IEC PAS 63702:2026

IEC PAS 63702 ®
Edition 1.0 2026-06
PUBLICLY AVAILABLE
SPECIFICATION
Classification of additive manufacturing and 3D-printing processes for
electronics
ICS 31.190  ISBN 978-2-8327-1330-3

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Classification of additive manufacturing and
3D-printing processes for electronics

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IEC 63702 has been prepared by IEC technical committee 91: Electronics assembly technology.
It is a Publicly Available Specification.
It is based on a document issued by Fachverband Elektronikdesign und -fertigung e. V. (FED)
entitled Classification of additive manufacturing and 3D-printing processes for electronics,
White Paper Edition 2024, and was submitted as a PAS document.
The text of this Publicly Available Specification is based on the following documents:
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91/2105/DPAS 91/2114/RVDPAS
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FED-Working group 3D-Elektronik
Classification
of additive
manufacturing and
3D-printing processes
for electronics
Additive Manufactured Electronics –
AME
Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
White Paper Edition 2024
1 Foreword
The growing demands for miniaturization and increased performance
of electronic devices today go far beyond system integration, which is
described as "More than Moore" and driving forces regarding Additive
Manufacturing in the electrical and electronics industry.
AM is becoming increasingly important, especially for 3D electronics
concepts. New 3D printing processes enable heterogeneous and func-
tional integration through multi-hybrid and tool-free production. Both,
physical and/or electrical functions, can be printed, additionally elec-
tronic components can be assembled within a single operation.
With the new 3D printing processes multidimensional substrates (components) and circuit carriers with
integrated functions such as sensors, actuators, electro-optical or bionic properties can be realized,
without the need for a carrier substrate or already manufactured Printed Circuit Board.
At the same time rapid progress due to material development is carried out. Nanomaterials in combi-
nation with new developed materials printed in one process enable advanced or new possibilities. As
an additional positive effect material, energy and transportation costs can be saved in further produc-
tion processes.
Given the large number of processes and applications it makes sense to classify the methods from the
perspective of manufacturing. The FED 3D Electronics Working Group developed this classification in
a two-year project and defined five classes of electronics integration using AM.
The classes differ in the used substrate material and the printing process. The different classes build
on each other and the requirements for complexity and handling as well as printing technology and
precision increase with each class.
The classification for Additive Manufacturing in electronics is intended to help manufacturers and us-
ers to find an easy way of the new and extensive possibilities of 3D electronics concepts. This creates
a level playing field for discussion between the partners and lowers the entry threshold for the new
technologies for users.
Hanno Platz
Head of „FED-Working Group 3D-Elektronik (AK 3D)“

Authors:
Hanno Platz, GED Gesellschaft Für Elektronik und Design (Leitung AK 3D)
Michael Matthes, Würth Elektronik
Markus Biener, Zollner Elektronik
Daniel Ernst, Technische Universität Dresden
Manuel Martin, KSG Leiterplatten
Michael Schleicher, Semikron Danfoss
Wolfgang Kühn, FED e.V.
Version: Jul 2024
Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
Content
FOREWORD . 1
1 Foreword . 4
1 Additive Manufacturing methods in electronic production, challenges and
opportunities. . 6
1.1 Digital Printing in electronics production . 8
1.2 Procedures according to ISO ASTM 52900 . 9
2 Classification of products using Additive Manufacturing (AM) methods . 10
2.1 Class 1 – basic class, 2D-substrate (carrier) and printing . 11
2.1.1 Material Application . 11
2.2 Class 2 – Multidimensional carrier (substrate) + printing . 12
2.2.1 Class 2 Examples . 13
2.3 Class 3 – Printed multidimensional substrate . 14
2.3.1 Application and drying (curing/hardening) of the material . 14
2.3.2 Examples of material application and drying (curing/hardening) . 15
2.3.3 Internal and external shape (contour) . 16
2.3.4 Advantages and Benefits . 16
2.4 Class 4 - 3D printed substrate + printed components . 17
2.5 Class 5 - Shape-changing solutions (4D) . 18
2.5.1 Materials. 19
2.5.2 Printing methods for 4D technology . 19
2.5.3 Application examples . 20
3 Overview of manufacturing technologies . 21
4 Digital printing and environmental goals (European Green Deal) . 22
5 Growth of Additive Manufacturing (AM) . 23
6 Design tools for 3D electronics . 25
7 Requirements for the data formats . 27
8 Production and scalability . 28
9 Thanks . 29

Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
1 Additive Manufacturing methods in electronic production, challenges and
opportunities.
Additive Manufacturing, 3D printing, Industry 4.0, digital twins and virtual manufacturing are hot topics
throughout the manufacturing industry. The possibility of using Additive Manufacturing (AM) to create
complex components or partial functions is inspiring people all over the world. AM is widely used in
mechanical engineering, automotive engineering, aerospace and medical technology.
There are also initial areas of “classic” electronics and applications, suitable using AM for mass pro-
duction and promising processes supporting electronics manufacturing. Substrates for electronics are
usually "multi-material systems", consisting of conductive and non-conductive materials. Today, vari-
ous printing methods and printers are on the market available. For the new design paradigms, how-
ever, the eCAD design tools and data formats still need to be developed considerably further.

Possible advantages of AM   Possible disadvantages of AM
· Main advantage: · Depending on the complexity each
Only needed material will be printed! part can take a long time to produce
as it is printed layer by layer.
· The design freedom of Additively Manu-
factured components seems endless! · Depending on the manufacturing pro-
cess not all tolerances can be
· Printing directly "quantity one" without
adhered to.
moulds or frames.
· If necessary, support structures must
· When printing on site there is no need
be taken into account in the design.
for logistics and transportation for the
manufactured parts. · Parts with a high surface quality may
require extensive post-processing or
· If necessary, the re-design can start
post-processing may be necessary.
from "quantity one"!
Various printing processes are known that are already in commercial use. Some of the processes
listed are still in the early stages of development. The different processes each have specific areas of
application that are not covered in detail in this document.
Possible printing processes in electronics production
· Drop on Demand (e.g.: Inkjet)
· Aerosol Jet
· Dispensing (used for 3D-printing)
· Impulse Printing
· Soft Lithography
· Electrohydrodynamic Printing (E-Jet)

Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
The “3D Electronics Working Group” of the Fachverband Elektronikdesign und -fertigung e.V. (FED)
has looked in deep at the AM processes and made an initial classification into five groups. This struc-
ture helps for a future development of an "AM Roadmap: Electronics Manufacturing" for applications,
processes and manufacturing methods, a consistent toolchain and data formats for Industry 4.0.

Comprehensive 3D Electronics offer the following features for which manufacturing processes are al-
ready available today:
- Many examples of multidimensional solutions, e.g.: known from 3D MID Technology, can
only be described as 2.5D.
- Some technologies, such as sheet moulding, are
planar and only then brought into a mould.
- Printing or embedding electronic components is
Disruptive Solu-
only possible with an additive process such as
3D printing is used.
tions:
- Components must be mountable in any 3D po-
Additive Manufacturing ena-
sition (azimuth) within the substrate or on the
bles interdisciplinary func-
surface.
tional integration by combin-
ing electronics, mechanics,
- Conductive structures (traces) must be able to
photonics, fluidics and oth-
be routed through the whole and available sub-
ers.
strate at any angle.
- Twisted or shielded conductive structures (traces),
e.g.: coaxial structures.
3D-Electronics
Free-formed components can be combined with functional layers and with SMD components or dies at
any angle or azimuth within substrate or on the surface. Conductive structures are possible on the sur-
face or within the substrates at any angle and shape.

Printed devices (electronics)
SMD-devices
AM Substrate
Conductive structures
Principle drawing of a three-dimensional circuit carrier (AM Substrate)
Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
1.1 Digital Printing in electronics production

Additive manufacturing principles or manufacturing processes usually use a material that is made
printable through upstream processes. A liquid or solid phase is printed (powdered or filaments). On
the surface “ink” appears at first glance Liquid. The medium contains solid nanoparticles, which to-
gether with the carrier liquid and a reaction partner is applied to a surface using the printing process
(suspension).
Pasty or gel-like materials can be applied in a variety of ways.
A comparison of the various processes that can be used for electronics production is currently being
published the inkjet process is the most versatile. High scalability is achieved by using several Print-
heads must be mounted in parallel. Another advantage in contrast to powder bed processes or 3D
printing from a liquid container (SLA) is, that with this process only the Quantities of material are
used that are actually printed.

Materials can be applied using a fully or partially additive process. This is with inkjet and Dispensing
procedures possible. One advantage is, that the material can be applied to existing surfaces (solid,
flexible or fabric) can be applied. These surfaces are immediately after
Printing process or functionalized in a further operation. The order is an example here of silver ink
using the inkjet process. In a later operation, for example: B. a component as Bare die or a flexible
conductor substrate is sintered on.

Digital printing / Drop on Demand (DoD)
Digital printing or drop on demand (DoD) is a process technology in which there is no fixed
printing body such as a screen, stencil, drum or other printing tools. Using digital printing the
printed image is applied "directly" from the data source (file).

One of the most useful methods in this area is "inkjet printing" or “inkjet process” or “DoD”, as
used in inkjet printers, for example. If there are nanoparticles are added to the ink instead of
colour pigments, the ink can be described as a "functional fluid". If different materials in sepa-
rate fluid tanks are available, the e.g.: conductive and non-conductive functional fluid can be
printed as a result, similar to a circuit carrier (printed circuit board). By implementing the right
software tools it is possible to print fully blended “Software Defined Materials” (SDM). This will
be a future topic related to the opportunities of DoD printing.

An important prerequisite for commercial use is, that the various functional fluids are specifically acti-
vated or cured after application. This usually takes place under the influence of radiation of different
wavelengths tailored to the reaction partner. The radiation sources can be IR, UV, laser, radar and mi-
crowaves or thermal radiation.
The fluids can be adapted and optimized to the target applications or processing with a variety of for-
mulations. It is important that the fluid and the print head are matched to each other. The field of appli-
cation for "functionalized fluids" is extensive. According to a 2018 forecast (Yole Development), growth
rates for industrial inkjet-applications are expected to exceed 13% per year.

Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
1.2 Procedures according to ISO ASTM 52900

The basic procedures used for AM are described in ISO/ASTM 52900:2015, which were developed by
the technical committees ISO TC261 and ISO TC438.

• Extrusion
• Material Jetting
• Binder Jetting
• Sheet lamination
• Vat Polymerisation
• Powder Bed Fusion
• Directed Energy Deposition
The Additive Manufacturing terms defined in the international standard ISO/ASTM 52900
Build up physical 3D geometries by successively adding material.
(Source: Fraunhofer IGCV)
Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
2 Classification of products using Additive Manufacturing (AM) methods

As already described, the use of the various AM methods will continue to increase as different ad-
vantages become more apparent. At the same time existing AM methods are constantly being im-
proved and new, methods are being developed. Due to the large number of processes and applica-
tions it makes sense to classify the methods from a general perspective of product manufacture. The
“FED 3D Electronics Working Group” has drawn up a classification in a two-year project.
The basic idea is, that the different classes build on each other. Many different technologies and meth-
ods can be used for application of materials on flat surfaces. Many of these technologies based on
classic printing technologies, in which the surface is touched (contact). For uneven surfaces or three-
dimensional shapes contactless printing processes has a high potential, other methods are used.
These processes are associated with "3D Printing" and "Additive Manufacturing" (AM).
With each class the requirements for complexity and handling as well as printing technology and preci-
sion increase.
The classification is intended to provide a classification model for the various facets of partially or fully
Additively Manufactured 3D electronics. In the model described here this is done on a simplified basis
and divided into five classes, to illustrate the basic information for differentiating between the classes.
Further details follow on the next pages of the document.

FED classification for Additive Manufacturing used Electronic manufacturing

Class 1 Existing support - pla- Additively applied functional layers (e.g. solder 2D Data

nar rigid or flexible stop mask, solder pastes, surfaces, insulation)

Class 2 Existing 3D support - Additively applied functional layers (e.g. solder 2D / 3D data
rigid or flexible stop mask, solder pastes, surfaces, insulation)

Class 3 Carrier printed (2.5D & Additively manufactured functional layers, ad- 3D Data, STEP,
3D) ditively applied functional layers .sliced

Class 4 Carrier printed (2.5D & Additively manufactured functional layers, lay- 3D Data, STEP,
3D) ers and embedded components (SMD etc.) .sliced

4D - designed & printed 3D design conductive and non-conductive lay- 3D Data, STEP,
Class 5
in 3D including me- ers embedded components, mechanical func- .sliced

The “FED 3D Electronics Working Group” defines five classes of Additively Manufactured Electronics
with increasing complexity that build on each other

Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
2.1 Class 1 – basic class, 2D-substrate (carrier) and printing

The “Basic class 1" defines the application of one or more conductive, semi-conductive or non-con-
ductive functional layers on an existing planar substrate (2D). The printed material can be rigid, flexible
or stretchable. The substrate can consist of almost any material: printed circuit board substrate, ce-
ramic, metal, plastic, textile, paper, cardboard and others.
The typical products for this class are referred to as "printed electronics".

2.1.1 Material Application
The additively applied functional layers can be created in a variety of ways. In the simplest case and as
known from classic printing technology, by gravure printing or screen printing. These two technologies
are often used for so-called "printed electronics". Additive application techniques also include numerous
other processes such as:
- Screen printing -  Roll application  -  Spray (coating)
- Inkjet printing -  Dispensing  -  Plasma Spraying
- Sputter  -  Hot stamping -  Pad printing/stamping
- Flame Spraying -  Aerosol Printing -  Electrostatic Jet printing
- Transfer Decal  - Electro-Hydro-Dynamic printing

From the perspective of electronics production or pcb manufacturing an easy example of an insulating
layer is 3D-inkjet-applied solder resist. Examples of conductive structures include the printing of elec-
trical functions or components such as antennas, sensors, filters or contact points.
If the insulation material is applied in one or more steps together with a conductive (semi-conductive)
material, three-dimensional structures can be produced on the available carrier substrate, for example.
The multi-layered conductive layers can be separated by local and partially applied insulation layers,
among other things.
Another example is the application of specific surface materials, Application of functional sensor lay-
ers, e.g made of nanomaterials with gold or other metals. Connecting materials can also be applied
additively, such as sintered material or heat-conducting layers.

Classification of Additive Manufacturing (AM) methods and processes and 3D printing pro-
cesses for electronic
Additively Manufactured Electronics Class 1:
a) The base or carrier material could be a tex-
tile, printed circuit board with or without
conductor tracks, foil, ceramic or plastic
part or paper.
b) The substrate can be rigid, flexible or
Profactor
stretchable, but it is in production process
flat.
c) Additive layers can be produced by screen
printi
...