IEC 61189-2-501:2022
(Main)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
L’IEC 61189-2-501:2022 établit une méthode mettant à l’essai la souplesse d’un stratifié flexible recouvert de cuivre (FCCL, Flexible Copper Clad Laminate) et des matériaux apparentés. Cette méthode détermine l’élasticité dans des conditions spécifiées. L’essai est effectué sur un échantillon tel que fabriqué et sans conditionnement. L’essai ne s’applique pas à une force élastique inférieure à 10 mN.
General Information
- Status
- Published
- Publication Date
- 02-Feb-2022
- Technical Committee
- TC 91 - Electronics assembly technology
- Drafting Committee
- WG 10 - TC 91/WG 10
- Current Stage
- PPUB - Publication issued
- Start Date
- 28-Jan-2022
- Completion Date
- 03-Feb-2022
Overview
IEC 61189-2-501:2022 is an international standard published by the International Electrotechnical Commission (IEC) that defines test methods for evaluating the mechanical resilience of flexible dielectric materials used in electrical interconnection structures. This part 2-501 standard specifically focuses on measuring the resilience strength and the resilience strength retention factor of flexible copper clad laminates (FCCLs) and similar flexible dielectric materials commonly utilized in printed boards and electronic assemblies.
Designed to assess the softness and mechanical response of FCCL products as manufactured, IEC 61189-2-501 provides a precise, reproducible method to quantify how these materials withstand compression and retain their elasticity without conditioning or aging processes. It excludes tests on samples with resilience force below 10 mN, ensuring the method targets materials relevant for industrial applications.
Key Topics
- Softness Measurement: Defines softness as the resistance to pressure, which enables easy molding essential for flexible dielectric materials.
- Resilience Force & Strength: The standard measures the force generated by a material when compressed (resilience force) and the force normalized by specimen width (resilience strength, mN/mm).
- Retention Factor: Evaluates how well the material maintains its resilience after holding compression, expressed by the resilience strength retention factor (ratio of post-compression to maximum resilience force).
- Test Specimens and Apparatus: Specifies requirements for precision measurement tools including micrometers, calipers, rulers, and specially designed compressive jigs for consistent testing.
- Test Procedure: Covers sample preparation without conditioning, compression testing at a controlled 50 mm/min rate, and detailed force measurement until a pre-set final distance between clamps is reached.
- Directions and Dimensions: Considers the machine direction (MD) and transverse direction (TD) of flexible materials, ensuring tests reflect manufacturing orientations and real-world conditions.
Applications
The IEC 61189-2-501 standard is invaluable for:
- Quality Assurance in Electronics Manufacturing: Ensures FCCL materials used in printed circuit boards (PCBs) meet mechanical resilience criteria to avoid failures in flexible interconnections.
- Material Selection and Development: Provides reliable data for manufacturers developing flexible dielectric materials with optimized softness and resilience tailored to various electronic applications.
- Research and Development: Supports engineering teams in quantifying mechanical properties critical for flexible interconnection designs in advanced electronics including wearable devices, foldable displays, and flexible sensors.
- Supplier Certification: Aids in establishing consistent criteria for suppliers of FCCLs and dielectric films, ensuring materials conform to internationally recognized resilience performance.
- Compliance and Interoperability: Helps manufacturers align with global standards facilitating smoother international trade and technology integration.
Related Standards
IEC 61189-2-501:2022 is part of the broader IEC 61189 series that governs test methods for electrical materials, printed boards, and interconnection assemblies. Related documents in this series cover additional mechanical, physical, and electrical tests such as:
- IEC 61189-2-x: Various parts focusing on different test methods for materials used in electronic interconnections.
- IEC 61249: Standards for base materials like copper-clad laminates for printed boards.
- IPC Standards (e.g., IPC-TM-650): Widely referenced US standards for flexible circuit material testing that complement IEC methodologies.
- ISO/IEC Directives: Provide guidance on the development and implementation of IEC standards ensuring conformity and harmonization.
Adoption of IEC 61189-2-501:2022 promotes standardized evaluation of flexible dielectric materials contributing to higher reliability and performance in modern flexible electronics. Its focus on resilience strength measurement underlines the critical role of mechanical properties in the durability and effectiveness of flexible interconnection structures used worldwide.
IEC 61189-2-501:2022 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Frequently Asked Questions
IEC 61189-2-501:2022 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials". This standard covers: IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
IEC 61189-2-501:2022 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
You can purchase IEC 61189-2-501:2022 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.
Standards Content (Sample)
IEC 61189-2-501 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention factor of
flexible dielectric materials
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –
Mesure de la puissance élastique et du facteur de rétention de la puissance
élastique des matériaux diélectriques flexibles
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IEC 61189-2-501 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention factor of
flexible dielectric materials
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –
Mesure de la puissance élastique et du facteur de rétention de la puissance
élastique des matériaux diélectriques flexibles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1071-7
– 2 – IEC 61189-2-501:2022 IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and materials . 8
5 Test specimens . 8
6 Procedure . 8
7 Calculation . 10
8 Report . 11
Annex A (informative) Example of test fixture . 12
Figure 1 – Test specimen . 8
Figure 2 – Schematic of compression jig with test specimen . 9
Figure 3 – Force curve . 10
Figure A.1 – A test fixture and a fixture with a sample . 12
Figure A.2 – General assembly drawing . 13
Figure A.3 – A detailed dimensional drawing for each part of an example test fixture . 15
Figure A.4 – Construction of a test fixture is using the parts shown in Figure A.3 . 16
Figure A.5 – Connector attachments . 16
Table 1 – Settings of distance between the clamps after compression . 9
Table A.1 – Parts list . 13
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention
factor of flexible dielectric materials
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-501 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1765/FDIS 91/1774/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 61189-2-501:2022 IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed
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subject of patent rights other than those in the patent database. IEC shall not be held
responsible for identifying any or all such patent rights.
– 6 – IEC 61189-2-501:2022 IEC 2022
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention
factor of flexible dielectric materials
1 Scope
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible
Copper Clad Laminate) products and related materials. This method determines the resilience
under specified conditions. The test is performed on the sample as manufactured and without
conditioning. The test does not apply to the resilience force lower than 10 mN.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
softness
property of little resistance to pressure
Note 1 to entry: This property enables easy molding.
3.2
resilience force
force produced by the deformation of an object under a force, which is opposite to the direction
of the applied force
3.3
maximum resilience force
L
max
resilience force when compressed to the final distance, expressed in millinewtons (mN)
3.4
resilience strength
F
max
resilience force per unit width, expressed in millinewtons per millimetres (mN/mm)
3.5
resilience force at the end of holding pressure
L
end
resilience force after compression to the final distance and held for a specified time, expressed
in millinewtons (mN)
3.6
resilience strength at the end of holding pressure
F
end
resilience force per unit width at the end of holding pressure, expressed in millinewtons per
millimetres (mN/mm)
3.7
resilience strength retention factor
K
Rf
ratio of the resilience strength at the end of holding pressure to the maximum resilience strength
at the final distance, reflecting the ability of the material to continue to retain the resilience after
the compression is completed
3.8
MD
machine direction
direction of flexible dielectric materials passing through an assembly line viewed from the
operator side
3.9
TD
transverse direction
direction perpendicular to the machine direction
3.10
initial distance
distance between the clamps before compression, expressed in millimetres (mm)
3.11
clamp distance
distance between the clamps, expressed in millimetres (mm)
3.12
test equipment
calibrated test equipment equipped with a load cell, capable of measuring to the nearest
0,001 N, and capable of a feed rate of (50 ± 1) mm per minutes
Note 1 to entry: The clamp jaws must cover the width of specimens.
3.13
test fixture
apparatus for compressing the test specimens
SEE: Figure 2
Note 1 to entry: See Annex A for additional information.
– 8 – IEC 61189-2-501:2022 IEC 2022
4 Test apparatus and materials
The test apparatus and materials are the following:
– micrometer: apparatus with 0,001 mm resolution for measuring the thickness of the test
specimens;
– calliper: apparatus with 0,01 mm resolution for measuring the width of the test specimens;
– ruler: apparatus with 0,1 mm resolution for measuring the length of the test specimens;
– sample cutter: apparatus for cutting the test specimens;
– marking pen: apparatus for drawing a straight line on test specimens as shown in Figure 1
with a clearly readable colour, in contrast to the colour of the test specimen.
The marking should be durable through the whole test procedure.
5 Test specimens
Test specimens should be cut of unclad material. The size of each specimen should be
(120 ± 2,0) mm × (15 ± 0,1) mm, described in Figure 1. Each specimen should be marked as
described in Figure 1. The test specimen should be free of incisions, twists, wrinkles and burrs.
Dimensions in millimetres
Figure 1 – Test specimen
6 Procedure
The procedure is as follows:
a) determine the thickness (h) and width (W ) of each prepared specimen;
S
b) initial distance is set to (30 ± 0,05) mm;
c) set the distance of the clamps after compression according to Table 1; the distance between
the clamps after compression is set according to the sample thickness, accurate to
± 0,05 mm, as shown in Table 1;
Dimensions in millimetres
Figure 2 – Schematic of compression jig with test specimen
Table 1 – Settings of distance between the clamps after compression
Specimen thickness, h Clamps distance after compression
h < 0,1 mm (1 ± 0,05) mm
0,1 mm ≤ h < 0,2 mm (2 ± 0,05) mm
0,2 mm ≤ h < 0,3 mm (3 ± 0,05) mm
0,3 mm ≤ h < 0,4 mm (4 ± 0,05) mm
Or user-defined
d) compression rate is set to (50 ± 1) mm/min;
e) pressure holding time after compression is set to (30 ± 0,5) s;
f) clamp the test specimen vertically in the upper and lower compression jigs to ensure that
the marked lines at both end are parallel with the edge of the jigs;
g) test Single-side adhesive specimens in a manner of adhesive-side inward bending, and
double-side asymmetric adhesive specimens in a manner of thicker adhesive-side inward
bending;
h) set the force of test equipment to zero and start the compression process according to the
above settings, and record the test process. The force curve is as shown in Figure 3;
– 10 – IEC 61189-2-501:2022 IEC 2022
Figure 3 – Force curve
i) record the maximum load value L and Load at the end of holding pressure value L of
max end
each specimen.
7 Calculation
a) Calculate the maximum resilience strength per Formula (1):
L
max
F =
max (1)
W
S
where
F is the maximum resilience strength, expressed in millinewtons per millimetres
max
(mN/mm);
L is the maximum load, expressed in millinewtons (mN);
max
W is the measured width of the specimen, expressed in millimetres (mm).
S
b) Calculate the resilience strength at the end of holding pressure as per the Formula (2):
L
end
F = (2)
end
W
S
where
F is the resilience strength at the end of holding pressure, expressed in millinewtons
end
per millimetres (mN/mm);
L is the resilience force at the end of holding pressure, expressed in millinewtons
end
(mN);
W is the measured width of the specimen, expressed in millimetres (mm).
S
c) Calculate the resilience strength retention factor as per the Formula (3):
F
end
K =
Rf (3)
F
max
where
K is the resilience strength retention factor;
Rf
F is the maximum resilience strength;
max
F is the resilience strength at the end of holding pressure
end
8 Report
Report the following:
a) test environment (temp
...
記事のタイトル:IEC 61189-2-501:2022 - 電気材料、プリント基板、他の接続構造および組立体の試験方法 - 第2-501部:接続構造用材料の試験方法 - 柔軟な絶縁材料の残留力と残留力保持係数の測定 記事の内容:IEC 61189-2-501:2022は、柔軟性銅被覆ラミネート(FCCL)製品および関連する材料の柔軟性を試験するための適切な方法を確立しています。この方法は、指定された条件下での残留力を決定します。このテストは、サンプルが製造されたままで、調整なしで行われます。ただし、残留力が10 mN未満の場合は、このテストは適用されません。
글 제목: IEC 61189-2-501:2022 - 전기 소재, 인쇄 기판 및 기타 상호 연결 구조물 및 조립품에 대한 시험 방법 - 제 2-501 부: 상호 연결 구조물용 소재의 시험 방법 - 유연한 절연 소재의 복원력 강도 및 복원력 유지율의 측정 글 내용: IEC 61189-2-501:2022은 FCCL (유연한 동박 구리 도금 기판) 제품 및 관련 소재의 연성을 테스트하는 데 적합한 방법을 제시합니다. 이 방법은 지정된 조건에서의 복원력을 결정합니다. 이 테스트는 제조 과정에서의 샘플에 대해 수행되며, 조건부 없이 진행됩니다. 그러나 복원력 힘이 10 mN보다 낮은 경우에는 이 테스트를 적용할 수 없습니다.
The article discusses a new test method, IEC 61189-2-501:2022, that measures the softness or resilience of Flexible Copper Clad Laminate (FCCL) products and related materials. The test is conducted on the sample as it is manufactured and without any conditioning. However, the test is not suitable for measuring resilience forces lower than 10 mN.










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