IEC 60747-5-5:2007/AMD1:2013
(Amendment)Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
Amendement 1 - Dispositifs à semiconducteurs - Dispositifs discrets - Partie 5-5: Dispositifs optoélectroniques - Photocoupleurs
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IEC 60747-5-5 ®
Edition 1.0 2013-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Semiconductor devices – Discrete devices –
Part 5-5: Optoelectronic devices – Photocouplers
Dispositifs à semiconducteurs – Dispositifs discrets –
Partie 5-5: Dispositifs optoélectroniques – Photocoupleurs
IEC 60747-5-5:2007/A1:2013
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IEC 60747-5-5 ®
Edition 1.0 2013-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Semiconductor devices – Discrete devices –
Part 5-5: Optoelectronic devices – Photocouplers
Dispositifs à semiconducteurs – Dispositifs discrets –
Partie 5-5: Dispositifs optoélectroniques – Photocoupleurs
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX D
ICS 31.080.01; 31.260 ISBN 978-2-83220-788-8
– 2 – 60747-5-5 Amend. 1 © IEC:2013
FOREWORD
This amendment has been prepared by subcommittee 47E: Discrete semiconductor devices,
of IEC technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
CDV Report on voting
47E/437/CDV 47E/451/RVC
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
_____________
5.2.7 Initial test voltage V , V
pd(ini) ini
Delete the NOTE at the end of this subclause.
7.4.3
Delete the following text below the paragraph “Package construction”:
Periodic testing shall be carried out at the latest 5 years after type testing and shall be
repeated at the latest every 5 years.
Delete the words “and periodic tests” in the sentence “Type tests and periodic tests shall
include at least the following subgroups (7.4.3.1 to 7.4.3.8), with the following conditions:”
above the fourth dashed item.
7.4.3.1 Preconditioning
Add, in the second paragraph, the terms “(IEC 60068-2-20, Test Tb, Method 1A)”, as follows:
Resistance to soldering heat 260 °C ± 5 °C, 5 s ± 1 s
(IEC 60068-2-20, Test Tb, Method 1A)
7.4.3.2.1 Tests
Replace, in the paragraph “Vibration”, the words "Amplitude: 75 mm" by "Amplitude: 0,75 mm".
7.4.3.2.2 Final measurements
Replace, in the paragraph “Apparent charge”, "F = 1,6 or 1,2 (see 5.2.7 c)" by "F = 1,6
(see 5.2.7 c)".
7.4.3.3.2 Final measurements:
Replace, in the paragraph “Apparent charge”, "F = 1,2 or 1,0 (see 5.3.1 a); " by "F = 1,2 (see
5.2.7 c); ".
Table 2 – Tests and test sequence for photocoupler providing protection against
electrical shock
Replace the existing Table 2 by the following new Table 2:
60747-5-5 Amend. 1 © IEC:2013 – 3 –
Table 2 – Tests and test sequence for photocoupler
providing protection against electrical shock
1) Routine test (non-destructive), see 7.4.1
1.1 Apparent charge magnitude at 1,875 V , method b1), b2) or b3), q ≤ 5 pC, V ≤ V
IORM c ini,b ini,a
See 5.2.11
1.2 Parametric test according to manufacturer’s specification
2) Sample test (destructive), n = 20/platform, with minimum n = 80 in total, c = 0, see 7.4.2
2.1 Visual inspection according to manufacturer’s specification see 7.4.3.1
2.2 Resistance to soldering heat see 7.4.3.1
2.3 Appa
...
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