IEC 61189-3-719:2016

IEC 61189-3-719 ®
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3-719: Test methods for interconnection structures (printed boards) –
Monitoring of single plated-through hole (PTH) resistance change during
temperature cycling
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes
imprimées) – Contrôles de la variation de résistance des trous métallisés
uniques (PTH) au cours des cycles de températures
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IEC 61189-3-719 ®
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 3-719: Test methods for interconnection structures (printed boards) –

Monitoring of single plated-through hole (PTH) resistance change during

temperature cycling
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes

imprimées) – Contrôles de la variation de résistance des trous métallisés

uniques (PTH) au cours des cycles de températures

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3095-4

– 2 – IEC 61189-3-719:2016 © IEC 2016
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
5.1 Reflow equipment . 6
5.2 Temperature cycling chamber . 6
5.3 Electrical resistance recording . 6
6 Procedure . 7
6.1 Preconditioning . 7
6.2 Temperature cycling test . 8
7 Report . 9
8 Additional information . 10
Bibliography . 11

Figure 1 – Example photograph of a section of a test coupon for a six-layer PCB . 6
Figure 2 – Principle of online resistance measurement with high currents . 7
Figure 3 – Reflow temperature profile for PCB preconditioning . 8

Table 1 – Details of the reflow temperature profile for PCB preconditioning . 8

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3-719: Test methods for interconnection structures
(printed boards) – Monitoring of single plated-through hole (PTH)
resistance change during temperature cycling

FOREWORD
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International Standard IEC 61189-3-719 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1303/FDIS 91/1327/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 61189-3-719:2016 © IEC 2016
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 3-719:
...