IEC 60068-2-58:2015/AMD1:2017

IEC 60068-2-58 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
A MENDMENT 1
AM ENDEMENT 1
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
Essais d’environnement –
Partie 2-58: Essais – Essai Td: Méthodes d’essai de la soudabilité, résistance
de la métallisation à la dissolution et résistance à la chaleur de brasage des
composants pour montage en surface (CMS)

IEC 60068-2-58:2015-03/AMD1:2017-07(en-fr)

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IEC 60068-2-58 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
A MENDMENT 1
AM ENDEMENT 1
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to

dissolution of metallization and to soldering heat of surface mounting devices

(SMD)
Essais d’environnement –
Partie 2-58: Essais – Essai Td: Méthodes d’essai de la soudabilité, résistance

de la métallisation à la dissolution et résistance à la chaleur de brasage des

composants pour montage en surface (CMS)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190 ISBN 978-2-8322-1092-3

– 2 – IEC 60068-2-58:2015/AMD1:2017
© IEC 2017
FOREWORD
This amendment has been prepared by IEC technical committee 91: Electronics assembly
technology.
The text of this amendment is based on the following documents:
FDIS Report on voting
91/1445/FDIS 91/1451/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC website under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
_____________
1 Scope
Replace the existing second paragraph of the Scope with the following new paragraph:
This document provides procedures for determining the solderability, resistance to dissolution
of metallization and resistance to soldering heat of devices in applications using solder alloys,
which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

© IEC 2017
3.2
resistance to soldering heat
Replace the existing definition with the following new definition:
ability of the component to withstand the highest temperature stress in terms of temperature
gradient, peak temperature and duration of the soldering process, within the applicable
temperature range of the solder alloy

6.5.3.4 Solder immersion
Replace the existing first paragraph of Subclause 6.5.3.4 with the following new paragraph:
If the preheating is prescribed by the relevant specification, the specified duration and
temperature shall be applied immediately prior to the immersion of the specimen in the solder
bath.
8.5.8 Evaluation
Replace “Clause A.4.” by “Clause A.2”.
Add the following new text at the end of Subclause 8.5.8:
Note that this test does not directly assess the dewetting but assesses the possibility of the
dewetting.
9.3.1.3 Metallic terminations shorter than 6 mm (dimension “d” in Figure 6)
Replace existing item b) with the following new text:
b) The upper side of the termination (area “b” in Figure 6):
After the dipping test, the dipped surface shall show visible evidence of being wettable, as
indicated by the presence of fresh solder. A homogeneous coating is not necessary here.
Replace existing item c) with the following new text:
c) Non-coated cut edges at the end of the termination and the termination above the lower
bend (area “c” in Figure 6):
For these areas (“b”, “c” and “d”), no quality criterion of solder coating is given.
Delete item d).
10.2 Solderability
Replace the existing text of Subclause 10.2 with the following new text:
The following details shall be applied for solderability.
a) Property to be tested *
b) Applicable test method *
– 4 – IEC 60068-2-58:2015/AMD1:2017
© IEC 2017
c) Condition of preconditioning (if required) *
d) For solder bath method
1) Selected solder alloy *
2) Flux type*
3) Clamping, fluxing and solder immersion *
4) Preheating *
5) Attitude to be used
6) Solder temperature and duration *
e) For reflow method
1) Solder paste *
2) Dimensional details of test substrate *
3) Thickness of solder paste *
4) Amount of solder paste
5) Placement procedure
6) Temperature profile *
7) Temperature measurement point *
f) Removal procedure
g) Cleaning method
h) Recovery conditions
i) Areas of the terminations to be examined *
j) Final inspection requirements and acceptance criteria *

10.3 Resistance to soldering heat, dewetting and resistance to dissolution of
metallization
Replace the existing text of Subclause 10.3 with the following new text:
The following details shall be applied for resistance to soldering heat, dewetting and
resistance to dissolution of metallization.
a) Property to be tested *
b) Applicable test method *
c) Condition of preconditioning (if required) *
d) For solder bath method
1) Selected solder alloy *
2) Flux type *
3) Clamping, fluxing and solder immersion *
4) Preheating *
5) Attitude to be used
6) Solder temperature and duration *
7) Number of test cycles if other than 1 cycle (for resistance to soldering heat) *
e) For reflow method
1) Solder paste (if required)*
2) Dimensional details of test substrate (for resistance to soldering heat and if required) *
3) Thickness of solder paste (if required) *

© IEC 2017
4) Amount of solder paste (if required) *
5) Placement procedure (if required) *
6) Temperature profile *
7) Temperature measurement point *
8) Number of test cycles for resistance to soldering heat *
f) Removal procedure
g) Cleaning method
h) Recovery conditions
i) Areas of the terminations to be examined *
j) Final inspection requirements and acceptance criteria *

Annex A Criteria for visual inspection
Replace the existing text of Annex A with the following new text:
A.1 Evaluation of wetting
A.1.1 General
In various specifications, a complete or nearly complete coating with solder is often defined
by the so-called 95 % requirement. The application of this requirement is often difficult when
assessing specimens with metallized terminations or with short metallic terminations,
especially when different parts of the termination are distinguished. Nevertheless, the same
approach is followed here.
A.1.2 Criteria for wetting
Acceptable when 95 % or more area to be evaluated covered by an ideal solder coating with a
dewetting area is scattered and not concentrated in one area.
Figure A.1 comprises six examples illustrating the criteria for visual examination.
NOTE To help in the evaluation of wetting, the photographs in Figure A.1 have been reproduced on such a scale
that the dimensions are reasonably comparable with the view obtained under a microscope, while ensuring that
smaller details are still sufficiently clear.

– 6 – IEC 60068-2-58:2015/AMD1:2017
© IEC 2017
Acceptable Unacceptable
IEC IEC
Unacceptable: more than 5 % dewetting on the toe; the
Acceptable: ideal coating both on the foot and on the
bend is well coated
sides; the visible rim is not dewetted because there is
no contact angle; the flux residues between body and
termination have not been removed.
IEC
IEC
Acceptable: some spots of non-ideal coating on the
Unacceptable: more than 5 % dewetting of the foot.
surface are visible.
IEC
IEC
Unacceptable: more than 5 % of the area not wetted.
Acceptable: a few very small irregularities are visible.
The arrows indicate imperfections (acceptable or unacceptable).

Figure A.1 – Evaluation of wetting
A.1.3 Additional criteria for wetting, method 2
For method 2 (reflow), in addition to A.1.2, the following criteria shall be applied:
• solder balls at the pins or irregular solder accumulations are not allowed;
• the surface shall be homogenous without irregularities or damage.

© IEC 2017
A.2 Evaluation of dewetting, method 2
Figure A.2 comprises four examples illustrating the criteria for visual examination.
Good example (dewetting not present) Negative example (dewetting > 5 %)

IEC
IEC
Bad edge covering
IEC
IEC
“Voids” dewetting
Figure A.2 – Evaluation of dewetting

___________
– 8 – IEC 60068-2-58:2015/AMD1:2017
© IEC 2017
AVANT-PROPOS
Le présent amendement a été établi par le comité d'études 91 de l'IEC: Techniques
d'assemblage des composants électroniques.
La présente version bilingue (2022-04) correspond à la version anglaise monolingue publiée en
2017-07.
La version française de cet amendement n'a pa
...