EN 61760-4:2015

SLOVENSKI STANDARD
01-september-2015
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Surface mounting technology - Part 4: Standard method for classification, packaging,
labelling and handling of moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation,
Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface -- Partie 4: Méthode normalisée de classification,
d'emballage, d'étiquetage et de manipulation des appareils sensibles à l'humidité
Ta slovenski standard je istoveten z: EN 61760-4:2015
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61760-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2015
ICS 31.190
English Version
Surface mounting technology - Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices
(IEC 61760-4:2015)
Technique du montage en surface (SMT) -  Oberflächenmontagetechnik -
Partie 4: Classification, emballage, étiquetage et Teil 4: Klassifikation, Verpackung, Kennzeichnung und
manipulation des dispositifs sensibles à l'humidité Handhabung feuchteempfindlicher Bauteile
(IEC 61760-4:2015) (IEC 61760-4:2015)
This European Standard was approved by CENELEC on 2015-06-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61760-4:2015 E
Foreword
The text of document 91/1244/FDIS, future edition 1 of IEC 61760-4, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61760-4:2015.

The following dates are fixed:
(dop) 2016-03-23
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-06-23
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61760-4:2015 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

1)
IEC 60068-2-58:2004 NOTE Harmonized as EN 60068-2-58:2004 (not modified).
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78.
IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1.
ISO 62 NOTE Harmonized as EN ISO 62.

1)
Superseded by EN 60068-2-58:2015 (IEC 60068-2-58:2015): DOW = 2018-05-01.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu
Publication Year Title EN/HD Year

IEC 60068-1 -  Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60749-20 -  Semiconductor devices - Mechanical EN 60749-20 -
and climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture
and soldering heat
IEC 61340-5-1 -  Electrostatics - EN 61340-5-1 -
Part 5-1: Protection of electronic devices
from electrostatic phenomena - General
requirements
IEC 61760-2 -  Surface mounting technology - EN 61760-2 -
Part 2: Transportation and storage
conditions of surface mounting devices
(SMD) - Application guide
IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-hermetic
Solid State Surface Mount Devices

IEC 61760-4 ®
Edition 1.0 2015-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface mounting technology –
Part 4: Classification, packaging, labelling and handling of moisture sensitive

devices
Technique du montage en surface (SMT) –

Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs

sensibles à l'humidité
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-2666-7

– 2 – IEC 61760-4:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General information . 9
4.1 Moisture sensitive devices . 9
4.2 Moisture sensitivity level (MSL) . 10
4.3 Relation to other environmental test methods (humidity tests) . 10
5 Assessment of moisture sensitivity . 10
5.1 Identification of non moisture sensitive devices . 10
5.2 Classification . 10
6 Test procedure . 11
6.1 General . 11
6.1.1 Structurally similar components . 11
6.1.2 Verification and validation tests . 11
6.1.3 Selection of applicable soak conditions and temperature profile . 12
6.2 Drying . 12
6.3 Moisture soak . 12
6.4 Temperature load . 13
6.4.1 Classification temperature profile . 13
6.4.2 Classification temperature profile for special devices . 14
6.5 Recovery . 14
6.6 Final measurements . 14
6.6.1 Requirements . 14
6.6.2 Visual inspection . 15
6.6.3 Electrical measurements . 15
6.6.4 Non-destructive inspection (if required) . 15
6.7 Classification . 15
6.8 Information to be given in the relevant specification . 15
7 Requirements to packaging and labelling . 16
7.1 Packaging process . 16
7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs . 16
7.1.2 Evacuation and sealing . 17
7.2 Packaging material for dry pack . 17
7.2.1 Moisture barrier bag (MBB) . 17
7.2.2 Desiccant . 17
7.2.3 Humidity indicator . 19
7.3 Information to be given on labels . 20
8 Handling of moisture sensitive devices . 21
8.1 Storage . 21
8.1.1 Recommended storage conditions . 21
8.1.2 Shelf life . 21
8.1.3 Floor life . 21
8.2 ESD . 22

IEC 61760-4:2015 © IEC 2015 – 3 –
8.3 Humidity indication . 22
8.3.1 Humidity indicator card (HIC) . 22
8.3.2 Moisture indicating desiccant . 22
8.4 Unpacking and re-packing . 22
9 Drying. 23
9.1 Drying options . 23
9.2 Methods . 24
9.2.1 General considerations for baking . 24
9.2.2 Bakeout times . 24
9.2.3 ESD protection . 25
9.2.4 Reuse of carriers . 25
9.2.5 Solderability limitations . 25
Annex A (informative) Moisture sensitivity of assemblies . 26
Annex B (informative) Mass/gain loss analysis . 27
Annex C (informative) Baking of devices . 28
C.1 Baking time and conditions . 28
C.2 Example of a baking process . 28
Annex D (normative) Moisture sensitivity labels . 30
D.1 Object . 30
D.2 Graphical symbols and labels . 30
D.2.1 Graphical symbol for moisture-sensitivity . 30
D.2.2 Moisture-sensitivity identification label (MSID) . 30
D.2.3 Moisture-sensitivity caution label (MSCL) . 31
Bibliography . 32

Figure 1 – Classification temperature profile . 13
Figure 2 – Examples of humidity indicator cards . 20
Figure C.1 – Baking process . 29
Figure D.1 – Standardized graphical symbol for use on equipment . 30
Figure D.2 – Alternative moisture sensitivity symbol (also in market use) . 30
Figure D.3 – MSID labels (examples) . 31

Table 1 – Moisture sensitivity levels . 11
Table 2 – Moisture soak conditions . 12
Table 3 – Parameters of the classification temperature profile . 14
Table 4 – Classification temperatures T . 14
c
Table 5 – MBB material properties . 17
Table 6 – Conditions for re-bake – Example for one type of plastic encapsulated
devices . 23
Table 7 – Conditions for baking prior to dry pack – Example for one type of plastic
encapsulated devices . 24

– 4 – IEC 61760-4:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1244FDIS 91/1259/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61760, published under the general title Surface mounting
technology, can be found on the IEC website.

IEC 61760-4:2015 © IEC 2015 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 61760-4:2015 © IEC 2015
INTRODUCTION
Due to the higher temperature profiles of reflow soldering processes using tin-silver-copper
alloys or other lead-free solder alloys with higher melting temperatures than Sn-Pb eutectic
solder, the sensitivity of components against soldering heat, when being exposed to moisture
before soldering, becomes an increasingly important factor.
The currently existing standards describing the moisture sensitivity classification of devices
are applicable for plastic encapsulated semiconductors and similar solid state packages (e.g.
IEC 60749-20), but not for other types of components.
This part of IEC 61760 also extends the classification and packaging methods as described in
J-STD-020 and J-STD-033. It is intended to be used for such type of components, where
J-STD-020 and J-STD-033 are not required or not appropriate.

IEC 61760-4:2015 © IEC 2015 – 7 –
SURFACE MOUNTING TECHNOLOGY –
Part 4: Classification, packaging,
labelling and handling of moisture sensitive devices

1 Scope
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture
sensitivity levels related to soldering heat, and provisions for packaging, labelling and
handling.
This part of IEC 61760 extends the classification and packaging methods to such components,
where currently existing standards are not required or not appropriate. For such cases this
standard introduces additional moisture sensitivity levels and an alternative method for
packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices,
including specific through-hole devices (where the device supplier has specifically
documented support for reflow soldering), but not to
• semiconductor devices,
• devices for flow (wave) soldering.
NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD-
020 and J-STD-033, are described in the INTRODUCTION.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions
of surface mounting devices (SMD) – Application guide
IPC/JEDEC J-STD-020D.1, March 2008, Moisture/Reflow Sensitivity Classification for Non-
hermetic Solid State Surface Mount Devices
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

– 8 – IEC 61760-4:2015 © IEC 2015
3.1
moisture sensitive device
MSD
device, where during soldering the evaporation of absorbed moisture is likely to deteriorate its
electrical or mechanical performance compared to what is given in the relevant specification
Note 1 to entry: This note applies to the French language only.
3.2
moisture sensitivity level
MSL
rating indicating a device’s susceptibility to damage due to absorbed moisture when subjected
to reflow soldering
Note 1 to entry: This note applies to the French language only.
3.3
moisture barrier bag
MBB
bag designed to restrict the transmission of water vapour and used to pack moisture sensitive
devices
Note 1 to entry: This note applies to the French language only.
3.4
manufacturer’s exposure time
MET
maximum time after baking that the component manufacturer requires to process components
prior to sealing of the bag
Note 1 to entry: The manufacturer’s exposure time also includes the maximum time allowed at the distributor in
order to keep the bag open to split up its content into smaller shipments.
Note 2 to entry: This note applies to the French language only.
3.5
floor life
allowable time for a device or semi-finished assembly to be exposed to normal room
environment humidity and temperature after removal from a moisture barrier bag or storage
chamber and before a solder reflow process
3.6
shelf life
recommendation of time that products can be stored in the original packaging, during which
the defined quality of the goods remains acceptable under specified conditions of
transportation, storage and handling
3.7
active desiccant
absorbent material used to maintain a low relative humidity
3.8
unit of desiccant
amount of active desiccant that will absorb a minimum of 2,85 g of water vapour at 25 °C and
a relative humidity of 20 % within 24 h
3.9
moisture indicating desiccant
desiccant whose colour (hue) changes perceptibly, when a certain relative humidity is
exceeded
IEC 61760-4:2015 © IEC 2015 – 9 –
Note 1 to entry: Typically a colour change due to a moisture indicating desiccant is from blue to pink, when the
change from dry state to wet state is detected.
3.10
humidity indicator card
HIC
card on which a moisture sensitive chemical is printed such that it changes colour from dry to
wet when the indicated relative humidity is exceeded
Note 1 to entry: This note applies to the French language only.
3.11
water vapour transmission rate
WVTR
measure of the permeability of a plastic film material to moisture, used to specify a moisture
barrier bag for dry packing
Note 1 to entry: This note applies to the French language only.
4 General information
4.1 Moisture sensitive devices
Certain materials, plastic polymers and fillers are hygroscopic and can absorb moisture
dependent on time and the storage environment. Absorbed moisture will vaporize during rapid
heating in the solder reflow process, generating
• pressure in the material,
• deformation,
• swelling,
• delamination,
• cracking,
• degradation of inner connection.
The penetration of moisture into the absorbing material is generally caused through exposure
to the ambient air. Moisture absorption or moisture penetrating into cavities can lead to
moisture concentrations in the device which are high enough to cause cracking and/or
delamination to the device during the soldering process (e.g. “popcorn phenomenon”), which
may adversely affect reliability.
NOTE “Popcorn phenomenon”: internal stress causes the package to bulge and then crack with an audible “pop”.
Moisture can also influence the bonding strength of adhesives, sealings, encapsulants,
plastics with galvanic coating, etc.
Moisture exposure also can induce the transport of ionic contaminations into the device,
thereby increasing the potential for circuit failure due to corrosion.
Hence it is necessary to dry moisture-sensitive devices, to seal them in a moisture barrier bag
and only to remove them immediately prior to soldering onto the PCB. The permissible time
from the opening of the moisture barrier bag until the final soldering process that a device can
remain unprotected in an environment with a level of humidity approximating to real-world
conditions (e.g. 30 °C/60 % RH) is a measure of the sensitivity of the device to ambient
humidity. This amount of time is called floor life.

– 10 – IEC 61760-4:2015 © IEC 2015
4.2 Moisture sensitivity level (MSL)
The moisture sensitivity level (MSL) is determined at the classification temperature, which is
set above practical soldering temperatures. The actual soldering temperature measured at the
top surface of the component therefore shall be less than the classification temperature.
Packaging, storage, floor life and pre-treatment of moisture sensitive devices before being
subjected to reflow soldering processes are identified by the MSL (see Clause 5 and Table 1).
The method for classification of devices into MSL is described in Clause 6.
4.3 Relation to other environmental test methods (humidity tests)
In humidity tests, e.g. as in IEC 60068-2-78, devices are tested as they are (unmounted) or in
mounted condition, e.g. soldered to a test board. These tests detect the influence of adsorbed
or absorbed moisture to the performance of the device, e.g. electrical characteristics,
corrosion effects, but cannot detect the influence of absorbed moisture to the sensitivity
against heat stresses of the soldering processes.
The target of the test method described in this standard is to test the resistance of devices
against the soldering heat in combination with the humidity load as preconditioning process.
Other effects of humidity, like detoriation of electrical characteristics or isolation properties,
are not covered by this standard and need to be tested separately.
5 Assessment of moisture sensitivity
5.1 Identification of non moisture sensitive devices
Non moisture sensitive devices shall be identified by analysis of design and materials of
devices depending on whether they can absorb humidity, or humidity can penetrate into
cavities. If the materials apparently do not absorb humidity, the devices may be declared by
the manufacturer as non moisture sensitive.
Such non moisture sensitive devices shall be designated as level “N”. There are no
requirements for non moisture sensitive devices.
5.2 Classification
The procedure to classify moisture sensitive devices into MSL is described in Clause 6. The
devices are classified at the appropriate classification temperature selected from Table 3 and
Table 4.
The recommended procedure is to start testing at the lowest moisture sensitivity level, which
the evaluation package is reasonably expected to pass (based on knowledge of other similar
evaluation packages).
If supplier and user agree, components can be classified at temperatures other than those in
Table 4.
If the conditions in Table 1 and/or Table 2 are not suitable for a specific product, other
conditions can be applied according to the agreement between users and suppliers.

IEC 61760-4:2015 © IEC 2015 – 11 –
Table 1 – Moisture sensitivity levels
LEVEL Floor life Floor life Shelf life Protective packaging Desic- Humidity
time condition cant indicator
(reference
condition)
a
1 No requirement
≤30 °C/85 % RH
b
MBB type 1 ,
a c
2 1 year ≤30 °C/60 % RH <60 % RH in MBB No Optional
no pre-drying
b
MBB type 1 ,
C2a <30 % RH in MBB
no pre-drying
c
b
4 weeks ≤30 °C/60 % RH Yes Yes
MBB type 2 ,
2a
<10 % RH in MBB
pre-drying
b
MBB type 1 ,
12 months
or as
C3 <30 % RH in MBB
specified
by the
no pre-drying
c
168 h supplier
≤30 °C/60 % RH Yes Yes
b
MBB type 2 ,
3 <10 % RH in MBB
pre-drying
b
MBB type 2 ,
c
4 72 h ≤30 °C/60 % RH <10 % RH in MBB Yes Yes
pre-drying
b
MBB type 2 ,
c
5 48 h ≤30 °C/60 % RH Yes Yes
<10 % RH in MBB
pre-drying
The floor life can be longer if the environmental conditions are less severe than the reference condition, or
shorter, if more severe.
Extended shelf life can be agreed upon, but needs recalculation of the amount of desiccant.
a
The sum of keeping time at floor and storage time should not exceed the maximum storage period as
specified by the supplier.
b
The required shelf life and humidity in packed condition shall be assured by the amount of the desiccant,
calculated by the use of WVTR (water vapour transmission rate) of the applied MBB. For the description of
MBB type, see Table 5.
c
Humidity indicator can be HIC or moisture indicating desiccant.

6 Test procedure
6.1 General
6.1.1 Structurally similar components
Classification may be performed for a group of structurally similar components. Information
about structural similarity shall be given in the relevant specification.
6.1.2 Verification and validation tests
The relevant specification shall describe the minimum number of specimens to be tested. The
minimum number should be at least 11 pieces.

– 12 – IEC 61760-4:2015 © IEC 2015
NOTE A sample of 11 pieces tested with an acceptance number zero represents a Lot Tolerance Percent
Defective (LTPD) of 20 % with a confidence level (C.L.) of 90 %. See ISO 2859-1 for further information.
6.1.3 Selection of applicable soak conditions and temperature profile
The soak conditions related to the MSL shall be selected from Table 2, the applicable
temperature profile for classification (Figure 1) from Table 3 and Table 4.
6.2 Drying
Unless otherwise specified in the relevant specification, the specimen shall be baked at
125 °C ± 5 °C for at least 24 h.
However, alternative baking conditions can be applied, when confirmed by the mass gain or
loss analysis as described in Annex B.
6.3 Moisture soak
Table 2 – Moisture soak conditions
a
LEVEL Soak time Soak condition Alternative
h
1 (168 +5/-0) (85 ± 2) °C, (85 ± 5) % RH (336 +5/-0) h; (85 ± 2) °C, (60 ± 5) % RH
2 (168 +5/-0) (85 ± 2) °C, (60 ± 5) % RH –
(168 +5/-0) (85 ± 2) °C, (30 ± 5) % RH,
C2a followed by followed by
(672 +5/-0) (30 ± 2) °C, (60 ± 5) % RH
2a (696 + 5/-0) (30 ± 2) °C, (60 ± 5) % RH
(168 +5/-0) (85 ± 2) °C, (30 ± 5) % RH,
–
C3 followed by followed by
(168 +5/-0) (30 ± 2) °C, (60 ± 5) % RH
(192 +5/-0) (30 ± 2) °C, (60 ± 5) % RH
4 (96 +2/-0)
(30 ± 2) °C, (60 ± 5) % RH
5 (72 +2/-0)
In levels C2a and C3, the first stage of soak condition corresponds to shelf life (≤30 °C, ≤30 % RH, 1 year) in

the MBB type 1. The second stage of soak condition corresponds to floor life (see IEC 60749-20).
a
Soak conditions according to IPC/JEDEC J-STD-020D.1. Alternatively accelerated equivalent soak
conditions from Table 5-1 in J-STD-020D.1:2008 may be applied in case the activation energy is confirmed
by the manufacturer.
IEC 61760-4:2015 © IEC 2015 – 13 –
6.4 Temperature load
6.4.1 Classification temperature profile
t
T
c
T – 5 °C
c
T
T
c
t
b
T
t
a
t
Time
IEC
Key
T Minimum preheating temperature
T Maximum preheating temperature
T Liquidus temperature
T Classification temperature
c
t Preheating duration
t Time at liquidus
t Time within (T – 5 °C)
3 c
t Time to T
4 c
a The temperature gradient of the increasing slope shall not exceed 3 K/s.
b Preheat area.
c The temperature gradient of the decreasing slope shall not exceed 6 K/s.
Figure 1 – Classification temperature profile
Temperature
– 14 – IEC 61760-4:2015 © IEC 2015
Table 3 – Parameters of the classification temperature profile
Solder Sn-Pb SnAgCu
process (or equivalent) (or equivalent)
T 100 °C 150 °C
T
150 °C 200 °C
t (60 to 120) s (60 to 120) s
T 183 °C 217 °C
t (60 to 150) s (60 to 150) s
t 20 s 30 s
T See Table 4
c
t ≤6 min ≤8 min
Table 4 – Classification temperatures T
c
Classification temperature T for package volume
c
Solder process Package thickness
3 3
350 mm to
<350 mm >2 000 mm
2 000 mm
mm °C °C °C
SnPb
<2,5 235 220 220
or equivalent
≥2,5 220 220 220
SnAgCu
<1,6 260 260 260
or equivalent
1,6 to 2,5 260 250 245
>2,5 250 245 245
>2,5
b b
plus high thermal not applicable 230 230
a
capacity
a
This condition may be applied for devices with high thermal mass, where peak package temperature does
not reach 245 °C when soldered with a profile typical to soldering processes using SnAgCu alloy solder, or
for very temperature sensitive devices. The peak package temperature is measured at the device surface or
any other point specified in the relevant specification.
b
Τ measured at the device terminal or solder joint shall achieve the minimum temperature and time needed
c
for a specific solder alloy to form a solder joint.

6.4.2 Classification temperature profile for special devices
When the classification temperature profiles of Table 3 and Table 4 are not applicable to a
device (e.g. components with high thermal mass and/or thermal sensitivity), other profiles may
be specified in the relevant specification according to the agreement between user and
supplier. For reference see also IEC 60068-2-58:2004, Table 7.
6.5 Recovery
The specimen shall be stored under the standard atmospheric conditions for measurements
and test as given in IEC 60068-1, (15 to 35) °C, (25 to 75) % RH for the time given in the
relevant specification.
6.6 Final measurements
6.6.1 Requirements
A component is considered to pass that level of moisture sensitivity if it passes the
requirements of 6.6.2 and 6.6.3, and if required, the non-destructive inspection of 6.6.4.

IEC 61760-4:2015 © IEC 2015 – 15 –
6.6.2 Visual inspection
Visual inspection shall be performed after the test. Special attention shall be paid to external
cracks and swelling which will be looked for under a magnification of 40×.
A device shall be considered as failure if it exhibits any of the following:
a) external crack visible using 40× optical microscope;
b) internal crack or delamination that intersects internal connections;
c) internal crack or delamination extending from any terminal to any other internal element
relevant for the function of the device;
d) internal crack or delamination extending more than 2/3 the distance from any internal
element relevant for the function of the device to the outside of the package;
e) changes in package body flatness caused by warpage, swelling or bulging invisible to the
naked eye;
f) dimensions out of specification.
Hot temperature warpage may be specified for multi-pin devices. If parts meet in hot condition
co-planarity and standoff dimensions as specified at room temperature, they shall be
considered passing.
The relevant specification may prescribe additional inspection criteria.
If internal cracks are detected by non-destructive inspection in 6.6.4, they are considered a
failure or verified good using polished cross sections through the identified site.
For packages known to be sensitive to vertical cracks, it is recommended that polished cross
sections be used to confirm the nonexistence of near vertical cracks within the mould
compound or encapsulant.
6.6.3 Electrical measurements
Electrical measurements on all devices shall be performed as required by the relevant
specification, e.g. datasheet, detail specifications, etc.
6.6.4 Non-destructive inspection (if required)
If required by the relevant specification, non-destructive inspection (e.g. x-ray computed
tomography, scanning acoustic microscopy, etc.) shall be performed.
6.7 Classification
If one or more devices in the test sample fail at final measurements, the package shall be
considered not to have passed the tested level.
If a device does not pass level 5, it is classified as extremely moisture sensitive and dry pack
will not provide adequate protection. If such devices are shipped, the customer shall be
advised of its classification. The supplier shall also include a warning label with the devices
indicating that those either shall be socket mounted, or baked dry within a time given on the
label before reflow soldering.
6.8 Information to be given in the relevant specification
The following details shall be specified in the relevant specification:
a) MSL and classification temperature profile;

– 16 – IEC 61760-4:2015 © IEC 2015
b) reject criteria, including non-destructive inspection criteria, in addition to those in 6.6.2
through 6.6.4;
c) any preconditioning requirements different to those given in 6.2 and 6.3.
7 Requirements to packaging and labelling
7.1 Packaging process
7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs
7.1.1.1 Requirements – Levels 2, C2a and C3
Packing of the MSDs into MBBs shall be carried out under environmental conditions below
30 °C/60 % RH, within one week after moulding, burn-in, baking or other heating process.
MET is not specified.
MBBs may be opened for a short period of time, e.g less than 1 h, and re-closed provided, if
present, that the HIC indicates a humidity of less than 30 % RH and provided that the
desiccant is replaced with fresh desiccant. When the MBB is next opened, as long as the HIC
indicates below 30 % RH, the duration time of the previous MBB’s opening may be
disregarded. Thus, if the HIC indicates below 30 % RH when MBB is opened, the floor life is
not dependent on the duration time of MBBs opening.
7.1.1.2 Drying requirements – Levels 2a, 3, 4 or 5
MSDs classified as levels 2a, 3, 4, or 5 shall be dried according to Clause 9 prior to being
sealed in MBBs. The period between drying and sealing shall not exceed the MET less the
time allowed for distributors to open the bags and repack parts. If the supplier’s actual MET is
more than the default 24 h, then the actual time shall be used. If the distributor practice is to
repack the MBBs with active desiccant, then this time does not need to be subtracted from the
MET.
Heating processes such as moulding, burn-in or baking can be regarded as pre-drying. If the
MSDs are stored in the low humidity controlled conditions until packaging into MBBs, MET
can be extended.
7.1.1.3 Drying requirements – Carrier materials
The materials from which carriers such as trays, tubes, reels, etc. are made can affect the
desiccant capacity when placed in the MBB. Therefore, the effect of these materials shall be
compensated for by baking or, if required, adding additional desiccant in the MBB to ensure
the shelf life of the devices
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