EN IEC 63287-1:2021

SLOVENSKI STANDARD
01-december-2021
Polprevodniški elementi - Splošne smernice za kvalifikacijo polprevodnikov - 1.
del: Smernice za kvalifikacijo zanesljivosti IC (IEC 63287-1:2021)
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1:
Guidelines for IC reliability qualification (IEC 63287-1:2021)
Halbleiterbauelemente - Allgemeine Leitlinien für die Qualifikation von Halbleitern - Teil 1:
Leitlinien für die IC-Zuverlässigkeitsqualifikation (IEC 63287-1:2021)
Dispositifs à semiconducteurs - Lignes directrices génériques concernant la qualification
des semiconducteurs - Partie 1: Lignes directrices concernant la qualification de la
fiabilité des circuits intégrés (IEC 63287-1:2021)
Ta slovenski standard je istoveten z: EN IEC 63287-1:2021
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 63287-1

NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2021
ICS 31.080.01
English Version
Semiconductor devices - Generic semiconductor qualification
guidelines - Part 1: Guidelines for IC reliability qualification
(IEC 63287-1:2021)
Dispositifs à semiconducteurs - Lignes directrices Halbleiterbauelemente - Allgemeine Leitlinien für die
génériques concernant la qualification des semiconducteurs Qualifikation von Halbleitern - Teil 1: Leitlinien für die IC-
- Partie 1: Lignes directrices concernant la qualification de Zuverlässigkeitsqualifikation
la fiabilité des circuits intégrés (IEC 63287-1:2021)
(IEC 63287-1:2021)
This European Standard was approved by CENELEC on 2021-09-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 63287-1:2021 E

European foreword
The text of document 47/2703/FDIS, future edition 1 of IEC 63287-1, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 63287-1:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-06-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-09-29
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 63287-1:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1
IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30
IEC 60749-11 NOTE Harmonized as EN 60749-11

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-5 -  Semiconductor devices - Mechanical and EN 60749-5 -
climatic test methods - Part 5: Steady-state
temperature humidity bias life test
IEC 60749-6 -  Semiconductor devices - Mechanical and EN 60749-6 -
climatic test methods - Part 6: Storage at
high temperature
IEC 60749-15 -  Semiconductor devices - Mechanical and EN IEC 60749-15 -
climatic test methods - Part 15: Resistance
to soldering temperature for through-hole
mounted devices
IEC 60749-20 -  Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20: Resistance
of plastic encapsulated SMDs to the
combined effect of moisture and soldering
heat
IEC 60749-21 -  Semiconductor devices - Mechanical and EN 60749-21 -
climatic test methods - Part 21:
Solderability
IEC 60749-23 -  Semiconductor devices - Mechanical and EN 60749-23 -
climatic test methods - Part 23: High
temperature operating life
IEC 60749-25 -  Semiconductor devices - Mechanical and EN 60749-25 -
climatic test methods - Part 25:
Temperature cycling
IEC 60749-26 -  Semiconductor devices - Mechanical and EN IEC 60749-26 -
climatic test methods - Part 26:
Electrostatic discharge (ESD) sensitivity
testing - Human body model (HBM)
IEC 60749-28 -  Semiconductor devices - Mechanical and EN 60749-28 -
climatic test methods - Part 28:
Electrostatic discharge (ESD) sensitivity
testing - Charged device model (CDM) -
device level
IEC 60749-29 -  Semiconductor devices - Mechanical and EN 60749-29 -
climatic test methods - Part 29: Latch-up
test
IEC 60749-42 -  Semiconductor devices - Mechanical and EN 60749-42 -
climatic test methods - Part 42:
Temperature and humidity storage

IEC 63287-1 ®
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Generic semiconductor qualification guidelines –

Part 1: Guidelines for IC reliability qualification

Dispositifs à semiconducteurs – Lignes directrices génériques concernant la

qualification des semiconducteurs –

Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits

intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1017-2

– 2 – IEC 63287-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Product categories and applications . 8
5 Failure . 9
5.1 Failure distribution . 9
5.2 Early failure . 10
5.2.1 Description . 10
5.2.2 Early failure rate . 11
5.2.3 Screening . 15
5.3 Random failure . 17
5.3.1 Description . 17
5.3.2 Mean failure rate . 18
5.4 Wear-out failure . 21
5.4.1 Description . 21
5.4.2 Wear-out failure rate . 21
6 Reliability test . 24
6.1 Reliability test description . 24
6.2 Reliability test plan . 24
6.2.1 Procedures for creating a reliability test plan . 24
6.2.2 Estimation of the test time required to confirm the TDDB from the
number of test samples . 27
6.2.3 Estimation of the number of samples required to confirm the TDDB from
the test time. 28
6.3 Reliability test methods . 29
6.4 Acceleration models for reliability tests . 33
6.4.1 Arrhenius model . 33
6.4.2 V-model . 33
6.4.3 Absolute water vapor pressure model . 33
6.4.4 Coffin-Manson model . 33
6.5 Concept of family . 34
6.5.1 General . 34
6.5.2 Conducting life test using family . 34
6.5.3 Verification of early failure rate using family . 37
7 Stress test methods . 39
8 Supplementary tests . 40
9 Summary table of assumptions . 40
10 Summary . 42
Bibliography . 43

Figure 1 – Bathtub curve . 10
Figure 2 – Failure process of IC manufacturing lots during the early failure period . 11
Figure 3 – Weibull conceptual diagram of the early failure rate . 12

IEC 63287-1:2021 © IEC 2021 – 3 –
Figure 4 – Example of a failure ratio: α (in hundreds) and the number of failures for CL
of 60 % . 14
Figure 5 – Screening and estimated early fail rate in Weibull diagram . 16
Figure 6 – Bathtub curve setting the point immediately after production as the origin . 17
Figure 7 – Bathtub curve setting the point after screening as the origin. 17
Figure 8 – Conceptual diagram of calculation method for the mean failure rate from the
exponential distribution .
...