IEC 61189-2-805:2024

IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces
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IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-8700-2

– 2 – IEC 61189-2-805:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
4.1 Preparation . 5
4.2 Number . 5
4.3 Form . 5
4.4 Conditioning . 6
5 Apparatus and materials . 6
6 Procedure . 6
7 Evaluation . 7
7.1 General . 7
7.2 Calculation of coefficient of thermal expansion curve . 8
7.3 Calculation of instantaneous coefficient of thermal expansion curve
(optional) . 9
8 Report . 9
Bibliography . 10

Figure 1 – TMA expansion curves: first heat cycles and second heat cycles . 6
Figure 2 – TMA expansion curve . 7
Figure 3 – TMA expansion curve and instantaneous CTE curve . 8

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-805: X/Y CTE test for thin base materials by TMA

FOREWORD
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IEC 61189-2-805 has been prepared IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1755/CDV 91/1782/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-805:2024 © IEC 2024
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUC
...