EN 60749-29:2011

SLOVENSKI STANDARD
01-oktober-2011
Polprevodniški elementi - Mehanske in klimatske preskusne metode - 29. del:
Preskus zapore
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
29: Essai de verrouillage
Ta slovenski standard je istoveten z: EN 60749-29:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60749-29
NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM
ICS 31.080.01 Supersedes EN 60749-29:2003 + corr. Mar.2004

English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 29: Latch-up test
(IEC 60749-29:2011)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essai mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 29: Essai de verrouillage Teil 29: Latch-up-Prüfung
(CEI 60749-29:2011) (IEC 60749-29:2011)

This European Standard was approved by CENELEC on 2011-05-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-29:2011 E
Foreword
The text of document 47/2083/FDIS, future edition 2 of IEC 60749-29, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-29 on 2011-05-12.
This European Standard supersedes EN 60749-29:2003 + corrigendum March 2004.
The significant changes with respect to EN 60749-29:2003 include:
– a number of minor technical changes;
– the addition of two new annexes covering the testing of special pins and temperature calculations.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-02-12
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-05-12
with the EN have to be withdrawn
__________
Endorsement notice
The text of the International Standard IEC 60749-29:2011 was approved by CENELEC as a European
Standard without any modification.
__________
IEC 60749-29 ®
Edition 2.0 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 29: Latch-up test
Dispositifs à semiconducteurs – Méthodes d'essai mécaniques et climatiques –
Partie 29: Essai de verrouillage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080.01 ISBN 978-2-88912-434-3

– 2 – 60749-29  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope and object . 5
2 Terms and definitions . 5
3 Classification and levels . 8
3.1 Classification . 8
3.2 Levels . 8
4 Apparatus and material . 8
4.1 Latch-up tester . 8
4.1.1 General . 8
4.1.2 V and their qualification method. 9
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4.1.3 Trigger source qualification method . 9
4.2 Automated test equipment (ATE) . 10
4.3 Heat source . 10
5 Procedure . 10
5.1 General latch-up test procedure . 10
5.2 Detailed latch-up test procedure . 13
5.2.1 I-test . 13
5.2.2 V overvoltage test . 17
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5.2.3 Testing dynamic devices . 19
5.2.4 DUT disposition . 19
5.2.5 Record keeping . 19
6 Failure criteria . 20
7 Summary . 20
Annex A (informative) Examples of special pins that are connected to passive
components . 21
Annex B (informative) Calculation of operating ambient or operating case temperature
for a given operating junction temperature . 23

qualification circuit . 9
Figure 1 – V
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Figure 2 – Trigger source qualification circuit . 10
Figure 3 – Latch-up test flow . 11
Figure 4 – Test waveform for positive I-test . 14
Figure 5 – Test waveform for negative I-test . 15
Figure 6 – Equivalent circuit for positive input/output I-test latch-up testing . 16
Figure 7 – Equivalent circuit for negative input/output I-test latch-up testing . 17
Figure 8 – Test waveform for V overvoltage . 18
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Figure 9 – Equivalent circuit for V overvoltage test latch-up testing . 19
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Figure A.1 – Examples of special pins that are connected to passive components . 22

a
Table 1 – Test matrix . 12
Table 2 – Timing specifications for I-test and V overvoltage test . 13
supply
60749-29  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 29: Latch-up test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-29 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2003 and constitutes a
technical revision. The significant changes with respect to the previous edition include:
– a number of minor technical changes;
– the addition of two new annexes covering the testing of special pins and temperature
calculations.
– 4 – 60749-29  IEC:2011
The text of this standard is based on the following documents:
FDIS Report on voting
47/2083/FDIS 47/2090/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60749-29  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 29: Latch-up test
1 Scope and object
This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated
circuits.
This test is classified as destructive.
The purpose of this test is to establish a method for determining integra
...