IEC 61190-1-2:2007

IEC 61190-1-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-2: Requirements for soldering pastes for high-quality interconnects in
electronics assembly
Matériaux de fixation pour les assemblages électroniques –
Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de
haute qualité dans les assemblages de composants électroniques

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IEC 61190-1-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-2: Requirements for soldering pastes for high-quality interconnects in
electronics assembly
Matériaux de fixation pour les assemblages électroniques –
Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de
haute qualité dans les assemblages de composants électroniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.190 ISBN 2-8318-9827-7
– 2 – 61190-1-2 © IEC:2007
CONTENTS
FOREWORD.3

INTRODUCTION.5

1 Scope.6

2 Normative references .6

3 Terms and definitions .7

4 Standardized description for products.7

5 Test methods .8

6 Requirements .8
6.1 Conflict.8
6.2 Alloy composition .8
6.3 Flux characterization and inspection.9
6.4 Solder powder particle size .9
6.5 Metal per cent .10
6.6 Viscosity.10
6.7 Slump and smear test.10
6.8 Solder ball test .12
6.9 Tack test .12
6.10 Wetting.12
6.11 Labelling .13
7 Quality assurance provisions .14
7.1 Responsibility for inspection .14
7.2 Classification for inspections .15
7.3 Inspection report form .15
7.4 Qualification inspection .15
7.5 Quality conformance .16
8 Preparation for delivery .16
9 Additional information – Performance and shelf-life extension inspections.16
Annex A (normative) Test report on solder paste .18

Figure 1 – Slump test stencil thickness, 0,20 mm.11
Figure 2 – Slump test stencil thickness, 0,10 mm.12
Figure 3 – Solder ball test standards.14

Table 1 – Standardized solder paste description.7
Table 2 – Standard solder powders.9
Table 3 – Test methods for particle size distribution .10
Table 4 – Solder paste qualification inspection .16
Table 5 – User inspection for solder paste prior to use .17
Table A.1 – Solder paste inspection report form.18

61190-1-2 © IEC:2007 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes

for high-quality interconnects in electronics assembly

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes
a technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an explanation of solder ball test standards.
This bilingual version, published in 2008-05, corresponds to the English version.

– 4 – 61190-1-2 © IEC:2007
The text of this standard is based on the following documents:

FDIS Report on voting
91/646/FDIS 91/678/RVD
Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

The French version of this standard has not been voted upon.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61190 series, under the general title Attachment materials for
electronic assembly, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61190-1-2 © IEC:2007 – 5 –
INTRODUCTION
This part of IEC 61190 defines the characteristics of solder paste through the definitions of

properties and specification of test methods and inspection criteria. Materials include solder

powder and solder paste flux blended to produce solder paste. Solder powders are classified

according to both shape and size distribution of the particles. It is not the intention of this

standard to exclude those particle sizes or distributions not specifically listed. For flux

properties of solder paste, including classification and testing, see IEC 61190-1-1.

The requirements for solder paste are defined in general terms. In practice, where more

stringent requirements are necessary, additional requirements may be defined by mutual

agreement between the user and supplier. Users are cautioned to perform tests (beyond the
scope of this specification) to determine the acceptability of the solder paste for specific
processes.
This standard is intended to be applicable to all types of solder paste used for soldering in
general, as well as for soldering in electronics assembly. The solder pastes involved relate to
all aspects of application. Generic specifications for soldering pastes are given in ISO 9454-2.

– 6 – 61190-1-2 © IEC:2007
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes

for high-quality interconnects in electronics assembly

1 Scope
This part of IEC 61190 specifies general requirements for the characterization and testing of
solder pastes used to make high-quality electronic interconnections in electronics assembly.
This standard serves as a quality control document and is not intended to relate directly to the
material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation
for solder flux and flux containing material may be found in IEC 61190-1-1.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61189-5, Test methods for electrical materials, interconnection structures and assemblies –
Part 5: Test methods for printed board assemblies
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies –
Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly
technologies
IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for
surface mount soldered assemblies
IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole mount soldered assemblies
IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies
ISO 9000, Quality management systems – Fundamentals and vocabulary
ISO 9001, Quality management systems – Requirements

61190-1-2 © IEC:2007 – 7 –
ISO 9453, Soft solder alloys – Chemical compositions and forms

ISO 9454-2, Soft soldering fluxes – Classification and requirements – Part 2: Performance

requirements
ISO 10012-1, Quality assurance requirements for measuring equipment – Part 1: Metrological

confirmation system for measuring equipment

3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194, as well as
the following apply.
3.1
drying
ambient or heating process to evaporate volatile components from solder paste which may, or
may not, result in melting of rosin/resin
3.2
rheology
study of the change in form and the flow of matter, generally characterized by elasticity,
viscosity, and plasticity
3.3
lead-free solder
solder alloy which lead content is equal to, or less than 0,10 % by mass
3.4
thinner (paste)
solvent or paste system with, or without, activator which is added to solder paste to replace
evaporated solvents, adjust viscosity, or reduce solids content
3.5
viscosity
internal friction of a fluid, caused by molecular attraction, which makes it resist a tendency to
flow, expressed in pascal-seconds (Pa s)
4 Standardized description for products
The solder paste product shall be described as outlined in Table 1.

Table 1 – Standardized solder paste description
Alloy Flux Powder size Nominal metal Viscosity
designation a type content
classification
Designation from Classification from b Weight per cent Pa s
Type no.
IEC 61190-1-3 IEC 61190-1-1
or ISO 9454-2
a
As defined and determined in IEC 61190-1-1 for low (L), moderate (M), and high (H) activity of the flux residues.
b
See Table 2.
– 8 – 61190-1-2 © IEC:2007
5 Test methods
The test methods used in this standard are taken from IEC 61189-5 and IEC 61189-6:

IEC 61189-5, Test methods for printed board assemblies

5X04 Solder paste viscosity – t-bar spin spindle method (applicable for 300 Pa s

to 1 600 Pa s)
5X05 Solder paste viscosity – t-bar spindle method (applicable at less than 300 Pa s)

5X06 Solder paste viscosity – spiral pump method (for 300 Pa s to 1 600 Pa s)

5X07 Solder paste viscosity – spiral pump method (applicable at less than 300 Pa s)
5X08 Solder paste – slump test
5X09 Solder paste – solder ball test
5X10 Solder paste – tack test
5X11 Solder paste – wetting test
IEC 61189-6, Test methods for printed board materials
6X01 Solder powder particle size distribution – screen method
6X02 Solder powder particle size distribution – measuring microscope method
6X03 Solder powder particle size distribution – optical image analyzer method
6X04 Determination of maximum solder powder particle size
6X05 Solder paste metal content by weight
6 Requirements
Except when otherwise specified in the design or assembly drawings, or instructions by the
user, the soldering pastes covered by this standard shall conform with the following
subclauses.
6.1 Conflict
In the event of conflict between the requirements of this standard and other requirements of
the applicable acquisition documents, the precedence in which documents shall govern in
descending order is as follows:
a) the applicable acquisition document;
b) the applicable specification sheet/drawing;

c) this standard;
d) applicable normative references.
6.2 Alloy composition
The alloy composition of the solder pastes shall be characterized by the supplier in
accordance with the alloy characterization requirements specified in IEC 61190-1-3 and shall
be inspected in accordance with the alloy inspection requirements of IEC 61190-1-3. The
results of these inspections should be recorded on the report form included in IEC 61190-1-3
and the alloy type shall be recorded on the solder paste report form (see Table A.1).
The percentage of each element in an alloy shall be determined by any standard analytical
procedure. Wet chemistry shall be used as the reference procedure.

61190-1-2 © IEC:2007 – 9 –
6.3 Flux characterization and inspection

The fluxes in solder pastes shall be characterized by the supplier in accordance with the flux

characterization requirements specified in IEC 61190-1-1 and shall be inspected in

accordance with the flux inspection requirements of IEC 61190-1-1. The results of these

inspections should be recorded on the report form included in IEC 61190-1-1 and the flux type
shall be recorded on the solder paste report form (see Table A.1). If the reflow temperature is

unsuitable for inspection, a different reflow temperature should be agreed upon by user and

supplier.
6.3.1 Shelf life
If the shelf life of the solder paste has expired, but the paste still meets performance testing,
then it may be used. Paste which has been re-qualified can only be used directly after re-
qualification.
6.4 Solder powder particle size
6.4.1 Powder size determination
Powder size determination shall be made using this standard. Alternate test procedures may
be agreed upon by user and supplier.
6.4.2 Powder size
When tested in accordance with 6.4.2.1, the powder size shall be classified by type as per a
standard sieve size or nearest sieve size shown which matches Table 2.
Table 2 – Standard solder powders
Percentages of powder by weight
Powder size
None larger Less than 1% At least 80 % At least 90 % Less than 10 %
a
symbol
than larger than between between smaller than
μm μm μm μm μm
1 160 150 150-75  20
2 80 75 75-45  20
3 50 45 45-25  20
4 40 38  38-20 20
5 28 25  25-15 15
6 18 15  15-5 5
a
Basic powder size symbol for each powder size type.

6.4.2.1 Maximum powder size (fineness of grind)
The maximum powder size shall be determined in accordance with IEC 61189-6, Test method
6X04.
6.4.2.2 Solder powder
Powder particle size distribution shall be determined by a suitable test method using
IEC 61189-6, Test methods 6X01, 6X02, or 6X03 for minimum particle size, as shown in
Table 3.
– 10 – 61190-1-2 © IEC:2007
Table 3 – Test methods for particle size distribution

Type of weight per cent
Test methods
nominal size
1, 2 1, 2, 3, 4
3, 4 2, 3, 4
5, 6 3, 4
Sieve method
Microscopic method
Optical image analyzer
Laser scattering reflectometry

6.4.3 Solder powder particle shape
6.4.3.1 Powder shape
Solder powder shape shall be spherical with maximum length-to-width ratio of 1:2 when tested
in accordance with 6.4.3.1.1. Other shapes shall be acceptable if agreed upon by user and
supplier.
6.4.3.1.1 Determination of solder powder particle shape
Solder powder particle shape shall be determined by visual observation of the powder with a
binocular microscope at a magnification sufficient to determine the percentage that are
spherical or elliptical (length-to-width ratio of less than 1:2). Powder with 90 % of the particles
that are spherical shall be classified as spherical; all other powders shall be classified as non-
spherical.
Solder powder roundness is determined with a light beam scatter and shall be classified as
spherical if the deviation is 1:0 (perfectly spherical) to 1:07. Powders with values above 1:07
shall be classified as non-spherical.
6.5 Metal per cent
The metal content should range from 65 % (by weight) to 96 % (by weight) when tested in
accordance with IEC 61189-6, test method 6X05. The metal per cent shall be within ± 1 % of
the nominal value specified on the user's purchase order.
6.6 Viscosity
The measured viscosity shall be within ±10 % of the value specified by the user. The
measurement and test conditions shall be in accordance with 6.6.1.
6.6.1 Methods of determining viscosity
The methods for determining the viscosity of solder paste in the range of 300 Pa s to
1 600 Pa s shall be in accordance with IEC-61189-5, test method 5X04, or test method 5X06.
The method for determining viscosity of solder paste in the range of 50 Pa s to 300 Pa s shall
be in accordance with IEC 61189-5, test method 5X05 or test method 5X07.
6.7 Slump and smear test
Unless otherwise specified in the contract or purchase order, slump is assessed using two
stencil thicknesses and three land (deposit) sizes in accordance with 6.7.1 and 6.7.2.

61190-1-2 © IEC:2007 – 11 –
6.7.1 Test with 0,2 mm thick stencil

The 0,63 mm x 2,03 mm lands of the stencil shown in Figure 1 when tested in accordance

IEC 61189-5, test method 5X08 at ambient, should show no evidence of bridging between

lands when spacing is 0,56 mm or greater. When tested in accordance with IEC 61189-5, test

method 5X08 at elevated temperature, the specimen shall show no evidence of bridging
between pads when the spacing is 0,63 mm or greater. The 0,33 mm x 2,03 mm lands of the

stencil shown in the Figure 1 pattern, when tested in IEC 61189-5, test method 5X08 at

ambient, shall show no evidence of bridging at spacing of 0,25 mm or greater; and when

tested as per IEC 61189-5, test method 5X08 at elevated temperature, they shall show no

evidence of bridging at spacing of 0,30 mm or greater.

Spacing
mm
0,06
0,10
0,15
Pad size: 0,63 mm × 2,03 mm
0,20
0,25
– 14 identical pads per row
0,30
Vertical
– Same spacings each row
0,35
rows
0,40
0,45
0,40
0,35
0,30
0,25
0,20
0,15
0,10
0,06
Pad size: 0,33 mm × 2,03 mm
– 18 identical pads per row
IEC  621/02
– Same spacings each row
Figure 1 – Slump test stencil thickness, 0,20 mm

6.7.2 Test with 0,1 mm thick stencil
The 0,33 mm x 2,03 mm lands of the stencil shown in Figure 2, when tested in accordance
IEC 61189-5, test method 5X08 at ambient, should show no evidence of bridging at spacing of
0,25 mm or greater. When tested as per IEC 61189-5, test method 5X08 at elevated
temperature, the lands shall show no evidence of bridging at spacing of 0,30 mm or greater.
The 0,2 mm x 2,03 mm lands of the stencil shown in Figure 2, when tested in accordance with
IEC 61189-5, test method 5X08 at ambient, shall show no bridging at spacing of 0,175 mm or
greater. When tested in accordance with IEC 61189-5, test method 5X08 at elevated
temperature, the lands shall show no evidence of bridging at spacing of 0,20 mm or greater.

Spacing
mm
0,33
0,41
0,48
0,56
0,63
0,71
0,79
0,71
0,63
0,56
0,48
0,41
0,33
– 12 – 61190-1-2 © IEC:2007
0,06
0,10
0,15
0,20
Pad size: 0,20 mm × 2,03 mm
0,25
– 16 identical pads per row
0,30
– Same spacings each row
0,35
0,40
0,075
0,10
0,45
0,125
Vertical
0,15
0,40
0,175
rows
0,20
0,35
0,25
0,30
0,30
0,25 0,25
0,20
0,20
0,175
0,15
0,15
0,125
0,10
0,10
0,06
0,075
Pad size: 0,33 mm × 2,03 mm
– 18 identical pads per row
IEC  622/02
– Same spacings each row
Figure 2 – Slump test stencil thickness, 0,10 mm
6.8 Solder ball test
The solder paste, when tested in accordance with the applicable method listed below, shall
meet the requirements for random solder particles (solder balls) as specified. If the solder
paste is required to reflow in a nitrogen atmosphere, for example in the case of In containing
solder paste, a solder ball test under controlled nitrogen atmosphere should be allowable.
6.8.1 Type 1-4 powder
The solder paste with type 1 through 4 type powder, as defined in IEC-61189-5, test method
5X09, shall meet the acceptance criteria presented in Figure 3. In addition, individual solder
balls of greater than 75 μm shall not form on more than one of the three test patterns used in
the evaluation.
6.8.2 Type 5-6 powder
The solder paste with type 5 through 6 type powder as defined in IEC-61189-5, test method

5X09, shall meet the acceptance presented in Figure 3. In addition, individual solder balls of
greater than 50 μm shall not form on more than one of the three test patterns used in the
evaluation. Tests shall be performed while specimen is in a controlled nitrogen atmosphere.
6.9 Tack test
The solder paste shall be tested in accordance with IEC-61189-5, test method 5X10. Minimum
holding force and time shall be agreed upon by user and supplier.

6.10 Wetting
When tested in accordance with IEC-61189-5, test method 5X11, the solder paste shall
uniformly wet the copper lands of the coupon without evidence of dewetting or non-wetting. If
the solder paste is required to reflow under a nitrogen atmosphere, for example in case of In
containing solder paste, wetting test under a controlled nitrogen atmosphere should be
allowable.
Spacing
mm
Spacing
mm
61190-1-2 © IEC:2007 – 13 –
6.11 Labelling
The supplier shall label each container of solder paste with the following:

a) the supplier's name and address;

b) the paste classification/designation and supplier's designation of the solder paste, if

different;
c) the net mass of solder paste;

d) the batch number;
e) the date of manufacture;
f) expiration date (see Clause 9);
g) all required health and safety warnings;
h) per cent metal;
i) Information about lead free soldering process if necessary;

– 14 – 61190-1-2 © IEC:2007
Category 1 Category 2
Preferred (pass) Acceptable (pass)
The solder paste has melted into a big
The solder paste has melted into a big
single solder ball
solder ball, which must not be
surrounded by clustered small solder
balls
Category 3 Category 4
Unacceptable (reject)
Unacceptable, clusters (reject)
The solder paste has melted into a big The molten solder paste has not melted
solder ball, which is surrounded by completely or has formed many
clustered solder balls individual solder balls

IEC  601/07
Figure 3 – Solder ball test standards
7 Quality assurance provisions
7.1 Responsibility for inspection
The solder paste supplier is responsible for the performance of all inspection specified herein
except the performance inspections which are the responsibility of the user. The solder paste
supplier may use its own or any other facilities suitable for the performance of the inspections
specified herein, unless disapproved by the user. The user reserves the right to perform any
of the inspections set forth in the specification where such inspections are deemed necessary
to ensure that supplies and services conform to prescribed requirements.

61190-1-2 © IEC:2007 – 15 –
7.1.1 Responsibility for compliance

Materials covered by this specification shall meet all requirements of Clause 6. The

inspection(s) excluding the performance inspections defined in this specification shall become

a part of the supplier's overall inspection system or quality program. The supplier has

responsibility of ensuring that all products or supplies submitted to the user for acceptance
comply with all requirements of the purchase order contract.

When required by the user, a quality assurance programme for material furnished under this
specification shall be established and maintained in accordance with ISO 9001, or as

otherwise agreed on between user and supplier, and shall be monitored by the qualifying

activity.
7.1.2 Test equipment and inspection facilities
Test/measuring equipment and inspection facilities, of sufficient accuracy, quality, and
quantity to permit performance of the required inspection(s), shall be established and
maintained or designated by the supplier. Establishment and maintenance of a calibration
system to control the accuracy of the measuring and test equipment shall be in accordance
with ISO 9001.
7.1.3 Inspection conditions
Unless otherwise specified herein, all inspections shall be performed in accordance with the
test conditions specified in Clause 6.
7.2 Classification for inspections
The inspections specified herein are classified as follows:
a) qualification inspection (7.4);
b) quality conformance (7.5);
c) performance inspection (Clause 9).
7.3 Inspection report form
Table A.1 is a report form suitable, and recommended, for recording the results of solder
paste inspections. Where definitive test results are not required or appropriate, successful
completion of inspections should be indicated by checkmarks on the solder paste report form.
7.4 Qualification inspection
Qualification inspection shall be performed at a laboratory acceptable to the user on samples
produced with equipment and procedures normally used in production.
7.4.1 Sample size
Sample sizes shall be appropriate to the solder paste being inspected and the inspection
being performed.
7.4.2 Inspection routine
The sample shall be subjected to the inspections specified in Table 4.

– 16 – 61190-1-2 © IEC:2007
Table 4 – Solder paste qualification inspection

Inspection IEC 61189 Qualification

Metal content (6.5) -6   6X05 X

Viscosity (6.6.1) -5   5X04, 5X05, 5X06, 5X07 X

Solder ball (6.8.1, 6.8.2) -5   5X09 X

Slump (6.7.1, 6.7.2) -5   5X08 X

Alloy composition (6.2) Standard analytical procedure X

Flux characterization (6.3) IEC 61190-1-1 X

Flux characteristics (6.3) IEC 61190-1-1 X
Powder size (6.4.2.2) -6   6X01, 6X02, 6X03 X
Maximum powder size (6.4.2.1) -6   6X04 X
Powder shape (6.4.3.1.1) Binocular microscope, sufficient magnification X
Tack (6.9) -5   5X10 X
Wetting (6.10) -5   5X11 X
7.5 Quality conformance
The material supplier shall perform those inspections necessary to insure that the process is
in control and to insure that the product is within specification limit.
7.5.1 Sampling plan
Statistical sampling and inspection shall be in accordance with an approved quality
programme (see 7.1.1).
7.5.2 Rejected lots
If an inspection lot is rejected, the supplier may modify it to correct the defects, or screen out
the defective units and resubmit for reinspection. Resubmitted lots shall be inspected using
tightened inspection. Such lots shall be separate from new lots, and shall be clearly identified
as reinspected lots.
8 Preparation for delivery
Preservation packaging, packing and marking for shipment, and identification shall be as
specified in the contract or purchase order.

9 Additional information – Performance and shelf-life extension inspections
Performance inspections are useful in assessing how well the solder products will perform in
a particular application. Table 5 indicates the methodology that the user should employ to
verify performance and shelf life extension of solder paste.

61190-1-2 © IEC:2007 – 17 –
Table 5 – User inspection for solder paste prior to use

Inspections IEC 61189-5 Performance Shelf life

test method extension
Visual X X
Viscosity (6.6.1) 5X04, 5X05, 5X06, 5X07 X X

Solder ball (6.8.1, 6.8.2) 5X09 X

Slump (6.7.1, 6.7.2) 5X08 X
Tack (6.9) 5X10 X
Wetting (6.10) 5X11 X
– 18 – 61190-1-2 © IEC:2007
Annex A
(normative)
Test report on solder paste
Table A.1 – Solder paste inspection report form

Enter appropriate/information in top portion of report and complete report by entering the test

results or checkmarks in the appropriate spaces. Add the measurements, values, pictures, et

al. as an attachment to this report.

Inspection purpose:
_____Qualification Supplier’s identification________________
_____Shelf life extension Supplier’s batch number________________
_____Performance Date of manufacture ___________________
Original USE-by date___________________
Revised USE-by date___________________
Date inspection completed: ________________________ Overall results: ______Pass_____Fail
Inspection performed by: Witnessed by:
________________________ ____________________________
Inspections Requirement Test User’s actual Test P/F * Tested by and
clause method requirement result date
Material
Visual
Metal content
Viscosity
Solder ball
Slump
Alloy
Flux
Powder size
% in top screen
% in bottom screen
% in receiver bottom
Max. powder size
Powder shape
Tack
Wetting
* P/F = pass/fail; enter P if test results are within tolerance of actual requirement; otherwise, enter F.

___________
– 20 – 61190-1-2 © CEI:2007
SOMMAIRE
AVANT-PROPOS .21

INTRODUCTION.23

1 Domaine d'application .24

2 Références normatives.24

3 Termes et définitions .25

4 Description normalisée des produits .25

5 Méthodes d’essai .26

6 Exigences .27
6.1 Conflit .27
6.2 Composition de l’alliage .27
6.3 Caractérisation et contrôle du flux .27
6.4 Dimension granulométrique de la poudre à braser.27
6.5 Pourcentage de métal .29
6.6 Viscosité .29
6.7 Essai de d’affaissement et d'étalement.29
6.8 Essai de la bille de soudure.31
6.9 Essai d'adhérence.31
6.10 Mouillage .31
6.11 Etiquetage.32
7 Dispositions relatives à l'assurance de la qualité .34
7.1 Responsabilité du contrôle .34
7.2 Classification des contrôles .34
7.3 Formulaires de contrôle.34
7.4 Contrôle de qualification.34
7.5 Conformité de la qualité .35
8 Préparation pour la livraison.35
9 Information supplémentaire – Contrôles de performance et d'allongement de la
durée de conservation .36
Annexe A (normative) Rapport d'essai relatif à la pâte à braser .37

Figure 1 – Epaisseur du pochoir de l'essai d’affaissement, 0,20 mm .30
Figure 2 – Epaisseur du pochoir de l'essai d’affaissement, 0,10 mm .31

Figure 3 – Normes relatives à l'essai de bille de soudure.33

Tableau 1 – Description normalisée de la pâte à braser.26
Tableau 2 – Poudres à braser normales.28
Tableau 3 – Méthodes d'essai pour la répartition granulométrique .28
Tableau 4 – Contrôle de qualification de la pâte à braser.35
Tableau 5 – Contrôle, par l'utilisateur, de la pâte à braser avant utilisation .36
Tableau A.1 – Formulaire pour le contrôle de la pâte à braser .37

61190-1-2 © CEI:2007 – 21 –
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE

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MATÉRIAUX DE FIXATION
POU
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