IEC 61189-5-4:2015

IEC 61189-5-4 ®
Edition 1.0 2015-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-4: General test methods for materials and assemblies – Solder alloys and
fluxed and non-fluxed solid wire for printed board assemblies

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 5-4: Méthodes d'essai générales pour les matériaux et les assemblages –
Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages
de cartes imprimées
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IEC 61189-5-4 ®
Edition 1.0 2015-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-4: General test methods for materials and assemblies – Solder alloys and

fluxed and non-fluxed solid wire for printed board assemblies

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 5-4: Méthodes d'essai générales pour les matériaux et les assemblages –

Alliages à braser et brasages solides fluxés et non fluxés pour les assemblages

de cartes imprimées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1999-7

– 2 – IEC 61189-5-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Accuracy, precision and resolution . 7
3.1 General . 7
3.2 Accuracy . 8
3.3 Precision . 8
3.4 Resolution . 9
3.5 Report. 9
3.6 Student’s t distribution . 9
3.7 Suggested uncertainty limits . 10
4 C: Chemical test methods . 11
4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated
and/or flux-cored solder . 11
4.1.1 Object . 11
4.1.2 Test specimen . 11
4.1.3 Apparatus . 11
4.1.4 Test procedure . 11
4.2 Test 5-4CXX . 12
5 X: Miscellaneous test methods . 12
5.1 Test 5-4X01: Spread test, extracted cored wires or preforms . 12
5.1.1 Object . 12
5.1.2 Method A . 12
5.1.3 Method B . 13
5.1.4 Additional information . 15
5.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15
5.2.1 Object . 15
5.2.2 Method A . 15
5.2.3 Method B . 16
5.2.4 Additional information . 19
5.3 Test 5-4X03: Solder pool test . 20
5.3.1 Object . 20
5.3.2 Test specimen . 20
5.3.3 Apparatus and reagents . 20
5.3.4 Test procedure . 20
5.3.5 Evaluation . 21
5.3.6 Additional information . 21
Bibliography . 22

Figure 1 – Test apparatus for spitting test . 16
Figure 2 – Test apparatus for spitting test, method B . 18
Figure 3 – Collecting paper with printed concentric circles with 1 cm pitch . 19

Table 1 – Student’s t distribution . 10
Table 2 – Typical spread areas defined in mm . 13
Table 3 – Example of a test report – Spitting of flux-cored wire . 19

– 4 – IEC 61189-5-4:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –
Part 5-4: General test methods for materials and assemblies –
Solder alloys and fluxed and non-fluxed solid wire for
printed board assemblies
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees
...