materials and joining system applied to discrete
type power electronic devices.
This document specifies the temperature cycling test method which takes into account the
actual usage conditions of discrete type power electronic devices to evaluate reliability of the
die attach joint materials and joining system, and establishes a classification level for joining
reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor
devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the
reliability of the power semiconductor device packages.
NOTE The test result obtained using this document will not be used as absolute quantitative data, but for
intercomparison with the other die attach materials results using the same setup.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60194-1, Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
IEC 60194-2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technolog
...