Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Relates to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. Includes only those dimensions which are essential for the taping of components for the above-mentioned purposes.

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants appropriés au montage en surface en bandes continues

Concerne la mise en bande des composants électroniques sans fils de sorties ou avec tronçons de sorties destinés à être connectés à des circuits électroniques Seules les dimensions essentielles pour la mise sur bande de composants destinés aux opérations mentionnées ci-dessus sont données.

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:1997)

General Information

Status: Withdrawn
Publication Date: 05-Feb-1998
Withdrawal Date: 30-Sep-1998

ICS: 31.020 - Electronic components in general
: 55.060 - Spools. Bobbins

Technical Committee: CLC/SR 40 - Capacitors and resistors for electronic equipment
Drafting Committee: IEC/TC 40 - IEC_TC_40
Parallel Committee: IEC/TC 40 - IEC_TC_40

Current Stage: 9960 - Withdrawal effective - Withdrawal
Start Date: 01-Sep-2010
Completion Date: 01-Sep-2010

Ref Project: SIST EN 60286-3:2002 - Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

Relations

Replaced By: EN 60286-3:2007 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Effective Date: 29-Jan-2023

Standard

EN 60286-3:2002

English language

22 pages

Preview

e-Library read for

AI-Chat

1 day

Create e-Library subscription and get permanent access to the document. Subscriptions are available for: 31 31.020 55 55.060

Frequently Asked Questions

What is EN 60286-3:1998?

EN 60286-3:1998 is a standard published by CLC. Its full title is "Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes". This standard covers: Relates to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. Includes only those dimensions which are essential for the taping of components for the above-mentioned purposes.

What is the scope of EN 60286-3:1998?

What ICS categories does EN 60286-3:1998 belong to?

EN 60286-3:1998 is classified under the following ICS (International Classification for Standards) categories: 31.020 - Electronic components in general; 55.060 - Spools. Bobbins. The ICS classification helps identify the subject area and facilitates finding related standards.

What standards are related to EN 60286-3:1998?

EN 60286-3:1998 has the following relationships with other standards: It is inter standard links to EN 60286-3:2007. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

How can I access EN 60286-3:1998?

EN 60286-3:1998 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

Loading comments...

CLC

EN 60286-1:2017(Main)

Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

SIST EN 60286-1:2018

IEC 60286-1:2017(E) applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: a) a complete revision of the structure (detailed in Annex A) and reworked layout.

Standard
15 pages
English language
e-Library read for
AI-Chat
1 day

16-Nov-2017
29-Aug-2020
31.020
31.240
55.060
CLC/SR 40

CLC

EN IEC 63382-1:2026(Main)

Management of distributed energy storage systems based on electrically chargeable vehicle batteries - Part 1: Use cases and architectures

SIST EN IEC 63382-1:2026

IEC 63382-1:2025 series specifies the management of distributed energy storage systems, composed of electrically chargeable vehicle batteries (ECV-DESS), which are handled by an aggregator/flexibility operator (FO) to provide energy flexibility services to grid operators. IEC 63382-1:2025 describes the technical characteristics and architectures of ECV-DESS, including: – EV charging stations configurations, comprising several AC-EVSEs and/or DC-EVSEs; – individual EVs connected to grid via an EVSE and managed by an aggregator/FO. The focus of this document is on the interface between the FO and the FCSBE and the data exchange at this interface, necessary to perform energy flexibility services (FS). The data exchange between FO and FCSBE typically includes: – flexibility service request and response; – flexibility services parameters; – EV charging station configuration and technical capabilities; – credentials check of parties involved in the flexibility service; – FS execution related notifications; – event log, detailed service record, proof of work. The exchange of credentials has the purpose to identify, authenticate and authorize the actors involved in the flexibility service transaction, to check the validity of a FS contract and to verify the technical capabilities of the system EV + CS, and conformity to applicable technical standards to provide the requested flexibility service. This document also describes the technical requirements of ECV-DESS, the use cases, the information exchange between the EV charging station operator (CSO) and the aggregator/FO, including both technical and business data. It covers many aspects associated to the operation of ECV-DESS, including: – privacy issues consequent to GDPR application (general data protection regulation); – cybersecurity issues; – grid code requirements, as set in national guidelines, to include ancillary services, mandatory functions and remunerated services; – grid functions associated to V2G operation, including new services, as fast frequency response; – authentication/authorization/transactions relative to charging sessions, including roaming, pricing and metering information; – management of energy transfers and reporting, including information interchange, related to power/energy exchange, contractual data, metering data; – demand response, as smart charging (V1G). It makes a distinction between mandatory grid functions and market driven services, taking into account the functions which are embedded in the FW control of DER smart inverters. This document deals with use cases, requirements and architectures of the ECV-DESSs with the associated EV charging stations. Some classes of energy flexibility services (FS) have been identified and illustrated in dedicated use cases: – following a dynamic setpoint from FO; – automatic execution of a droop curve provided by FO, according to local measurements of frequency, voltage and power; – demand response tasks, stimulated by price signals from FO; – fast frequency response. Furthermore, some other more specific flexibility service use cases include: – V2G for tertiary control with reserve market; – V2H with dynamic pricing linked to the wholesale market price; – distribution grid congestion by EV charging and discharging. FS are performed under flexibility service contracts (FSC) which can be stipulated

Draft
219 pages
English language
e-Library read for
AI-Chat
1 day

CLC

EN IEC 63616:2026(Main)

Measurement of the conductivity for metal thin films at microwave and millimeter-wave frequencies - Balanced-type circular disk resonator method

SIST EN IEC 63616:2026

IEC 63616:2025 relates to a conductivity measurement method of thin metal films at microwave and millimeter-wave frequencies. This method has been developed to evaluate the conductivity of a metal foil used for adhering to a substrate or the interfacial conductivity of a metal layer formed on a dielectric substrate. It uses higher-order modes of a balanced-type circular disk resonator and provides broadband conductivity measurements by using a single resonator.

Draft
13 pages
English language
e-Library read for
AI-Chat
1 day

CLC

EN IEC 60749-22-2:2026(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

SIST EN IEC 60749-22-2:2026

IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features: a) the integrity of the metallurgical bond which has been formed, and b) the quality of ball bonds to die or package bonding surfaces. This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003"). This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision. This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information. The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both. This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds. This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1. This first edition, together with the first edition of IEC 60749-22-1, cancels and replaces the first edition IEC 60749-22 published in 2002. This International Standard is to be used in conjunction with IEC 60749-22-1:2025. This edition includes the following significant technical changes with respect to the previous edition: a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749‑22‑1).

Draft
32 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
31.080.01
CLC/TC 47X

CLC

EN IEC 60079-29-0:2026(Main)

Explosive atmospheres - Part 29-0: Gas detection equipment - General requirements and test methods

SIST EN IEC 60079-29-0:2026

IEC 60079-29-0:2025 specifies general requirements, test methods and acceptance criteria that apply to flammable, oxygen and toxic gas detection equipment intended to detect gases and vapours and to provide an indication, alarm or other output function for personnel or property protection in industrial and commercial applications. This document applies to the following gas detection equipment: – Gas detection equipment Type "FL" intended for the detection of flammable gases: • Type FL-Group I, in mines susceptible to firedamp; • Type FL-Group II, in locations other than mines susceptible to firedamp; and • Type FL-OP, open path gas detection equipment for flammable gases. – Gas detection equipment Type "O2" intended for the detection of Oxygen: • Type O2-DE, detection of oxygen deficiency or oxygen enrichment; and • Type O2-IN, inertisation as measuring function for explosion protection. – Gas detection equipment Type "TX" intended for the detection of toxic gases: • Type TX-SM, detection in areas for safety monitoring applications and typically using alarm signalling; • Type TX-HM, occupational exposure measurement in the region of occupational exposure limit values; and • Type TX-OP, open path gas detection equipment for toxic gases. This document is not applicable to equipment: – used for medical applications; – used only in laboratories for analysis or measurement; – used only for process monitoring or control purposes (such as a gas analyser); – used in the domestic environment; – used in environmental air pollution monitoring; – used for flue gas analysis; – used for sampling systems external to the gas detection equipment; – with samplers and concentrators such as sorbents or paper tape having an irreversible indication; – consisting of a passive optical receiver without a dedicated optical source; – equipment within the scope of IEC 60335-2-40 and IEC 60335-2-89. This first edition of IEC 60079-29-0 cancels and replaces the second edition of 60079-29-1 published in 2016 and its Amendment 1:2020, and the first edition of IEC 60079-29-4 published in 2009. In addition, IEC 60079-29-0 Type TX-SM cancels and replaces Type SM of the first edition of IEC 62990-1.

Draft
87 pages
English language
e-Library read for
AI-Chat
1 day
Draft
89 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
29.260.20
CLC/TC 31

CLC

EN IEC 60749-24:2026(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

SIST EN IEC 60749-24:2026

IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) rearrangement of clauses to reposition requirements; b) addition of two notes to the post-test electrical procedures.

Draft
9 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
31.080.01
CLC/TC 47X

CLC

EN IEC 60749-22-1:2026(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

SIST EN IEC 60749-22-1:2026

IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024"). This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance. This test method allows for two distinct methods of pulling wires: a) One method incorporates the use of a hook that is placed under the wire and is then pulled. b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire. This test method does not include bond strength testing using wire bond shear testing. Wire bond shear testing is described in IEC 60749-22-2. This first edition, together with the first edition of IEC 60749-22-2:2025, cancels and replaces the first edition of IEC 60749-22 published in 2002. This edition includes the following significant technical changes with respect to the previous edition: a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749-22-2). This International Standard is to be used in conjunction with IEC 60749-22-2:2025.

Draft
63 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
31.080.01
CLC/TC 47X

CLC

EN IEC 60749-7:2026(Main)

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

SIST EN IEC 60749-7:2026

IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749‑8. This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10. b) Additional detail has been provided in the calibration requirements.

Draft
12 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
31.080.01
CLC/TC 47X

CLC

EN IEC 61076-2:2026(Main)

Connectors for electrical and electronic equipment - Product requirements - Part 2: Sectional specification for circular connectors

SIST EN IEC 61076-2:2026

IEC 61076-2:2025 establishes uniform specifications and technical information for circular connectors.

Draft
28 pages
English language
e-Library read for
AI-Chat
1 day

15-Jan-2026
31.220.10
CLC/SR 48B

CLC

EN IEC 61643-21:2026(Main)

Low voltage surge protective devices - Part 21: Surge protective devices connected to telecommunications and signalling networks - Requirements and test methods

SIST EN IEC 61643-21:2026

IEC 61643-21:2025 is applicable to devices for surge protection against indirect and direct effects of lightning or other transient overvoltages. These devices are intended to be connected to telecommunications and signalling networks, and equipment rated up to 1 000 V RMS and 1 500 V DC. These telecommunications and signalling networks can also provide power on the same line, e.g. Power over Ethernet (PoE). Performance and safety requirements, tests and ratings are specified in this document. These devices contain at least one voltage-limiting component (clamping or switching) and are intended to limit surge voltages and divert surge currents. This second edition cancels and replaces the first edition published in 2000, Amendment1:2008 and Amendment 2:2012. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) New structure of IEC 61643-21 based on IEC 61643-01:2024; b) Several safety requirements based on IEC 61643-01:2024 have been added. This International Standard is to be used in conjunction with IEC 61643-01:2024.

Standard
89 pages
English language
e-Library read for
AI-Chat
1 day