IEC 60748-23-5:2003

INTERNATIONAL IEC
STANDARD
60748-23-5
QC 165000-5
First edition
2003-10
Semiconductor devices –
Integrated circuits –
Part 23-5:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Procedure for qualification approval
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-5:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Procédure d'homologation
Reference number
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INTERNATIONAL IEC
STANDARD
60748-23-5
QC 165000-5
First edition
2003-10
Semiconductor devices –
Integrated circuits –
Part 23-5:
Hybrid integrated circuits and film structures –
Manufacturing line certification –
Procedure for qualification approval
Dispositifs à semiconducteurs –
Circuits intégrés –
Partie 23-5:
Circuits intégrés hybrides et structures par films –
Certification de la ligne de fabrication –
Procédure d'homologation
 IEC 2003  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
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International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60748-23-5  IEC:2003(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references. 5
3 Terms and definitions. 5
4 Qualification approval procedures . 5
4.1 General . 5
4.2 Marking . 5
4.3 Validity of release for delivery. 6
4.4 Application for qualification approval . 6
4.5 Structural similarity . 6
4.6 Materials, piece-parts and added components . 6
4.7 Initial qualification approval . 6
4.8 Granting of qualification approval . 7
4.9 Maintenance of qualification approval. 7
4.10 Procedure in the event of a failure in a periodic test . 8
4.11 Withdrawal of qualification approval . 8
5 Qualification-product assessment level schedules . 9
6 Blank detail specification.28
6.1 General .28
6.2 FRONT PAGE FOR COMPONENTS ASSESSED BY QUALIFICATION
APPROVAL.29
6.3 GENERAL DATA.30
6.4 Inspection requirements.31

60748-23-5  IEC:2003(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-5: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Procedure for qualification approval
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60748-23-5 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the European standard EN 165000-5 and the following
documents:
FDIS Report on voting
47A/672/FDIS 47A/677/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 60748-23-5  IEC:2003(E)
This standard should be read in conjunction with IEC 60748-23-1.
The QC number that appears on the front cover of this publication is the specification number
in the IEC Quality Assessment System for Electronic Components (IECQ).
The committee has decided that the contents of this publication will remain unchanged until
2006. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60748-23-5  IEC:2003(E) – 5 –
SEMICONDUCTOR DEVICES – INTEGRATED CIRCUITS –
Part 23-5: Hybrid integrated circuits and film structures –
Manufacturing line certification –
Procedure for qualification approval
1 Scope
This part of IEC 60748-23 applies to high quality hybrids (with films) incorporating special
customer quality and reliability requirements whose quality is assessed on the basis of
Qualification Approval.
NOTE 1 Hybrid integrated circuits may be fully or part completed. Part completed devices are those that may be
supplied to customers for further processing.
NOTE 2 Test methods are selected from IEC 60748-23-1. A blank detail specification (BDS) is included to assist
manufacturers and users in the preparation of detail specifications.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60748-23-1:2002, Semiconductor devices – Integrated circuits – Part 23-1: Hybrid
integrated circuits and film structures – Manufacturing line certification – Generic specification
IEC 61340-5-1:1998, Electrostatics – Part 5-1: Protection of electronic devices from electro-
static phenomena – General requirements
QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval procedures
3 Terms and definitions
For the purposes of this part of IEC 60748, related documents, preferred ratings and
characteristics, and terminology are given in IEC 60748-23-1.
4 Qualification approval procedures
4.1 General
The procedures in QC 001002-3 shall apply.
Subclause 6.1 of IEC 60748-23-1 applies with the exceptions given in 4.2 to 4.11 of this
standard.
4.2 Marking
Clause 5 of IEC 60748-23-1 applies.

– 6 – 60748-23-5  IEC:2003(E)
4.3 Validity of release for delivery
Circuits may be released under qualification approval subject to the following conditions:
a) the circuits conform with the requirements of the detail specification;
b) the circuits, their added components, piece parts and materials are traceable to original
manufacturer's lot numbers.
4.4 Application for qualification approval
Application shall be made to the NSI in accordance with QC 001002-3. In addition, the
manufacturer shall:
a) conform with the eligibility requirements of 6.1.1 of IEC 60748-23-1;
b) conform with the relevant detail specification based on the blank detail specification (see
Clause 6) and the Qualification – product assessment level schedules (Q-PALS) (see
Clause 5) contained in this standard.
4.5 Structural similarity
For the purposes of assessment testing, structural similarity can be used if the testing of one
representative type of circuit gives at least the same quality level for the rest of the types which
are grouped together.
The designated management representative (DMR) shall declare to the satisfaction of the NSI
the method of operating the structural similarity plan within the manufacturing facilities and
agree the representative type(s) from each structurally similar group.
For the qualification approval procedure, two or more circuits can be considered structurally
similar, and thus the required numbers of specimens for a test shall be selected from the
combined production, when they have the same function type, use the same design rules,
materials, processes and methods (for example a range of T-cell thick film attenuators using
the same line of inks; or thin film D/A convertors using the same film material and same added
components from the same supplier).
Only those tests not specifically excluded in the Q-PALS may be considered for structural
similarity.
4.6 Materials, piece-parts and added components
Subclause 6.1.3 of IEC 60748-23-1 applies.
4.7 Initial qualification approval
The schedules to be used for qualification approval testing on the basis of lot-by-lot and
periodic testing are given in the Q-PALS tables contain
...