IEC 61189-2-719:2016

IEC 61189-2-719 ®
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-719: Test methods for materials for interconnection structures – Relative
permittivity and loss tangent (500 MHz to 10 GHz)

Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion –
Permittivité relative et tangente de perte (500 MHz à 10 GHz)
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IEC 61189-2-719 ®
Edition 2.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-719: Test methods for materials for interconnection structures – Relative

permittivity and loss tangent (500 MHz to 10 GHz)

Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-719: Méthodes d'essai des matériaux pour structures d'interconnexion –

Permittivité relative et tangente de perte (500 MHz à 10 GHz)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3520-1

– 2 – IEC 61189-2-719:2016 © IEC 2016
CONTENTS
FOREWORD. 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test methods. 6
4.1 Test specimens . 6
4.1.1 General . 6
4.1.2 Size . 6
4.1.3 Thickness of dielectric . 6
4.1.4 Thickness of copper foil . 6
4.2 Test set . 7
4.3 Test fixture . 9
4.4 Test equipment . 11
4.5 Procedure . 11
4.5.1 Measurements . 11
4.5.2 Calculations . 12
5 Report . 14
6 Additional information . 14
6.1 Accuracy . 14
6.2 Additional information concerning fixtures and results . 14
Annex A (informative) Example of test fixture and test results . 15
A.1 Dimension example of a test fixture . 15
A.2 Example of test results . 19

Figure 1 – One side of board A . 7
Figure 2 – Another side of board A . 7
Figure 3 – Cross section between X1 and X2 of board A . 8
Figure 4 – Cross section between Y1 and Y2 of board A . 8
Figure 5 – One side of board B . 8
Figure 6 – Another side of board B . 9
Figure 7 – Cross-section between X1 and X2 of board B . 9
Figure 8 – Cross section between Y1 and Y2 of board B . 9
Figure 9 – Top view of test fixture . 10
Figure 10 – Horizontal cross section of test fixture with test set . 10
Figure 11 – Side view of test fixture . 10
Figure 12 – Vertical cross-section of test fixture with test set . 11
Figure 13 – Example of VNA raw data . 12
Figure 14 – Envelopes of raw data from VNA measurement . 14
Figure A.1 – Parts of test fixture . 17
Figure A.2 – Construction of parts . 18
Figure A.3 – Part for connector attachment . 18
Figure A.4 – Attachment with connector . 19
Figure A.5 – An example of measured ε data, PTFE CCL . 19
r
Figure A.6 – An example of measured tanδ data, PTFE CCL . 20

– 4 – IEC 61189-2-719:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-719: Test methods for materials for interconnection structures –
Relative permittivity and loss tangent (500 MHz to 10 GHz)

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