IEC 61192-5:2007
(Main)Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.
Exigences relatives à la qualité d'exécution des assemblages électroniques brasés - Partie 5: Retouche, modification et réparation des assemblages électroniques brasés
La CEI 61192-5:2007 fournit des informations et des exigences s'appliquant aux procédures de modification, retouche et réparation des assemblages électroniques brasés. Elle s'applique à des processus spécifiques utilisés pour la fabrication d'assemblages électroniques brasés où les composants sont fixés à des cartes imprimées et aux parties concernées des produits qui en résultent. La norme s'applique également aux activités pouvant faire partie du travail d'assemblage des produits issus de technologies mixtes. Elle contient également des directives relatives aux questions de conception dans les cas où la retouche est nécessaire.
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INTERNATIONAL IEC
STANDARD 61192-5
First edition
2007-05
Workmanship requirements
for soldered electronic assemblies –
Part 5:
Rework, modification and repair
of soldered electronic assemblies
Reference number
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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INTERNATIONAL IEC
STANDARD 61192-5
First edition
2007-05
Workmanship requirements
for soldered electronic assemblies –
Part 5:
Rework, modification and repair
of soldered electronic assemblies
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 61192-5 © IEC:2007(E)
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references .8
3 Terminology .9
3.1 Terms and definitions .9
3.2 Abbreviations .9
4 Classification of rework activities.10
4.1 Pre-soldering rework .10
4.2 Post-soldering rework.10
4.3 Essential prerequisites for successful and reliable rework .10
5 Pre-soldering rework .11
5.1 General .11
5.2 Reworking solder paste and non-conducting adhesive deposits.11
5.2.1 General .11
5.2.2 General misalignment or smudging of deposits.11
5.2.3 Local misalignment or smudging of deposit.11
5.2.4 General paste or adhesive quantity incorrect .12
5.2.5 Local paste or adhesive quantity incorrect .12
5.3 Reworking placed components .12
5.3.1 General overall component misalignment .12
5.3.2 Local component misalignment.12
5.4 Realigning components after curing thermoplastic adhesive .12
5.5 Realigning components after curing thermosetting adhesive.12
6 Factors affecting post-soldering rework .13
6.1 Component marking and unmarked components .13
6.2 Reuse of removed components .13
6.3 Sensitive components .13
6.4 Printed board layout design and space constraints .14
6.5 Heat-sink effects .14
6.6 Printed board material type .14
6.7 Solder resist material and aperture size .15
6.8 Reworking individual fine pitch device leads .16
6.9 Reworking grid arrays .16
7 Preparation for post-soldering rework and repair .17
7.1 Electrostatic precautions .17
7.2 Avoiding exposure of components to contaminants.17
7.3 Removal of conformal coating .17
7.4 Unsuitable components .18
7.5 Cleaning prior to rework .18
7.6 Protecting adjacent sensitive components .18
7.7 Baking of assemblies prior to component replacement .18
7.8 Preheating large multilayer boards .18
7.9 Preheating replacement sensitive components .18
8 Post-soldering rework.19
8.1 General .19
61192-5 © IEC:2007(E) – 3 –
8.2 Component realignment (tweaking) .19
8.3 Component removal .19
8.4 Removal of adjacent components .19
8.5 Reuse of components.19
8.6 Addition of flux and solder .20
8.7 Topping-up.20
8.8 Removal of excess solder from joints .21
8.9 Preparation of lands before component replacement .21
8.10 Component replacement.22
8.11 Cleaning (if required).22
8.12 Visual inspection and electrical testing .22
8.13 Checking thermal integrity of solder joints .22
8.14 Replacement of local conformal coating (if required) .22
9 Selection of rework equipment, tools and methods .22
9.1 General .22
9.2 Matching rework equipment to component and printed-board prerequisites .23
9.2.1 General .23
9.2.2 Selection based on component types on the printed board .24
9.2.3 Selection based on printed-board laminate material type .24
9.2.4 Selection based on assembly structure and soldering processes .24
10 Manual rework tools and methods .26
10.1 General .26
10.2 Miniature conventional (stored energy) soldering irons .26
10.3 Directly heated soldering irons .27
10.4 Hot air/gas pencils.28
10.5 Heated tweezers .28
10.6 Soldering irons with special tips .29
11 Mechanized and programmable rework machines.29
11.1 General .29
11.2 Hot air rework machines.29
11.3 Focused infrared (IR) equipment .30
11.4 Thermode (heated electrode) equipment .31
11.5 Laser equipment for de-soldering .32
12 Ancillary tools and equipment.33
12.1 Conventional soldering irons .33
12.2 Hotplates.33
12.3 Pneumatic dispensers .33
12.4 De-soldering tools, as used for through-hole assemblies .34
12.5 Tweezers and vacuum pencils.34
12.6 Solder pots.34
12.7 Copper braid .34
13 Rework recording procedures .34
13.1 General .34
13.2 Anomaly charts .34
13.3 Travelling documents .35
13.4 Rework status .36
14 Training of operators and inspectors .36
15 Field repair .37
– 4 – 61192-5 © IEC:2007(E)
Bibliography.38
Figure 1 – Typical in-process modification, rework or repair activities .7
Figure 2 – Gang mounting no solder mask between lands.15
Figure 3 – Conductor between lands on small pitch .15
Figure 4 – Optional solder-mask design for multiple termination component
attachment.16
Figure 5 – SOIC repair procedure example .23
Figure 6 – Comparing hot air/gas and infrared rework processes .26
Figure 7 – Miniature conventional soldering iron .27
Fig
...
IEC 61192-5
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Workmanship requirements for soldered electronic assemblies –
Part 5: Rework, modification and repair of soldered electronic assemblies
Exigences relatives à la qualité d’exécution des assemblages électroniques
brasés –
Partie 5: Retouche, modification et réparation des assemblages électroniques
brasés
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
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et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
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publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
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The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
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IEC 61192-5
Edition 1.0 2007-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Workmanship requirements for soldered electronic assemblies –
Part 5: Rework, modification and repair of soldered electronic assemblies
Exigences relatives à la qualité d’exécution des assemblages électroniques
brasés –
Partie 5: Retouche, modification et réparation des assemblages électroniques
brasés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.190 ISBN 2-8318-9781-5
– 2 – 61192-5 © IEC:2007
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references .8
3 Terminology .9
3.1 Terms and definitions .9
3.2 Abbreviations .10
4 Classification of rework activities.10
4.1 Pre-soldering rework .10
4.2 Post-soldering rework.11
4.3 Essential prerequisites for successful and reliable rework .11
5 Pre-soldering rework .12
5.1 General .12
5.2 Reworking solder paste and non-conducting adhesive deposits.12
5.2.1 General .12
5.2.2 General misalignment or smudging of deposits.12
5.2.3 Local misalignment or smudging of deposit.12
5.2.4 General paste or adhesive quantity incorrect .12
5.2.5 Local paste or adhesive quantity incorrect .12
5.3 Reworking placed components .12
5.3.1 General overall component misalignment .12
5.3.2 Local component misalignment.13
5.4 Realigning components after curing thermoplastic adhesive .13
5.5 Realigning components after curing thermosetting adhesive.13
6 Factors affecting post-soldering rework .13
6.1 Component marking and unmarked components .13
6.2 Reuse of removed components .14
6.3 Sensitive components .14
6.4 Printed board layout design and space constraints .14
6.5 Heat-sink effects .15
6.6 Printed board material type .15
6.7 Solder resist material and aperture size .15
6.8 Reworking individual fine pitch device leads .17
6.9 Reworking grid arrays .17
7 Preparation for post-soldering rework and repair .18
7.1 Electrostatic precautions .18
7.2 Avoiding exposure of components to contaminants.18
7.3 Removal of conformal coating .18
7.4 Unsuitable components .18
7.5 Cleaning prior to rework .19
7.6 Protecting adjacent sensitive components .19
7.7 Baking of assemblies prior to component replacement .19
7.8 Preheating large multilayer boards .19
7.9 Preheating replacement sensitive components .19
8 Post-soldering rework.19
8.1 General .19
8.2 Component realignment (tweaking) .20
61192-5 © IEC:2007 – 3 –
8.3 Component removal .20
8.4 Removal of adjacent components .20
8.5 Reuse of components.20
8.6 Addition of flux and solder .20
8.7 Topping-up.21
8.8 Removal of excess solder from joints .22
8.9 Preparation of lands before component replacement .22
8.10 Component replacement.22
8.11 Cleaning (if required).23
8.12 Visual inspection and electrical testing .23
8.13 Checking thermal integrity of solder joints .23
8.14 Replacement of local conformal coating (if required) .23
9 Selection of rework equipment, tools and methods .23
9.1 General .23
9.2 Matching rework equipment to component and printed-board prerequisites .24
9.2.1 General .24
9.2.2 Selection based on component types on the printed board .24
9.2.3 Selection based on printed-board laminate material type .25
9.2.4 Selection based on assembly structure and soldering processes .25
10 Manual rework tools and methods .27
10.1 General .27
10.2 Miniature conventional (stored energy) soldering irons .27
10.3 Directly heated soldering irons .28
10.4 Hot air/gas pencils.29
10.5 Heated tweezers .29
10.6 Soldering irons with special tips .30
11 Mechanized and programmable rework machines.30
11.1 General .30
11.2 Hot air rework machines.30
11.3 Focused infrared (IR) equipment .31
11.4 Thermode (heated electrode) equipment .32
11.5 Laser equipment for de-soldering .33
12 Ancillary tools and equipment.34
12.1 Conventional soldering irons .
...
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