IEC TR 61967-4-1:2005

TECHNICAL IEC
REPORT TR 61967-4-1
First edition
2005-02
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz –
Part 4-1:
Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4
Reference number
IEC/TR 61967-4-1:2005(E)
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TECHNICAL IEC
REPORT TR 61967-4-1
First edition
2005-02
Integrated circuits –
Measurement of electromagnetic
emissions, 150 kHz to 1 GHz –
Part 4-1:
Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4

 IEC 2005  Copyright - all rights reserved
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mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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For price, see current catalogue

– 2 – TR 61967-4-1  IEC:2005(E)
CONTENTS
FOREWORD.4

1 Scope .6
2 Normative references .6
3 Terms and definitions .7
4 Splitting ICs into IC function modules.9
4.1 Background .9
4.2 Benefits.9
4.3 IC function modules.9
4.4 Example matrix for splitting ICs into IC function modules .14
5 Workflow to perform IC EMC emission tests .15
5.1 Emission test philosophy .15
5.2 Flowchart of performing emission tests .15
6 Test configurations for IC function modules.16
6.1 EMC test recommendations for IC function modules .16
6.2 Port selection guide .16
6.3 Test networks at selected ports.18
6.4 Supply selection guide.22
6.5 Test networks at selected supplies.23
6.6 Parameter initialization of IC function modules for testing .24
6.7 Test parameter for performing conducted emission measurements .30
7 Test board layout recommendations.36
7.1 Common test board recommendations .36
7.2 150 Ω network on 2 layer and multi layer PCB.36
7.3 1 Ω network on 2 layer and multi-layer PCB .37
8 Test report .37

Annex A (normative) IEC 61967-4 test network modification .38
Annex B (informative) Trace impedance calculation .40
Annex C (informative) Examples for splitting ICs into IC function modules.42

Figure 1 – Common definition of an IC function module .8
Figure 2 – Flowchart of performing emission tests .15
Figure 3 – Test network for IC function module line driver.18
Figure 4 – Symmetrical line driver without termination (not required by bus system
datasheet) .18
Figure 5 – Symmetrical line driver with termination required by bus system datasheet.19
Figure 6 – Test network for IC function module line driver.19
Figure 7 – Test network for IC function module high side driver .20
Figure 8 – Test network for IC function module low side driver.21
Figure 9 – Conducted emission measurement circuits for IC function module supply .23
Figure 10 – Layout recommendation 150 Ω network .36
Figure 11 – Layout recommendation 1 Ω network .37

TR 61967-4-1  IEC:2005(E) – 3 –
Figure A.1 – 150 Ω network, attenuation chart of some example capacitor values .38
Figure B.1 – Micro stripline .40
Figure B.2 – Symmetric stripline.41
Figure B.3 – Offset stripline .41

TTable 1 – Example matrix for splitting ICs into IC function modules T .14
TTable 2 – EMC test recommendations for IC function modules T.16
TTable 3 – Test port selection table T .17
TTable 4 – Creating priority for a subset of supply modules T.23
TTable 5 – Driver toggling definition T.24
TTable 6 – Test initialization software module for cores containing a CPU T .27
TTable 7 –Test loop software module for cores containing a CPU T.29
TTable 8 – Test procedure driver switching noise, with CPU T.30
TTable 9 – Test procedure driver switching noise, without CPU T.30
TTable 10 – Test procedure port internal crosstalk, with CPU T.31
TTable 11 – Test procedure regional signal driver supply noise, with CPU T.31
TTable 12 – Test procedure regional signal driver supply noise, without CPU T .31
TTable 13 – Test procedure symmetrical line drivers, with CPU T.32
TTable 14 – Test procedure symmetrical line drivers, without CPU T .32
TTable 15 –Test procedure high side drivers (without CPU) T.32
TTable 16 – Test procedure low side drivers (without CPU) T.33
TTable 17 – Test procedure core supply, without CPU T .33
TTable 18 – Test procedure core to drivers and inputs crosstalk, without CPU T.34
TTable 19 – Test procedure core supply, core with CPU T.34
TTable 20 – Test procedure core to drivers and inputs crosstalk, core with CPU, single
driver or input port T.35
TTable 21 – Test procedure core to drivers and inputs crosstalk, with CPU, multiple
driver or input port T.35
TTable 22 – Test procedure oscillator supply noise, with CPU T .36
TTable 23 – Test procedure oscillator supply noise, without CPU T .36
TTable A.1 – Limit frequencies of modified DC block capacitor values in 150 Ω network T .39

– 4 – TR 61967-4-1  IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 4-1: Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 61967-4-1, which is a technical report, has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.

TR 61967-4-1  IEC:2005(E) – 5 –
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47A/694/DTR 47A/702A/RVC
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz
Part 1 General conditions and definitions
Part 2 Measurement of radiated emissions – TEM-cell method
Part 3 Measurement of radiated emissions – Surface scan method
Part 4 Measurement of conducted emissions – 1 Ω / 150 Ω Direct coupling method
Part 5 Measurement of conducted emissions – Workbench Faraday cage method
Part 6 Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date T indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this Technical Report may be issued at a later date.

– 6 – TR 61967-4-1  IEC:2005(E)
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 4-1: Measurement of conducted emissions –
1 Ω/150 Ω direct coupling method –
Application guidance to IEC 61967-4

1 Scope
This technical report serves as an application guidance and relates to IEC 61967-4.The
division of IC types into →IC function modules and the software modules for →cores with
CPU can be used for Parts 3, 5 and 6 of IEC 61967 as well. This report gives advice for
performing test methods described in IEC 61967-4 by classifying types of integrated circuits
(ICs) and providing hints for test applications related to the IC type classification.
To obtain comparable results of IC emission measurements using IEC 61967-4, definitions
are given which are in addition to the general conditions specified in IEC 61967-1 and
IEC 61967-4. These definitions concern IC related operating modes, pins and →ports to be
tested, test set-ups according IEC 61967-4, including description of load circuits and RF path,
and IC related emission limits (or limit classes). Parts of the guidance provided by this
technical report may be applicable to other parts of IEC 61967.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050(101), International Electrotechnical Vocabulary (IEV) – Part 101: Mathematics
IEC 60050(161:1990), International Electrotechnical Vocabulary (IEV) – Part 161: Electro-
magnetic compatibility
Amendment 2 (1998)
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-2, Integrated circuits − Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 2: Measurement of radiated emissions, TEM-cell method T T
IEC 61967-3, Integrated circuits − Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 3: Measurement of radiated emissions, surface scan method T T
IEC 61967-4, Integrated circuits − Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
———————
T T In preparation.
T T To be published.
TR 61967-4-1  IEC:2005(E) – 7 –
IEC 61967-5, Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to
1 GHz - Part 5: Measurement of conducted emissions, Workbench Faraday Cage method
IEC 61967-6, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method
ISO 9141, Road vehicle – Diagnostic systems – Requirements for interchange of digital
information
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
analog
pertaining to the representation of information by means of a physical quantity which may at
any instant within a continuous time interval assume any value within a continuous interval of
values
NOTE The quantity considered may, for example, follow continuously the values of another physical quantity
representing information.
[IEV 101-12-05]
3.2
core
→IC function module without any connection outside the IC via pins
NOTE The supply is connected via the IC function module supply to pins, signals to pins are connected via the IC
function module driver.
3.3
common mode (CM) current
in a cable having more than one conductor, including shields and screens, if any, the
magnitude of the sum of the phasors representing the currents in each conductor
[IEV 161-04-39]
3.4
digital
pertaining to the representation of information by distinct states or discrete values
[IEV 101-12-07]
3.5
differential mode (DM) current
in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half the
magnitude of the difference of the phasors representing the currents in each conductor
[IEV 161-04-38]
3.6
EMC pin type
3.6.1
global pin
signal carrier which comes from or leaves the application via a cable harness
NOTE The cable harness is an antenna for RF energy.
In general, there are series impedances (discrete components, PCB traces) and capacitances to an application's
ground system in between the cable harness and the IC pin to reduce the IC pin's RF emission.

– 8 – TR 61967-4-1  IEC:2005(E)
3.6.2
local pin
signal carrier which does not leave the application via a cable harness
NOTE 1 It remains on the application PCB as a signal between two components with or without additional EMC
components.
NOTE 2 In general, the PCB traces of these signals are as short as possible. Such a trace and the loop of the
signal current is a smaller antenna for RF energy in comparison to the cable harness, so the ability of the antenna
to radiate RF energy is smaller.
3.7
fixed function unit
FFU
functional core sub-unit of the →IC function module 'Core', designed to perform one fixed
function without instruction decode and execute capability
3.8
integrated circuit
IC
set of implemented →IC function modules in one die or package
3.9
IC type
IC with a characteristic set of functions built in
NOTE These functions are realized with →IC function modules.
3.10
IC function module
functional part of an IC with at least one function and its supply connection, if needed
3.10.1
passive IC function module
no supply system for function
3.10.2
active IC function module
dedicated supply connection needed for function
NOTE The supply connection is handled as a separate input/output pair as it has a dedicated EMC behavior.

supply connection
IC Function
inputs outputs
Module
supply reference
connection
Figure 1 – Common definition of an IC function module
3.11
printed circuit board
PCB
piece of isolating material with fixed metal traces to connect electronic components

TR 61967-4-1  IEC:2005(E) – 9 –
3.12
port
functional set of minimum one Driver and/or minimum one Input
NOTE It is physically related to one →fixed function unit (FFU, see IC function module core). It is very useful to
define this functional set of input and/or output IC function modules to get a common description of an interface
between an IC and its circuit environment.
3.13
active port
port switched to a defined configuration or connected to a →fixed function unit and controlled
during EMC measurements
3.14
inactive port
port switched to a defined configuration or connected to a →fixed function unit and remains
in a defined static mode
3.15
test port
port selected for IC EMC tests
3.16
supply pin pairs
all supply voltage pins of the same supply voltage system with their related ground pin(s) of
an IC supply module
4 Splitting ICs into IC function modules
4.1 Background
The functionality of an IC pin can be characterized as an IC function module. The defined set
of IC function modules is sufficient to be combined to every kind of IC on the market. The
advantage of this set of IC function modules is that it provides a description of EMC test set-
ups and emission limit levels for each single IC function module with its characteristic EMC
behaviour.
4.2 Benefits
– The number of test circuits is equivalent to the number of IC function modules
independent from all IC types currently existing and future IC types (for examples for
dividing actual IC types into IC function modules, see Annex C).
– The test circuit for each IC function module can be described precisely.
– Emission limits can be defined for each IC function module T T.
4.3 IC function modules
4.3.1 Port
The port is an interface between an IC and its circuit environment.
———————
T T Limit definitions are not the target of IEC standardization. Limits have to be defined by the specific user groups,
depending on application of EMC requirements in the business field concerned.

– 10 – TR 61967-4-1  IEC:2005(E)
IC function modules comprising a set of at least one IC function module 'Driver' and/or one IC
function module 'Input' are called 'port modules'. If there is no driver implemented in the port
or only 'local pin' defined drivers are implemented, the port is referred to as a 'local pin' type
port. If 'global pin' defined drivers are implemented, the port is referred to as a 'global pin' port.
PLL factor
Supply module Supply module
Core Oscillator
Oscillator
Supply Supply
(PLL)
Digital Logic
Digital Logic
or analog
or analog
Fixed-function Unit
Fixed-function Unit
Core
Digital Logic Digital Logic
or analog or analog
Fixed-function Unit Fixed-function Unit
Port
Supply module
Driver or Driver or Driver or Driver or
Port
Input Input Input Input
Supply
The Port can be a combination of eight kinds of port modules:
4.3.1.1 Line driver EMC pin type: 'global'
Drives signals into cables (signals leaving application to cable harness).
Examples: ISO 9141 outputs, LIN outputs.
4.3.1.2 Line receiver EMC pin type: 'global'
Receives signals from cables (signals get into application from cable harness).
Examples: ISO 9141 inputs, LIN inputs.
4.3.1.3 Symmetrical line driver EMC pin type: 'global'
Drives differential signals into cables with two phase-correlated outputs (signals leaving
application to cable harness).
Examples: CAN outputs, LVDS outputs.
4.3.1.4 Symmetrical line receiver EMC pin type: 'global'
Receives differential signals from cables with two phase-correlated inputs cables (signals get
into application from cable harness).
Examples: CAN inputs, LVDS inputs.
4.3.1.5 Regional signal driver EMC pin type: 'local'
Drives signals into all other kind of lines than cables not leaving the application (application
local signals).
TR 61967-4-1  IEC:2005(E) – 11 –
Examples: Digital signals: →Ports with inputs and outputs in 'Output mode', serial
data outputs, clock outputs, status signal outputs.
Analog signals: operational amplifier outputs.
4.3.1.6 Regional Input EMC pin type: 'local'
Receives signals with any or discrete voltage level from all kinds of lines other than cables
leaving the applications (local signals on application PCB).
Examples: Digital signals: →Ports with input and output modules in 'Input mode',
serial data inputs, clock inputs, status signal inputs (not
related to other IC function modules), interrupt inputs.
Analog signals: Input stages of operational amplifiers, input stages of
ADCs.
4.3.1.7 High side driver EMC pin type: 'global' or 'local'
Drives power into loads. The current flows out of the driver. If driver and load are on same
application PCB, the EMC pin type of the driver is 'local', if it is separated by a cable harness,
the EMC pin type of the driver is 'global'.
Examples: High side switch, switched power supply current output (step down converter).
4.3.1.8 Low side driver EMC pin type: 'global' or 'local'
Drives power into loads. The current flows into the driver. If driver and load is on same
application PCB, the EMC pin type of the driver is 'local', if it is separated by a cable harness,
the EMC pin type of the driver is 'global'.
Examples: Low side switch, switched power supply current input (step up converter).
4.3.2 Supply
Distributes supply current to at least one IC function module.
An IC function module with at least one current input pin of same supply system and minimum
one current output pin. It may contain active elements like voltage stabilization and/or passive
elements such as internal charge buffering, current limiting series elements and other kinds of
EMC filtering.
PLL factor
Supply module Supply module
Core Oscillator
Oscillator
Supply
Supply
(PLL)
Digital Logic
Digital Logic
or analog
or analog
Fixed-function Unit
Fixed-function Unit
Digital Logic Digital Logic
or analog or analog
Fixed-function Unit Fixed-function Unit
Supply module
Port
Driver or Driver or Driver or Driver or
Supply Input Input Input Input

– 12 – TR 61967-4-1  IEC:2005(E)
4.3.3 Core
A core is an IC function module without any connection outside of the IC via pins.
NOTE The supply is connected via the IC function module supply to pins. It contains a set of minimum one IC
function sub-module as described below.
PLL factor
Supply module
Supply module
Core
Oscillator
Oscillator
Supply
Supply
(PLL)
Digital Logic
Digital Logic
or analog
or analog
Fixed-function Unit
Fixed-function Unit
Core
Digital Logic Digital Logic
or analog or analog
Fixed-function Unit Fixed-function Unit
Supply module
Driver or Driver or Driver or Driver or
Port
Input Input Input Input
Supply
The core can be divided into two kinds of sub-modules:
4.3.3.1 Central processing unit (CPU)
A CPU decodes and executes instructions, can make decisions and jump to a new set of
instructions based on those decisions.
Sub-units within the CPU decode and execute instructions (Sub-Unit CU (Control Unit)) and
perform arithmetic and logical operations (Sub-Unit ALU (Arithmetic/Logic Unit)), making use
of small number-holding areas called registers.
4.3.3.2 Fixed function unit (FFU)
Functional core sub-unit -> IC function module ‘Core’, designed to perform one analog, digital,
or mixed-signal fixed function without instruction decode and execute capability
4.3.3.2.1 Digital logic fixed function unit
Functional core sub-unit, designed to perform one fixed core Udigital logic U function without
instruction decode and execute capability.
Examples: UClock distribution U, UMemory logic and arrays U, Registers, Timer, Watchdog Timer,
State Machines, Programmable Logic Arrays (PLA).
4.3.3.2.2 Analog fixed function unit
Functional core analog sub-unit, clocked or unclocked, designed to perform one fixed core
analog function without instruction decode and execute capability.
Examples: Analog-to-digital-converter (ADC), Digital-to-analog-converter (DAC), Sample-
and-hold-circuits, Switched capacitor filter, Charge Coupled Devices (CCDs).

TR 61967-4-1  IEC:2005(E) – 13 –
Dedicated analog fixed function unit: sensor element
A sensor element is a converter of an environmental value into an electrical value and
therefore a FFU.
Examples: Hall sensor element for magnetic field sensing, E-field sensing, acceleration
sensing. It can be combined with a precision amplifier (FFU), a supply module
and a line driver to realize an IC type "sensor".
4.3.4 Oscillator
Generates a periodic signal.
NOTE This IC function module is a combination of a fixed function module of the core with regional drivers and
regional inputs, but because of its EMC behaviour, it is dedicated to be defined as a separate IC function module.
A fixed-frequency oscillator may be part of a phase locked loop (PLL) circuit with voltage
controlled oscillator (VCO), low pass filter, frequency divider and phase detection. All pins
related to these circuits (for example divider, digital logic input pins) are part of this IC
function module.
PLL factor
Supply module
Supply module
Core
Oscillator
Oscillator
Supply
Supply
(PLL)
Digital Logic
Digital Logic
or analog
or analog
Fixed-function Unit
Fixed-function Unit
Core
Digital Logic Digital Logic
or analog or analog
Fixed-function Unit Fixed-function Unit
Supply module
Driver or Driver or Driver or Driver or
Port
Input Input Input Input
Supply
– 14 – TR 61967-4-1  IEC:2005(E)
4.4 Example matrix for splitting ICs into IC function modules
Table 1 – Example matrix for splitting ICs into IC function modules
Functional module Connection external circuit via pin No pin local external
circuits
Driver (outputs) Inputs Supplies Core Core/inputs

supply connec
IC Function
inputs output
Module
supply referen
connection
IC type examples
Microcontrollers
• • • • • • •
RAM, ROM, bus
•   • • •
drivers
Logic gate ICs
•   • • •
Operational
(•) (•) • • • •
amplifier
VCOs  •   • • • •
Sensor circuit • (•) (•)   • •
High side switch
(•) • • • • (•) (•)
Low side switch
(•)  •  • • • (•)
Bridge
(•)  • •  • • • (•)
Symmetrical
communication
• •  • • • • (•) (•)
(e.g. CAN,
LVDS)
Asymmetrical
communication
• •  • • • • (•) (•)
(e.g. LIN, single
wire CAN)
Voltage regulator,
(•) • • (•) • (•) (•)
linear
Voltage regulator,
(•) (•) (•) (•) (•) (•)
• • •
switch mode
ASICs Any combination
• = standard configuration
(•) = possible alternative configuration
NOTE For visual examples, see Annex C.

Interface driver Power driver Analog ICs Digital ICs
Line driver
Symmetrical line driver
Regional signal driver
High side driver
Low side driver
Line receiver
Symmetrical line receiver
Regional input
All IC function module supplies
Digital fixed function unit
Analog fixed function unit
Central processing unit (CPU)
Oscillator
TR 61967-4-1  IEC:2005(E) – 15 –
5 Workflow to perform IC EMC emission tests
5.1 Emission test philosophy
The recommended order to test a DUT is to perform measurements from 'outside' to 'inside'.
Highest priority have signals and supplies defined as EMC pin type 'global', see Definition
3.6.1.
5.2 Flowchart of performing emission tests

Split DUT's internal functions (circuit blocks) into IC function modules
Identify the IC function modules of the DUT, see 4.3

Common test circuit
Create a test circuit with recommended components according datasheet

Ports (combinations of drivers and inputs)
1. Select Ports for emission tests, for selection guide see 6.1
2. Add test circuits (networks and connectors) according to 6.3.1 to 6.3.5 of corresponding drivers
and inputs to all selected Ports.
NOTE Crosstalk core-to-ports is measured with these test circuits, too.

Core (combinations of sub-modules without connection to outside of the IC)
Core with CPU: select active fixed function units by corresponding software as a combination of two
parts, the initialization part and the loop software part (see 6.6 ).
Core without CPU: select 'worst case' action of the core, if possible.

Supplies
1. Select Supplies (minimum the supplies of the ports selected above) for emission tests, for
selection guide see 6.4.
2. Add test circuits (networks and connectors) according to 6.5 to all selected Supplies.

Test board creation
Create test board layout with test circuit diagram designed above. For layout recommendations, see
Clause 7.
Performing measurements
Perform tests determined with the selections above.

Test report
Combine data to a test report: motivation of test pin selections, test circuit diagram, test board
description, software descriptions (if Core contains a CPU, see 6.7.7), supplies, environmental
parameters and result data. See Clause 8.

Figure 2 – Flowchart of performing emission tests

– 16 – TR 61967-4-1  IEC:2005(E)
6 Test configurations for IC function modules
6.1 EMC test recommendations for IC function modules
The following IC function modules should be tested for conducted emission:
Table 2 – EMC test recommendations for IC function modules
Kind of coupling
EMC pin type
Test to be
IC function module and emission
considered
output
Local Global
Port IC function modules
Line driver • Yes Directly to driver pin
Line receiver No -
•
Symmetrical line driver Yes Directly to driver pins
•
Symmetrical line receiver • No -
Regional signal driver • Yes Directly to driver pin
Regional input No -
•
1 1
High side driver • P P • P P Yes Directly to driver pin
1 1
Low side driver • P P • P P Yes Directly to driver pin
Indirectly by
Oscillator • Yes
crosstalk to pin
Core sub modules
Crosstalk to driver
CPU • Yes
pin
Crosstalk to driver
Digital Logic FFU • Yes
pin
Analog FFU No -
•
Analog FFU sensor element • No -
IC function modules supply
All available IC function module supplies • • Yes Directly to supply pin
P P EMC pin type depending on whether is a cable harness in between pin and load or not.

6.2 Port selection guide
6.2.1 Test pin selection
At least one port should be prepared for measurement.
6.2.2 If more than one port is implemented into the IC:
The selection of a 'representative port' should be carried out according to the following
priorities:
TR 61967-4-1  IEC:2005(E) – 17 –
Table 3 – Test port selection table
EMC risk Item Port selection Testing kind of coupling
Minimum one driver of a port is EMC
Direct coupling:
pin type 'global':
Driver switching noise
High All type 'global' driver pins
- line driver
Indirect coupling:
Crosstalk driver to driver P P
- symmetrical line driver
Fastest port, base for
selection: switch to 'multi-
High Port slew rate and driver strength function' and fastest switching Driver switching noise
edges and/or select port with
the highest driver capability
Dedicated digital signals: Examples
System clock outputs CLOCK_OUTx
SPI_CLOCK
High Serial communication outputs Driver switching noise
SPI_MOSI
CLOCK
Parallel communication outputs
DATAx
Use an already selected test
Medium Oscillator, digital FFU, CPU Crosstalk oscillator-to-port
port
P P More than one test network needed, for example see Figure 6, 'multiple driver port'.

For example:
In case of more than one multiple driver/input ports (e.g.: microcontroller):
Select the port, consisting of identical 4 or 8 or 16, … I/O-drivers according following criteria:
a) The port with the shortest rising and falling time capability for emission measurements.
NOTE EMC functionality, e.g. voltage edge control, should be disabled for port selection.
b) Additionally this port should be the closest to the core of the microcontroller or where the
highest crosstalk via supply and other noisy structures, for example clock distribution, is
expected.
– 18 – TR 61967-4-1  IEC:2005(E)
6.3 Test networks at selected ports
6.3.1 Line driver
(Z = 50 Ω)
trace
(Z = 50 Ω)
trace R
An
C
Bn
IC
IC
Ω
120 C
B2
R
A2
R C
1 1
C
R B1
R
A1
Ω)
(Z = 150
trace
R
(Z = 150 Ω)
trace
Circuit A: Single line driver port Circuit B: Multiple line driver port*
* Use circuit B, if more than one driver I to be tested simultaneously (means: all drivers are active) of a multiple line
driver port, only suitable for sum emission measurement of all drivers.

C B B 6,8 nF or maximum load capacitance according to IC data sheet (see Annex A)
R B B=
A1
R = 120Ω ⋅ n n = number of line drivers
A ±5%
R B B=.
A2
Select a resistor according resistor standard set within the tolerance of 5 %
=R B B
An
C
C B B=
B1 1
C = n = number of line drivers
B ±5%
C B B=.
B2
n
= C B B
Bn
Select a capacitor according to capacitor standard set within the tolerance of 5 %
Figure 3 – Test network for IC function module line driver
6.3.2 Symmetrical line driver
6.3.2.1 Bus system with separate termination*
(Z = 50 Ω)
trace
IC
R
A
C
B
R
A
C
B
R
(Z = 150 Ω)
trace-to-ground
(Z according bus
trace-to-trace
system datasheet )
CB 6,8 nF or maximum load capacitance according to IC data sheet (see Annex A)
1B
Common bus systems 240 Ω
RB Deviant definition: CAN 120 Ω
AB
-3T
NOTE The resistance matching tolerance shall be better than 10T
Common bus systems 6,8 nF
Deviant definition: CAN 4,7 nF
CB
BB
NOTE The impedance of both capacitors CB shall be small compared to RA, the matching tolerance may
be not so tight as with the resistors. By default for CB a capacitance matching tolerance of better than 10-2
is sufficient.
*
P PTermination not part of the test network, but may be needed for the symmetrical line driver.

Figure 4 – Symmetrical line driver without termination
(not required by bus system datasheet)
Core
Line Driver
Core
Symmetrical
51 Ω
Line Driver
Core
Ω
Line Driver
Ω
TR 61967-4-1  IEC:2005(E) – 19 –
6.3.2.2 Bus system with termination used for test network
(Z = 50 Ω)
trace
R
IC
A2
R
A1
R C
B 1
R
(Z = 150 Ω)
trace-to-ground
(Z according bus
trace-to-trace
system datasheet )
C B B 6,8 nF or maximum load capacitance according IC data sheet (see Annex A)
Examples:
Bus system R B B
Ax
Termination according bus system datasheet to the symmetrical
R B B=
A1
star point (this point has no resulting current to reference ground, High speed CAN 30 Ω
R B B
A2
if there is no common mode current on lines)
LVDS
50 Ω
Airbag squib e.g. 1 Ω
Examples:
R
Bus system R B B
A
B
R = 125 Ω −
B ±5%
High Speed CAN
R B B 110 Ω
B
Select a resistor according resistor standard set within the
LVDS 100 Ω
tolerance of 5 %
Airbag squib 130 Ω
Figure 5 – Symmetrical line driver with termination required by bus system datasheet
6.3.3 Regional signal driver
**
R
Pullup
(Z = 150 Ω) (Z = 50 Ω)
trace trace
V
cc
R C
1 1
*
Ω
R 120
Pullup IC
V
cc
(Z = 50 Ω)
trace
V
cc
IC
R
120 Ω 2
V
cc
R 6.8nF
Ω 3
R
* 4
Network B
C
R C
LOAD
1 1
R
(Z = 150 Ω)
trace
Network A
Network A Network B
static output tests toggle output tests
Single driver port Multiple driver port, minimum test configuration

C B B, C B B 6,8 nF or maximum load capacitance according IC data sheet (see Annex A)
1 Load
Digital signal: according IC data sheet, if it is needed for external pull up (default 3 300 Ω)
at IC function module input
R B B
Pullup
Analog signal: signal connection to functional required circuit
Figure 6 – Test network for IC function module line driver
Core
Region Driver
al
or Input
Core
Symmetrical
Line Driver
Ω
Core
Regional Drivers
or Inputs
Ω
51 Ω
51 Ω
– 20 – TR 61967-4-1  IEC:2005(E)
6.3.4 High side driver
(Z = 50 Ω)
trace
supply
120 Ω
Ω) R 6.8 nF
(Z = 150
trace
IC output C R
1 2
L L
reference D C
1 2
R
49 Ω
Load
1 2
Alternative measurements depending on
configuration and load, see definition below
1 Ω Probe
Setup component variation
Placement depending on circuit type
Item Value
Linear voltage Switched mode power
High side driver circuit
regulator circuit supply circuit
L B B 5 µH • • •
L B B acc. IC data sheet Shorted Shorted •
D B B acc. IC data sheet
•
C B B acc. IC data sheet • •
• • •
ΔT
R B B According I B B
Load mes
I =
mes
I B B= 80% of I B B I B B= 80% of I B B
R ⋅ R
mes nom mes nom
th ON150
(ΔT = 65 K, I B B ≤ 10 A)
mes
R B B ≤ 30 Ω 1 1 1
Load
Test
DC load current: 1
network
1 1
R B B > 30 Ω
Load
PWM load current: 2
Figure 7 – Test network for IC function module high side driver
Core
High Side
Driver
1 Ω
51 Ω
TR 61967-4-1  IEC:2005(E) – 21 –
6.3.5 Low side driver
V
DD
R
Load,1
1 2 Alternative measurements
depending on configuration and
L
load, see definition below
supply
L
2 (Z = 50 Ω)
C trace
D (Z = 150 Ω)
trace
IC output
120 Ω
6.8 nF
R
C
R
reference 2
C R
2 Load,2
49 Ω
1 Ω Probe
Setup component variation
Placement depending on circuit type
Item Value
Low side driver Boost converter
C B B acc. IC data sheet
•
C B B acc. IC data sheet
•
L B B 5 µH • Optional
L B B acc. IC data sheet Shorted •
D B B acc. IC data sheet Shorted
•
• Shorted
ΔT
R B B According I B B
Load,1 mes I =
mes
R ⋅ R
th ON150
(ΔT = 65 K, I
...