IEC TS 62228:2007

TECHNICAL IEC
SPECIFICATION TS 62228
First edition
2007-02
Integrated circuits –
EMC evaluation of CAN transceivers

Reference number
IEC/TS 62228:2007(E)
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TECHNICAL IEC
SPECIFICATION TS 62228
First edition
2007-02
Integrated circuits –
EMC evaluation of CAN transceivers

© IEC 2007 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X

International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – TS 62228 © IEC:2007(E)
CONTENTS
FOREWORD.4

1 Scope.6

2 Normative references .6

3 Terms and definitions .7

4 Measurements and tests.7

4.1 General .7

4.2 RF and transient tests .8
4.3 ESD .35
5 Test report.39

Annex A (informative) Test circuit boards.40
Annex B (informative) Documentation of test results .42

Bibliography.44

Figure 1 – Overview of a minimum configuration of a CAN system for emission and
immunity tests against transient and RF disturbances.9
Figure 2 – Example of the circuit diagram of the minimum network for a CAN high
speed system for measuring emission and immunity in respect to RF disturbances and
transients.10
Figure 3 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring emission and immunity in respect to RF disturbances and
transients.11
Figure 4 – Example of the circuit diagram of the minimum network for a CAN high
speed system for measuring the emission of RF disturbances .15
Figure 5 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring the emission of RF disturbances.16
Figure 6 – Test set-up for measurement of RF disturbances on the bus lines.18
Figure 7 – Decoupling network for emission measurement at CAN_High and CAN_Low
in the frequency domain.18
Figure 8 – Example of the circuit diagram of the minimum network for a CAN high
speed system for testing the RF immunity.21
Figure 9 – Example of the circuit diagram of the minimum network for a CAN low speed
system for testing the RF immunity .22
Figure 10 – Test set-up for DPI measurements .24
Figure 11 – Coupling network for DPI measurements on bus lines .25
Figure 12 – RF monitoring network for DPI measurements of bus lines.25
Figure 13 – Coupling network for DPI measurements on V .25
Bat
Figure 14 – RF monitoring network for DPI measurements of V .26
Bat
Figure 15 – Coupling network for DPI measurements on wake-up.26
Figure 16 – RF monitoring network for DPI measurements of wake-up.26
Figure 17 – Example of the circuit diagram of the minimum network for a CAN high
speed system for testing the transient immunity.29
Figure 18 – Example of the circuit diagram of the minimum network for a CAN low
speed system for testing the transient immunity.30

TS 62228 © IEC:2007(E) – 3 –
Figure 19 – Test set-up for direct capacitive impulse coupling .32

Figure 20 – Coupling network for direct capacitive impulse coupling on CAN_High and

CAN_Low .33

Figure 21 – Coupling network for direct capacitive impulse coupling on V .33
Bat
Figure 22 – Coupling network for direct capacitive impulse coupling on wake-up .33

Figure 23 – Circuit diagram of the test set-up for ESD measurements at CAN high

speed transceivers.36

Figure 24 – Circuit diagram of the test set-up for ESD measurements at CAN low

speed transceivers.36

Figure 25 – Test set-up for ESD measurements.37
Figure 26 – Coupling network for ESD measurements on bus lines, V and wake-up .38
Bat
Figure A.1 – Example of IC interconnections of CAN high and CAN low.40
Figure B.1 – Example of presentation of emission test results in the frequency domain .42
Figure B.2 – Example of presentation of DPI test results.43

Table 1 – Overview of requested measurements and tests.7
Table 2 – General test conditions.8
Table 3 – Communication test signal TX1 .13
Table 4 – Communication test signal TX2 .13
Table 5 – Basic scheme for immunity evaluation.14
Table 6 – Boundary values for normal IC operation.14
Table 7 – Overview of decoupling ports for emission.17
Table 8 – Parameters for emission test in the frequency domain.19
Table 9 – Settings of the measurement device for measurement of emission in the
frequency domain .20
Table 10 – Overview of coupling ports .23
Table 11 – Specifications for DPI measurements .27
Table 12 – Required DPI measurements for function test.28
Table 13 – Combination of resistors for coupling on DPI measurements .28
Table 14 – Overview of coupling ports .31
Table 15 – Parameters for functional test.34
Table 16 – Required impulse tests for functioning.34

Table 17 – Parameters for impulse test (damage test) .35
Table 18 – Required impulse tests for damage .35
Table 19 – Summery of ESD coupling points .37
Table 20 – Specifications for ESD measurements .39
Table A.1 – Parameter ESD test circuit board .41

– 4 – TS 62228 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
INTEGRATED CIRCUITS −
EMC EVALUATION OF CAN TRANSCEIVERS

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
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• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 62228, which is a technical specification, has been prepared by subcommittee 47A:
Integrated circuits, of IEC technical committee 47: Semiconductor devices.

TS 62228 © IEC:2007(E) – 5 –
The text of this technical specification is based on the following documents:

Enquiry draft Report on voting

47A/747/DTS 47A/761/RVC
Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

The committee has decided that the contents of this publication will remain unchanged until

the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in

the data related to the specific publication. At this date, the publication will be
• transformed into an international standard;
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 6 – TS 62228 © IEC:2007(E)
INTEGRATED CIRCUITS −
EMC EVALUATION OF CAN TRANSCEIVERS

1 Scope
This document specifies test and measurement methods, test conditions, test setups, test
procedures, failure criteria and test signals for the EMC evaluation of CAN transceivers

concerning:
• the immunity against RF common mode disturbances on the signal lines,
• the emissions caused by non-symmetrical signals regarding the time and frequency
domain,
• the immunity against transients (function and damage), and
• the immunity against electrostatic discharges – ESD (damage).
All measurements and functional tests except ESD are performed in a small (three transceiver)
network. For ESD damage tests a single transceiver configuration on a special test board is
used.
External protection circuits are not applied during the tests in order to get results for the
transceiver IC only.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967 (all parts), Integrated circuits – Measurement of electromagnetic emissions,
150 kHz to 1 GHz
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω /150 Ω direct coupling method
IEC 62132 (all parts), Integrated circuits – Measurement of electromagnetic immunity,
150 kHz to 1 GHz
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 62132-4, Integrated circuits –Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF Power Injection Method
IEC 61000-4-2:1995, Electromagnetic compatibility – Part 4: Testing and measurement
1)
techniques – Section 2: Electrostatic discharge immunity test
Amendment 1 (1998)
Amendment 2 (2000)
ISO 7637-2: 2004, Road vehicles – Electrical disturbances from conduction and coupling –
Part 2: Electrical transient conduction along supply lines only
———————
1)
A consolidated edition 1.2 exists, including IEC 61000-4-2:1995 and its Amendment 1 (1998) and Amendment 2

(2000)
TS 62228 © IEC:2007(E) – 7 –
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61967 and

IEC 62132 apply.
4 Measurements and tests
4.1 General
For evaluation of the EMC characteristic of CAN transceivers different test conditions and test
set-ups are used:
– configuration of three powered transceivers in a CAN network for:
• evaluation of narrowband emission at the bus lines and
• evaluation of RF and transient immunity at the bus lines, voltage supply line V and
Bat
the wake-up line;
– configuration of single unpowered transceiver for testing the damage immunity against
ESD of the pins for bus lines, V and wake-up on a test board with functional required
Bat
external components.
An overview of the requested measurements and tests is given in Table 1.
Table 1 – Overview of requested measurements and tests
Transceiver Required Transceiver
Test method Evaluation
state test mode
150 Ω direct coupling Spectrum and
RF emission Normal
asymmetry
(IEC 61967-4)
Normal
DPI
RF immunity Function Stand by
(IEC 62132-4)
Sleep
Active
(powered)
Supply lines- direct Normal
galvanic coupling
Function Stand by
Transient I/O lines- capacitive
Sleep
immunity coupling
Test pulse wave forms
Damage Normal
(ISO 7637-2)
Passive Contact discharge
ESD Damage Normal
(unpowered) (IEC 61000-4-2)
In order to reduce the effort for the characterization and to increase the compatibility of the
results of different transceiver types, the number of test methods is defined to a necessary
minimum. The 150 Ω direct coupling, DPI and direct galvanic and capacitive coupling methods
are chosen for the evaluation of the EMC characteristic of active transceivers in a network
configuration with three CAN nodes. While using a conductive decoupling and coupling, these
three test methods are based on the same approach. Thus it is possible to use the same PCB
for all required active/functional tests and measurements. These tests can be performed on
the same test board in a common test configuration and set-up.
To get more reproducible test results, all measurement and tests should be done with
soldered transceivers.
The described test conditions, configurations and test procedures are based on present
stand-alone CAN transceivers. In case of ASICs with an integrated CAN transceiver, the test
conditions cannot be defined completely for any type of IC. If it is possible, the test conditions

– 8 – TS 62228 © IEC:2007(E)
of stand-alone CAN transceivers should be used. The configuration of the physical layer of

the CAN bus should be the same.

4.2 RF and transient tests
4.2.1 General test conditions and configurations

4.2.1.1 Test conditions
The general test conditions are given in Table 2:

Table 2 – General test conditions

Parameter Value
Voltage supply V (14 ± 0,2) V
Bat
Voltage supply V (5 ± 0,1) V (default)
CC
Voltage supply V
(5 ± 0,1) V (default)
IO
Test temperature
(23 ± 5) °C
The ambient noise floor for emission measurements shall be below the expected signal noise
and shall be documented in the test report.

4.2.1.2 Test configuration
For the transceiver EMC analysis, a minimum network of three bus nodes has to be set up
according to Figure 1.
TS 62228 © IEC:2007(E) – 9 –
Node 1
Filter
Transceiver Decoupling
VBat VBat TX1
TX
VBat network
RX1
VCC VCC RX
VCC
CAN_H
GND
GND GND ERR ERR1
CAN_L
INH INH1
mode 1
Central Node 2
1)
Coupling/
termination
HF1
decoupling
Transceiver
Decoupling
HF2
networks
network RX2
RX
HF3
CAN_H CAN_H
ERR ERR2
CAN_L CAN_L
IMP1
INH INH2
VBat
IMP2 Wake-up
mode 2
IMP3
Node 3
EMI1
Transceiver
Decoupling
network RX3
RX
CAN_H
ERR ERR3
CAN_L
INH INH3
mode 3
1) only for CAN high speed
IEC  206/07
Figure 1 – Overview of a minimum configuration of a CAN system for emission and
immunity tests against transient and RF disturbances
An example of a test circuit diagram for filter and the transceiver network for CAN high speed
systems is given in Figure 2 and for CAN low speed systems in Figure 3.

VBat VBat VBat
VCC VCC VCC
GND GND GND
mode mode mode
– 10 – TS 62228 © IEC:2007(E)
JP11
Central Node 1
Coupling/ termination
decoupling networks
R7
X11
R11 R12
R13
ERR1
A1
1K
8 7
/ERR INH
R14
9 6 X12
Wake EN EN1
10 5
VBat VI/O 1K INH1
11 4
SPLIT RXD R15
12 3
CANL Vcc Vcc
13 2
CANH GND X13
14 1
R16
/STB TX
RX1
1K
CAN HS 14
STB1
C11 C12 X14
R17
TX1
100n 100n
1K
JP21
Node 2
X15
R21 R22
R23
ERR2
A2
1K
8 7
/ERR INH
R24
9 6 X16
Wake EN EN2
10 5
VBat VI/O 1K
INH2
11 4
SPLIT RXD
R25
12 3
CANL Vcc Vcc
13 2
CANH GND
X17
14 1 R26
/STB TX
RX2
1K
CAN HS 14
STB2
C21 C22
100n 100n
JP31
Node 3
X18
R31 R32
R33
ERR3
A3
1K
8 7
/ERR INH
R34
9 6 X19
Wake EN EN3
10 5
VBat VI/O 1K INH3
11 4
SPLIT RXD R35
12 3
CANL Vcc Vcc
13 2
CANH GND X20
14 1
R36
/STB TX
RX3
1K
CAN HS 14
VBAT
STB3
C31 C32
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C44
C42 C45
C43 C46
1 n 330 p 1 n 330 p
22uF 22uF
X30 X31 X32
GND
VBat Vcc
IEC  207/07
Figure 2 – Example of the circuit diagram of the minimum network for a CAN high speed
system for measuring emission and immunity in respect to RF disturbances and
transients
TS 62228 © IEC:2007(E) – 11 –
Node 1
JP11
Coupling/
decoupling networks
R11
X11
R13
ERR1
R17
R12 1K
A1
Vcc X12
8 7
R14
RTH Wake
R18
9 6 RX1
RTL EN EN1
10 5 1K
Vcc STB STB1
11 4
CH ERR
12 3 X13
CL RX
R15
13 2
GND TX
TX1
14 1
Vbat INH 1K
X14
CAN LS TC
R16
C11 C12
INH1
1K
100n 100n
R17
JP21
Node 2
R21
X15
R23
ERR2
R27
R22 1K
A2
560 Vcc
X16
8 7 R24
RTH Wake
R28
9 6 RX2
RTL EN EN2
1K
10 5
560 Vcc STB STB2
11 4
CH ERR
12 3 X17
CL RX
R25
13 2
GND TX INH2
14 1
1K
Vbat INH
R26
CAN LS TC
C21 C22
100n 100n
Node 3
JP31
R31
X18
R33
ERR3
R37
R32 1K
A3
Vcc X19
8 7
R34
RTH Wake
R38
9 6 RX3
RTL EN EN3
10 5 1K
Vcc STB STB3
11 4
CH ERR
12 3
X20
CL RX
R35
13 2
GND TX
INH3
14 1
Vbat INH 1K
R36
CAN LS TC
C31 C32
VBAT
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C44
C42 C45
C43 C46
1 n 330 p 1 n 330 p
22uF 22uF
X30 X31 X32
GND
VBat Vcc
IEC  208/07
Figure 3 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring emission and immunity in respect to RF disturbances and
transients
– 12 – TS 62228 © IEC:2007(E)
• CAN nodes:
A CAN node consists of a transceiver, mandatory external components for functional settings

and support and decoupling networks at monitored pins or inputs. Node 1 operates as a

transmitter for a bit pattern, which simulates a CAN message to be received and monitored at

the RX output ports of all nodes in the configured network.

At all voltage supply ports (V , V ) of the transceiver buffer, ceramic capacitors shall be
Bat CC
used corresponding to the manufacturers specifications (default value: 100 nF).

Every control input for operation modes shall be connected corresponding to the

manufacturers specifications for a setting either to normal, stand by, or sleep mode.
Connections to the peripheral control equipment shall be decoupled from the test circuit board.
The resistor values at the wake-up pin (R , R , R , R , R , R ) are to be selected
11 12 21 22 31 32
corresponding to the manufacturers specifications in the following way:
− resistors R , R and R : maximum specified value (default: 10 kΩ)
11 21 31
− resistors R , R and R minimum specified value (default: 3,3 kΩ)
12 22 32:
For RF decoupling of outputs (RX, ERR, INH) as well as the input TX resistors R = 1 kΩ are
used.
In respect to avoid a floating voltage at pin INH (stand by or sleep mode), a pull down resistor
shall be used corresponding to the manufacturers specifications (default value R = 10 kΩ).
Before RF and transient testing the wake-up function needs to be tested be using the jumpers
JP11, JP21 and JP31.
• Bus termination:
In the test circuit for CAN high speed systems as shown in Figures 1 and 2, the termination
shall be realized by a central termination using the resistor R = 60 Ω.
In the test circuit for CAN low speed systems, the termination shall be realized on every CAN
node (R = 560 Ω, see Figure 3).
• Filter:
The central voltage supply is buffered by two electrolytic capacitors C = C = 22 µF. For
43 46
the decoupling of external connected voltage supplies V and V , two-stage LC-filters are
CC Bat
connected to each of them (L , C , L , C at V and L , C , L , C at V ). The parts L
1 41 2 42 Bat 3 44 4 45 CC 2
and L should have an impedance above 400 Ω in the frequency range of interest (e.g.
6-hole- ferrites). The jumper JP1 is used to disconnect the supply and RF decoupling filter
network for the transient tests at IMP3. In this case, the voltage supply V is directly
Bat
provided via the IMP3 path.
4.2.1.3 Operation mode definitions
• Definitions of transceiver communication test signals
Two different communication test signals TX1 and TX2 are defined. Depending on partial
emission measurement or immunity test, the respective communication test signal
(transmitted by transceiver 1) shall be used. Emission measurements in the frequency domain
on CAN high speed transceivers shall be done with the communication test signals TX1 and
TX2, in the case of CAN low speed system only with communication test signal TX1.

TS 62228 © IEC:2007(E) – 13 –
• Communication test signal TX1:

The communication test signal TX1 shall be used for emission measurements and immunity

tests with communication (normal mode). The input signal is defined as a square wave with a

duty cycle of 50 %. This represents a CAN signal with permanent data alternation (0-1-0 data)

with the frequencies and bit rates as shown in Table 3.

Table 3 – Communication test signal TX1

Bit rate
f
Bus system
kHz kBit/s
High speed 250 500
Low speed 50 100
• Communication test signal TX2:
The communication test signal TX2 shall be used only for emission measurements with CAN
high speed systems additionally. The input signal is defined as a square wave with a duty
cycle of 90 % with the frequency as shown in Table 4. This represents an asymmetrically data
stream.
Table 4 – Communication test signal TX2
f
Bus system
kHz
High speed 50
4.2.1.4 Definition of evaluation criteria for bus system immunity
4.2.1.4.1 Damage test evaluation criteria for bus system immunity
For evaluation of immunity against damages, a functional test of the transceiver shall be
performed. The functional test includes:
• send- and receive-functionality,
• error detection,
• wake-up capability by the bus and by the wake-up pin, and
• operation mode setting.
All monitored functions shall be within the specifications given by the semiconductor
manufacturer after expose to the disturbances.

4.2.1.4.2 Function test evaluation criteria for bus system immunity
The immunity of a CAN bus system shall be tested in different transceiver modes while the
specified function is monitored at pins RX, ERR and INH according to the scheme in Table 5.

– 14 – TS 62228 © IEC:2007(E)
Table 5 – Basic scheme for immunity evaluation

Failure validation on
Mode Type of disturbance
pin
Normal RF / Transients RX, ERR, INH

Stand by RF / Transients RX, INH

Sleep RF / Transients INH
The boundary values for normal IC operation at different functional pins defined in Table 6 will

be used for failure monitoring.

Table 6 – Boundary values for normal IC operation
Type of TX- Maximum voltage variations Maximum time variations
Mode
disturbance signal
V µs
a,d d e
RX ERR INH RX ERR INH
b b
f
Normal RF With – –
± 0,9 ± 0,9 ± 5 ± 0,2
g
±1,0
b b b
Transient With – – –
± 0,9 ± 0,9 ± 5
c b b b
Standby RF / Transient Without ± 0,9 – ± 5 – – –
c c b b b
Sleep RF / Transient Without – – ± 3 – – –
a
The undisturbed voltage level depends on the tested transceiver. For the immunity evaluation, the monitored pin
of all transceivers in the network with and without applied disturbances shall be compared by using an
oscilloscope. The given values are the maximum allowed variation to the undisturbed signal.
b
Independent of the duration.
c
No evaluation, because the output has no function in this mode.
d
The definition for the maximum deviation of the voltage levels on the RX and/or ERR pin were done according to
the transceiver specification.
e
The definition for the maximum deviation of the voltage levels on the pin INH were done under the following limit
conditions: V = 0,8 V; V = 3,6 V; V = 0,8 V and possible RF
drop_typ_CAN transceiver on_typ_volt.reg. off_typ_volt.reg.
superposition on pin INH with RF influencing of V with an amplitude of approx. 3 V
Bat
f
Only for CAN high speed, 10 % variation of bit time TX1.
g
Only for CAN low speed, 10 % variation of bit time TX1.

The boundary values for normal IC operation apply to all three transceivers. As soon as at
least one transceiver in the network violates a boundary value an error event has occurred. In
some cases, a reset of the system may be necessary before the test can be continued.

NOTE To reset an error indicated by the ERR pin, a dominant or recessive level is required for a minimum time at
the communication test signal TX1. This minimum reset time is to be chosen according to the semiconductor
manufacturer information (typical value > 40 μs).

TS 62228 © IEC:2007(E) – 15 –
4.2.2 Emission of RF disturbances

4.2.2.1 Test configuration
4.2.2.1.1 Test circuit diagram

JP11
Central Node 1
termination
Decoupling bus lines
R7 X11
R11 R12
R13
ERR1
A1
1K
8 7
/ERR INH
R14
9 6 X12
Wake EN EN1
10 5
1K
VBat VI/O INH1
11 4
SPLIT RXD
R1 R15
C1 12 3
CANL Vcc Vcc
X9
13 2
4,7n CANH GND X13
EMI1
14 1
R16
/STB TX
R2
C2 RX1
1K
CAN HS 14
4,7n
STB1
C11 C12
X14
R17
R3
TX1
51 100n 100n
1K
JP21
Node 2
X15
R21 R22
R23
ERR2
A2
1K
8 7
/ERR INH
R24
9 6 X16
Wake EN EN2
10 5
1K
VBat VI/O INH2
11 4
SPLIT RXD R25
12 3
CANL Vcc Vcc
13 2
CANH GND X17
14 1 R26
/STB TX
RX2
1K
CAN HS 14
STB2
C21 C22
100n 100n
JP31
Node 3
X18
R31 R32
R33
ERR3
A3
1K
8 7
/ERR INH R34
9 6 X19
Wake EN EN3
10 5
1K
VBat VI/O INH3
11 4
SPLIT RXD R35
12 3
CANL Vcc Vcc
13 2
CANH GND X20
14 1 R36
/STB TX
RX3
1K
CAN HS 14
VBAT
STB3
C31 C32
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C44
C42 C45
C43 C46
1 n 1 n
330 p 330 p
22uF 22uF
X30 X31 X32
GND
VBat Vcc
IEC  209/07
Figure 4 – Example of the circuit diagram of the minimum network for a CAN high speed
system for measuring the emission of RF disturbances

– 16 – TS 62228 © IEC:2007(E)
Node 1
JP11
Decoupling bus lines
R11
X11
R13
ERR1
R17
R12 1K
A1
Vcc X12
8 7 R14
RTH Wake
R18
9 6 RX1
RTL EN EN1
10 5 1K
560 Vcc STB STB1
R1
C1 11 4
CH ERR
X9
12 3 X13
4,7n CL RX
R15
EMI1
13 2
GND TX TX1
R2
C2 14 1
Vbat INH 1K
4,7n
X14
CAN LS TC
R16
C11 C12
R3 INH1
51 1K
100n 100n
R17
JP21 Node 2
R21
X15
R23
ERR2
R27
R22 1K
A2
560 Vcc X16
8 7
R24
RTH Wake
R28
9 6 RX2
RTL EN EN2
10 5 1K
560 Vcc STB STB2
11 4
CH ERR
12 3 X17
CL RX
R25
13 2
GND TX INH2
14 1
Vbat INH 1K
R26
CAN LS TC
C21 C22
100n 100n
Node 3
JP31
R31
X18
R33
ERR3
R37
R32 1K
A3
560 Vcc X19
8 7
R34
RTH Wake
R38
9 6 RX3
RTL EN EN3
10 5 1K
560 Vcc STB STB3
11 4
CH ERR
12 3 X20
CL RX
R35
13 2
GND TX INH3
14 1
1K
Vbat INH
R36
CAN LS TC
C31 C32
VBAT
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C42 C44 C45
C43 C46
1 n 330 p 1 n 330 p
22uF 22uF
X32
X30 X31
GND
VBat Vcc
IEC  210/07
Figure 5 – Example of the circuit diagram of the minimum network for a CAN low speed
system for measuring the emission of RF disturbances

TS 62228 © IEC:2007(E) – 17 –
4.2.2.1.2 Networks for decoupling of disturbances

The decoupling of disturbances shall be realized by impedance matching networks according

to IEC 61967-4 with passive components (see Figures 4 and 5). The maximum components

mismatch is 1 %, which can be confirmed by measurement. For the resistors R and R used
1 2
for symmetrical decoupling, a maximum mismatch of 0,1 % is recommend (see Table 7).

Table 7 – Overview of decoupling ports for emission

Port Purpose Components
EMI1 RF decoupling on bus lines In pairs RC-serial circuit, matching resistor:
R = R = 120 Ω, C = C = 4,7 nF, R = 51 Ω
1 2 1 2 3
• Decoupling port EMI1
The capacitors C = 4,7 nF realize the DC-decoupling of bus lines from the connected
measurement equipment. The decoupling resistors R = 120 Ω build a power combiner for
symmetrical decoupling of RF disturbances. The resistor R = 51 Ω builds the voltage divider
according to IEC 61967-4.
4.2.2.2 Test set-up
The RF emission measurement of transceiver shall be carried out according to Figure 6 on
the bus lines in the frequency and the time domain.
All networks for transient and RF immunity tests shall be disconnected from the test circuit
during the emission measurements.
• Measurements in the frequency domain
To evaluate the emission of the transceiver (common mode emission of the differential mode
data transfer) in frequency domain, the spectrum of the bus signals CAN_High and CAN_Low
as sum according to IEC 61967-4 should be measured.

– 18 – TS 62228 © IEC:2007(E)
Monitoring and
RF measurement
Control PC
stimulation
SA/ EMI receiver
DSO
Pattern generator
IEC bus
IEC bus
TX
Mode control unit
Decoupling
bus lines
Coaxial
connector 1
EMI1
RX
Connectors
External power supply
VCC, GND, V
Bat
Test board
IEC  211/07
Figure 6 – Test set-up for measurement of RF disturbances on the bus lines
Test equipment requirements:
− Spectrum analyzer (SA)/ EMI receiver according to CISPR 16
− Digital storage oscilloscope (DSO) bandwidth ≥ 500 MHz
with probes (≥ 1 MΩ)
− Test board according to Annex A
− Pattern generator
− External power supply
− Mode control unit (if possible remotely controlled by the PC)
− PC
The input of the measuring instrument shall be connected with the port EMI1 of the test board
by a short coaxial cable according to Figure 7.

HF- analysis
Test board
(spectrum analyser/
C1 R1
measuring receiver)
CAN_H
EMI1
4,7 nF
R2
C2
R3
R
i
CAN_L
50 51
4,7 nF
IEC  212/07
Figure 7 – Decoupling network for emission measurement at
CAN_High and CAN_Low in the frequency domain

TS 62228 © IEC:2007(E) – 19 –
• Measurements in the time domain

To evaluate the emission of the transceiver in time domain, a measurement of the bus signals
CAN_High and CAN_Low and its mathematical addition should be done by using of a digital
storage oscilloscope.
To determine the emission of the bus lines in the time domain, the signals CAN_High and
CAN_Low shall be measured directly on the test board with high impedance probes during

communication with communication test signal TX1. The measuring instrument or software

should be used to build the mathematical addition of the signals.

• Characterization of the measurement port/path
The insertion losses (S measurement) between the respective transceiver signal pads to the
port EMI1 of the test board (without transceiver) shall be measured and documented in the
test report.
Each decoupling path shall be measured separately. By this way, the other pads should be
unconnected.
4.2.2.3 Test procedure and parameters
The characterization of the RF emission on the bus lines shall be performed with the following
test parameters (Table 8) and documented in a diagram in the test report.
Measurements in frequency domain
Table 8 – Parameters for emission test in the frequency domain
f
Bus system Mode Test signal
kHz
a
High speed 0,15 to 1 000 Normal/high speed TX1, TX2
Low speed 0,15 to 1 000 Normal TX1
a
In case of adjustable slope for the bus signals, the maximum slew rate shall be

used in the test.
The settings of the RF analyzer or EMI receivers are given in Table 9.

– 20 – TS 62228 © IEC:2007(E)
Table 9 – Settings of the measurement device for measurement
of emission in the frequency domain

Measuring equipment Spectrum analyzer EMI receiver

Detector Peak
Frequency range 0,15 to 1 000 MHz

Resolution bandwidth (RBW)
150 kHz to 30 MHz 10 kHz 9 kHz

30 MHz to 500 MHz 100 kHz 120 kHz

Video bandwidth (VBW) equal to RBW -
Numbers of sweeps 10 (max hold) -
Measurement time per step -
≥ 1 ms
Frequency sweep time -
≥ 20 s
Frequency step width
150 kHz to 30 MHz - ≤ 9 kHz
30 MHz to 500 MHz -
≤ 120 kHz
Measurements in time domain
The emission in the time domain shall be measured with test signal TX1 and documented in
the test report. The bus signals shall be measured directly on the test board at the pins
CAN_High and CAN_Low of transceiver node 1 with high-impedance probes.

TS 62228 © IEC:2007(E) – 21 –
4.2.3 Immunity to RF disturbances

4.2.3.1 Test configuration
4.2.3.1.1 Test circuit diagram

JP11
Central Node 1
termination
Coupling bus lines
R7 X11
R11 R12
R13
ERR1
A1
1K
8 7
/ERR INH
R14
9 6 X12
Wake EN EN1
10 5
1K
VBat VI/O INH1
11 4
R1 SPLIT RXD R15
C1 12 3
CANL Vcc Vcc
X1
13 2
4,7n CANH GND X13
HF1
14 1 R16
R2 /STB TX
C2 RX1
CAN HS 14 1K
4,7n
STB1
C11 C12 X14
R17
TX1
100n 100n
1K
R5
C5
X2
1nF
MHF1
R6
C6
1nF
JP21
Node 2
Coupling VBat
X15
R21 R22
R23
ERR2
A2
1K
8 7
/ERR INH
R24
C3 9 6 X16
X3
Wake EN EN2
10 5
HF2
1K
VBat VI/O INH2
11 4
SPLIT RXD R25
4,7nF 12 3
CANL Vcc Vcc
13 2
CANH GND X17
14 1 R26
/STB TX
RX2
1K
CAN HS 14
X4
R7 STB2
C21 C22
C7
MHF2
1k
1nF 100n 100n
R8
JP31 Node 3
Coupling Wake-up
X18
R31 R32
R33
C4
X5
ERR3
A3
HF3
1K
8 7
/ERR INH
R34
4,7nF 9 6 X19
Wake EN EN3
10 5
1K
VBat VI/O INH3
11 4
SPLIT RXD
R35
12 3
CANL Vcc Vcc
13 2
CANH GND X20
14 1 R36
X6
R9 /STB TX
C8 RX3
MHF3
1K
CAN HS 14
1k
VBAT
1nF STB3
C31 C32
R10
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C44
C42 C45
C43 C46
1 n 330 p 1 n 330 p
22uF 22uF
X32
X30 X31
GND
VBat Vcc
IEC  213/07
Figure 8 – Example of the circuit diagram of the minimum network
for a CAN high speed system for testing the RF immunity

– 22 – TS 62228 © IEC:2007(E)
Node 1
JP11
Coupling bus lines
R11
X11
R13
ERR1
R17
R12 1K
A1
Vcc X12
8 7 R14
R18 RTH Wake
9 6 RX1
RTL EN EN1
1K
10 5
R1 Vcc STB STB1
C1 11 4
CH ERR
X1
12 3 X13
4,7n CL RX R15
HF1
13 2
R2 GND TX TX1
C2 14 1
1K
Vbat INH
4,7n
X14
CAN LS TC
R16
C11 C12
INH1
1K
100n 100n
R5 R17
C5
X2
1nF
MHF1
R6
C6
1nF
JP21
Node 2
R21
Coupling VBat
X15
R23
ERR2
R27
R22 1K
A2
Vcc X16
C3 8 7 R24
X3
R28 RTH Wake
9 6 RX2
HF2
RTL EN EN2
1K
10 5
Vcc STB STB2
4,7nF 11 4
CH ERR
12 3 X17
CL RX R25
13 2
GND TX INH2
14 1
1K
Vbat INH
R26
X4
R7
C7 CAN LS TC
MHF2
C21 C22
1k
1nF
100n 100n
R8
Node 3
JP31
Coupling Wake-up
R31
X18
R33
C4 ERR3
X5
R37
R32 1K
HF3
A3
Vcc X19
4,7nF 8 7 R34
R38 RTH Wake
9 6 RX3
RTL EN EN3
1K
10 5
Vcc STB STB3
11 4
CH ERR
12 3 X20
CL RX R35
13 2
X6
R9 GND TX INH3
C8 14 1
MHF3
1K
Vbat INH
1k
R36
1nF
CAN LS TC
R10 C31 C32
VBAT
100n 100n
Filter
JP1
VBAT Vcc
D2
L1 L2 L3 L4
47 µH e.g. 6-hole ferrite 47 µH e.g. 6-hole ferrite
C41 C44
C42 C45
C43 C46
1 n 1 n
330 p 330 p
22uF 22uF
X32
X30 X31
GND
VBat Vcc
IEC  214/07
Figure 9 – Example of the circuit diagram of the minimum network
for a CAN low speed system for testing the RF immunity

TS 62228 © IEC:2007(E) – 23 –
4.2.3.1.2 Networks for coupling and decoupling of disturbances

The coupling of disturbances shall be realized by passive components (see Figures 8, 9 and

Table 10). The maximum components mismatch is 1 %, which can be confirmed by

measurement. For the resistors R and R used for symmetrical coupling, a maximum
1 2
mismatch of 0,1 % is recommend.

Table 10 – Overview of coupling ports

Port Purpose Components
RF injection
HF1 Symmetrical RF coupling on CAN ports In pairs RC-serial circuit:
R = R = 120 Ω, C = C = 4,7 nF
1 2 1 2
HF2 RF-coupling on V C = 4,7 nF
Bat 3
HF3 RF-coupling on wake-up C = 4,7 nF
RF monitoring
MHF1 Symmetrical RF decoupling on CAN ports for additional In pairs RC-serial circuit:
measurement of RF disturbances during immunity tests R = R = 909 Ω, C = C = 1 nF
5 6 5 6
MHF2 RF decoupling on V for additional measurement of Voltage divi
...