IEC 60068-2-69:2017/COR1:2018

 IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
IEC 60068-2-69 IEC 60068-2-69
Edition 3.0  2017-03 Édition 3.0  2017-03

ENVIRONMENTAL TESTING – ESSAIS D'ENVIRONNEMENT –

Part 1: 2-69: Tests – Test Te/Tc: Solderability Partie 2-69: Essais – Essai Te/Tc: Essai de
testing of electronic components and brasabilité des composants électroniques et
printed boards by the wetting balance cartes imprimées par la méthode de la balance
(force measurement) de mouillage (mesure de la force)

CORRIGENDUM 1
Corrections to the French version appear after the English text.
Les corrections à la version française sont données après le texte anglais.

7.1.4 Solder contamination control
Replace Table 2 with the following new table:
IEC 60068-2-69:2017-03/COR1:2018-01(en-fr)

– 2 – IEC 60068-2-69:2017/COR1:2018
 IEC 2018
Table 2 – Maximum limits of solder bath contaminants
Contaminant Maximum mass fraction contaminant limit
a b c d
, ,
SnPb alloys Lead-free alloys
% %
Copper 0,300 1,100
Gold 0,200 0,200
Cadmium 0,005 0,005
Zinc 0,005 0,005
Aluminium 0,006 0,006
Antimony 0,500 0,200
Iron 0,020 0,020
Arsenic 0,030 0,030
Bismuth 0,250 0,250
Silver 0,100 4,000
Nickel 0,010 0,050
Lead N/A 0,100
a
The tin content of the solder shall be maintained within ±1,5 % of the nominal alloy being used. Tin content
shall be tested at the same frequency as testing for copper/gold contamination. The balance of the bath shall
be lead and/or the items listed above.
b
The total of copper, gold, cadmium, zinc, and aluminium contaminants shall not exceed 0,4 %. Not
applicable to lead-free alloys.
c
The tin content of the solder shall be maintained within ±1 % of the nominal alloy being used. Tin content
shall be tested at the same frequency as testing for copper/silver concentration. The balance of the bath
shall be the items listed above.
d
Maximum contamination limits are applicable for Sn96,5Ag3Cu,5. Other lead-free solder alloy contamination
limits may be used upon agreement between user and vendor.

8.2.2 Solder bath wetting balance procedure
rd
Replace the 3 paragraph to Table 5 with the following new paragraph:
The recommended immersion speed for all components is between 1 mm/s and 5 mm/s,
except for leaded non-SMD where between 5 mm/s and 20 mm/s is recommended.
8.2.4.2 Procedure
st
In the 1 paragraph, replace "7.2.3" with "7.2.1".
10 Information to be given in the relevant specification
In the list item e), replace "8.2.2" with "8.2.3".
In the list item l), replace with the following text and replace "9.2" with "8.2.2, 8.2.3":
Areas to be visually examined for wetting and de-wetting

 IEC 2018
B.5 Test flux
st
In the 1 paragraph, replace "8.1.2" with "8.2.2".
B.7.2.1 Stiffness of the spring (see Clause A.1 d))
In the title, replace "A.1 d)" with "A.1 e)".
B.7.2.2 Noise level (see Clause A.1 e))
In the title, replace "A.1 e)" with "A.1 c)".
B.7.4.1 Choice of test criteria
Replace "8.2 with "9.2".
D.2 Evaluation criteria for components
Replace Figure D.1 and Figure D.2 with the following new figures:
Equilibrium wetting force
AA
Time (s)
Buoyancy corrected zero axis
T
IEC
Figure D.1 – Set A wetting curve

Force (μN/mm)
F
x
F
y
– 4 – IEC 60068-2-69:2017/COR1:2018
 IEC
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