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IEC 60748-23-1:2002

(Main)

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Applies to high quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing.

General Information

Status
Published
Publication Date
14-May-2002
ICS
01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
31.200 - Integrated circuits. Microelectronics
Technical Committee
SC 47A - Integrated circuits
Drafting Committee
WG 7 - TC 47/SC 47A/WG 7
Current Stage
PPUB - Publication issued
Start Date
15-Jun-2002
Completion Date
15-May-2002
Ref Project

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IEC 60748-23-1:2002 - Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specificationIEC 60748-23-1:2002 - Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
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IEC 60748-23-1:2002 - Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
English language
85 pages
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INTERNATIONAL IEC
STANDARD
60748-23-1
QC 165000-1
First edition
2002-05
Semiconductor devices –
Integrated circuits –
Part 23-1:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Generic specification
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-1:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Spécification générique
© IEC 2002 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
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For price, see current catalogue

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IEC
IEC 62433-3:2017(Main)
EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

  • Standard
    181 pages
    English and French language
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IEC
IEC 62433-2:2017(Main)
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technical changes with respect to the previous edition:
Incorporation of an XML based exchange format for model representation.

  • Standard
    217 pages
    English and French language
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